CN102717324B - Substrate board treatment - Google Patents
Substrate board treatment Download PDFInfo
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- CN102717324B CN102717324B CN201210171635.9A CN201210171635A CN102717324B CN 102717324 B CN102717324 B CN 102717324B CN 201210171635 A CN201210171635 A CN 201210171635A CN 102717324 B CN102717324 B CN 102717324B
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- substrate
- spacing
- bistrique
- board treatment
- plummer
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The present invention relates to technical field of flat panel display, relate in particular to a kind of substrate board treatment. This substrate board treatment is for the treatment of substrate, it at least comprises bistrique, plummer and cushion pad, described bistrique is for carrying out polishing to described substrate, described plummer is used for carrying described substrate, described cushion pad is arranged between described substrate and plummer, for play cushioning effect in the time that described bistrique carries out polishing to described substrate; Described plummer comprises bearing part and qualifying part, described bearing part is used for carrying described cushion pad and substrate, can there is relative displacement in relatively described bearing part in described cushion pad, described qualifying part is used for limiting described cushion pad and substrate, prevents that described substrate and cushion pad from larger displacement occurring; Described bearing part at least comprises first surface, and described qualifying part at least comprises second surface, and described qualifying part is combined and is combined with described bearing part with described first surface by described second surface.
Description
Technical field
The present invention relates to technical field of flat panel display, relate in particular to a kind of substrate board treatment.
Background technology
Capacitive touch panels is the advantage such as multi-point touch, transmitance are high, long service life owing to having, day by dayReplace traditional electrical resistive touch panel, mobile phone, player, e-book, net book, personal digital assistant,On panel computer, use.
Owing to having replaced traditional mechanical key, make capacitive touch panels have larger viewing area for aobviousShow word or picture, video information. Also just because of this, described touch panel is by the receiver of traditional communication devicePosition covers, and for the ease of the sound dispersion of described receiver, industry is conventionally corresponding on described touch panelThe position of the receiver of described communicator arranges a through hole. Described through hole through boring device at described touch panelAfter upper formation, its edge is more coarse, and light, therefore needs this edge to carry out polishing not. But, orderThe polishing mode that front industry adopts, the layer on very easy damage touch panel surface, even causes described touchingTouch panel ruptures.
Summary of the invention
In view of this, be necessary to provide a kind of and can effectively reduce damage, improve the processing substrate dress in service lifePut.
A kind of substrate board treatment is for the treatment of substrate, and it at least comprises bistrique, plummer and cushion pad, instituteState bistrique for described substrate is carried out to polishing, described plummer is used for carrying described substrate, described cushion padBe arranged between described substrate and plummer, for play buffering in the time that described bistrique carries out polishing to described substrateEffect; Described plummer comprises bearing part and qualifying part, and described bearing part is used for carrying described bufferingPad and substrate, can there is relative displacement in relatively described bearing part in described cushion pad, and described qualifying part is used forLimit described cushion pad and substrate, prevent that described substrate and cushion pad from larger displacement occurring; Described supporting partDivide and at least comprise first surface, described qualifying part at least comprises second surface, and this qualifying part is by secondSurperficial and described first surface is combined and is combined with described bearing part.
In described substrate board treatment provided by the invention, described first surface at least comprises first area andTwo regions, this first area and described second area adjacency, and described second area is around described the firstth districtTerritory, the second surface of this qualifying part is combined with second area.
In described substrate board treatment provided by the invention, described qualifying part also comprises the 3rd surface and firstSide, described second surface is parallel and by described the first side combination, described qualifying part with the 3rd surfaceProtrude from outside described first surface, and there is the second spacing between described the 3rd surface and first surface; DescribedThe first side is positioned at the side near described first area on described qualifying part.
In described substrate board treatment provided by the invention, this cushion pad at least comprises the 4th surface, the 5th tableFace and the second side, described the 4th surface is parallel with the 5th surface, and described cushion pad is by described the 4th surfaceBe combined and be placed on described bearing part with the first area of described first surface, described the 5th surface is with theBetween one surface, there is the 3rd spacing, and described the second spacing is greater than described the 3rd spacing; Described the second sideWith described the first parallel sided, and between described the second side and the first side, there is one the 4th spacing.
