CN102746622A - Prepreg with moderate-temperature cured epoxy resin as substrate material and preparation method thereof - Google Patents
Prepreg with moderate-temperature cured epoxy resin as substrate material and preparation method thereof Download PDFInfo
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- CN102746622A CN102746622A CN2012102616080A CN201210261608A CN102746622A CN 102746622 A CN102746622 A CN 102746622A CN 2012102616080 A CN2012102616080 A CN 2012102616080A CN 201210261608 A CN201210261608 A CN 201210261608A CN 102746622 A CN102746622 A CN 102746622A
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- epoxy resin
- prepreg
- temperature setting
- intermediate temperature
- body material
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 176
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 176
- 239000000463 material Substances 0.000 title claims abstract description 35
- 238000002360 preparation method Methods 0.000 title claims abstract description 19
- 239000000758 substrate Substances 0.000 title abstract 3
- 239000000203 mixture Substances 0.000 claims abstract description 80
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 25
- 239000007787 solid Substances 0.000 claims abstract description 14
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 42
- 150000001875 compounds Chemical class 0.000 claims description 16
- 239000000835 fiber Substances 0.000 claims description 13
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 12
- 229920001971 elastomer Polymers 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 12
- 238000003756 stirring Methods 0.000 claims description 12
- 239000012943 hotmelt Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- -1 glyoxaline compound Chemical class 0.000 claims description 8
- 239000002966 varnish Substances 0.000 claims description 8
- 239000004593 Epoxy Substances 0.000 claims description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 7
- 229930185605 Bisphenol Natural products 0.000 claims description 6
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 6
- 229920002396 Polyurea Polymers 0.000 claims description 6
- 150000002460 imidazoles Chemical class 0.000 claims description 6
- 229920000570 polyether Polymers 0.000 claims description 6
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 4
- 229920002748 Basalt fiber Polymers 0.000 claims description 4
- 239000004705 High-molecular-weight polyethylene Substances 0.000 claims description 4
- 239000004760 aramid Substances 0.000 claims description 4
- 229920006231 aramid fiber Polymers 0.000 claims description 4
- 229920003235 aromatic polyamide Polymers 0.000 claims description 4
- 239000011258 core-shell material Substances 0.000 claims description 4
- 125000003700 epoxy group Chemical group 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 4
- 239000012528 membrane Substances 0.000 claims description 4
- 239000003607 modifier Substances 0.000 claims description 4
- 229920003986 novolac Polymers 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 229920001568 phenolic resin Polymers 0.000 claims description 4
- 239000005011 phenolic resin Substances 0.000 claims description 4
- 150000003672 ureas Chemical class 0.000 claims description 4
- 238000006116 polymerization reaction Methods 0.000 claims description 3
- 238000009954 braiding Methods 0.000 claims description 2
- 239000004744 fabric Substances 0.000 claims description 2
- 239000012783 reinforcing fiber Substances 0.000 claims description 2
- 238000005265 energy consumption Methods 0.000 abstract description 2
- 230000008595 infiltration Effects 0.000 abstract 1
- 238000001764 infiltration Methods 0.000 abstract 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 abstract 1
- 239000012779 reinforcing material Substances 0.000 abstract 1
- 239000012745 toughening agent Substances 0.000 abstract 1
- 238000012360 testing method Methods 0.000 description 12
- 238000007711 solidification Methods 0.000 description 10
- 230000008023 solidification Effects 0.000 description 10
- 238000003860 storage Methods 0.000 description 9
- 239000002131 composite material Substances 0.000 description 8
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000011159 matrix material Substances 0.000 description 6
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 238000002161 passivation Methods 0.000 description 4
- 238000011056 performance test Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- OWRCNXZUPFZXOS-UHFFFAOYSA-N 1,3-diphenylguanidine Chemical compound C=1C=CC=CC=1NC(=N)NC1=CC=CC=C1 OWRCNXZUPFZXOS-UHFFFAOYSA-N 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical group C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 238000007666 vacuum forming Methods 0.000 description 2
- 238000012795 verification Methods 0.000 description 2
- 241001274660 Modulus Species 0.000 description 1
- 239000011157 advanced composite material Substances 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
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Abstract
The invention relates to a prepreg with moderate-temperature cured epoxy resin as a substrate material and a preparation method of the prepreg, relates to a prepreg and a preparation method of the prepreg, and is used for solving the problems that the prepreg is prepared at the curing temperature higher than 120 DEG C, so that the product is high in energy consumption and the dimensional accuracy of the product is difficult to control. The prepreg with moderate-temperature cured epoxy resin as the substrate material is composed of an epoxy resin mixture, a curing agent system mixture and a moderate-temperature cured epoxy resin infiltration reinforcing material prepared by a toughening agent, wherein the epoxy resin mixture is composed of solid or semisolid epoxy resin and liquid epoxy resin, and the curing agent system mixture is composed of a curing agent and a promoter. The preparation method comprises the steps of: (1) preparing the epoxy resin mixture; (2) preparing the curing agent system mixture; (3) preparing the moderate-temperature cured epoxy resin; and (4) preparing the prepreg. The prepared product can be used for preparing planes, spacecrafts, yachts, golf rods and the like, and has important commercial value.
