CN102818144B - A high-power LED lighting lamp - Google Patents

Abstract

The invention provides a white light LED lamp, which adopts a blue light chip and different fluorescent powder to improve the color rendering index to more than 80 percent and improve the light contrast to ensure that the contrast ratio R of red light and yellow light is increased₉Greater than 1. The packaging structure of the LED lamp utilizes the first support and the second support with a plurality of inclined planes which are integrally formed to support the LED chips, the LED chips can be placed in the pit grooves on the first support so as to be packaged, and the inclined planes enable the angle of the chips emitting light to the space to be up to 250 degrees at most, and ghost images can be eliminated. The LED lamp adopts the technology of attaching the reflecting mirror surface copper plate on the back surface of the LED chip to improve the heat dissipation and increase the luminous efficiency. The LED lamp has no metal conductor exposed on the whole, and meets the safety standard.

Description

A high-power LED lighting lamp

This application is a divisional application of the Chinese patent application 201010176600.5 filed on May 10, 2010, entitled "A High Power LED Lighting Lamp".

technical field

The present invention generally relates to the packaging technology of LED lamps, and more specifically, the present invention relates to a high-power LED lighting lamp with high color rendering, and its packaging technology and power supply circuit design meet the LED international lighting safety and energy label requirements.

Background technique

With the development of light-emitting diode (LED) technology, more and more high-power LED lamps are designed for lighting, such as home lighting. Compared with existing lighting sources such as incandescent lamps, LED lamps have many advantages such as sufficient brightness, energy saving, high reliability, and long life, which make them have broader application prospects in the lighting field.

In the past two years, LED technology has been further widely used, and various countries have increasingly strict requirements for its use, and have issued corresponding standards. For example, the energy label in the United States and the CE certification in Europe have added relevant requirements for LED lights. Among them The requirements for LED circuits, color rendering index, red-yellow light contrast, and safety requirements are getting higher and higher.

Existing LED chips generally can only emit light of a specific wavelength, such as blue light, red light, green light or yellow light. The poor color rendering of this single-color LED chip limits its wider application . The so-called color rendering refers to the degree to which the light source presents the color of the object, usually called the color rendering index (CRI). The closer the effect under the illumination of an incandescent lamp with a color rendering index of 100, the smaller the color distortion. There are 14 standard color samples stipulated internationally and people can calculate a wide range of CRI (R _1-14 ) from their average value, in which the R ₉ value of strong red color rendering (or red-yellow light contrast value) is measured It is very important for many fields of application, especially medical applications.

In order to replace the existing incandescent lamps, it is necessary to develop white LED lamps with high color rendering index. At present, the more common white light LEDs are composed of blue light chips and YAG yellow light phosphors. It only contains blue and yellow spectrums, the color rendering index is still much lower than that of traditional lamps, and the red-yellow light ratio R ₉ is 0 or negative. In the prior art, white light LED lamps are generally improved in the following ways: (1) Simultaneously energize multiple monochromatic LED chips (such as blue light chips, yellow light chips, red light chips and/or green light chips), and the multicolor light source emits White light with a high color rendering index can be obtained by mixing the light of this scheme, but because the control circuit of this scheme is complicated and the chip cost is extremely high, it is rarely used in the market; (2) Encapsulate one or more pieces of blue light with a variety of mixed phosphors Chip, through the excitation of a variety of monochromatic light and blue light mixed to obtain white light with high color rendering index, but the luminous efficiency of this scheme is low, only about 70% of the normal value, and the existence of a variety of fluorescent particles leads to light decay Serious, poor practicability; (3) The blue light chip is packaged with yellow light phosphor to form a conventional white light chip, and the white light emitted by it is mixed with the red light emitted by the additional red light chip to obtain white light with a high color rendering index, but due to The cost of red light chips is very high, and its luminous efficiency is relatively low, so there is still room for further improvement.