In described substrate board treatment provided by the invention, described substrate at least comprises the first base being parallel to each otherPlate surface and second substrate surface, have between the 5th between described first substrate surface and second substrate surfaceDistance; Described substrate is placed in described cushion pad by described first substrate surface with described the 5th surface conjunctionUpper, described the 3rd spacing is 3 to 6 times of the 5th spacing, and described the second spacing is greater than described the 3rdDistance and the 5th spacing sum.
In described substrate board treatment provided by the invention, this bistrique is positioned at the top of described plummer, and it extremelyComprise less Part I, Part II and Part III, described Part I and Part III are by described theTwo part combinations, the distance of this Part III and plummer is the near distance of this Part I and plummer.
In described substrate board treatment provided by the invention, described bistrique entirety is bar-shaped cylindrical, its with holdMicroscope carrier has one first spacing, and it is cylindrical that described Part I and Part III are all strip, and described secondPart is strip taper shape, and described Part I has the first bottom surface radius, and described Part II has theTwo bottom surface radiuses and the 3rd bottom surface radius, described Part III has the 4th bottom surface radius, described the first bottom surfaceRadius equals the second bottom surface radius, and described the 3rd bottom surface radius equals the 4th bottom surface radius, and described first endRadius surface is greater than described the 4th bottom surface radius; Described substrate board treatment also comprises a regulon and a rotationUnit, can there is vertical displacement through described regulon in described bistrique, and between adjustment and described plummerThe first spacing; Described bistrique also can carry out High Rotation Speed under the drive of described rotary unit, to described substrateCarry out polishing.
In described substrate board treatment provided by the invention, described substrate also comprises the first through hole, described firstThrough hole is positioned at a side of described substrate, and it runs through described first substrate surface and second substrate surface; DescribedThe size of one through hole is greater than the size of described Part III, and is less than the size of Part I, and it can collecting postState Part III; Described Part II and Part III have in the direction perpendicular to described first surfaceOne height and the second height, described the first height and the second height sum are less than or equal to described the 5th spacing; InstituteThe first through hole of stating substrate by the Part II of described bistrique and Part III polishing after, its shape is a funnelShape, its size near a side on described second substrate surface is greater than it near described first substrate surface one sideSize.
In described substrate board treatment provided by the invention, the throwing of described qualifying part on described first surfaceShadow overlaps with described second area, described first surface, second surface, the 3rd surface, first substrate surfaceAnd second substrate surface is smooth plane, and this first area is rectangular, the rectangular ring-type of second area.
In described substrate board treatment provided by the invention, described bistrique is made up of high-abrasive material, described bufferingPad is made up of elastomeric material, and it in the time being subject to External Force Acting, deformation can occur.
In described substrate board treatment provided by the invention, described in described substrate is positioned over by described cushion padOn plummer, can effectively prevent the bistrique of High Rotation Speed under described rotary unit drives and described substrateDescribed in while dislocation a little between the first through hole, bistrique damages described substrate, even makes described substrate break;Meanwhile, can effectively reduce the wearing and tearing of described bistrique, extend the service life of described bistrique.
Brief description of the drawings
Below in conjunction with drawings and Examples, the invention will be further described, in accompanying drawing:
Fig. 1 is the schematic diagram of the substrate board treatment of a preferred embodiments.
Detailed description of the invention
For substrate board treatment provided by the invention and processing method thereof are described, below in conjunction with Figure of descriptionThe present invention will be described in detail.
Refer to Fig. 1, it is the signal of the substrate board treatment of a preferred embodiments provided by the inventionFigure. Substrate board treatment 100 is for the treatment of substrate 200, its at least comprise bistrique 110, plummer 120,Cushion pad 130. Described bistrique 110 is for described substrate 200 is carried out to polishing, described plummer 120 useIn the described substrate 200 of carrying, described cushion pad 130 is arranged at described substrate 200 and described plummer 120Between, for play cushioning effect in the time that described bistrique 110 carries out polishing to described substrate 200.