Description
Technical field
The present invention relates to a kind of prepreg and preparation method thereof.
Background technology
Advanced polymer matrix composites have critical role in fields such as aerospace, electronics, traffic, the energy, and become one of most hotly competitive in the world field of new gradually.Have epoxy prepreg specific tenacity, specific modulus height and performance can design and characteristics such as forming technology variety, are widely used in space flight and aviation and civil area etc.
When the solidification value of epoxy prepreg was higher than 120 ℃, resulting product can produce bigger internal stress, was unfavorable for the controlling dimension precision, even can cause material to destroy in advance.Higher solidification value is had relatively high expectations and the height that consumes energy to molding device, mold tooling and the subsidiary material of matrix material, and at room temperature period of storage is short, has limited the range of application of prepreg.
Summary of the invention
The present invention will solve the solidification value of existing epoxy prepreg height; The preparing product energy consumption is high; Be unfavorable for controlling the problem of dimensional accuracy of products; Short and the little problem of the scope of application of period of storage, and prepreg that a kind of intermediate temperature setting epoxy resin is provided is body material and preparation method thereof.
The prepreg that a kind of intermediate temperature setting epoxy resin is body material soaks into strongthener by intermediate temperature setting epoxy resin and forms; Wherein intermediate temperature setting epoxy resin is prepared from 50% ~ 90% epoxy resin composition, 5% ~ 30% curative systems mixture and 5% ~ 20% toughner by massfraction; Epoxy resin composition is that solid-state or semi-solid state epoxy resin and 20% ~ 80% liquid-state epoxy resin mix by 20% ~ 80% by massfraction; The curative systems mixture is to be mixed by 40% ~ 90% solidifying agent and 10% ~ 60% promotor by massfraction.
A kind of intermediate temperature setting epoxy resin is the preparation method of the prepreg of body material: one, with solid-state or semi-solid state epoxy resin exsiccant container internal heating to 50 ℃ ~ 140 ℃; Constant temperature 1 h ~ 12 hours; Get fused epoxy resin, add liquid-state epoxy resin therein, the rotating speed with 1700 commentaries on classics/min ~ 3000 commentaries on classics/min in container stirs; And, obtain epoxy resin composition 50 ℃ ~ 140 ℃ following constant temperature 0.1 h ~ 3 hours; Solid-state or the semi-solid state epoxy resin that wherein adds by mass percentage in the epoxy resin composition is 20% ~ 80%, and the liquid-state epoxy resin of adding is 20% ~ 80%; Two, with solidifying agent exsiccant container internal heating to 50 ℃ ~ 100 ℃, constant temperature 5 h ~ 20 hours add promotor therein, the rotating speed with 1700 commentaries on classics/min ~ 3000 commentaries on classics/min in container stirs 0.5h ~ 2h, obtains the curative systems mixture; The solidifying agent that adds by mass percentage in this curative systems mixture is 40% ~ 90%, and the promotor of adding is 10% ~ 60%; Three, epoxy resin composition in toughner, the step 1 and the curative systems mixture in the step 2 are joined in the exsiccant container; Mix; Promptly obtain intermediate temperature setting epoxy resin; The epoxy resin composition that adds by mass percentage in the said composition is 50% ~ 90%, and the curative systems mixture of adding is 6% ~ 30%, and the toughner of adding is 4% ~ 20%.Four, with the intermediate temperature setting epoxy resin that obtains in the step 3 at 50 ℃ ~ 140 ℃, constant temperature polymerization 10 minutes ~ 200 minutes; With polymeric intermediate temperature setting epoxy resin is that body material and strongthener prepare prepreg with hot melt process.
