CN102768601A - Touch panel and manufacturing method thereof - Google Patents

Abstract

The invention relates to a touch panel and a manufacturing method thereof. The manufacturing method of the touch panel comprises the steps of preparing a transparent conductive film with a conductive electrode pattern distributed on one surface, and applying an in-mold decoration technology to form a transparent cover plate in an injection molding mode, and enabling the transparent conductive film to face the transparent cover plate through the conductive electrode pattern and be combined with one surface of the transparent cover plate. Therefore, the technical scheme provided by the invention can simplify the structural layer number of the touch panel, reduce the manufacturing cost, thickness and process complexity of the touch panel and is very practical.

Description

Touch panel and manufacturing method thereof

technical field

The present invention relates to a touch panel, in particular to a capacitive touch panel.

Background technique

Referring to Fig. 1 and Fig. 2, when manufacturing a capacitive touch panel 1 in the past, a conductive thin film (ITO) 10 is plated on a substrate 11 by a semiconductor process, such as PET (polyethylene terephthalate). ester), glass or PMMA (polymethyl methacrylate) substrate, and then form the required conductive electrode pattern 12 on the conductive film 10 by etching, and then use optical glue 13 to cover a protective cover (cover lenses) 14 are stacked and adhered on the substrate 11 so as to interpose the conductive film 10 between the substrate 11 and the protective cover 14 to form the touch panel 1 .

In addition, when making the protective cover 14, since the upper surface of the protective cover 14 needs to form a pattern (black paint) 15 with a visual barrier effect to cover the conductive film 10 extending to the surrounding wires 16 of the substrate 11, Therefore, in-mold decoration molding (In-Mold Decoration, referred to as IMD) technology is usually used to combine the pre-made pattern (black paint) 15 on the upper surface of the protective cover 14 while injecting the protective cover 14. around.

However, the manufacturing method of the above-mentioned touch panel 1 requires the use of two sets of processes, the semiconductor process and the IMD process, and the required cost, panel thickness and complexity are high. Therefore, if the semiconductor process can be omitted, and the IMD method can be directly used for manufacturing The integrated touch panel will greatly reduce the manufacturing cost, thickness and structural complexity of the touch panel.

In view of the above-mentioned defects in the existing production of touch panels, the inventor, based on his rich practical experience and professional knowledge in the design and manufacture of such products for many years, and in conjunction with the application of academic principles, actively researched and innovated, in order to create a new type of structure The touch panel and the manufacturing method thereof can improve the general existing touch panel and make it more practical. Through continuous research, design, and after repeated trial samples and improvements, the present invention with practical value is finally created.

Contents of the invention

The purpose of the present invention is to overcome the existing defects in the production of touch panels and provide a touch panel and its manufacturing method. The technical problems to be solved are: simplify the number of structural layers and reduce manufacturing costs, thickness and process complexity Spend.

In order to achieve the above object, the manufacturing method of the touch panel of the present invention comprises (A) preparing a transparent conductive film, and a conductive electrode pattern is arranged on one side thereof; At the same time, the transparent conductive film faces the transparent cover with the conductive electrode pattern and is bonded to one side of the transparent cover.

The object of the present invention and the solution to the prior technical problems can also be further realized by adopting the following technical means.

Preferably, in step (A), the transparent conductive film comprises a light-transmitting film, and the conductive electrode pattern is formed on the light-transmitting film by physical reactive deposition or chemical wet reactive deposition of sputtering or evaporation superior.

Preferably, in step (B), an in-mold transfer printing technique is used to bond the transparent conductive film to one side of the transparent cover that is simultaneously injection molded.

Preferably, in step (B), the transparent conductive film is placed in an injection mold of an injection molding machine with the conductive electrode pattern facing up by applying in-mold labeling or in-mold film technology, and then injection-molded the A transparent cover plate, the transparent conductive film is bonded to one side of the transparent cover plate with the conductive electrode pattern facing inward.

Preferably, in the step (B), a shielding pattern is formed around the other side of the transparent cover plate by a double injection technique.