Described bistrique 110 entirety are bar-shaped cylindrical, and it is positioned at described plummer 120 tops, and with instituteState plummer 120 and there is one first spacing. Described bistrique 110 comprises Part I 111, Part II112 and Part III 113. Described Part I 111 and Part III 113 are by described Part II112 combinations, it is cylindrical that described Part I 111 is strip, and it has the first bottom surface radius; DescribedPart II 112 is strip taper shape, and it has the second bottom surface radius and the 3rd bottom surface radius; DescribedIt is cylindrical that Part III 113 is strip, and it has the 4th bottom surface radius. Described the first bottom surface radius etc.In the second bottom surface radius, described the 3rd bottom surface radius equals the 4th bottom surface radius, described the first bottom surface radius andThe second bottom surface radius is greater than the 3rd bottom surface radius and the 4th bottom surface radius. Described Part III 113 with described inThe more described Part I 111 of distance of plummer 120 and the near distance of described plummer 120.
Described bistrique 110 is made up as diamond of high-abrasive material, and it can be through a regulon (not shown)There is vertical displacement, and the first spacing between adjustment and described plummer; It also can be at a rotary unit(not shown) is carried out High Rotation Speed under driving, and described substrate 200 is carried out to polishing.
Described plummer 120 comprises bearing part 121 and qualifying part 122. Described bearing part 121 useIn the described cushion pad 130 of carrying and substrate 200, described qualifying part 122 is for limiting described cushion pad130 and substrate 200, prevent that described cushion pad 130 and substrate 200 from larger displacement occurring. Described holdingCarry part 120 and at least comprise a first surface 121a, in the present embodiment, described first surface 121aIt is a smooth plane. Described first surface 121a at least comprises first area 121aa, second area (figureIn not shown), described first area 121aa and second area adjacency, and described second area is around describedFirst area 121aa. Described qualifying part 122 at least comprises second surface (not shown), the 3rd tableFace 122a and the first side 122b, described second surface and the 3rd surperficial 122a lay respectively at described restrictionThe both sides of part 122, and described second surface is two parallel planes with the 3rd surperficial 122a; DescribedTwo surfaces and the 3rd surperficial 122a are by described the first side 122b combination. Described qualifying part 122 is logicalCross described second surface and be combined with described second area, and it protrudes from outside described first surface 121a, makeDescribed the 3rd surperficial 122a parallel with described first surface 121a and and described first surface 121a betweenHave the second spacing, described the first side 122b is positioned on described qualifying part 122 near described the firstth districtA side of territory 121aa. The projection of described the 3rd surperficial 122a on described first surface 121a with described inSecond area overlaps. Described plummer 120 in the present embodiment entirety is square, and described the firstth districtTerritory 121aa is rectangular, and described second area is rectangular ring.
Described cushion pad 130 at least comprises the 4th surface 131, the 5th surface 132 and the second side 133.Described the 4th surface 131, the 5th surface 132 are a plane in the present embodiment, and it is parallel to each other and is logicalCross described the second side 133 combinations. Described cushion pad 130 is by described the 4th surface 131 and described theOne region 121aa in conjunction with and be placed on described bearing part 121, and make described the 5th surface 132 withParallel and described the 5th surface 132 of described first surface 121a and the 4th has one the between surface 131Three spacing, second side 133 parallel and described with described the first side 122b, described the second side 133 withBetween the first side 122b, there is one the 4th spacing. Described the second spacing is greater than described the 3rd spacing, the 4thSpacing is between 5 to 10 millimeters, and after described cushion pad 130 is placed on described bearing part 121,Can there is relative displacement in relatively described bearing part 121 in it. Described cushion pad 130 is made up of elastomeric material,In the time being subject to External Force Acting, can there is deformation in it.