Advantage of the present invention: the solidification value of this prepreg is 70 ℃ ~ 100 ℃, and lower solidification value can reduce the manufacturing cost of composite products, improves product size stability; This prepreg is applicable to autoclave molding, vacuum forming, compression molding and matched-mold forming; The matrix material of this equipment of preimpregnated material manufacture has excellent mechanical property, and this type of prepreg has the storage period greater than 3 months at normal temperatures, helps storage, transportation and the production of prepreg.The present invention can be used for preparing national defence and civil areas such as aircraft, spacecraft, yacht, bike.
Embodiment
Below provide embodiment of the present invention and be further described, yet technical scheme of the present invention but is not limited to following cited embodiment.
Embodiment one: the prepreg that a kind of intermediate temperature setting epoxy resin is body material soaks into strongthener by intermediate temperature setting epoxy resin and forms; Wherein intermediate temperature setting epoxy resin is prepared from 50% ~ 90% epoxy resin composition, 5% ~ 30% curative systems mixture and 5% ~ 20% toughner by massfraction; Epoxy resin composition is that solid-state or semi-solid state epoxy resin and 20% ~ 80% liquid-state epoxy resin mix by 20% ~ 80% by massfraction; The curative systems mixture is to be mixed by 40% ~ 90% solidifying agent and 10% ~ 60% promotor by massfraction.
The solidification value of the prepreg that a kind of intermediate temperature setting epoxy resin of this embodiment design is body material is 70 ℃ ~ 100 ℃, and lower solidification value can reduce the manufacturing cost of composite products, improves product size stability; This prepreg is applicable to autoclave molding, vacuum forming, compression molding and matched-mold forming; The matrix material of this type of equipment of preimpregnated material manufacture has excellent mechanical property, and this type of prepreg has the storage period greater than 3 months at normal temperatures, helps storage, transportation and the production of prepreg.
Embodiment two: the difference of this embodiment and embodiment one is: described solid-state or semi-solid state epoxy resin is one or more the combination in bisphenol A type epoxy resin, bisphenol-s epoxy resin and the novolac epoxy; Liquid-state epoxy resin is one or more the combination in bisphenol A type epoxy resin, bisphenol f type epoxy resin, bisphenol-s epoxy resin, trifunctional epoxy resin, four-functional group epoxy resin, phenolic resin varnish type epoxy resin and the formaldehyde varnish type epoxy resin.Other is identical with embodiment one.
Embodiment three: this embodiment with embodiment one or two difference is: described solidifying agent is Dyhard RU 100 compounds or Dyhard RU 100 compounds modifier; Described promotor is one or several the combination in urea compounds, polyureas compound, polyether monoamine compound, imidazoles and the imdazole derivatives; Described toughner is one or more the combination in core-shell particles class toughner, epoxy resin and rubber prepolymer, end epoxy group(ing) rubber and the terminal hydroxy group rubber.Other is identical with embodiment one or two.
Embodiment four: the difference of this embodiment and embodiment one to three is: described strongthener is one or more the combination in thomel, spun glass, aramid fiber, aromatic polyamide fibre, high molecular weight polyethylene fiber and the basalt fibre.Other is identical with one of embodiment one to three.