Other existing technologies use a combination of the above methods, for example: Chinese patent application 200810027162.9 and Chinese patent ZL200820124942.0 use LED modules including at least white chips, red chips and green chips to improve the color rendering index of white LED lamps ; Chinese patent ZL200520088490.1 discloses a white LED lamp with a yellow powder layer and a red powder layer wrapped sequentially outside the blue chip; Light (red light) phosphor powder is used to improve the spectral composition and the color rendering index of LED lamps; Chinese patents ZL200720108605.8 and ZL200720006417.4 use silica gel mixed with yellow light phosphor powder to package blue light chips and red light chips to improve the performance of white light LEDs. Color rendering; Chinese patent application 200910025014.8 improves the color rendering index of LED lamps by using the blue light emitted by the blue chip to excite the mixed phosphor to produce yellow-green light and red light.

Although the above-mentioned technical solution improves the color rendering index of white LED lamps to a certain extent, generally speaking, there are problems such as difficult realization of red light compensation, complex structure, high cost, and difficulty in large-scale standardized production.

Contents of the invention

In order to overcome the deficiencies of the prior art, the present invention provides a new type of LED lighting lamp. This LED lamp has a higher color rendering index, can increase the irradiation angle, and improve the heat dissipation efficiency. Comply with safety standards.

According to one aspect of the present invention, there is provided a white LED lamp with a high color rendering index, which includes a light emitting module, a radiator fixedly connected thereto, and an internal power supply circuit, wherein the light emitting module includes: a first group The blue LED chip is coated with phosphor powder that uses blue light to excite white light; and the second group of blue LED chips is coated with phosphor powder that uses blue light to excite red light.

Preferably, the red-yellow light ratio R ₉ of the white light generated by the LED lamp is higher than 1.

Preferably, the ratio of the number of blue LED chips in the first group to the number of blue LED chips in the second group is in the range of 4:1 to 12:1. More preferably, the ratio of the number of blue LED chips in the first group to the number of blue LED chips in the second group is 5:1.

Preferably, the light-emitting module of the white LED lamp further includes: a third group of blue LED chips coated with phosphors that emit yellow-green light using blue light.

Preferably, the color rendering index (CRI) of the white light generated by the LED lamp is higher than 80%.

Preferably, the ratio of the numbers of the first group of blue LED chips, the second group of blue LED chips and the third group of blue LED chips is (3~26):(1~3):(1~ 3) within the range. More preferably, the ratio of the numbers of the first group of blue LED chips, the second group of blue LED chips and the third group of blue LED chips is 3:1:1.

Preferably, the white LED lamp further includes a metal radiator. More preferably, the heat sink is a metal or alloy block formed by casting, and it is formed with a plurality of fin-like structures. The radiator is preferably made of cast aluminum or aluminum alloy.

Preferably, the light-emitting module of the white LED lamp further includes: a first bracket, on which a groove is formed for arranging the blue LED chip, and the blue LED chip is close to one of the bottoms of the first bracket. or a plurality of copper plates; and a second bracket, which has a plurality of slopes, is used to support the first bracket, and is in close contact with the copper plates.

Preferably, the copper plate has a thickness of 0.5mm-8mm and has been electroplated and polished.

Preferably, the second bracket is an aluminum casting, and the inclination angles of its multiple slopes are in the range of 25-90 degrees, so that the illumination angle of the LED light is greater than 250 degrees and eliminate ghost images.

Preferably, the first bracket is compression-molded from transparent PC material, and the compression-molded PC transparent part is triangular or trapezoidal, and its two sides form a certain included angle. The angle is preferably 30, 45, 60 or 75 degrees.

Preferably, the back of the PC transparent member is coated with a reflective layer to reflect light and increase luminous efficiency.

Preferably, the second bracket is connected to the radiator through an intermediate connecting body.

Preferably, the heat sink is fixed in the insulating casing. More preferably, the insulating shell has a plurality of ribs corresponding to the fin-like structure of the heat sink, and a plurality of air gaps are formed between the ribs to avoid hindering heat dissipation. More preferably, the insulating casing is formed by casting transparent or opaque plastic.