Described substrate 200 at least comprises the first substrate surface 201 and the second substrate surface that are parallel to each other202, described first substrate surface 201 and second substrate surface 202 are smooth in the present embodimentPlane, and described substrate 200 is positioned on described cushion pad 130, described first substrate surface 201 withThe 5th surperficial 132 combinations of described cushion pad 130, described second substrate surface 202 and described the 5th tableFace 132 is parallel, and between described second substrate surface 202 and described first substrate surface 201, has theFive spacing, described the 3rd spacing is 3 to 6 times of described the 5th spacing, and described the 5th spacing with described inThe 3rd spacing sum is less than described the second spacing. Described substrate 200 also comprises and is arranged at first of one sideThrough hole 203, described the first through hole 203 runs through the first substrate surface 201 and second of described substrate 200Substrate surface 202. The size of described the first through hole 203 is greater than the size of described Part III 113, andCan accommodate described Part III 113; The size of described the first through hole 203 is less than described Part I 111Size. Described Part II 112 and Part III 113 are perpendicular to described first surface 121a'sIn direction, have respectively the first height and the second height, described the first height and the second height sum are less than or equal toDescribed the 5th spacing, and described the first height and second highly identical. The first through hole of described substrate 200203 by after the Part III 113 of described bistrique 110 and 112 polishings of Part II, and its shape is oneFunnel-form, described the first through hole 203 is greater than near the size of a side on described second substrate surface 202It is near the size of described first substrate surface 201 1 sides.
Described substrate 200 is positioned on described plummer 120 by described cushion pad 130, can be effectivePrevent the bistrique 110 of High Rotation Speed and the first through hole of described substrate 200 under described rotary unit drivesDescribed in while dislocation a little between 203, bistrique 110 damages described substrate 200, even makes 200 of described substratesRaw breaking, therefore substrate board treatment 100 provided by the invention in the time for the treatment of substrate 200, described substrate200 and described bistrique 110 between do not need exactitude position, shortened debug time, reduced labour intensity,Can greatly enhance productivity; Meanwhile, also can effectively reduce the wearing and tearing of described bistrique 110, described in prolongationIn the service life of bistrique 110, improve more than 10 times the service life of described bistrique 110, greatly fallsLow production cost.
Be more than the preferred embodiments of substrate board treatment provided by the invention, can not be interpreted as thisThe restriction of bright rights protection scope, those skilled in the art should know, and is not departing from the present invention designUnder prerequisite, also can do multiple improvement or replacement, these all improvement or replacement all should be in power of the present inventionIn profit protection domain, the scope of the present invention should be as the criterion with claim.
Claims (10)
1. a substrate board treatment, for the treatment of substrate, it at least comprises bistrique, plummer and bufferingPad, described bistrique is for carrying out polishing to described substrate, and described plummer is used for carrying described substrate, described inCushion pad is arranged between described substrate and plummer, in the time that described bistrique carries out polishing to described substratePlay cushioning effect; Described plummer comprises bearing part and qualifying part, and described bearing part is used for carrying instituteStating cushion pad and substrate, can there is relative displacement, described limited section in relatively described bearing part in described cushion padDivide for limiting described cushion pad and substrate, prevent that described substrate and cushion pad from larger displacement occurring; DescribedBearing part at least comprises first surface, and described qualifying part at least comprises second surface, described qualifying partBe combined and be combined with described bearing part with described first surface by described second surface.
2. substrate board treatment as claimed in claim 1, is characterized in that: described first surface at leastComprise first area and second area, this first area and described second area adjacency, and described Second RegionTerritory is around described first area, and the second surface of this qualifying part is combined with second area.
3. substrate board treatment as claimed in claim 2, is characterized in that: described qualifying part also wrapsDraw together the 3rd surface and the first side, described second surface is surperficial parallel and by described the first lateral junction with the 3rdClose, described qualifying part protrudes from outside described first surface, and tool between described the 3rd surface and first surfaceThere is the second spacing; Described the first side is positioned at the side near described first area on described qualifying part.
4. substrate board treatment as claimed in claim 3, is characterized in that: described cushion pad at least wrapsDraw together the 4th surface, the 5th surface and the second side, described the 4th surface is parallel with the 5th surface, described bufferingPad is combined and is placed in described bearing part with the first area of described first surface by described the 4th surfaceUpper, between described the 5th surface and first surface, there is the 3rd spacing, and described the second spacing is greater than described theThree spacing; Described the second side and described the first parallel sided, and between described the second side and the first sideThere is one the 4th spacing.
