CN102758232A - Method for improving gold-plating bonding strength on surface of molybdenum-based electrical contact - Google Patents
Method for improving gold-plating bonding strength on surface of molybdenum-based electrical contact Download PDFInfo
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- CN102758232A CN102758232A CN2012102279208A CN201210227920A CN102758232A CN 102758232 A CN102758232 A CN 102758232A CN 2012102279208 A CN2012102279208 A CN 2012102279208A CN 201210227920 A CN201210227920 A CN 201210227920A CN 102758232 A CN102758232 A CN 102758232A
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- gold
- value
- molybdenum
- electroplating
- electric contact
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- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 title claims abstract description 21
- 229910052750 molybdenum Inorganic materials 0.000 title claims abstract description 21
- 239000011733 molybdenum Substances 0.000 title claims abstract description 21
- 238000000034 method Methods 0.000 title claims abstract description 16
- 238000007747 plating Methods 0.000 title claims abstract description 12
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims abstract description 18
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract description 18
- 238000009713 electroplating Methods 0.000 claims abstract description 15
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000010931 gold Substances 0.000 claims abstract description 14
- 229910052737 gold Inorganic materials 0.000 claims abstract description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052802 copper Inorganic materials 0.000 claims abstract description 8
- 239000010949 copper Substances 0.000 claims abstract description 8
- 230000001105 regulatory effect Effects 0.000 claims abstract description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 6
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 claims abstract description 4
- 239000007788 liquid Substances 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 7
- 230000007704 transition Effects 0.000 claims description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- DPDMMXDBJGCCQC-UHFFFAOYSA-N [Na].[Cl] Chemical compound [Na].[Cl] DPDMMXDBJGCCQC-UHFFFAOYSA-N 0.000 claims description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 2
- 229910000366 copper(II) sulfate Inorganic materials 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- 238000002203 pretreatment Methods 0.000 claims description 2
- 238000007669 thermal treatment Methods 0.000 claims description 2
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 2
- 230000004048 modification Effects 0.000 abstract description 2
- 238000012986 modification Methods 0.000 abstract description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 abstract 2
- 229910003803 Gold(III) chloride Inorganic materials 0.000 abstract 1
- 238000004140 cleaning Methods 0.000 abstract 1
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 abstract 1
- RJHLTVSLYWWTEF-UHFFFAOYSA-K gold trichloride Chemical compound Cl[Au](Cl)Cl RJHLTVSLYWWTEF-UHFFFAOYSA-K 0.000 abstract 1
- 239000007769 metal material Substances 0.000 abstract 1
- 239000011780 sodium chloride Substances 0.000 abstract 1
- 235000010265 sodium sulphite Nutrition 0.000 abstract 1
- 239000000463 material Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 230000003245 working effect Effects 0.000 description 1
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Abstract
A method for improving gold-plating bonding strength on the surface of a molybdenum-based electric contact belongs to the field of surface modification of a metal material. The method comprises the following steps of: firstly, removing oxides on the surface of the molybdenum-based electric contact before electroplating and then ultrasonically cleaning to remove oil stains; secondly, electroplating copper, wherein a copper-layer electroplating solution comprises the following components: 215-250 g/L of copper sulfate pentahydrate, 65-80 g/L of sulfuric acid and the balance of water; and the technical parameters are as follows: the pH value is 1.3-1.5, the current density is 0.4-0.6A/dm<2>, the temperature is 20-50 DEG C, the electroplating time is 30-120 seconds, and the pH value is regulated by using sulfuric acid and sodium hydroxide; and finally, electroplating gold, wherein a gold electroplating solution comprises the following components: 25-35 g/L of auric chloride, 135-160g/L of sodium sulfite, 85-100 g/L of sodium chloride and the balance of water; the technical parameters are as follows: the pH value is 9-11, the current density is 0.1-0.3 A/dm<2>, the temperature is 25-35 DEG C, the electroplating time is 90-140 seconds and the pH value is regulated by using sulfuric acid and sodium hydroxide. According to the method for improving gold-plating bonding strength on the surface of the molybdenum-based electric contact, an obtained gold-plated layer and the surface of the molybdenum-based electric contact are bonded well without falling off and peeling.
