CN102723293A - Etching-first and packaging-later manufacturing method for chip inversion single-surface three-dimensional circuit and packaging structure of chip formal double-surface three-dimensional circuit - Google Patents

Abstract

The invention relates to a manufacturing method of flip-chip single-sided three-dimensional circuit and its packaging structure. The method includes the following steps: taking a metal substrate; pre-plating copper on the surface of the metal substrate; coating with green paint; removing part of the green on the back of the substrate Paint; electroplating inert metal circuit layer; electroplating metal circuit layer; green paint covering; removing part of the green paint on the back of the substrate; electroplating metal circuit layer; green paint covering; removing part of the green paint on the back of the substrate; ;Remove the circuit board; electroplate metal circuit layer; green paint coating; remove part of the green paint on the front side of the substrate; chemical etching; electroplate metal circuit layer; chip loading and chip bottom filling; Balls; cut finished products. The beneficial effects of the invention are: the manufacturing cost is reduced, the safety and reliability of the packaging body are improved, the environmental pollution is reduced, and the design and manufacture of high-density circuits can be truly achieved.

Description

Flip chip single-sided three-dimensional circuit manufacturing method and packaging structure after etching first

technical field

The invention relates to a chip flip-chip single-sided three-dimensional circuit manufacturing method and its packaging structure. It belongs to the technical field of semiconductor packaging.

Background technique

The manufacturing process flow of the traditional high-density substrate package structure is as follows:

Step 1, referring to Figure 53, take a substrate made of glass fiber material,

Step 2, see Figure 54, make holes on the required position on the glass fiber substrate,

Step 3, see Figure 55, coat a layer of copper foil on the back of the glass fiber substrate,

Step 4, see Figure 56, fill in the conductive material at the position where the glass fiber substrate is punched,

Step 5, see Figure 57, coat a layer of copper foil on the front of the glass fiber substrate,

Step 6, see Figure 58, coat the photoresist film on the surface of the glass fiber substrate,

Step 7, see Figure 59, expose and develop the photoresist film at the required position to open the window,

Step 8, see Figure 60, etch the part where the window is opened,

Step 9, see Figure 61, peel off the photoresist film on the surface of the substrate,

Step 10, see Figure 62, apply solder resist paint (commonly known as green paint) on the surface of the copper foil circuit layer,

Step 11. Referring to Figure 63, open the window in the area where the solder resist paint needs to be installed in the post-process and wire bonded.

Step 12, see Figure 64, perform electroplating on the area where the window is opened in step 11, and relatively form base islands and pins,

Step thirteen, complete subsequent related processes such as film loading, wire bonding, encapsulation, and cutting.

The above-mentioned traditional high-density substrate packaging structure has the following deficiencies and defects:

1. There is an extra layer of glass fiber material, and also the cost of an extra layer of glass fiber;

2. Because glass fiber must be used, there is an extra layer of glass fiber thickness of about 100~150μm;

3. Glass fiber itself is a kind of foaming material, so it is easy to absorb moisture and moisture due to the storage time and environment, which directly affects the safety capability or reliability level of reliability;

4. The surface of the glass fiber is covered with a copper foil metal layer thickness of about 50-100 μm, and the etching distance between the metal layer line and the line can only achieve an etching gap of 50-100 μm due to the characteristics of the etching factor (etching factor: most The ability of good manufacturing is that the etching gap is approximately equal to the thickness of the object to be etched, see Figure 65), so it is impossible to truly design and manufacture high-density circuits;

5. Because the copper foil metal layer must be used, and the copper foil metal layer is pasted by high pressure, so the thickness of the copper foil is difficult to be less than 50μm, otherwise it will be difficult to operate such as unevenness or copper foil damage Or the extension and displacement of copper foil, etc.;

6. Also because the entire substrate material is made of glass fiber material, the thickness of the glass fiber layer is obviously increased by 100~150 μm, and it is impossible to achieve ultra-thin packaging;

7. Due to the large difference in material properties (expansion coefficient), the traditional glass fiber plus copper foil technology is easy to cause stress deformation in the harsh environment process, which directly affects the accuracy of component loading and the adhesion and reliability of components and substrates. sex.