Embodiment five: this embodiment is the preparation method that a kind of intermediate temperature setting epoxy resin is the prepreg of body material, specifically accomplishes according to the following steps:
One, with solid-state or semi-solid state epoxy resin exsiccant container internal heating to 50 ℃ ~ 140 ℃; Constant temperature 1 h ~ 12 hours; Get fused epoxy resin, add liquid-state epoxy resin therein, the rotating speed with 1700 commentaries on classics/min ~ 3000 commentaries on classics/min in container stirs; And, obtain epoxy resin composition 50 ℃ ~ 140 ℃ following constant temperature 0.1 h ~ 3 hours; Solid-state or the semi-solid state epoxy resin that wherein adds by mass percentage in the epoxy resin composition is 20% ~ 80%, and the liquid-state epoxy resin of adding is 20% ~ 80%;
Two, with solidifying agent exsiccant container internal heating to 50 ℃ ~ 100 ℃, constant temperature 5 h ~ 20 hours add promotor therein, the rotating speed with 1700 commentaries on classics/min ~ 3000 commentaries on classics/min in container stirs 0.5h ~ 2h, obtains the curative systems mixture; The solidifying agent that adds by mass percentage in this curative systems mixture is 40% ~ 90%, and the promotor of adding is 10% ~ 60%;
Three, epoxy resin composition in toughner, the step 1 and the curative systems mixture in the step 2 are joined in the exsiccant container; Mix; Promptly obtain intermediate temperature setting epoxy resin; The epoxy resin composition that adds by mass percentage in the said composition is 50% ~ 90%, and the curative systems mixture of adding is 6% ~ 30%, and the toughner of adding is 4% ~ 20%;
Four, with the intermediate temperature setting epoxy resin that obtains in the step 3 at 50 ℃ ~ 140 ℃, constant temperature polymerization 10 minutes ~ 200 minutes; With polymeric intermediate temperature setting epoxy resin is that body material and strongthener prepare prepreg with hot melt process.
Embodiment six: this embodiment and embodiment five differences are: the solid-state or semi-solid state epoxy resin in the described step 1 is one or more the combination in bisphenol A type epoxy resin, bisphenol-s epoxy resin and the novolac epoxy; Liquid-state epoxy resin in the step 1 is one or more the combination in bisphenol A type epoxy resin, bisphenol f type epoxy resin, bisphenol-s epoxy resin, trifunctional epoxy resin, four-functional group epoxy resin, phenolic resin varnish type epoxy resin and the formaldehyde varnish type epoxy resin.Other is identical with embodiment five.
Embodiment seven: this embodiment with embodiment five or six differences is: the solidifying agent in the described step 2 is Dyhard RU 100 compounds or Dyhard RU 100 compounds modifier; Promotor in the step 2 is one or several the combination in urea compounds, polyureas compound, polyether monoamine compound, the glyoxaline compound; Toughner in the step 3 is one or more the combination in core-shell particles class toughner, epoxy resin and rubber prepolymer, end epoxy group(ing) rubber and the terminal hydroxy group rubber.Other and embodiment five or six phase with.
Embodiment eight: this embodiment and embodiment five to eight differences are: the hot melt process in the described step 4 prepares the prepreg method for being under 50 ℃ ~ 140 ℃ the condition polymeric intermediate temperature setting epoxy resin to be prepared into glued membrane being coated with film temperature earlier, is to carry out the hot melt preimpregnation under 50 ℃ ~ 140 ℃ the condition in the preimpregnation temperature with the glued membrane for preparing and strongthener again.Other is identical with one of embodiment five to eight.
Embodiment nine: this embodiment and embodiment five to seven differences are: the strongthener in the described step 4 is one or more the combination in thomel, spun glass, aramid fiber, aromatic polyamide fibre, high molecular weight polyethylene fiber and the basalt fibre.Other is identical with one of embodiment five to seven.
Embodiment ten: this embodiment with embodiment five to nine differences is: described strongthener is fibrous braid that obtains through braiding or the fibrous bundle that obtains through unilateral stretching; Wherein, the ratio of the mass area ratio of fortifying fibre cloth and thickness is 300 ~ 1700; The unit of mass area ratio is g/m
2, the unit of thickness is mm; The Tex number of reinforcing fiber bundles is 100 ~ 10000.Other is identical with one of embodiment five to nine.