Preferably, the white LED lamp further includes a lampshade covering the light emitting module.

According to another aspect of the present invention, there is provided a LED chip holder, which includes: an insulating plate, on which a groove for installing a chip is formed on the insulating plate, for placing a light-emitting chip; a metal strip, which is embedded in the insulating plate on and below the groove so as to be in close contact with the light-emitting chip; and metal leads for connecting the light-emitting chip to a power circuit; wherein the insulating plate, the metal strip and the metal lead are molded The chip holder is integrally formed.

Preferably, the insulating plate is trapezoidal, rectangular or triangular.

Preferably, one row or more than one row of chip slots are provided on the insulating plate to accommodate chips and facilitate packaging.

Preferably, the metal strip is a copper plate with a thickness of 0.5mm-8mm, and is electroplated and polished.

Preferably, the insulating board is made of transparent PC material.

Preferably, the two sides of the insulating board form a certain angle, and the degree of the angle is 30, 45, 60 or 75 degrees.

Preferably, the back of the insulating board is coated with a reflective layer to reflect light and increase luminous efficiency.

Preferably, the chip holder is used in conjunction with a metal holder.

Preferably, the metal support has a flat top surface or a plurality of inclined surfaces for supporting the chip support.

Preferably, the metal bracket is an aluminum casting, and the inclination angles of its multiple slopes are in the range of 25-90 degrees.

According to still another aspect of the present invention, there is provided a method for manufacturing a white LED lamp with a high color rendering index, which includes: preparing a first support, a second support, a radiator and an internal power circuit; arranging a plurality of LED chips on on the first bracket; and assembling together the first bracket, the second bracket, the radiator and the internal power supply circuit to form the LED lamp, the method is characterized in that: through injection molding The molding process forms the first support, and forms chip grooves for arranging LED chips on the first support.

Preferably, the step of arranging a plurality of LED chips on the first bracket includes: arranging a first group of blue LED chips on the first bracket, and coating the first group of blue LED chips with Blue light excites phosphor powder that emits white light; a second group of blue LED chips is arranged on the first bracket, and phosphor powder that utilizes blue light to emit red light is coated on the second group of blue LED chips.

Preferably, the red-yellow light ratio R ₉ of the white light generated by the LED lamp is higher than 1.

Preferably, the ratio of the number of blue LED chips in the first group to the number of blue LED chips in the second group is in the range of 4:1 to 12:1.

Preferably, the ratio of the number of blue LED chips in the first group to the number of blue LED chips in the second group is 5:1.

More preferably, the step of arranging a plurality of LED chips on the first support includes: arranging a third group of blue LED chips on the first support, and coating the third group of blue LED chips A phosphor that emits yellow-green light using blue light.

Preferably, the color rendering index (CRI) of the white light generated by the LED lamp is higher than 80%.

Preferably, the ratio of the numbers of the first group of blue LED chips, the second group of blue LED chips and the third group of blue LED chips is (3~26):(1~3):(1~ 3) within the range.

Preferably, the ratio of the numbers of the first group of blue LED chips, the second group of blue LED chips and the third group of blue LED chips is 3:1:1.

Preferably, the step of preparing the second support and the heat dissipation body includes: casting the second support with multiple slopes on the outside and the heat dissipation body with multiple fin structures on the outside with metal or alloy.

Preferably, the metal or alloy is aluminum or an aluminum alloy.

Preferably, the step of preparing the first bracket includes: placing one or more copper plates and metal leads in a mold; using an injection molding machine to inject molding material into the mold to form an insulating plate by compression molding; A plurality of grooves for arranging the LED chips and holes for fixedly connecting the second support are reserved.

Preferably, the copper plate has a thickness of 0.5mm-8mm, and is electroplated and polished.

Preferably, the molding material is a transparent PC material, and the two sides of the molded PC transparent part form an included angle of 45 degrees, and a reflective layer is coated on the back of the PC transparent part to reflect light and increase luminescence efficiency.