Contents of the invention

The purpose of the present invention is to overcome the above disadvantages, to provide a flip-chip single-sided three-dimensional circuit manufacturing method and packaging structure after etching, the process is simple, no need to use glass fiber layer, reducing production costs, improving packaging The safety and reliability of the circuit reduce the environmental pollution caused by the glass fiber material, and the metal substrate circuit layer adopts the electroplating method, which can truly achieve the design and manufacture of high-density circuits.

The purpose of the present invention is achieved in this way: a method for manufacturing a flip-chip single-sided three-dimensional circuit that is etched first and then sealed, said method comprising the following steps:

Step 1. Take the metal substrate

Step 2. Pre-plating copper on the surface of the metal substrate

Coating a layer of copper film on the surface of the metal substrate;

Step 3, green paint coating

Green paint is applied to the front and back of the metal substrate with the pre-plated copper film;

Step 4. Remove part of the green paint on the back of the metal substrate

Use the exposure and development equipment to expose, develop and remove part of the graphic green paint on the back of the metal substrate coated with green paint in step 3;

Step 5. Electroplating inert metal circuit layer

Electroplating an inert metal circuit layer in the area where part of the green paint is removed on the back of the metal substrate in step 4;

Step 6. Plating metal circuit layer

On the surface of the inert metal circuit layer in step 5, a multi-layer or single-layer metal circuit layer is plated;

Step 7. Green paint coating

Covering the back of the metal substrate with green paint;

Step 8. Remove part of the green paint on the back of the metal substrate

Use the exposure and development equipment to perform graphic exposure, development and removal of part of the graphic green paint on the back of the metal substrate covered with green paint in step 4;

Step 9. Plating metal circuit layer

Plating a multi-layer or single-layer metal circuit layer on the surface of the metal circuit layer in step 6;

Step 10. Green paint coating

Covering the back of the metal substrate with green paint;

Step 11. Remove part of the green paint on the back of the metal substrate

Exposing, developing and removing part of the graphic green paint on the back of the metal substrate coated with green paint in step ten by using exposure and developing equipment;

Step 12. Cover the circuit board

Cover the circuit board on the back of the metal substrate;

Step 13, pre-metallization treatment

Pre-metallization of the electroplated metal circuit layer on the back of the substrate;

Step 14. Remove the circuit board

Remove the circuit board in step 12;

Step 15. Electroplating the metal circuit layer

Coating multi-layer or single-layer metal circuit layers on the back of the metal substrate;

Step sixteen, green paint coating

Covering the back of the metal substrate with green paint;

Step 17. Remove part of the green paint on the front surface of the metal substrate

Use exposure and development equipment to expose, develop and remove part of the graphic green paint on the front of the metal substrate;

Step 18. Chemical Etching

Perform chemical etching on the area where exposure and development have been completed in step seventeen;

Step 19. Electroplating metal circuit layer

A single or multi-layer metal circuit layer is plated on the surface of the inert metal circuit layer. After the metal plating is completed, corresponding pins or base islands and pins or base islands, pins and electrostatic discharge rings are formed on the metal substrate;

Step 20, chip loading and chip bottom filling

Fill epoxy resin on the front side of the pin or the front side of the base island and the front side of the pin flip chip and the bottom of the chip in step 19;

Step 21. Encapsulation

Carry out the plastic encapsulation process on the front of the metal substrate after chip loading and wiring;

Step 22. Open holes on the back of the metal substrate

On the back of the metal substrate, drill holes in the area where metal balls will be planted;

Step twenty-three, cleaning

Cleaning of oxidized substances and organic substances at the openings on the back of the metal substrate;

Step twenty-four, planting the ball

Implant metal balls in the green paint openings on the back of the metal substrate;

Step 25. Cut the finished product

Cut the semi-finished products that have been ball-planted in step 24, so that the plastic package modules that were originally integrated in the form of an array assembly and contain chips are cut and separated one by one, and the single-chip flip chip is etched first and then packaged. The base island is embedded in the packaging structure, and conventional diamond blades and conventional cutting equipment can be used.