Preferably, the transparent cover is made of PET, PMMA or glass.

Preferably, in step (B), when the transparent cover is injection-molded, at least one connecting seat on which a connecting element or a control element can be provided is also formed on the transparent cover.

Preferably, the conductive electrode pattern of the transparent conductive film includes a plurality of first electrode columns arranged along a first direction, and the method further includes a step (C), and then attaching another transparent conductive film to the above transparent On the side of the conductive film facing away from the transparent cover plate, and on the side of the other transparent conductive film facing the above-mentioned transparent conductive film, another conductive electrode pattern is arranged, which includes a pattern along a direction approximately perpendicular to the first direction. A plurality of second electrode rows arranged in the second direction and staggered from the first electrode row.

Furthermore, a touch panel manufactured by the above method in the present invention includes a transparent conductive film and a transparent cover. One side of the transparent conductive film is provided with a conductive electrode pattern, the transparent cover is covered on the transparent conductive film, and the conductive electrode pattern faces the transparent cover and is combined with one side of the transparent cover; wherein the transparent cover is Simultaneously with injection molding, the transparent conductive film is bonded to one side of the transparent cover plate with the conductive electrode pattern facing the transparent cover plate using in-mold decoration technology.

The object of the present invention and the solution to the prior technical problems can also be further realized by adopting the following technical means.

Preferably, the transparent conductive film includes a light-transmitting film, and the conductive electrode pattern is formed on the light-transmitting film by physical reactive deposition or chemical wet reactive deposition by sputtering or vapor deposition.

Preferably, the transparent conductive film is bonded to one side of the transparent cover that is simultaneously injection molded by an in-mold transfer printing technique.

Preferably, the transparent conductive film is bonded to one side of the transparent cover by an in-mold labeling or in-mold film technique.

Preferably, a shielding pattern is also formed around the other surface of the transparent cover.

Preferably, at least one connection seat on which a connection element or a control element can be arranged is formed on the transparent cover.

Preferably, the conductive electrode pattern of the transparent conductive film includes a plurality of first electrode columns arranged along a first direction, and the touch panel further includes another transparent conductive film, which is bonded to the above-mentioned transparent conductive film. On the side facing away from the transparent cover plate, and on the side of the other transparent conductive film facing the above-mentioned transparent conductive film, another conductive electrode pattern is arranged, which includes a second direction approximately perpendicular to the first direction A plurality of second electrode columns arranged and staggered from the above-mentioned first electrode columns.

The effect of the present invention is to combine the pre-prepared transparent conductive film on one side of the transparent cover to form a touch panel while injecting the transparent cover through the in-mold decoration technology, and to form a touch panel through the double-material injection technology. A masking pattern is formed on the upper surface of the injected transparent cover, which simplifies the number of structural layers of the capacitive touch panel, reduces the manufacturing cost, thickness and process complexity of the touch panel, and achieves the effect and purpose of the present invention.

Description of drawings

FIG. 1 is a schematic side view of components of a conventional capacitive touch panel.

FIG. 2 is a three-dimensional schematic diagram of components of a capacitive touch panel manufactured in the prior art.

FIG. 3 is a flow chart of the first embodiment of the manufacturing method of the touch panel of the present invention.

FIG. 4 is a schematic diagram of the manufacturing process of the touch panel by the in-mold decoration technique according to the first embodiment.

FIG. 5 is a schematic diagram of a conductive electrode pattern of the transparent conductive film of the first embodiment.

FIG. 6 is a schematic diagram of the touch panel and the transparent cover of the first embodiment.

FIG. 7 is a schematic diagram of a touch panel manufactured by the second embodiment of the method for manufacturing a touch panel of the present invention.

FIG. 8 shows the conductive electrode pattern on the first transparent conductive film of the second embodiment.

FIG. 9 shows the conductive electrode pattern on the second transparent conductive film of the second embodiment.