Preferably, the LED chip is placed in the groove, and is bonded to the metal lead through gold wire bonding, and then phosphor powder and silica gel are added for packaging and fixing.

Preferably, the first bracket, the second bracket and the radiator are fastened to each other by screws.

It can be understood that the features of the above preferred embodiments of the LED lamp are also applicable to the above manufacturing method, and more preferred embodiments are described in more detail in the detailed description section below.

The present invention adopts a variety of new technologies to meet the requirements of LED international lighting safety and energy label packaging technology, which includes, for example: using blue chips and different phosphors to increase the color rendering index to more than 80%; improving light contrast to make red and yellow light The contrast value R ₉ is greater than 1; the angle of emitting light to the space by the specially designed support chip can reach up to 250°, and can eliminate the ghosting effect; the reflective mirror copper plate is used to improve heat dissipation and luminous efficiency; the entire lamp uses metal-free conductors Exposed design, in line with safety standards.

To the accomplishment of the above and related ends, the invention comprises the features hereinafter fully described and particularly pointed out in the claims. The following description and accompanying drawings describe in detail certain exemplary embodiments of the invention. However, these examples are illustrative and the principles of the invention may have equivalents to the disclosure.

Description of drawings

Other objects, advantages and novel features of the present invention will become apparent from the following detailed description of the present invention in conjunction with the following drawings, in which like reference numerals refer to like parts, wherein:

1 is a side view of an LED lamp according to a first embodiment of the present invention;

Fig. 2 is a side view of the LED lamp shown in Fig. 1 with the lampshade removed;

Fig. 3A is a schematic front view of part of the first bracket of the LED lamp shown in Fig. 1;

Figure 3B is a schematic view of the back of the first bracket shown in Figure 3A;

FIG. 3C is a schematic diagram of another configuration scheme of LED chips;

Fig. 4 is a top view of the LED lamp shown in Fig. 2;

Fig. 5A is a schematic cross-sectional view of the light-emitting module of the LED lamp shown in Fig. 1 along the line A-A in Fig. 5;

Fig. 5B is a schematic structural view of the fastening device shown in Fig. 5A;

Fig. 6 is a partial perspective view of an LED lamp according to a second embodiment of the present invention.

specific embodiment

The LED lighting lamp of the present invention will be described in detail below with reference to the accompanying drawings.

Fig. 1 shows a side view of an LED lamp according to a preferred embodiment of the present invention. It can be seen from the figure that the LED lamp mainly includes a lampshade 1, a radiator 2, a lamp cap or a lamp holder 3, a light-emitting module 4 and an internal DC power supply electronic board (not shown in the figure), wherein the lamp cap or lamp holder 3 is used for A 220V AC power supply is connected to power the LED lamp, which has the same specifications as the corresponding lamp base of the general lighting bulb, so that the LED lamp can conveniently replace the fluorescent lamp currently used. The radiator 2 can be a metal or alloy block formed by casting, and preferably has a considerable number of high-efficiency fin-shaped structures on the outside, which can maximize the contact area with the air. The heat sink 2 and the lamp holder 3 can be integrally formed to facilitate processing and assembly. The lampshade 1 can be made of glass, transparent plastic such as PC material (ie polycarbonate) or other polymers. According to the needs of light effect, frosted glass or other translucent plastic materials can also be used to make lampshades 1 of various shapes, so as to increase the softness of light and the aesthetics of the LED lamp.