The present invention also provides a flip-chip single-sided three-dimensional circuit packaging structure that is etched first and then sealed. It includes pins, and the front of the pins is provided with a chip through a conductive or non-conductive adhesive material. The front of the chip is connected to the front of the pins. The area between the pins, the area above the pins, the area below the pins, as well as the chip and the metal wires are all encapsulated with plastic encapsulant and green paint. A small hole is opened on the green paint on the back of the foot, and the small hole communicates with the back of the pin, and a metal ball is arranged in the small hole, and the metal ball is in contact with the back of the pin.

The step 23 cleans the openings of the green paint on the back of the metal substrate and covers the metal protective layer at the same time.

The packaging structure includes a base island, the front of the chip is flip-chip on the front of the base island and the front of the pins, and an underfill glue is arranged between the bottom of the chip and the front of the base island and the front of the pins.

Compared with the prior art, the present invention has the following beneficial effects:

1. The present invention does not need to use the glass fiber layer, so the cost brought by the glass fiber layer can be reduced;

2. The present invention does not use the foaming material of the glass fiber layer, so the reliability level can be further improved, and the relative safety of the package will be improved;

3. The present invention does not need to use glass fiber material, so the environmental pollution caused by glass fiber material can be reduced;

4. The circuit layer of the three-dimensional metal substrate of the present invention adopts the electroplating method, and the total thickness of the electroplating layer is about 10-15 μm, and the gap between the lines can easily reach a gap below 25 μm, so it can be truly The technical ability to achieve high-density internal pin line tiling;

5. The three-dimensional metal substrate of the present invention adopts the metal layer electroplating method, so it is simpler than the process of glass fiber high-voltage copper foil metal layer, and there will be no metal layer unevenness, metal layer damage and metal layer due to high pressure. Poor or confused layer extension and displacement;

6. The three-dimensional metal substrate circuit layer of the present invention is metal electroplated on the surface of the metal substrate, so the material properties are basically the same, so the internal stress of the plating circuit and the metal substrate is basically the same, and the post-engineering in harsh environments can be easily carried out ( Such as high-temperature eutectic chip mounting, high-temperature tin solder chip mounting, and surface mount work of high-temperature passive components) are not prone to stress deformation.

Description of drawings

1 to 25 are schematic diagrams of each process in Embodiment 1 of the manufacturing method of flip-chip single-sided three-dimensional circuit of the present invention, which is etched first and then sealed.

Fig. 26 is a structural schematic diagram of Embodiment 1 of the packaging structure of flip-chip single-sided three-dimensional circuit etched first and then sealed according to the present invention.

27 to 51 are schematic diagrams of each process in Embodiment 2 of the manufacturing method of flip-chip single-sided three-dimensional circuit of the present invention, which is etched first and then sealed.

Fig. 52 is a structural schematic diagram of Embodiment 2 of the packaging structure of flip-chip single-sided three-dimensional circuit etched first and then sealed according to the present invention.

53 to 64 are flow charts of the manufacturing process of the traditional high-density substrate packaging structure.

Figure 65 is a schematic diagram of the etching status of the copper foil metal layer on the surface of the glass fiber.

in:

Metal Substrate 1

Copper film 2

Green paint 3

Inert metal wiring layer 4

metal line layer 5

Circuit board 6

Metallization pretreatment layer 7

Underfill 8

Chip 9

Plastic compound 10

Small hole 11

Metal protection layer 12

metal ball 13

Key Island 14

pin 15.

Detailed ways

A manufacturing method of a flip-chip single-sided three-dimensional circuit of the present invention is etched first and then sealed, and its packaging structure is as follows:

Embodiment 1, no base island

Step 1. Take the metal substrate

Referring to Figure 1, take a metal substrate with a suitable thickness. The material of the metal substrate can be changed according to the function and characteristics of the chip, such as copper, iron, nickel-iron, zinc-iron, etc.