Detailed ways

In order to further explain the technical means and effects adopted by the present invention to achieve the intended purpose of the invention, below in conjunction with the drawings and preferred embodiments, the specific implementation, structure, features, The process and its effects are described in detail below.

Referring to Fig. 3 and Fig. 4, it is the first preferred embodiment of the manufacturing method of the touch panel of the present invention. First, as shown in step 21 of Fig. 3, a transparent conductive film 31 is first prepared, which includes a light-transmitting The film 32 is made of thermoplastic polymer or ester, such as PET or PMMA plastic film, and a conductive electrode pattern 33 is arranged on one side of the transparent film 32 . The conductive electrode pattern 33 may be a one-dimensional conductive electrode structure with a plurality of electrodes 331 as shown in FIG. 5 , or other existing one-dimensional conductive electrode structures, but is not limited thereto. And the conductive electrode pattern 33 can be formed on the light-transmitting film 32 by physical reactive deposition (PVD) or chemical wet reactive deposition (CVD) of sputtering or vapor deposition, but not limited to the above methods.

Then, perform step 22, applying in-mold decoration technology (IMD) to inject and mold a transparent cover plate 34, and at the same time, combine the transparent conductive film 31 on one side of the transparent cover plate 34, so as to interpose the conductive electrode pattern 33 on the light-transmitting film 32 and the transparent cover 34. The detailed process is described below.

In-mold decoration technology is usually divided into three methods, namely In-Mold Transfer/In-Mold Roller (IMR for short), In-Mold Film (IMF for short) and In-mold labeling (In-Mold Roller). -Mold Label, referred to as IML), this embodiment is then made with in-mold transfer printing technology, that is, the transparent conductive film 31 is made into a roll (Roller), and then as shown in Figure 4, by sending A film machine (not shown) attaches the transparent conductive film 31 to the inner cavity of a plastic mold, and transfers (transfers) the conductive electrode pattern 33 on the transparent conductive film 31 to the surface of the injection-molded transparent cover plate 34 during injection molding. The light-transmitting film 32 is left on the transparent cover plate 34, so that it can be used as a protective film for the conductive electrode pattern 33, that is, a touch panel 3 that does not require a substrate, and the transparent conductive film 31 and the transparent cover plate 34 are integrally formed. .

Thereby, as shown in FIG. 4 , the touch panel 3 of this embodiment includes a transparent conductive film 31, which includes a light-transmitting film 32 and a conductive electrode pattern 33 arranged on the upward surface of the light-transmitting film 32, and covers the A transparent cover plate 34 on the conductive electrode pattern 33 of the transparent conductive film 31 . Moreover, the material of the transparent cover 34 can be made of transparent materials including PET (polyethylene terephthalate), PMMA (polymethylmethacrylate) or glass.

Furthermore, since a layer of visual barrier pattern (black paint) needs to be formed around the upper surface of the transparent cover 34 to cover the wires 332 and contacts 333 extending from the conductive electrode pattern 33 to the periphery of the transparent cover 34, therefore, Before performing in-mold transfer (IMR), a double-material mold capable of injecting two materials (double injection) can be prepared in advance, and the transparent cover 34 can be injected on the transparent cover 34 at the same time. A pattern (black paint) as shown in Figure 6 was formed around the surface.

And, as shown in FIG. 6, before the injection molding of the transparent cover plate 34, a connection element can be designed on the mold, such as a row of wires or a control element, such as a structure of a control chip, so that through When the mold injection molds the transparent cover plate 34, a connection seat (that is, a connection port) that can be provided with a connecting element (cable) or a control element (control chip) is formed on the transparent cover plate 34 at a position corresponding to the above-mentioned contact point 333, such as a The groove 341 or a plurality of through holes (vias) corresponding to the above-mentioned contacts 333 (not shown).

