CN102792790A - Electromagnetic-shielding film, flexible substrate formed using same, and process for producing same - Google Patents
Electromagnetic-shielding film, flexible substrate formed using same, and process for producing same Download PDFInfo
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- CN102792790A CN102792790A CN2011800133192A CN201180013319A CN102792790A CN 102792790 A CN102792790 A CN 102792790A CN 2011800133192 A CN2011800133192 A CN 2011800133192A CN 201180013319 A CN201180013319 A CN 201180013319A CN 102792790 A CN102792790 A CN 102792790A
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 57
- 239000000843 powder Substances 0.000 claims abstract description 54
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- 229920005989 resin Polymers 0.000 claims abstract description 15
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 13
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- 230000001629 suppression Effects 0.000 description 9
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000004642 Polyimide Substances 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 241000555268 Dendroides Species 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 238000005452 bending Methods 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 229920005749 polyurethane resin Polymers 0.000 description 5
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Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/002—Inhomogeneous material in general
- H01B3/004—Inhomogeneous material in general with conductive additives or conductive layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0009—Casings with provisions to reduce EMI leakage through the joining parts
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Conductive Materials (AREA)
- Laminated Bodies (AREA)
Abstract
提供了电磁波屏蔽膜以及使用该膜形成电磁波屏蔽层的基板的制造方法，该电磁波屏蔽膜即使用于移动电话等的铰链部等频繁进行弯曲或滑动的部分，也长时间保持电磁波屏蔽效果。在将保护层层合于包含（A）金属粉和（B）粘结剂树脂的导电层而成的电磁波屏蔽膜中，导电层由含有（a）平均厚度50～300nm、平均粒径3～10μm的薄片状金属粉和（b）平均粒径3～10μm的针状或树枝状金属粉的导电性浆料形成。Provided is an electromagnetic wave shielding film that maintains an electromagnetic wave shielding effect for a long period of time even when it is used in a part that frequently bends or slides, such as a hinge portion of a mobile phone, and a method of manufacturing a substrate using the film to form an electromagnetic wave shielding layer. In the electromagnetic wave shielding film in which the protective layer is laminated on the conductive layer containing (A) metal powder and (B) binder resin, the conductive layer consists of (a) an average thickness of 50 to 300 nm, an average particle size of 3 to 10 μm flaky metal powder and (b) conductive paste of acicular or dendritic metal powder with an average particle size of 3 to 10 μm.
Description
Technical field
The present invention relates to electromagnetic shielding film, use its flexible base, board and manufacturing approach thereof.More particularly, even relate to the electromagnetic shielding film that also can keep electromagnetic shielding effect after long-term the slip, use this film to form the flexible base, board and the manufacturing approach thereof of electromagnetic wave shielding.
Background technology
All the time, flexible base, board (FPC) layer in the hinge that is disposed at mobile phone etc. closes electromagnetic shielding film and carries out electromagnetic wave shielding.As electromagnetic shielding film, use the electromagnetic shielding film have conductive layer and protective layer at least, this conductive layer is scattered in the electrically conductive adhesive (conductive paste) that resin glue forms by metal powder and forms.
Be accompanied by the slimming of mobile phone etc., such electromagnetic shielding film required and compared further filmization in the past, but reduce owing to shielding under the identical situation of other condition is accompanied by filmization, suppressing such reduction becomes problem.In addition, be used for the part of when using mobile phone, frequently carrying out bending or slip as the flexible base, board of electromagnetic wave shielding object, the problem that the shield effectiveness that generates electromagnetic waves along with service time is elongated reduces is also hoped its solution.