Step 2. Pre-plating copper on the surface of the metal substrate

Referring to Figure 2, a layer of copper film is plated on the surface of the metal substrate to lay the foundation for subsequent electroplating. (The way of electroplating can be electroless plating or electrolytic plating).

Step 3, green paint coating

Referring to FIG. 3 , green paint is applied to the front and back of the metal substrate on which the pre-plated copper film is completed, so as to protect the subsequent electroplating metal layer process.

Step 4. Remove part of the green paint on the back of the metal substrate

Referring to Figure 4, use the exposure and development equipment to expose, develop and remove part of the graphic green paint on the back of the metal substrate covered with green paint in step 3, so as to expose the pattern of the area on the back of the metal substrate that needs to be electroplated.

Step 5. Electroplating inert metal circuit layer

Referring to Figure 5, an inert metal circuit layer is electroplated in the area where part of the green paint is removed on the back of the metal substrate in step 4. As a barrier layer for subsequent etching work, the inert metal can be nickel, titanium or copper, and the electroplating method can be electroless plating or It is an electrolytic plating method.

Step 6. Plating metal circuit layer

Referring to Fig. 6, multi-layer or single-layer metal circuit layers are plated on the surface of the inert metal circuit layer in step five, and the metal circuit layer can be made of gold-nickel, copper-nickel-gold, copper-nickel-palladium-gold, palladium-gold, copper One or more of them, the electroplating method can be electroless plating or electrolytic plating.

Step 7. Green paint coating

Referring to FIG. 7 , green paint is applied on the back of the metal substrate to protect the subsequent electroplating metal layer process.

Step 8. Remove part of the green paint on the back of the metal substrate

Referring to FIG. 8 , use the exposure and developing equipment to expose, develop and remove part of the patterned green paint on the back of the metal substrate coated with green paint in step 4, so as to expose the pattern of the area on the back of the metal substrate that needs to be electroplated.

Step 9. Plating metal circuit layer

Referring to Fig. 9, a multi-layer or a single-layer metal circuit layer is plated on the surface of the metal circuit layer in step six, and the metal circuit layer can be made of gold-nickel, copper-nickel-gold, copper-nickel-palladium-gold, palladium-gold, or copper. One or more of them, the electroplating method can be electroless plating or electrolytic plating.

Step 10. Green paint coating

Referring to FIG. 10 , green paint is applied on the back of the metal substrate to protect the subsequent electroplating metal layer process.

Step 11. Remove part of the green paint on the back of the metal substrate

Referring to FIG. 11 , use exposure and developing equipment to expose, develop and remove part of the graphic green paint on the back of the metal substrate covered with green paint in step ten, so as to expose the pattern of the area on the back of the metal substrate that needs to be electroplated.

Step 12. Cover the circuit board

Referring to Fig. 12, the circuit board is covered on the back of the metal substrate.

Step 13, pre-metallization treatment

Referring to Figure 13, the metallization pretreatment of the electroplated metal circuit layer is performed on the back of the substrate, and the metallization pretreatment can be applied by coating methods (spraying, printing, shower coating, immersion, etc.).

Step 14. Remove the circuit board

Referring to Figure 14, remove the circuit board in step 12.

Step 15. Electroplating the metal circuit layer

Referring to Figure 15, a multi-layer or single-layer metal circuit layer is plated on the back of the metal substrate. The metal circuit layer can be one or more of gold-nickel, copper-nickel-gold, copper-nickel-palladium-gold, palladium-gold, and copper. One, the electroplating method can be chemical plating or electrolytic plating.

Step sixteen, green paint coating

Referring to FIG. 16 , green paint is applied on the back of the metal substrate so as to encapsulate the metal circuit layer.