In FIG. 2 , the internal structure of the LED lamp can be seen more clearly by removing the lampshade 1 . It should be understood that the dimensions marked in this figure are also exemplary rather than limiting. As shown in the figure, the light emitting module 4 includes a first bracket 41 and a second bracket 42 . The first bracket 41 includes a plurality of roughly trapezoidal or triangular insulating plates (such as transparent PC boards), and a plurality of grooves are reserved on both sides of each insulating plate for placing LED chips. Although the present embodiment shows the first frame including 6 insulating plates, the present invention is not limited thereto, that is, the first frame may include more or less insulating plates. Moreover, the shape of the insulation board is not limited to trapezoid or triangle, and may also be other polygonal shapes such as rectangle, square, hexagon and so on. In addition, the arrangement of the grooves is not limited to two rows, and can also be one row or more than two rows. The second bracket 42 is a metal casting, which may be cast from, for example, aluminum or an aluminum alloy. The casting is generally in the shape of a multi-faceted frustum, and its side faces and bottom face form a certain angle, such as 25°-90°, and preferably 45°, in order to achieve a better light divergence effect, and the shape of the side faces is consistent with that of the first bracket The insulation board of 41 is consistent, makes the insulation board back side close to this side fixed placement. According to the different numbers of sides of the second bracket, the angle between the two sides of the insulating plate of the first bracket (that is, the apex angle of an approximate triangle) can have different degrees, for example, the degree can be 30°, 45°, 60°, 75° etc. The second bracket 42 and the radiator 2 may be connected together by an intermediate connecting body 5 made of metal material, so that a certain gap (such as a gap of 3 mm) is reserved between the second bracket and the radiator. The horizontal part of the intermediate connecting body 5 (that is, the part connected to the heat sink 2) can be formed into a porous or hollow structure to achieve good air circulation and serve as an in-out channel for wires connecting the light-emitting module and the internal power circuit.

This design of separating the light-emitting module from the heat sink can achieve a larger illumination range on the one hand, and better heat dissipation effect on the other hand. Specifically, in terms of illumination, if the second bracket 42 is directly connected to the radiator 2, the upper surface of the radiator 2 will block part of the light, reducing the illumination range. For example, when the inclination angle of the light emitting slope is 45 degrees, the ideal irradiation angle is 135 degrees. However, in the current design, by using the intermediate connector 5 to lift the light emitting module 4 to a certain height, the heat sink can be prevented from blocking the light, and a larger illumination range can be achieved. For example, the illumination angle can be greater than 250 degrees, and ghost images can be eliminated. In terms of heat dissipation, secondary heat dissipation can be achieved through the connection of the second support 42, the intermediate connector 5 and the heat sink 2, that is, the heat emitted by the LED chip when it is powered on is first quickly taken away by the second support 42 and passed through the second support 42. The connecting body 5 is transmitted to the radiator 2, and then the fin-like structure outside the radiator 2 exchanges heat with the air to achieve a better heat dissipation effect. Through this two-stage heat dissipation mechanism, the temperature of the second support 2 (primary heat sink) can generally be maintained at 80°C-120°C, and the temperature of heat sink 2 (secondary heat sink) can generally be maintained at 90°C Below C. This secondary heat dissipation structure not only increases the heat dissipation area, but also realizes rapid heat transfer from the primary heat sink to the secondary heat sink through the different temperatures of the two heat sinks, avoiding heat accumulation in the primary heat sink and affecting the LED At the same time, the air around the two heat sinks will also form air flow in the gap shown in the figure due to being heated to different temperatures, thereby further improving the heat dissipation efficiency.

The arrangement of the LED chips will be described in detail below with reference to FIG. 3A and FIG. 3B . As shown in FIG. 3A, the first bracket 41 includes a plurality of insulating plates 411 connected together by metal leads 412. A hole H is left in the center of the insulating plates 411, and a bump P is left on the bottom edge, so as to realize the connection with the first support 411. The fastening connection of the two brackets 42 will be described in more detail below. Two rows of grooves are formed on both sides of the insulating plate 411 to place the LED chips 414 and 415, and the back side of the LED chip is close to the metal strip 413 (which is embedded in the insulating plate, as shown in FIG. 3B ), the metal strip 413 It is preferably a 0.5-8mm copper plate, which can be electroplated and polished on the one hand to increase light reflection, and on the other hand can quickly transfer the heat generated by the LED chip to the second bracket to improve heat dissipation efficiency. The back of the insulating plate 411 may also be coated with a reflective layer, so that scattered light in different directions is reflected outward, thereby further improving the luminous efficiency. The pins of the LED chip are connected to the metal lead wire 412 through the bonding wire, and the lead wire is further connected to the internal power supply circuit, so as to realize power supply to the LED chip.

