CN102732166A - Composite-type high-temperature resistant adhesive tape - Google Patents
Composite-type high-temperature resistant adhesive tape Download PDFInfo
- Publication number
- CN102732166A CN102732166A CN2011100867380A CN201110086738A CN102732166A CN 102732166 A CN102732166 A CN 102732166A CN 2011100867380 A CN2011100867380 A CN 2011100867380A CN 201110086738 A CN201110086738 A CN 201110086738A CN 102732166 A CN102732166 A CN 102732166A
- Authority
- CN
- China
- Prior art keywords
- temperature resistant
- adhesive tape
- type high
- resistant adhesive
- high temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 18
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 10
- 229920006267 polyester film Polymers 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 19
- 239000002131 composite material Substances 0.000 claims description 15
- 238000005516 engineering process Methods 0.000 claims description 7
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 abstract 4
- 230000000873 masking effect Effects 0.000 abstract 1
- 229920001721 polyimide Polymers 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
- Insulating Bodies (AREA)
Abstract
The invention discloses a composite-type high-temperature resistant adhesive tape, which comprises a substrate, a pressure-sensitive layer on one side surface of the substrate, and a reinforcing band combined on the other side of the substrate. The substrate is a polyester film or a polyimide film, and can be sheet paper, micron paper or masking paper. The reinforcing band is a high-temperature resistant type patterned tape. The thickness of the pressure-sensitive layer is 2-4 microns. The composite-type high-temperature resistant adhesive tape is relatively low in cost, simple in structure and convenient for manufacture, and is advantaged in being high-temperature resistant, shrinkproof and deformation-free.
Description
Technical field:
The invention belongs to the adhesive tape technical field, particularly a kind of composite type high temperature resistant adhesive tape.
Background technology:
In the manufacturing processed of existing electron device; Tin etc. on foot need be used in specific zone on the PC board; Yet all the other zones of wiring board need to use the specific covering of protective tapes and so on to protect; Simultaneously, in the process of making, the printing plate circuit need carry out zinc-plated with the short time under the pyritous environment.
Yet existing protective tapes adopts the compound glue of rubber-type as composite adhesive usually, and such adhesive tape is can't be resistant to elevated temperatures; Through in the ME of PC board, will make the paper of base material separate, in existing technology with PET; Rubber-type need be coated onto certain degree, just can reach the adherent state, can cause the thickness of whole adhesive tape very high like this; The pcb board general requirement reaches the 250-260 degree, but present product has satisfied not such requirement.
Summary of the invention:
The objective of the invention is in order to overcome above deficiency, provide that a kind of cost is low, making method is simple and can ensures that the composite type high temperature resistant adhesive tape possesses the effect of excellent anti-contraction.
The present invention realizes through following technical scheme: a kind of composite type high temperature resistant adhesive tape; The varistor layer that comprises a side surface of base material and base material; The opposite side of base material also is combined with a reinforcing band, and wherein base material is polyester film or Kapton, and base material can be sheet paper, Micron Technology's paper or can be U.S. line paper; Its reinforcing band is the high temperature resistant type patterned rubber belt, and the thickness of varistor layer is 2-4um.
The present invention compared with prior art has the following advantages: be combined with reinforcing band on the base material; Thereby the matrix structure that makes the individual layer in the existing technology becomes the composite structured of bilayer, has high temperature resistant anti-contraction of ideal and indeformable performance, low friction; Wearability; Moisture resistance, high insulation can ensure that the composite type high temperature resistant adhesive tape possesses described performance.
Description of drawings:
Fig. 1 is a structural representation of the present invention;
Label among the figure: 1-base material, 2-varistor layer, 3-reinforcing band.
Embodiment:
In order to deepen to understanding of the present invention, will combine embodiment that the present invention is made further detailed description below, following examples only are used to explain the present invention, do not constitute the qualification to protection domain of the present invention.
The present invention is a kind of composite type high temperature resistant adhesive tape, comprises the varistor layer 2 of a side surface of base material 1 and base material 1, also is combined with a reinforcing band 3 at the opposite side of base material 1; Base material 1 is polyester film or Kapton, and base material 1 can be sheet paper, Micron Technology's paper or can be U.S. line paper, and reinforcing band 3 is the high temperature resistant type patterned rubber belt; The thickness of varistor layer 2 is 2-4um; Use the frivolous of the comparison that seems like this, smooth, both artistic and practical.
Compound high temperature gummed tape is combined with reinforcing band on base material; Thereby the matrix structure that makes the individual layer in the existing technology becomes the composite structured of bilayer, has high temperature resistant anti-contraction of ideal and indeformable performance, low friction; Wearability; Moisture resistance, high insulation can ensure that the composite type high temperature resistant adhesive tape possesses described performance.
Claims (5)
1. composite type high temperature resistant adhesive tape comprises the varistor layer (2) of a side surface of base material (1) and base material (1), and it is characterized in that: the opposite side of said base material (1) also is combined with a reinforcing band (3).
2. composite type high temperature resistant adhesive tape according to claim 1 is characterized in that said base material (1) is polyester film or Kapton.
3. composite type high temperature resistant adhesive tape according to claim 1 is characterized in that said base material (1) can be sheet paper, Micron Technology's paper or can be U.S. line paper.
4. composite type high temperature resistant adhesive tape according to claim 1 is characterized in that said reinforcing band (3) is the high temperature resistant type patterned rubber belt.
5. composite type high temperature resistant adhesive tape according to claim 1, the thickness that it is characterized in that said varistor layer (2) is 2-4um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100867380A CN102732166A (en) | 2011-03-31 | 2011-03-31 | Composite-type high-temperature resistant adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100867380A CN102732166A (en) | 2011-03-31 | 2011-03-31 | Composite-type high-temperature resistant adhesive tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102732166A true CN102732166A (en) | 2012-10-17 |
Family
ID=46988487
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100867380A Pending CN102732166A (en) | 2011-03-31 | 2011-03-31 | Composite-type high-temperature resistant adhesive tape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102732166A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103937425A (en) * | 2014-04-03 | 2014-07-23 | 苏州华周胶带有限公司 | Novel textured tape |
| CN114206030A (en) * | 2021-12-06 | 2022-03-18 | 博罗县精汇电子科技有限公司 | Production process of thin rigid-flex board |
-
2011
- 2011-03-31 CN CN2011100867380A patent/CN102732166A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103937425A (en) * | 2014-04-03 | 2014-07-23 | 苏州华周胶带有限公司 | Novel textured tape |
| CN114206030A (en) * | 2021-12-06 | 2022-03-18 | 博罗县精汇电子科技有限公司 | Production process of thin rigid-flex board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20121017 |