Step 17. Remove part of the green paint on the front surface of the metal substrate

Referring to FIG. 11 , the exposure and development equipment is used to expose, develop and remove part of the graphic green paint on the front of the metal substrate, so as to expose the pattern of the area on the front of the metal substrate that needs to be electroplated.

Step 18. Chemical Etching

Referring to FIG. 18 , perform chemical etching on the exposed and developed area in step seventeen until the inert metal circuit layer is reached. The etching solution can be copper chloride or ferric chloride.

Step 19. Electroplating metal circuit layer

Referring to Figure 19, a single-layer or multi-layer metal circuit layer is plated on the surface of the inert metal circuit layer. After the metal plating is completed, corresponding pins are formed on the metal substrate. The type of plating can be copper-nickel-gold, copper-nickel-silver, Palladium gold, gold or copper, etc., the electroplating method can be electroless plating or electrolytic plating.

Step 20, chip loading and chip bottom filling

Referring to FIG. 20 , in the nineteenth step, the front flip chip of the pins and the bottom of the chip are filled with epoxy resin.

Step 21. Encapsulation

Referring to Figure 21, the front side of the metal substrate after chip mounting and wire bonding is subjected to a plastic encapsulation process. The purpose is to use epoxy resin to fix and protect the chip and metal wires. The encapsulation method adopts mold filling, spraying or brushing. The molding compound can be filled or unfilled epoxy resin.

Step 22. Open holes on the back of the metal substrate

Referring to Fig. 22, holes are drilled on the back of the metal substrate in the area where metal balls are to be planted, and holes can be drilled by dry laser sintering or wet chemical etching.

Step twenty-three, cleaning

Referring to Figure 23, cleaning of oxidized substances and organic substances is carried out at the openings of the green paint on the back of the metal substrate, and at the same time, the coating of the metal protective layer can be carried out, and the metal protective layer is made of anti-oxidation material.

Step twenty-four, planting the ball

Referring to Figure 24, metal balls are implanted in the holes on the back of the metal substrate so that the metal balls are in contact with the back of the pins. A conventional ball planting machine or a metal paste can be used to print and dissolve at high temperature to form a spherical body. , the material of the metal ball can be pure tin or tin alloy.

Step 25. Cut the finished product

Referring to Figure 25, the semi-finished product that has completed the ball planting in step 24 is cut, so that the plastic package modules that were originally integrated in the form of an array assembly and contain chips are cut and separated one by one to obtain a single chip flip chip The base island is embedded in the packaging structure after etching first, and conventional diamond blades and conventional cutting equipment can be used.

As shown in FIG. 26 , the present invention also provides a packaging structure in which a flip-chip single-sided three-dimensional circuit is etched first and then sealed. The packaging structure includes pins 15, and the front of the chip 9 is flip-chip on the front of the pins 15. Underfill glue 8 is arranged between the bottom of the chip 9 and the front of the pin 15, the area between the pin 15 and the pin 15, the area on the upper part of the pin 15, the area on the lower part of the pin 15, and the area outside the chip 9. Both are encapsulated with green paint 3 and molding compound 10, the green paint 3 on the back of the pin 15 is provided with a small hole 11, the small hole 11 communicates with the back of the pin 15, and the small hole 11 is provided with A metal ball 13, a metal protection layer 12 is provided between the metal ball 13 and the back of the pin 15, and the metal ball 13 is made of tin or tin alloy material.

Embodiment 2, there is base island

Step 1. Take the metal substrate

Referring to Figure 27, take a metal substrate with an appropriate thickness. The material of the metal substrate can be changed according to the functions and characteristics of the chip, such as copper, iron, nickel-iron, zinc-iron, etc.

Step 2. Pre-plating copper on the surface of the metal substrate

Referring to Figure 28, a layer of copper film is plated on the surface of the metal substrate to lay the foundation for subsequent electroplating. (The way of electroplating can be electroless plating or electrolytic plating).

Step 3, green paint coating

Referring to FIG. 29 , green paint is applied to the front and back of the metal substrate on which the pre-plated copper film is completed, so as to protect the subsequent electroplating metal layer process.