In order to improve all performances of electromagnetic shielding film, also carry out various studying intensively at aspects such as the shape of metallic or particle diameters.For example, disclose in the patent documentation 1 in order to improve conductivity, adherence and electromagnetic wave shielding performance, using the average grain diameter 0.5 μ m～silver particles of 20 μ m and the average grain diameter of primary particle in certain proportion is the granular silver particles below the 50 μ m.In addition; To disclose in the patent documentation 2 in order obtaining and to have satisfied conductive paste composition, the mixed-powder of the flakey silver powder of use average grain diameter 2.0～5.0 μ m and the dendroid silver-plated copper powder of average grain diameter 10～19 μ m the desired bending characteristic of flexible base, board.
But, even present situation is the electromagnetic shielding film that does not also obtain also keeping at the crooked of hundreds thousand of sub-levels or after sliding electromagnetic wave shielding performance.
The prior art document
Patent documentation
Patent documentation 1: the spy opens the 2005-294254 communique
Patent documentation 2: the spy opens the 2009-230952 communique
Summary of the invention
The problem that invention will solve
The present invention makes in view of the above; Purpose provides electromagnetic shielding film; Even this electromagnetic shielding film filmization also has excellent electromagnetic wave shielding performance; And such frequent part of carrying out repeated flex or slip such as the hinge that promptly is used in mobile phone etc. also keeps the electromagnetic wave shielding performance at initial stage for a long time.In addition, the purpose of this invention is to provide flexible base, board and the manufacturing approach thereof of using this film to form electromagnetic wave shielding.
The means that are used to deal with problems
Promptly; Electromagnetic shielding film of the present invention is in comprising the electromagnetic shielding film that (A) metal powder and (B) conductive layer of resin glue form with the protection laminated; In order to address the above problem, the needle-like of average grain diameter 3～10 μ m or the conductive paste of dendritic metal powder form above-mentioned conductive layer by the laminar metal powder that contains (a) average thickness 50～300nm, average grain diameter 3～10 μ m with (b).
In above-mentioned electromagnetic shielding film; Preferably; (A) ratio of metal powder and (B) resin glue is by weight be (but press the solid conversion) in A:B=50:50～80:20 scope, and said (a) laminar metal powder and (b) ratio of needle-like or dendritic metal powder by weight being in a:b=20:80～80:20 scope.
The manufacturing approach of flexible base, board of the present invention is through on flexible base, board, loading the electromagnetic shielding film of the invention described above; In that this electromagnetic shielding film is heated in the thickness direction pressurization with flexible base, board, on flexible base, board, form electromagnetic wave shielding thus then.
In addition, flexible base, board of the present invention is the flexible base, board with electromagnetic wave shielding of the electromagnetic shielding film that comprises the invention described above.
The invention effect
Electromagnetic shielding film of the present invention has excellent electromagnetic shielding effect; Using this electromagnetic shielding film that electromagnetic wave shielding is arranged under the situation of flexible base, board, even obtain also keeping at the crooked of hundreds thousand of sub-levels or after sliding the effect of electromagnetic wave shielding with high level.
In addition, the manufacturing approach of the substrate through possessing electromagnetic wave shielding of the present invention easily obtains possessing the flexible base, board of electromagnetic wave shielding, and this electromagnetic wave shielding keeps the electromagnetic shielding effect of above-mentioned excellence for a long time.
Description of drawings
Fig. 1 is the schematic end view drawing that the assay method of film resistor is shown.
Fig. 2 is the schematic end view drawing that the assay method that connects resistance is shown, and (b) is the partial enlarged drawing of (a).
Fig. 3 is the schematic end view drawing that the method for sliding test is shown.
Embodiment
Face electromagnetic shielding film of the present invention down and use the manufacturing approach of its flexible base, board to be elaborated.
As stated, electromagnetic shielding film of the present invention is characterised in that to have conductive layer and the protective layer that comprises metal powder and resin glue at least, as metal powder, with laminar metal powder and needle-like or dendritic metal powder and usefulness.
" laminar metal powder " of the present invention normally is called the metal powder of flakey or sheet etc.With the crushing of the particle of different shape, break into pieces and the scaled metal powder that forms because favourable aspect cost and the productivity and use suitably.