In addition, in this embodiment, the touch panel 3 can also be manufactured by in-mold lamination (IML), that is, the transparent conductive films 31 are prepared one by one, and each time a transparent conductive film 31 is placed in the injection molding machine. Inject the transparent cover plate 34 into the injection mold, so that the transparent conductive film 31 is closely combined on the transparent cover plate 34, and the light-transmitting film 32 is coated on the outer surface of the conductive electrode pattern 33, which has wear resistance and scratch resistance. effect. Similarly, when the transparent cover 34 is injected by IML, a shielding pattern can be made around the upper surface of the transparent cover 34 by means of the above-mentioned double injection mold.

In addition, in this embodiment, the touch panel 3 can also be manufactured by in-mold labeling (IML), that is, the transparent conductive film 31 is cut into individual sheets, and the individual transparent conductive films 31 are put into the mold one by one by a mechanical arm. In the mold cavity, the transparent conductive film 31 and the injection-molded transparent cover 34 are combined into one by using the temperature of the extruded plastic during injection molding, so that the transparent conductive film 31 is firmly embedded on the surface of the transparent cover 34 . And the hardened light-transmitting film 32 coated on the outer surface of the conductive electrode pattern 33 has the functions of wear resistance and scratch resistance. Similarly, while the transparent cover 34 is molded by in-mold labeling, a masking pattern can be formed around the upper surface of the transparent cover 34 by means of the above-mentioned double injection molding technique.

Referring again to FIG. 7 to FIG. 9 , it is the second preferred embodiment of the manufacturing method of the touch panel of the present invention. The conductive electrode pattern 33' on the first transparent conductive film 31' includes a plurality of first electrode rows 330 arranged along a first direction as shown in FIG. electrode 331', and in this embodiment, after the first transparent conductive film 31' is combined on the surface of the transparent cover plate 34 by the above-mentioned in-mold decoration technology, a further processing step is performed, and the first transparent conductive film 31' and the transparent cover A second transparent conductive film 36 is pasted on the side facing away from the plate 34, and another conductive electrode pattern 37 is arranged on the side facing the first transparent conductive film 31' of the second transparent conductive film 36, which includes A plurality of second electrode rows 370 are arranged along a second direction approximately perpendicular to the first direction and are staggered from the first electrode row 330, and each second electrode row 370 includes a plurality of conductive electrode 371 . Thereby, a touch panel 3' having a two-dimensional conductive electrode structure is formed.

To sum up, in the above embodiment, the transparent cover plate is injection-molded by the in-mold decoration technology, and the pre-prepared transparent conductive film 31 is combined on one side of the transparent cover plate to form a touch panel, and the double-material injection is used to form a touch panel. Mold technology makes a masking pattern on the upper surface of the transparent cover plate 34 injected by injection molding, which simplifies the structural layers of the capacitive touch panel, reduces the manufacturing cost, thickness and process complexity of the touch panel, and indeed achieves the goal of the present invention. efficacy and purpose.

The above description is only a preferred embodiment of the present invention, and does not limit the present invention in any form. Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Anyone familiar with this field Those skilled in the art, without departing from the scope of the technical solution of the present invention, may use the method and technical content disclosed above to make some changes or modifications to equivalent embodiments with equivalent changes, but if they do not depart from the technical solution of the present invention, Any simple modifications, equivalent changes and modifications made to the above embodiments according to the technical essence of the present invention still fall within the scope of the technical solutions of the present invention.

Claims (18)

1. contact panel manufacturing approach is characterized in that:

This contact panel manufacturing approach comprises:

(A) preparation one transparent conductive film, it simultaneously is laid with a conductive electrode pattern; And

(B) use decoration technique inside mold in ejection formation one transparent cover plate, this transparent conductive film is incorporated into the one side of this transparent cover plate with this conductive electrode pattern towards this transparent cover plate.

2. contact panel manufacturing approach as claimed in claim 1; It is characterized in that: in step (A); This transparent conductive film comprises a light transmission film, and this conductive electrode pattern is that physical reactions property deposition or chemical wet reactive deposition with sputter or vapor deposition is formed on this light transmission film.

3. contact panel manufacturing approach as claimed in claim 1 is characterized in that: in step (B), be to use the in-mold transfer printing technology this transparent conductive film is incorporated into the one side of this transparent cover plate of ejection formation simultaneously.