The first bracket 41 can be formed and the LED chip can be packaged by the following process: one or more electroplated and polished metal strips 413 (preferably copper plates) and metal leads 412 are placed in the mold, and the molding material is injected into the mold by an injection molding machine (such as a transparent PC material) to form an insulating plate 411 by compression molding, reserve a plurality of grooves and holes H on the insulating plate 411, put LED chips in the grooves, and bond the LED chips with bonding wires ( Such as gold wire) and add phosphor and silica gel for encapsulation and fixation. This integrally formed process and structure can improve the production efficiency of the first bracket and simplify the interconnection between multiple insulating plates. This integrally formed first bracket can be attached to the above-mentioned second bracket with multiple slopes, or simply distributed in a fan shape on the planar metal bracket, which is within the expectation of the present invention.

In order to achieve a higher average color rendering index, that is, the red-yellow light ratio R ₉ (making it greater than 1), it is necessary to use red light to match the white light emitted by conventional white LED chips. The present invention achieves this effect through the following design: a plurality of blue LED chips packaged with "INTERM" phosphors excite white light with a color temperature of 2000K to 10000K, and then a plurality of blue LED chips packaged with one or more red phosphors Red light in the 630-660nm band is excited, and the generated white light and red light are mixed to obtain an improved white light with a red-yellow light ratio R ₉ >1. As shown in FIG. 3A , the LED chip 414 can be a blue chip that excites white light, and the LED chip 415 can be a blue chip that excites red light. This symmetrical layout can achieve uniform red light compensation. Although the figure shows that the ratio of the number of white light emitting chips to red light emitting chips is 3:1, the present invention is not limited thereto. In practical applications, the ratio of the number of chips that excite white light to those that excite red light can be in the range of 4:1 to 12:1, and is preferably 5:1. All LED chips in the present invention are low-priced blue-light chips, and expensive red-light chips are avoided, thereby saving costs.

For white LEDs, a more important parameter is the color rendering index (CRI). Although the above embodiment improves the color rendering index of the LED lamp to a certain extent through red light compensation, other color light compensations can be used to make the generated mixed white light closer to the light emitted by an ideal incandescent light source. In order to achieve this goal, another preferred embodiment of the present invention adds yellow-green light compensation on the basis of the above, that is, multiple blue LED chips encapsulated with "INTERM" phosphors excite white light with a color temperature of 2000K to 10000K, and then use red light to fluoresce One or more blue LED chips packaged with powder excite red light in the 630-660nm band, and one or more blue LED chips packaged with yellow-green phosphor powder excite yellow-green light, and the resulting white light, red light and yellow-green light are mixed to obtain high For white light with a color rendering index, the color rendering index CRI can be higher than 80, or even reach more than 90. As shown in Figure 3C, the LED chip 414 can be a blue chip that excites white light, the LED chip 415 can be a blue chip that excites red light, and the LED chip 415' can be a blue chip that excites yellow-green light. Although the figure shows that the ratio of the number of chips for exciting white light, red light and yellow-green light is 6:1:1, it should be understood that the present invention is not limited thereto. In practical applications, the ratio of the number of chips that excite white light, yellow light and yellow-green light can be in the range of (3-26):(1-3):(1-3), and is preferably 3:1:1. It should be noted that since this embodiment includes three light sources, and in the assembled lamp, the LED chip 415 is close to 416, and 415' is close to 416', so the three light sources can be arranged according to the manner shown in FIG. 3C, namely LED chips 415 and 416' are blue light chips that excite red light, while LED chips 415' and 416 are blue light chips that excite yellow-green light. In this way, roughly balanced excitation of white light, red light, and yellow-green light can be achieved in any local area. Avoid local concentration or loss of color light, so as to obtain uniform lighting effect. Of course, in practical applications, the arrangement of the illuminants of various colors is not limited to the forms shown in FIG. 3A and FIG. 3C , but generally the distribution of the three illuminants should be roughly uniform to achieve better light mixing.