The kind of the metal of laminar metal powder is gold, silver, silver-plated copper, copper, nickel etc., wherein preferred silver, silver-plated copper.In addition, for the size of this laminar metal powder, preferably average thickness is that 50～300nm and average grain diameter are the scope of 3～10 μ m.Reduce if average thickness greater than 300nm, is difficult to take place the fusing point of laminar metal powder, if average thickness less than 50nm production cost significantly rise.In addition, if average grain diameter is greater than 10 μ m then dispersed the reduction, if average grain diameter is less than 3 μ m, in the tendency that metal powder is low to exist conductivity to reduce when filling.
On the other hand, for " needle-like or dendritic metal powder ", no matter needle-like, dendroid (dendrimer) or their mixture all can.At this, so-called dendroid is not limited to have and clearly is identified as dendritic part, comprises the metal powder of protuberance that granule candy (the flat sugar of gold) that kind has the metal powder of projection or has the shape of different sizes.The kind of the metal of this needle-like or dendritic metal powder with above-mentioned the same be gold, silver, silver-plated copper, copper, nickel etc., wherein preferred silver-plated copper.For size, preferably average grain diameter is the scope of 3～10 μ m.If average grain diameter is greater than 10 μ m, the film change of screened film difficulty, if average grain diameter less than 3 μ m, the formation of the shape for lugs of metal powder becomes difficulty.
The average grain diameter of above-mentioned metal powder or average thickness can be measured through the laser diffraction and scattering method.
Through with above-mentioned laminar metal powder and needle-like or dendritic metal powder and use; With any side of independent use in them situation or with the situation of other combination of shapes (for example; With the situation of laminar metal powder with spherical metal powder and usefulness) compare, confirm to significantly improve continuation for the electromagnetic shielding effect of repeated flex, slip.Shield effectiveness is along with the time reduces according to thinking because film is out of shape the metallic contact condition deterioration each other that causes conductive layer repeatedly in the prior art; And infer that under the situation of above-mentioned that kind needle-like or the generation of dendritic metal powder partly penetrate the physical bond of laminar metal powder etc. with laminar metal powder and needle-like or dendritic metal powder and usefulness.And; According to thinking the operation that is described below and heats when process is pressurizeed; Melts combine takes place or based on the firm combination of this melts combine in metal powder each other, and according to think through after the flexible electrode stated levelling (は ん だ リ ヮ ロ one) operation again, this combination becomes more firm.
Preferably, above-mentioned laminar metal powder (a) and needle-like or dendritic metal powder (b) are by weight using with the ratio in the scope of a:b=20:80～80:20.If with respect to laminar metal powder, the ratio of needle-like or dendritic metal powder is outside above-mentioned scope, and the reduction of the conductivity crooked, that slip causes becomes big.Be that shield effectiveness significantly reduces.
Secondly, as resin glue, can especially restrictedly not use thermosetting resins such as epoxy resin, polyurethane resin, acrylic resin, polyimide resin, phenolic resins, melamine resin.Wherein, polyurethane resin uses because pliability is excellent suitably.
The cooperation ratio of above-mentioned (A) metal powder and (B) resin glue is by weight the scope that is preferably A:B=50:50～80:20 (but press the solid conversion), the more preferably scope of A:B=55:45～70:30.If metal powder is less than 50 weight %, the appearance of the conductivity difficulty that becomes, if more than 80 weight % pliability or adherence reduce.
The method of being made electromagnetic shielding film by above-mentioned metal powder and resin glue does not receive special restriction, and for example modulation comprises the slurry of above-mentioned metal powder and resin glue, coats peeling paper and forms the film that becomes conductive layer.The thickness of this film is preferably 8～28 μ m, after preferably become 5～25 μ m behind the suppression process stated.If it is not the 5 μ m of the thickness less than behind the suppression process are difficult to obtain sufficient electromagnetic wave shielding performance,, preferred owing to the requirement of filmization if surpass 25 μ m.