Description
Technical field
The invention belongs to the metal surface properties modification technical field, a kind of method that improves molybdenum base electric contact surface gold-plating bonding strength is provided, molybdenum base electric contact surface gold-plating pull-up falls to solve, the problem of peeling.
Background technology
The contact material general requirement has characteristics such as high conduction, high heat conduction, HMP, HS, low contact resistance and low temperature rise, and contact material is divided into three major types at present: pure metal contact material, alloy contact material and composited contact material.Wherein the molybdenum material as the pure metal contact material have the fusing point height, advantage such as hardness is big, intensity is high, wear-resisting and resistance fusion welding is good; But because molybdenum is prone to generate the particulate state oxide compound under the effect of electric arc; Increase the contact resistance of electrical contact, had a strong impact on the reliability and stability that electrically contact.In order to prevent the electrical contact surface oxidation, generally adopt the electrical contact coating surface to have that chemical property is stable, the method for low-resistivity thin-film material, as gold-plated.But direct when gold-plated on molybdenum base electric contact surface, because molybdenum is a body-centered cubic crystal structure, and gold be a face-centered cubic crystal structure, and molybdenum and golden lattice match degree differ greatly, so Gold plated Layer can come off voluntarily, peeling, influence the work-ing life and the safety of electrical contact.
Summary of the invention
In order to solve the bonding force problem on Gold plated Layer and molybdenum base electric contact surface, the invention provides a kind of method that strengthens the gold-plated bonding strength of molybdenum primary surface, obtained in this way and the firm Gold plated Layer of molybdenum base electric contact surface bonding.
In order to realize the foregoing invention purpose, the present invention has adopted following process step:
(1) pre-treatment
Before the plating, place the hydrogen stove to carry out thermal treatment in 30 minutes the molybdenum base electric contact,, carry out ultrasonic cleaning afterwards, remove greasy dirt to remove molybdenum base electric contact oxide on surface at 900 ℃.
(2) electro-coppering
The composition of transition copper layer electroplate liquid: cupric sulfate pentahydrate 215～250g/L, sulfuric acid 65～80g/L, all the other are water;
Processing parameter: pH value 1.3～1.5, current density 0.4～0.6A/dm
2, 20～50 ℃ of temperature, electroplating time 30～120s, the pH value is regulated with sulfuric acid and sodium hydroxide.
(3) electrogilding
After obtaining copper electroplating layer, carry out gold-plated again;
The composition of gold plating liquid: gold perchloride 25～35g/L, S-WAT 135～160g/L, sodium-chlor 85 ~ 100g/L, all the other are water.
Processing parameter: pH value 9～11, current density 0.1～0.3A/dm
2, 25～35 ℃ of temperature.Electroplating time 90～140s, the pH value is regulated with sulfuric acid and sodium hydroxide.When the electro-coppering time is less than 30s or during greater than 120s, the copper plate that is obtained is too thin or blocked up, all can make follow-up Gold plated Layer and matrix bond property poor.Gold-plated again after copper facing between 30～120s, the Gold plated Layer and the matrix bond property that are obtained are good.
The invention has the advantages that adopting acid copper technology to obtain thickness earlier is the transition layer of 0.1～1 μ m, carries out gold-plated afterwards on transition layer.Adopt this method can obtain the Gold plated Layer good with matrix bond property, easy and simple to handle, method is simple, and processing parameter is easy to regulate.
Description of drawings
Fig. 1: instance 1 electroplating effect figure.
Embodiment
Instance 1: press the composition preparation of electroplate liquid in the table 1, the electro-coppering time set is 30s, then according to above-mentioned process step electro-coppering transition layer.
Table 1 practical implementation condition
Electroplating effect and Fig. 1 of instance 2 and instance 3 are similar.
Instance 2: press the composition preparation of electroplate liquid in the table 2, the electro-coppering time set is 60s, then according to above-mentioned process step electro-coppering transition layer.
Table 2 practical implementation condition
Instance 3: press the composition preparation of electroplate liquid in the table 3, the electro-coppering time set is 120s, then according to above-mentioned process step electro-coppering transition layer.