Adopt following verification experimental verification effect of the present invention:
Test one: a kind of intermediate temperature setting epoxy resin is the preparation method of the prepreg of body material, specifically accomplishes according to the following steps:
One, with bisphenol A type epoxy resin CYD012 at exsiccant container internal heating to 100 ℃; Constant temperature 2 hours; Get fused bisphenol A type epoxy resin CYD012, add trifunctional epoxy resin TDE85 therein, the rotating speed with 2000 commentaries on classics/min in container stirs; And, obtain epoxy resin composition 90 ℃ of following constant temperature 2 hours; The bisphenol A type epoxy resin CYD012 that wherein adds by mass percentage in the epoxy resin composition is 66.7%, and the trifunctional epoxy resin TDE85 of adding is 33.3%;
Two, with curing agent dicyandiamide at exsiccant container internal heating to 70 ℃, constant temperature 8 hours adds promotor passivation imidazoles therein, in container, carries out stirring 1h with the rotating speed of 2000 commentaries on classics/min, obtains the curative systems mixture; The curing agent dicyandiamide that adds by mass percentage in this curative systems mixture is 72.7%; The promotor passivation imidazoles that adds is 27.3%;
Three, epoxy resin composition in terminal hydroxy group rubber-like toughner 1800XB, the step 1 and the curative systems mixture in the step 2 are joined in the exsiccant container; Mix; Promptly obtain intermediate temperature setting epoxy resin; The epoxy resin composition that adds by mass percentage in the said composition is 81.1%, and the curative systems mixture of adding is 9.9%, and the toughner 1800XB of adding is 9%.
Four, with the intermediate temperature setting epoxy resin that obtains in the step 3 at 80 ℃, constant temperature polyase 13 0 minute; With polymeric intermediate temperature setting epoxy resin is that body material and strongthener prepare prepreg with hot melt process; Described strongthener is carbon fiber bundle T700, and the tex number is 800, and being coated with film temperature is 80 ℃, 100 ℃ of preimpregnation temperature.
This prepreg is when the storage time is 113 days at normal temperatures, its viscosity diminishes.The use characteristics of prepreg of testing a gained is as shown in table 1.
Prepreg use characteristics in table 1 test one
Performance | Characteristic |
Viscosity under the room temperature | Have viscosity, can be bonding between the prepreg |
50 ℃ of gel times | Greater than 2 hours |
90 ℃ of gel times | Less than 50 minutes |
The following shelf lives of normal temperature | 113 days |
Prepreg is equipped with matrix material with the autoclave legal system, and its processing parameter is pressure 0.5MPa, and solidification value is earlier 60 ℃ of constant temperature 2 hours, and 80 ℃ of constant temperature 10 hours, measured composite property was as shown in table 2 again.
Table 2 test one composite property
Performance | Test value |
Fiber volume fraction | ?60% |
Voidage | ?0.32% |
0 ° of tensile strength | ?2119MPa |
0 ° of tensile modulus | ?165GPa |
Flexural strength | ?1563MPa |
Modulus in flexure | ?136GPa |
0 ° of compressive strength | ?1033MPa |
0 ° of modulus of compression | ?146GPa |
The short beam interlaminar shear strength | ?72MPa |
Test two: a kind of intermediate temperature setting epoxy resin is the preparation method of the prepreg of body material, specifically accomplishes according to the following steps:
One, with phenol aldehyde type epoxy resin F54 at exsiccant container internal heating to 100 ℃; Constant temperature 2 hours; Get fused phenol aldehyde type epoxy resin F54, add bisphenol A type epoxy resin E51 therein, the rotating speed with 2000 commentaries on classics/min in container stirs; And, obtain epoxy resin composition 90 ℃ of following constant temperature 2 hours; The phenol aldehyde type epoxy resin F54 that wherein adds by mass percentage in the epoxy resin composition is 70%, and the bisphenol A type epoxy resin E51 of adding is 30%;
Two, with curing agent dicyandiamide at exsiccant container internal heating to 80 ℃; Constant temperature 3 hours; Add polyether monoamine solidifying agent D2000 and polyureas vulkacit D yhradUR500 therein, the rotating speed with 2000 commentaries on classics/min in container stirs 1h, obtains the curative systems mixture; The curing agent dicyandiamide that adds by mass percentage in this curative systems mixture is 46.7%, and the polyether monoamine solidifying agent D2000 of adding is 33.3%, and the polyureas vulkacit D yhrad UR500 of adding is 20%;
Three, epoxy resin composition in terminal hydroxy group rubber-like toughner DTBN401, the step 1 and the curative systems mixture in the step 2 are joined in the exsiccant container; Mix; Promptly obtain intermediate temperature setting epoxy resin; The epoxy resin composition that adds by mass percentage in the said composition is 83.3%, and the curative systems mixture of adding is 12.5%, and the toughner DTBN401 of adding is 4.2%;
Four, with the intermediate temperature setting epoxy resin that obtains in the step 3 at 60 ℃, constant temperature polyase 13 0 minute; With polymeric intermediate temperature setting epoxy resin is that body material and strongthener prepare prepreg with hot melt process.Described strongthener is carbon fiber bundle T700, and the tex number is 800, and being coated with film temperature is 80 ℃, 100 ℃ of preimpregnation temperature.