For above-mentioned conductive layer, as required, can in the scope that does not depart from the object of the invention, add known additive.As the instance of additive, enumerate fire retardant, levelling agent, viscosity modifier etc.As fire retardant, can use the fire retardant of mineral-type such as Phosphorus or organic type suitably.
Close in the film that constitutes above-mentioned conductive layer through the rete that will constitute protective layer, obtain electromagnetic shielding film of the present invention.Perhaps, can form the film that constitutes protective layer earlier, the rete that will constitute conductive layer again closes in this film.
The film that constitutes protective layer can pass through formation such as epoxy resin, polyurethane resin.In addition, the case hardness of protective layer is that H～4H is preferred by pencil hardness,, also can hard conating layers such as acrylic acid series be closed in the layer that comprises epoxy resin or polyurethane resin as required for this reason.If the case hardness of protective layer is pressed pencil hardness less than H, be with flaw easily, on the other hand,, there is the risk that pliability diminishes, sliding properties reduces if greater than 4H.
In addition, the thickness that constitutes the film of this protective layer is preferably 3～15 μ m, after preferably become 2～12 μ m behind the suppression process stated.If the 2 μ m of the thickness less than behind the suppression process are as the undercapacity of protective layer, if surpass 12 μ m, not preferred owing to the requirement of filmization.
Further, whole as electromagnetic shielding film, after thickness before the suppression process stated be preferably 11～30 μ m, be preferably 7～28 μ m behind the suppression process.
Secondly; Manufacturing approach as flexible base, board of the present invention; Can be through on flexible base, board, loading the electromagnetic shielding film of the invention described above, the suppression process through heating in the pressurization under the pressure of 1～5MPa forms electromagnetic wave shielding on flexible base, board.Heating-up temperature in the suppression process is preferably 140～200 ℃.
In addition, through supplying with flexible electrode levelling operation again, sliding properties is further improved by leaps and bounds by the flexible base, board that above-mentioned suppression process has formed electromagnetic wave shielding.The flexible electrode implementation condition of levelling operation does not more receive special restriction so long as the condition of flexible electrode fusing gets final product, and is generally in about 260 ℃ of about 4 seconds.Because metal reduces because of the filmization fusing point; Even the laminar metal powder that the present invention uses for example fusing point is silver-colored such refractory metal of 962 ℃; Through also fusion of levelling operation again, above-mentioned melts combine takes place or based on the firm combination of this melts combine in this temperature range.
Need to prove, in order to ensure with the adherence of flexible base, board as the lining object, it is the bonding force more than the 2N by 180 ° of peel strengths that electromagnetic shielding film of the present invention preferably has for polyimides.
Embodiment
Embodiments of the invention are shown below, but the present invention is not limited by the following examples.
[embodiment, comparative example]
Through the thickness coating epoxy with 6 μ m on mold release film is resin and dry, is coated with acrylic acid series hard conating liquid and dry above that, forms to comprise the protective layer that epoxy is 2 layers of structure of soft formation and acrylic acid series hard conating (afterwards stating the symbol 1 among Fig. 1,2).The conductive paste of table 1, the preparation of the proportioning shown in 2 is pressed in coating on this protective layer, forms conductive layer (symbol 2 among same Fig. 1,2) through drying, obtains electromagnetic shielding film.The electromagnetic shielding film that use obtains carries out following evaluation.The resin glue that uses and the details of metal powder are described below.
Resin glue: industry (strain) system of refining big day, polyurethane resin UD1357
Metal powder: (a) flakey silver powder: average thickness 100nm, average grain diameter 5 μ m, about 250 ℃ of fusing point.(b) dendroid silver-plated copper powder: average grain diameter 5 μ m.
But, in comparative example 3, use spherical silver-plated copper powder (average grain diameter 6～7 μ m) to replace the dendroid silver-plated copper powder.