Step 4. Remove part of the green paint on the back of the metal substrate

Referring to FIG. 30 , use the exposure and developing equipment to expose, develop and remove part of the graphic green paint on the back of the metal substrate coated with green paint in step 3, so as to expose the pattern of the area on the back of the metal substrate that needs to be electroplated.

Step 5. Electroplating inert metal circuit layer

Referring to Figure 31, an inert metal circuit layer is electroplated in the area where part of the green paint is removed on the back of the metal substrate in step 4. As a barrier layer for subsequent etching work, the inert metal can be nickel, titanium or copper, and the electroplating method can be electroless plating or It is an electrolytic plating method.

Step 6. Plating metal circuit layer

Referring to Fig. 32, a multi-layer or single-layer metal circuit layer is plated on the surface of the inert metal circuit layer in step five, and the metal circuit layer can be made of gold nickel, copper nickel gold, copper nickel palladium gold, palladium gold, copper material One or more of them, the electroplating method can be electroless plating or electrolytic plating.

Step 7. Green paint coating

Referring to FIG. 33 , green paint is applied on the back of the metal substrate to protect the subsequent electroplating metal layer process.

Step 8. Remove part of the green paint on the back of the metal substrate

Referring to FIG. 34 , use the exposure and developing equipment to expose, develop and remove part of the patterned green paint on the back of the metal substrate covered with green paint in step 4, so as to expose the pattern of the area on the back of the metal substrate that needs to be electroplated.

Step 9. Plating metal circuit layer

Referring to Fig. 35, a multi-layer or single-layer metal circuit layer is plated on the surface of the metal circuit layer in step six, and the metal circuit layer can be made of gold nickel, copper nickel gold, copper nickel palladium gold, palladium gold, copper material One or more of them, the electroplating method can be electroless plating or electrolytic plating.

Step 10. Green paint coating

Referring to FIG. 36 , green paint is applied on the back of the metal substrate to protect the subsequent electroplating metal layer process.

Step 11. Remove part of the green paint on the back of the metal substrate

Referring to FIG. 37 , use the exposure and developing equipment to expose, develop and remove part of the graphic green paint on the back of the metal substrate coated with green paint in step ten, so as to expose the pattern of the area on the back of the metal substrate that needs to be electroplated.

Step 12. Cover the circuit board

Referring to Fig. 38, the circuit board is covered on the back of the metal substrate.

Step 13, pre-metallization treatment

Referring to Figure 39, the metallization pretreatment of the electroplated metal circuit layer is carried out on the back of the substrate, and the metallization pretreatment can be applied by coating methods (spraying, printing, shower coating, immersion, etc.).

Step 14. Remove the circuit board

Referring to Figure 40, remove the circuit board in step 12.

Step 15. Electroplating the metal circuit layer

Referring to Figure 41, a multi-layer or single-layer metal circuit layer is plated on the back of the metal substrate. The metal circuit layer can be one or more of gold-nickel, copper-nickel-gold, copper-nickel-palladium-gold, palladium-gold, and copper. One, the electroplating method can be chemical plating or electrolytic plating.

Step sixteen, green paint coating

Referring to FIG. 42 , green paint is applied on the back of the metal substrate so as to encapsulate the metal circuit layer.

Step 17. Remove part of the green paint on the front surface of the metal substrate

Referring to FIG. 43 , the front of the metal substrate is subjected to graphic exposure, development and removal of part of the graphic green paint by using the exposure and development equipment, so as to expose the pattern of the area on the front of the metal substrate that needs to be electroplated later.

Step 18. Chemical Etching

Referring to FIG. 44 , chemically etch the exposed and developed area in step 17 until the inert metal circuit layer is reached. The etching solution can be copper chloride or ferric chloride.

Step 19. Electroplating metal circuit layer

Referring to Figure 45, a single or multi-layer metal circuit layer is plated on the surface of the inert metal circuit layer. After the metal plating is completed, corresponding base islands and pins are formed on the metal substrate. The type of plating can be copper-nickel-gold, copper Nickel silver, palladium gold, gold or copper, etc., the electroplating method can be electroless plating or electrolytic plating.