4. contact panel manufacturing approach as claimed in claim 1; It is characterized in that: in step (B); Be that Filming Technology is placed in this transparent conductive film up in the injection mold of one Jet forming machine with this conductive electrode pattern in application in-mold label or the mould; This transparent cover plate of injection mo(u)lding makes this transparent conductive film be incorporated into the one side of this transparent cover plate inwardly with this conductive electrode pattern again.

5. contact panel manufacturing approach as claimed in claim 1 is characterized in that: in step (B), also around the another side of this transparent cover plate, form one with an extra quality emission technology and cover pattern.

6. contact panel manufacturing approach as claimed in claim 1 is characterized in that: the material of this transparent cover plate comprises polyethylene terephthalate, polymethylmethacrylate or glass.

7. contact panel manufacturing approach as claimed in claim 1 is characterized in that: in step (B), when this transparent cover plate of ejection formation, also on this transparent cover plate, form at least one Connection Block that a Connection Element is set.

8. contact panel manufacturing approach as claimed in claim 1 is characterized in that: in step (B), when this transparent cover plate of ejection formation, also on this transparent cover plate, form at least one Connection Block that a control element is set.

9. contact panel manufacturing approach as claimed in claim 1; It is characterized in that: the conductive electrode pattern of this transparent conductive film comprises a plurality of first electrodes series of arranging along a first direction; And this method also comprises a step (C); Another transparent conductive film fit again in the one side back to this transparent cover plate of above-mentioned this transparent conductive film; And this another transparent conductive film on the one side of above-mentioned this transparent conductive film, be laid with another conductive electrode pattern, it comprises along one and generally is the arrangement of vertical second direction with this first direction, and a plurality of second electrodes series that stagger mutually with above-mentioned first electrodes series.

10. contact panel is characterized in that:

This contact panel comprises:

One transparent conductive film, it simultaneously is laid with a conductive electrode pattern; And

One transparent cover plate is covered on this transparent conductive film, and this conductive electrode pattern is incorporated into the one side of this transparent cover plate towards this transparent cover plate; Wherein this transparent cover plate is in ejection formation, uses decoration technique inside mold is incorporated into this conductive electrode pattern this transparent conductive film this transparent cover plate towards this transparent cover plate one side.

11. contact panel as claimed in claim 10 is characterized in that: this transparent conductive film comprises a light transmission film, and this conductive electrode pattern is formed on this light transmission film by physical reactions property deposition or chemical wet reactive deposition with sputter or vapor deposition.

12. contact panel as claimed in claim 10 is characterized in that: this transparent conductive film is incorporated into the one side of this transparent cover plate of ejection formation simultaneously with an in-mold transfer printing technology.

13. contact panel as claimed in claim 10 is characterized in that: this transparent conductive film is incorporated into the one side of this transparent cover plate by Filming Technology in an in-mold label or the mould.

14. contact panel as claimed in claim 10 is characterized in that: also form one around the another side of this transparent cover plate and cover pattern.

15. contact panel as claimed in claim 10 is characterized in that: the material of this transparent cover plate comprises polyethylene terephthalate, polymethylmethacrylate or glass.

16. contact panel as claimed in claim 10 is characterized in that: also form at least one Connection Block that a Connection Element is set on this transparent cover plate.

17. contact panel as claimed in claim 10 is characterized in that: also form at least one Connection Block that a control element is set on this transparent cover plate.

18. contact panel as claimed in claim 10; It is characterized in that: the conductive electrode pattern of this transparent conductive film comprises a plurality of first electrodes series of arranging along a first direction; And this contact panel also comprises another transparent conductive film; It fits in the one side back to this transparent cover plate of above-mentioned this transparent conductive film; And this another transparent conductive film on the one side of above-mentioned this transparent conductive film, be laid with another conductive electrode pattern, it comprises along one and generally is the arrangement of vertical second direction with this first direction, and a plurality of second electrodes series that stagger mutually with above-mentioned first electrodes series.

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