(1) film resistor
Electrode A, B (electrode area: 1cm with the cubic shaped shown in Fig. 1
2(L1=L2=L3=1cm); Electrode gap d:1cm, electrode surface: gold-plated processing) load on conductive layer 2, each electrode is applied in a direction indicated by the arrow the load of 4.9N; Measure the interelectrode resistance value of A-B with 4 terminal methods, begun value after 1 minute as film resistor with mensuration.The mensuration atmosphere temperature is normal temperature (18～28 ℃), uses the cutting sample of 249mm * 50mm during mensuration.The test number is that the mean value of n=5 is shown in table 1.
(2) 180 ° of peel strengths
The conductive layer side of above-mentioned electromagnetic shielding film is passed through polyimide film (eastern レ デ ュ Port Application (strain) system; カ プ ト Application 100H(trade name)) be attached at breadboard; Also polyimide film (being カ プ ト Application 100H equally) is attached at the protective layer side, tears from polyimide film with 50mm/ minute speed by bond layer.The test number is that the mean value of n=5 is shown in table 1.
(3) connect resistance
Above-mentioned electromagnetic shielding film is loaded on flexible printed board (thickness 53.5 μ m); In with the exert pressure of 3MPa, heated 30 minutes at 170 ℃; Process the evaluation of the flexible printed board (FPC) that possesses electromagnetic wave shielding and use sample; It has Fig. 2 (a) and (b) shown in section configuration, after this carry out No. 5 flexible electrodes levelling again.At Fig. 2 (a) with (b), the protective layer of symbol 1 expression electromagnetic shielding film, symbol 2 its conductive layers of expression.In addition; The polyimide layer (thickness 12.5 μ m) of symbol 3 expression FPC; Symbol 4 expression copper layers (Cu:18 μ m), symbol 5 expression no electrolytic nickel-gold plates (Ni:3～5 μ m, Au:0.05～0.1 μ m); Symbol 6 expression bond layers (thickness 35 μ m), symbol 7 expression polyimide layers (thickness 25 μ m).A is the diameter of grounded part.(b) be the enlarged drawing of the grounded part in (a).The diameter (a) of measuring grounded part is respectively the resistance value R (connection resistance) under the situation of 0.5mm φ, 0.8mm φ, 1.0mm φ.The test number is that the mean value of n=5 is shown in table 1,2.
(4) sliding properties
With polyimide layer (12.5 μ m), bond layer (15 μ m), copper foil layer (12 μ m) and polyimide layer (12.5 μ m) from last in this order the layer upper and lower surface layer that closes the FPC13 of 4 layers of structure that form close electromagnetic wave shielding 14,15 (length 100mm; Width 12mm), process evaluation and use sample.With this evaluation with sample in the length direction bending so that the upside of FPC13 becomes the inboard; As shown in Figure 3 with fixed head 11 and sliding panel 12 clampings (bending radius b:1.0mm); Be connected with terminal (not shown) through the length direction both ends of Copper Foil (wide 10mm) the conductive layer of electromagnetic shielding film 14,15; Measure the resistance value of these films 14,15 respectively, as the initial resistance of screen.With the stain be continuously basic point back and forth advance in the direction of arrow (slip amplitude 50mm (c=c '=25mm), 60 back and forth/minute), the reciprocal travel times (back and forth being " once ") when recording screen resistance and reaching 100 Ω is as " sliding properties ".In addition, to above-mentioned evaluation with test supply with flexible electrode again the sample after the levelling operation 3 times also carry out same test.The result is shown in the table 1,2.In table, " interior bending " expression becomes the resistance value of electromagnetic shielding film 15 of the inboard of FPC13 when crooked, and " outside sweep " expression becomes the resistance value of electromagnetic shielding film 15 in the outside of FPC13.