Step 20, chip loading and chip bottom filling

Referring to FIG. 46 , in step nineteen, flip-chip on the front side of the base island and the front side of the pins and fill the bottom of the chip with glue.

Step 21. Encapsulation

Referring to Figure 47, the front side of the metal substrate after the chip loading is completed is encapsulated with a plastic encapsulation process, the purpose is to use epoxy resin to fix and protect the chip and the metal wire, and the encapsulation method adopts mold pouring, spraying or brushing. The molding compound can be filled or unfilled epoxy resin.

Step 22. Open holes on the back of the metal substrate

Referring to Fig. 48, holes are drilled on the back of the metal substrate in the area where metal balls are to be planted later, and holes can be drilled by dry laser sintering or wet chemical etching.

Step twenty-three, cleaning

Referring to Figure 49, cleaning of oxidized substances and organic substances is carried out at the openings of the green paint on the back of the metal substrate, and at the same time, the coating of the metal protective layer can be carried out, and the metal protective layer is made of anti-oxidation material.

Step twenty-four, planting the ball

Referring to Figure 50, metal balls are implanted in the openings on the back of the metal substrate so that the metal balls are in contact with the back of the pins. A conventional ball planting machine or a metal paste can be used to print and dissolve at high temperature to form a spherical body. , the material of the metal ball can be pure tin or tin alloy.

Step 25. Cut the finished product

Referring to Figure 51, the semi-finished products that have been ball-planted in step 24 are cut, so that the plastic package modules that are originally integrated in the form of an array assembly and contain chips are cut and separated one by one to obtain a single-chip flip-chip The base island is embedded in the packaging structure after etching first, and conventional diamond blades and conventional cutting equipment can be used.

As shown in Fig. 52, the present invention also provides a package structure in which flip-chip single-sided three-dimensional circuits are etched first and then sealed. The package structure includes base islands 14 and pins 15. The front side of the island 14 and the front side of the pin 15, the bottom of the chip 9 and the front side of the base island 14 and the front side of the pin 15 are provided with underfill glue 8, the area around the base island 14, the area between the base island 14 and the pin 15 The area between the pins 15 and 15, the area above the base island 14 and the pin 15, the area below the base island 14 and the pin 15, and the chip 9 is encapsulated with green paint 3 and plastic encapsulant 10 , the green paint 3 on the back side of the pin 15 is provided with a small hole 11, the small hole 11 communicates with the back side of the pin 15, and a metal ball 13 is arranged in the small hole 11, and the metal ball 13 is connected to the lead wire. A metal protection layer 12 is provided between the backs of the feet 15, and the metal ball 13 is made of tin or tin alloy material.

Claims (4)

1. the three-dimensional circuit of flip-chip single face loses earlier and afterwards seals manufacturing approach, said method comprising the steps of:

Step 1, get metal substrate

Step 2, metallic substrate surfaces preplating copper

At metallic substrate surfaces plating one deck copper material film;

Step 3, the lining of green lacquer

The lining of green lacquer is carried out at the metal substrate front and the back side accomplishing preplating copper material film respectively;

The green lacquer of part is removed at step 4, the metal substrate back side

The metal substrate back side that utilizes exposure imaging equipment that step 3 is accomplished green lacquer lining is carried out graph exposure, develops and is removed the green lacquer of part figure;

Step 5, plating inert metal line layer

In step 4, electroplate the inert metal line layer in the zone of the green lacquer of metal substrate back side removal part;

Step 6, plated metal line layer

Inert metal line layer surface in step 5 plates multilayer or single-layer metal line layer;

Step 7, the lining of green lacquer

Carry out the lining of green lacquer at the back side of metal substrate;

The green lacquer of part is removed at step 8, the metal substrate back side

The metal substrate back side that utilizes exposure imaging equipment that step 4 is accomplished green lacquer lining is carried out graph exposure, develops and is removed the green lacquer of part figure;