The assembling manner of the light emitting module 4 will be described below with reference to FIG. 4 , FIG. 5A and FIG. 5B . 4 is a top view of the LED lamp shown in FIG. 2 , FIG. 5A is a schematic cross-sectional view of the light emitting module 4 along line A-A in FIG. 5 , and FIG. 5B is a schematic structural view of the fastening fitting 43 shown in FIG. 5A . As previously mentioned, the second bracket 42 is a metal (such as aluminum) casting, and its interior is a hollow cylinder, and a through hole is left in the lower part of the main body, so that the second bracket 42 can be fixed by means of fasteners such as screws passing through the through hole. The bracket 42 is fastened to the intermediate connecting body 5 . The insulating plate 411 and the second bracket 42 are fastened and connected through the joint configuration of the upper and lower parts. In the lower part, the protrusion P on the insulating plate 411 is inserted into the hole on the outer edge of the second bracket 42, and the protruding stopper P′ on the outer edge of the second bracket 42 abuts against the rib on the lower side of the insulating plate 411, The stable connection of the lower part is realized by this structure similar to a bolt; at the upper part, a through hole corresponding to the hole H on the insulating plate 411 is formed on the side of the second bracket 42, so that the insulating plate 411 can be fixed by fasteners such as screws. Fastened to the second bracket 42 . It should be noted that since the thickness of the insulating plate 411 and the side wall of the second bracket 42 are generally relatively thin compared to the length of the screw, a fastening fitting 43 is usually added inside to achieve a stable connection. The fastening fitting 43 can be made of plastic, and its structure is shown in FIG. 5B , which includes a plurality of cylinders adapted to the side of the second bracket 42 , and these cylinders are connected together for integral processing. Each column has a central hole H' corresponding to the hole H, so as to extend the effective length of the fixing screw and realize the fast connection between the insulating plate 411 and the second bracket 42.

Fig. 6 shows a schematic structural diagram of an LED lamp according to a second embodiment of the present invention, the LED lamp is roughly similar to the aforementioned structure, except that the intermediate connecting body is removed, and the second bracket is directly connected to the radiator, which is This structure can also achieve rapid heat transfer and obtain a better heat dissipation effect.

In order to comply with the international safety standards of lighting lamps, that is, no metal exposure is allowed to prevent leakage, an insulating shell can be added to the outside of the heat sink of the assembled LED lamp, or a layer of thermally conductive but insulating paint can be coated on the heat sink. To ensure that no metal is exposed and improve the safety performance of LED lights. In this case, the insulating case used may have a cage-like structure, which includes a plurality of ribs corresponding to the fin-like structure of the internal heat sink and spaced apart from each other to form air gaps to avoid hindering heat dissipation. The insulating shell can be formed by casting transparent or opaque plastic.

From the foregoing description, certain modifications and improvements will occur to those skilled in the art. The present invention is intended to cover the contents of the claims and any equivalents. The specific examples used herein are to aid in the understanding of the invention and are not to be used to limit the scope of the invention in a narrower manner than the claims and their equivalents. Additionally, while specific features of the invention have been described above with respect to some embodiments, these features may be combined with one or more other features of other embodiments, as may be desired for any given or particular application and favorable.

Claims (24)