This prepreg is at normal temperatures during 102 days storage times, its viscosity diminishes.The use characteristics of prepreg of testing two gained is as shown in table 3.
The prepreg use characteristics of table 3 test two
Performance | Characteristic |
Viscosity under the room temperature | Have viscosity, can be bonding between the prepreg |
50 ℃ of gel times | Greater than 2 hours |
90 ℃ of gel times | Less than 50 minutes |
The following shelf lives of normal temperature | 102 days |
This prepreg prepares matrix material with vacuum bag molding, and its processing parameter is pressure 0.08MPa, and solidification value is earlier 60 ℃ of constant temperature 1 hour, and 90 ℃ of constant temperature 5 hours, measured composite property was as shown in table 4 again.
Table 4 test two composite properties
Performance | Test value |
Fiber volume fraction | ?58% |
Voidage | ?0.46% |
0 ° of tensile strength | ?1980MPa |
0 ° of tensile modulus | ?161GPa |
Flexural strength | ?1543MPa |
Modulus in flexure | ?132GPa |
0 ° of compressive strength | ?1043MPa |
0 ° of modulus of compression | ?138GPa |
The short beam interlaminar shear strength | ?68MPa |
Test three: a kind of intermediate temperature setting epoxy resin is the preparation method of the prepreg of body material, specifically accomplishes according to the following steps:
One, be that phenol aldehyde type epoxy resin DEN438 and the bisphenol A type epoxy resin CYD012 of 6:5 is at exsiccant container internal heating to 70 ℃ with mass ratio; Constant temperature 6 hours; Get the compsn of fused phenol aldehyde type epoxy resin DEN438 and bisphenol A type epoxy resin CYD012; In this compsn, adding mass ratio is the bisphenol f type epoxy resin 170 and bisphenol A type epoxy resin E54 of 5:4; Rotating speed with 2000 commentaries on classics/min in container stirs, and 70 ℃ of following constant temperature 2 hours, obtains epoxy resin composition; Phenol aldehyde type epoxy resin DEN438 that wherein adds by mass percentage in the epoxy resin composition and the compsn of bisphenol A type epoxy resin CYD012 are 55%; Bisphenol f type epoxy resin 170 that adds and the compsn of bisphenol A type epoxy resin E54 are 45%;
Two, with curing agent dicyandiamide at exsiccant container internal heating to 70 ℃, constant temperature 8 hours adds promotor passivation imidazoles therein, the rotating speed with 2000 commentaries on classics/min in container stirs 1h, obtains the curative systems mixture; The curing agent dicyandiamide that adds by mass percentage in this curative systems mixture is 72.7%, and the promotor passivation imidazoles of adding is 27.3%;
Three, epoxy resin composition in terminal hydroxy group rubber-like toughner 1800XB, the step 1 and the curative systems mixture in the step 2 are joined in the exsiccant container; Mix; Promptly obtain intermediate temperature setting epoxy resin; The epoxy resin composition that adds by mass percentage in the said composition is 82.6%, and the curative systems mixture of adding is 9.1%, and the toughner 1800XB of adding is 8.3%;
Four, with the intermediate temperature setting epoxy resin that obtains in the step 3 at 80 ℃, constant temperature polyase 13 0 minute; With polymeric intermediate temperature setting epoxy resin is that body material and strongthener prepare prepreg with hot melt process; Described strongthener is a glasscloth, and the ratio of its mass area ratio and thickness is 400; The unit of mass area ratio is g/m
2, the unit of thickness is mm; Being coated with film temperature is 90 ℃, 90 ℃ of preimpregnation temperature.