Table 2
Industrial applicibility
Electromagnetic shielding film of the present invention is used for suitably generally packing into and has the flexible base, board of the equipment such as digital camera of bend or sliding part beyond the mobile phone.
Symbol description
3,7 polyimide layers, 4 bronze medal layers
5 nickel-gold plate 6 bond layers
11 fixed heads, 12 sliding panels
13 FPC, 14,15 electromagnetic shielding films
Claims (4)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010-054587 | 2010-03-11 | ||
| JP2010054587A JP5528857B2 (en) | 2010-03-11 | 2010-03-11 | Electromagnetic wave shielding film, flexible substrate using the same, and method for producing the same |
| PCT/JP2011/001102 WO2011111324A1 (en) | 2010-03-11 | 2011-02-25 | Electromagnetic-shielding film, flexible substrate formed using same, and process for producing same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102792790A true CN102792790A (en) | 2012-11-21 |
| CN102792790B CN102792790B (en) | 2017-12-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180013319.2A Expired - Fee Related CN102792790B (en) | 2010-03-11 | 2011-02-25 | Electromagnetic shielding film, flexible base board and its manufacture method using it |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5528857B2 (en) |
| KR (1) | KR101751564B1 (en) |
| CN (1) | CN102792790B (en) |
| TW (1) | TWI526150B (en) |
| WO (1) | WO2011111324A1 (en) |
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- 2011-02-25 WO PCT/JP2011/001102 patent/WO2011111324A1/en active Application Filing
- 2011-02-25 KR KR1020127022770A patent/KR101751564B1/en active Active
- 2011-02-25 CN CN201180013319.2A patent/CN102792790B/en not_active Expired - Fee Related
- 2011-03-08 TW TW100107719A patent/TWI526150B/en active
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| JP2008078677A (en) * | 2001-06-29 | 2008-04-03 | Tatsuta Electric Wire & Cable Co Ltd | Shield flexible printed wiring board |
| JP2005294254A (en) * | 2004-03-12 | 2005-10-20 | Sumitomo Electric Ind Ltd | Conductive silver paste and electromagnetic wave shielding member using the same |
| JP2009230952A (en) * | 2008-03-21 | 2009-10-08 | Fukuda Metal Foil & Powder Co Ltd | Conductive paste composition, electronic circuit, and electronic parts |
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| CN105744818A (en) * | 2016-02-03 | 2016-07-06 | 中电海康集团有限公司 | Flexible magnetic shielding and anti-irradiation film |
| CN107914435A (en) * | 2016-10-10 | 2018-04-17 | 昆山雅森电子材料科技有限公司 | A kind of multilayer Anisotropically conductive glued membrane and preparation method thereof |
| CN108300360A (en) * | 2016-10-10 | 2018-07-20 | 昆山雅森电子材料科技有限公司 | Profiled metal particle conductive glued membrane and preparation method thereof |
| CN107914435B (en) * | 2016-10-10 | 2019-10-29 | 昆山雅森电子材料科技有限公司 | A kind of multilayer Anisotropically conductive glue film and preparation method thereof |
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| CN108913057B (en) * | 2017-03-27 | 2023-11-10 | 昆山雅森电子材料科技有限公司 | Multilayer anisotropic conductive cloth adhesive and manufacturing method thereof |
| CN115867626A (en) * | 2022-03-30 | 2023-03-28 | 东洋油墨Sc控股株式会社 | Adhesive for metal plate, reinforcing member for printed wiring board and method for producing same, and wiring board and method for producing same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011187895A (en) | 2011-09-22 |
| TW201206334A (en) | 2012-02-01 |
| CN102792790B (en) | 2017-12-19 |
| TWI526150B (en) | 2016-03-11 |
| KR20130004903A (en) | 2013-01-14 |
| WO2011111324A1 (en) | 2011-09-15 |
| KR101751564B1 (en) | 2017-06-27 |
| JP5528857B2 (en) | 2014-06-25 |
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