1. A LED chip support, comprising: An insulating plate, the insulating plate is shaped with a chip-loading groove for placing LED chips; a metal strip embedded in the insulating plate and located under the groove so as to be in close contact with the LED chip; and metal leads for connecting said LED chip to a power circuit and connecting a plurality of said insulating plates; wherein the insulating plate, the metal strip and the metal lead are integrally formed into the chip holder by injection molding, Wherein the chip holder is used in conjunction with a metal holder, and the metal holder has a flat top surface or a plurality of inclined surfaces for supporting the chip holder. 2. The chip holder according to claim 1, wherein the insulating plate is trapezoidal, rectangular or triangular in shape. 3 . The chip holder according to claim 2 , wherein one or more than one row of grooves are provided on the insulating plate to accommodate chips and facilitate packaging. 4 . 4. The chip holder according to claim 1, wherein the metal strip is a copper plate with a thickness of 0.5mm-8mm, and is electroplated and polished. 5. The chip holder according to claim 1, wherein the insulating board is made of transparent PC material. 6 . The chip holder according to claim 1 , wherein the two sides of the insulating plate form a certain angle, and the degree of the angle is 30, 45, 60 or 75 degrees. 7 . The chip holder according to claim 1 , wherein a reflective layer is coated on the back of the insulating board to reflect light and increase luminous efficiency. 7 . 8. The chip holder according to claim 1, characterized in that: The metal bracket is an aluminum casting, and the inclination angles of its multiple inclined surfaces are in the range of 25-90 degrees. 9. A method of manufacturing a white LED lamp with a high color rendering index, comprising: Prepare chip support, metal support, radiator and internal power circuit; arranging a plurality of LED chips on the chip holder; and Assembling the chip holder, the metal holder, the heat sink and the internal power supply circuit together to form the LED lamp, It is characterized in that the chip holder is the chip holder according to any one of claims 1-8 formed by an integral injection molding process. 10. The method of claim 9, wherein: The step of arranging a plurality of LED chips on the chip holder includes: Arranging the first group of blue LED chips on the chip holder, and coating the first group of blue LED chips with a phosphor that uses blue light to excite white light; Arranging the second group of blue LED chips on the chip holder, and coating the phosphor powder that uses blue light to excite red light on the second group of blue LED chips. 11. The method of claim 10, wherein: The red-yellow light ratio _R9 of the white light generated by the LED lamp is higher than 1. 12. The method of claim 10, wherein: The ratio of the numbers of the first group of blue LED chips to the second group of blue LED chips is in the range of 4:1 to 12:1. 13. The method of claim 12, wherein: The ratio of the numbers of the first group of blue LED chips to the second group of blue LED chips is 5:1. 14. The method of claim 10, wherein arranging a plurality of LED chips on the chip holder comprises: Arranging the third group of blue LED chips on the chip holder, and coating the third group of blue LED chips with fluorescent powder that uses blue light to excite yellow-green light. 15. The method of claim 14, wherein: The color rendering index (CRI) of the white light generated by the LED lamp is higher than 80%. 16. The method of claim 14, wherein: The ratio of the numbers of the first group of blue LED chips, the second group of blue LED chips and the third group of blue LED chips is (3～26):(1～3):(1～3) within range. 17. The method of claim 16, wherein: The ratio of the numbers of the first group of blue LED chips, the second group of blue LED chips and the third group of blue LED chips is 3:1:1. 18. The method according to any one of claims 9-17, wherein the step of preparing the metal bracket and the heat sink comprises: A metal bracket with multiple slopes on the outside and a heat sink with multiple fin-like structures on the outside are cast from metal or alloy. 19. The method of claim 18, wherein: The metal is aluminum and the alloy is an aluminum alloy. 20. The method according to any one of claims 9-17, wherein the step of preparing the chip holder comprises: Place one or more copper plates and metal leads in the mold; Injecting molding material into the mold by using an injection molding machine to form the insulation board by compression molding; A plurality of grooves for arranging the LED chips and holes for fixedly connecting the metal bracket are reserved on the insulating plate. 21. The method of claim 20, wherein: The copper plate has a thickness of 0.5mm-8mm, and is electroplated and polished. 22. The method of claim 20, wherein: The molding material is a transparent PC material, and the two sides of the molded PC transparent part form an included angle of 45 degrees, and a reflective layer is coated on the back of the PC transparent part to reflect light and increase luminous efficiency. 23. The method of claim 20, wherein: The LED chip is placed in the groove, and is bonded to the metal lead by gold wire bonding, and then phosphor powder and silica gel are added for packaging and fixing. 24. The method of claim 20, wherein: The chip support, the metal support and the heat sink are fastened to each other by screws.