During 107 days storage times, it is viscosity diminishes at room temperature at normal temperatures for this prepreg.The use characteristics of prepreg of testing three gained is as shown in table 5.
Table 5 test three prepreg use characteristics
Performance | Characteristic |
Viscosity under the room temperature | Have viscosity, can be bonding between the prepreg |
50 ℃ of gel times | Greater than 2 hours |
100 ℃ of gel times | Less than 50 minutes |
The following shelf lives of normal temperature | 107 days |
This prepreg is with matched-mold forming prepared matrix material, and its processing parameter is: solidification value for earlier 60 ℃ of constant temperature 1 hour, again 80 ℃ of constant temperature 1 hour, at last 100 ℃ of constant temperature 3 hours.Measured composite property is as shown in table 6.
Table 6 test three composite properties
Performance | Test value |
Fiber volume fraction | 60% |
Voidage | 0.52% |
0 ° of tensile strength | 581MPa |
0 ° of tensile modulus | 61GPa |
90 ° of tensile strengths | 572MPa |
90 ° of tensile moduluses | 60GPa |
0 ° of compressive strength | 573MPa |
0 ° of modulus of compression | 55GPa |
90 ° of compressive strengths | 571MPa |
90 ° of modulus of compression | 56GPa |
Shearing resistance | 95MPa |
Claims (10)
1. prepreg that intermediate temperature setting epoxy resin is body material is characterized in that intermediate temperature setting epoxy resin is that the prepreg of body material soaks into strongthener by intermediate temperature setting epoxy resin and forms; Wherein intermediate temperature setting epoxy resin is prepared from 50% ~ 90% epoxy resin composition, 5% ~ 30% curative systems mixture and 5% ~ 20% toughner by massfraction; Epoxy resin composition is to be mixed by 20% ~ 80% liquid-state epoxy resin solid-state or semi-solid state epoxy resin and 20% ~ 80% by massfraction; The curative systems mixture is to be mixed by 40% ~ 90% solidifying agent and 10% ~ 60% promotor by massfraction.
2. the prepreg that a kind of intermediate temperature setting epoxy resin according to claim 1 is body material is characterized in that described solid-state or semi-solid state epoxy resin is one or more the combination in bisphenol A type epoxy resin, bisphenol-s epoxy resin and the novolac epoxy; Liquid-state epoxy resin is one or more the combination in bisphenol A type epoxy resin, bisphenol f type epoxy resin, bisphenol-s epoxy resin, trifunctional epoxy resin, four-functional group epoxy resin, phenolic resin varnish type epoxy resin and the formaldehyde varnish type epoxy resin.
3. the prepreg that a kind of intermediate temperature setting epoxy resin according to claim 1 is body material is characterized in that described solidifying agent is Dyhard RU 100 compounds or Dyhard RU 100 compounds modifier; Described promotor is one or several the combination in urea compounds, polyureas compound, polyether monoamine compound, imidazoles and the imdazole derivatives; Described toughner is one or more the combination in core-shell particles class toughner, epoxy resin and rubber prepolymer, end epoxy group(ing) rubber and the terminal hydroxy group rubber.
4. the prepreg that a kind of intermediate temperature setting epoxy resin according to claim 1 is body material is characterized in that described strongthener is one or more the combination in thomel, spun glass, aramid fiber, aromatic polyamide fibre, high molecular weight polyethylene fiber and the basalt fibre.