Table 3 practical implementation condition
Claims (1)
1. method that improves molybdenum base electric contact surface gold-plating bonding strength, it is characterized in that: the process step that is adopted is following:
(1) pre-treatment
Before the plating, place the hydrogen stove to carry out thermal treatment in 30 minutes the molybdenum base electric contact,, carry out ultrasonic cleaning afterwards, to remove greasy dirt to remove molybdenum base electric contact oxide on surface at 900 ℃;
(2) electro-coppering
The composition of transition copper layer electroplate liquid: cupric sulfate pentahydrate 215～250g/L, sulfuric acid 65～80g/L, all the other are water;
Processing parameter: pH value 1.3～1.5, current density 0.4～0.6A/dm
2, 20～50 ℃ of temperature, electroplating time 30s～120s, the pH value is regulated with sulfuric acid and sodium hydroxide;
(3) electrogilding
After obtaining copper electroplating layer, adopt gold plating liquid to carry out gold-plated;
The composition of gold plating liquid: gold perchloride 25～35g/L, S-WAT 135～160g/L, sodium-chlor 85 ~ 100g/L, all the other are water;
Processing parameter: pH value 9～11, current density 0.1～0.3A/dm
2, 25～35 ℃ of temperature, electroplating time 90～140s, the pH value is regulated with sulfuric acid and sodium hydroxide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102279208A CN102758232A (en) | 2012-07-02 | 2012-07-02 | Method for improving gold-plating bonding strength on surface of molybdenum-based electrical contact |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102279208A CN102758232A (en) | 2012-07-02 | 2012-07-02 | Method for improving gold-plating bonding strength on surface of molybdenum-based electrical contact |
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|---|---|
| CN102758232A true CN102758232A (en) | 2012-10-31 |
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| CN2012102279208A Pending CN102758232A (en) | 2012-07-02 | 2012-07-02 | Method for improving gold-plating bonding strength on surface of molybdenum-based electrical contact |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103572338A (en) * | 2013-11-14 | 2014-02-12 | 贵州振华群英电器有限公司 | Gold plating method for contact and reed of micro relay |
| CN111020657A (en) * | 2019-12-31 | 2020-04-17 | 中国工程物理研究院机械制造工艺研究所 | Method for electroplating molybdenum part with gold |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040120371A1 (en) * | 2000-02-18 | 2004-06-24 | Jds Uniphase Corporation | Contact structure for a semiconductor component |
| CN102168294A (en) * | 2011-05-19 | 2011-08-31 | 北京工业大学 | Method for improving tungsten-base gold-plating bond strength |
| CN102212854A (en) * | 2011-05-20 | 2011-10-12 | 北京工业大学 | Cyanide-free gold electroplating liquid |
-
2012
- 2012-07-02 CN CN2012102279208A patent/CN102758232A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040120371A1 (en) * | 2000-02-18 | 2004-06-24 | Jds Uniphase Corporation | Contact structure for a semiconductor component |
| CN102168294A (en) * | 2011-05-19 | 2011-08-31 | 北京工业大学 | Method for improving tungsten-base gold-plating bond strength |
| CN102212854A (en) * | 2011-05-20 | 2011-10-12 | 北京工业大学 | Cyanide-free gold electroplating liquid |
Non-Patent Citations (2)
| Title |
|---|
| （美）戴维斯（DAVIS.J.R.): "《金属手册案头卷(上册）》", 31 January 2011, article "电接触材料", pages: 1161 - 1 * |
| 陆群: "《表面处理技术教程》", 31 January 2011, article "单金属电镀" * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103572338A (en) * | 2013-11-14 | 2014-02-12 | 贵州振华群英电器有限公司 | Gold plating method for contact and reed of micro relay |
| CN103572338B (en) * | 2013-11-14 | 2016-08-24 | 贵州振华群英电器有限公司 | Midget relay contact, reed gold-plating process |
| CN111020657A (en) * | 2019-12-31 | 2020-04-17 | 中国工程物理研究院机械制造工艺研究所 | Method for electroplating molybdenum part with gold |
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Application publication date: 20121031 |