Step 9, plated metal line layer

Metallic circuit laminar surface in step 6 plates multilayer or single-layer metal line layer;

Step 10, the lining of green lacquer

Carry out the lining of green lacquer at the back side of metal substrate;

The green lacquer of part is removed at step 11, the metal substrate back side

The metal substrate back side that utilizes exposure imaging equipment that step 10 is accomplished green lacquer lining is carried out graph exposure, develops and is removed the green lacquer of part figure;

Step 12, be covered with the circuit web plate

Be covered with the circuit web plate at the metal substrate back side;

Step 13, metallization pre-treatment

Carry out the metallization pre-treatment of plated metal line layer at substrate back;

Step 14, remove the circuit web plate

The circuit web plate of step 12 is removed;

Step 15, plated metal line layer

Plate multilayer or single-layer metal line layer at the metal substrate back side;

Step 10 six, the lining of green lacquer

Carry out the lining of green lacquer at the back side of metal substrate;

Step 10 seven, metal substrate front face are removed the green lacquer of part

Utilize exposure imaging equipment that the metal substrate front is carried out graph exposure, develops and removed the green lacquer of part figure;

Step 10 eight, chemical etching

Chemical etching is carried out in the zone of accomplishing exposure imaging in the step 10 seven;

Step 10 nine, plated metal line layer

Plate the metallic circuit layer of individual layer or multilayer on inert metal line layer surface, promptly on metal substrate, form corresponding pin or Ji Dao and pin after metal plating is accomplished;

Step 2 ten, load and chip bottom are filled

Positive and pin front flip-chip and chip bottom filling epoxy resin on the positive or basic island of the pin of step 10 nine;

Step 2 11, seal

Plastic packaging material is carried out in metal substrate front behind the completion load routing seal operation;

Step 2 12, the perforate of the metal substrate back side

At the metal substrate back side perforate operation is carried out in the follow-up zone that will plant metal ball;

Step 2 13, cleaning

Tapping carries out the cleaning of oxidation material, organic substance at the metal substrate back side;

Step 2 14, plant ball

Green lacquer tapping is implanted into metal ball at the metal substrate back side;

Step 2 15, cutting finished product

Step 2 14 is accomplished the semi-finished product of planting ball carry out cutting operation; Make and originally integrate and to contain more than cuttings of plastic-sealed body module of chip independent with array aggregate mode; Encapsulate base island embedded encapsulating structure after making the etching of single-chip upside-down mounting elder generation, can adopt conventional diamond blade and conventional cutting equipment to get final product.

2. the three-dimensional circuit of flip-chip single face as claimed in claim 1 loses earlier and afterwards seals encapsulating structure; It is characterized in that it comprises pin (16); The positive upside-down mounting of said chip (9) is in pin (5) front; Be provided with underfill (8) between said chip (9) bottom and pin (15) front; The zone of the zone on the zone between said pin (15) and the pin (15), pin (15) top, pin (15) bottom and chip (9) are outer to be encapsulated with green lacquer (3) and plastic packaging material (10), offers aperture (11) on the green lacquer (3) at said pin (15) back side, and said aperture (11) is connected with pin (15) back side; Be provided with metal ball (13) in the said aperture (11), said metal ball (13) contacts with pin (15) back side.

3. the three-dimensional circuit of a kind of flip-chip single face according to claim 1 loses the manufacture method of afterwards sealing earlier, it is characterized in that: the 13 pairs of metal substrate back side of said step 2 tapping cleans and carries out the coat of metal lining simultaneously.

4. the three-dimensional circuit of a kind of flip-chip single face according to claim 2 loses earlier the encapsulating structure that afterwards seals; It is characterized in that: said encapsulating structure comprises Ji Dao (14); The positive upside-down mounting of said chip (9) is positive and pin (15) front in Ji Dao (14), is provided with underfill (8) between said chip (9) bottom and Ji Dao (14) front and pin (15) front.

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