5. the preparation method that a kind of intermediate temperature setting epoxy resin as claimed in claim 1 is the prepreg of body material is characterized in that the preparation method that a kind of intermediate temperature setting epoxy resin is the prepreg of body material accomplishes according to the following steps:
One, with solid-state or semi-solid state epoxy resin exsiccant container internal heating to 50 ℃ ~ 140 ℃; Constant temperature 1 h ~ 12 hours; Get fused epoxy resin, add liquid-state epoxy resin therein, the rotating speed with 1700 commentaries on classics/min ~ 3000 commentaries on classics/min in container stirs; And, obtain epoxy resin composition 50 ℃ ~ 140 ℃ following constant temperature 0.1 h ~ 3 hours; Solid-state or the semi-solid state epoxy resin that wherein adds by mass percentage in the epoxy resin composition is 20% ~ 80%, and the liquid-state epoxy resin of adding is 20% ~ 80%;
Two, with solidifying agent exsiccant container internal heating to 50 ℃ ~ 100 ℃, constant temperature 5 h ~ 20 hours add promotor therein, the rotating speed with 1700 commentaries on classics/min ~ 3000 commentaries on classics/min in container stirs 0.5h ~ 2h, obtains the curative systems mixture; The solidifying agent that adds by mass percentage in this curative systems mixture is 40% ~ 90%, and the promotor of adding is 10% ~ 60%;
Three, epoxy resin composition in toughner, the step 1 and the curative systems mixture in the step 2 are joined in the exsiccant container; Mix; Promptly obtain intermediate temperature setting epoxy resin; The epoxy resin composition that adds by mass percentage in the said composition is 50% ~ 90%, and the curative systems mixture of adding is 6% ~ 30%, and the toughner of adding is 4% ~ 20%.
Four, with the intermediate temperature setting epoxy resin that obtains in the step 3 at 50 ℃ ~ 140 ℃, constant temperature polymerization 10 minutes ~ 200 minutes; With polymeric intermediate temperature setting epoxy resin is that body material and strongthener prepare prepreg with hot melt process.
6. the preparation method that a kind of intermediate temperature setting epoxy resin according to claim 5 is the prepreg of body material is characterized in that solid-state or semi-solid state epoxy resin in the described step 1 is one or more the combination in bisphenol A type epoxy resin, bisphenol-s epoxy resin and the novolac epoxy; Liquid-state epoxy resin in the step 1 is one or more the combination in bisphenol A type epoxy resin, bisphenol f type epoxy resin, bisphenol-s epoxy resin, trifunctional epoxy resin, four-functional group epoxy resin, phenolic resin varnish type epoxy resin and the formaldehyde varnish type epoxy resin.
7. the preparation method that a kind of intermediate temperature setting epoxy resin according to claim 5 is the prepreg of body material is characterized in that the solidifying agent in the described step 2 is Dyhard RU 100 compounds or Dyhard RU 100 compounds modifier; Promotor in the step 2 is one or several the combination in urea compounds, polyureas compound, polyether monoamine compound, the glyoxaline compound; Toughner in the step 3 is one or more the combination in core-shell particles class toughner, epoxy resin and rubber prepolymer, end epoxy group(ing) rubber and the terminal hydroxy group rubber.
8. the preparation method who is the prepreg of body material according to right 5 described a kind of intermediate temperature setting epoxy resin; It is characterized in that hot melt process in the described step 4 prepares the prepreg method for being under 50 ℃ ~ 140 ℃ the condition polymeric intermediate temperature setting epoxy resin to be prepared into glued membrane being coated with film temperature earlier, is to carry out the hot melt preimpregnation under 50 ℃ ~ 140 ℃ the condition in the preimpregnation temperature with the glued membrane for preparing and strongthener again.
9. the preparation method who is the prepreg of body material according to claim 5 or 8 described a kind of intermediate temperature setting epoxy resin is characterized in that described strongthener is one or more the combination in thomel, spun glass, aramid fiber, aromatic polyamide fibre, high molecular weight polyethylene fiber and the basalt fibre.
10. the preparation method who is the prepreg of body material according to claim 5 or 8 described a kind of intermediate temperature setting epoxy resin is characterized in that described strongthener is fibrous braid that obtains through braiding or the fibrous bundle that obtains through unilateral stretching; Wherein, the ratio of the mass area ratio of fortifying fibre cloth and thickness is 300 ~ 1700; The unit of mass area ratio is g/m
2, the unit of thickness is mm; The Tex number of reinforcing fiber bundles is 100 ~ 10000.
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