5. substrate board treatment as claimed in claim 4, is characterized in that: described substrate at least comprisesThe first substrate surface and the second substrate surface that are parallel to each other, described first substrate surface and second substrate surfaceBetween there is the 5th spacing; Described substrate is put with described the 5th surface conjunction by described first substrate surfaceBe put on described cushion pad, described the 3rd spacing is 3 to 6 times of the 5th spacing, and described the second spacingBe greater than described the 3rd spacing and the 5th spacing sum.
6. substrate board treatment as claimed in claim 5, is characterized in that: described in described bistrique is positioned atThe top of plummer, it at least comprises Part I, Part II and Part III, described Part I andPart III is by described Part II combination, the more described First of distance of described Part III and plummerDivide the near distance with plummer.
7. substrate board treatment as claimed in claim 6, is characterized in that: described bistrique entirety is rodShape is cylindrical, and itself and plummer have one first spacing, and described Part I and Part III are all stripCylindrical, described Part II is strip taper shape, and described Part I has the first bottom surface radius, instituteState Part II and have the second bottom surface radius and the 3rd bottom surface radius, described Part III has the 4th bottom surface halfFootpath, described the first bottom surface radius equals the second bottom surface radius, and described the 3rd bottom surface radius equals the 4th bottom surface halfFootpath, and described the first bottom surface radius is greater than described the 4th bottom surface radius; Described substrate board treatment also comprises oneRegulon and a rotary unit, can there is vertical displacement through described regulon in described bistrique, and adjust andThe first spacing between described plummer; Described bistrique also can carry out high speed under the drive of described rotary unitRotation, carries out polishing to described substrate.
8. substrate board treatment as claimed in claim 7, is characterized in that: described substrate also comprisesOne through hole, described the first through hole is positioned at a side of described substrate, and it runs through described first substrate surface and secondSubstrate surface; The size of described the first through hole is greater than the size of described Part III, and is less than Part ISize, it can accommodate described Part III; Described Part II and Part III are being shown perpendicular to described firstIn the direction of face, have the first height and the second height, described the first height and the second height sum are less than or equal toDescribed the 5th spacing; The first through hole of described substrate is by the Part II of described bistrique and Part III polishingAfter, its shape is a funnel-form, and its size near a side on described second substrate surface is greater than it near instituteState the size of first substrate surface one side.
9. substrate board treatment as claimed in claim 8, is characterized in that: described qualifying part is in instituteThe projection of stating on first surface overlaps with described second area, described first surface, second surface, the 3rd tableFace, first substrate surface and second substrate surface are smooth plane, and described first area is rectangular,The rectangular ring-type of second area.
10. substrate board treatment as claimed in claim 9, is characterized in that: described bistrique is by wear-resisting materialMaterial is made, and described cushion pad is made up of elastomeric material, and it in the time being subject to External Force Acting, deformation can occur.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210171635.9A CN102717324B (en) | 2012-05-29 | 2012-05-29 | Substrate board treatment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210171635.9A CN102717324B (en) | 2012-05-29 | 2012-05-29 | Substrate board treatment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102717324A CN102717324A (en) | 2012-10-10 |
| CN102717324B true CN102717324B (en) | 2016-05-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210171635.9A Active CN102717324B (en) | 2012-05-29 | 2012-05-29 | Substrate board treatment |
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| CN (1) | CN102717324B (en) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW400567B (en) * | 1995-04-10 | 2000-08-01 | Matsushita Electric Ind Co Ltd | The polishing device and its polishing method for the substrate |
| US6024630A (en) * | 1995-06-09 | 2000-02-15 | Applied Materials, Inc. | Fluid-pressure regulated wafer polishing head |
| JPH09141545A (en) * | 1995-11-22 | 1997-06-03 | Kyodo Printing Co Ltd | Foreign material removal device for filter substrate |
| JP2000094310A (en) * | 1998-09-24 | 2000-04-04 | Matsushita Electric Ind Co Ltd | Device for holding substrate to be polished, method for polishing substrate, and method for manufacturing semiconductor device |
| CN100453269C (en) * | 2006-12-12 | 2009-01-21 | 友达光电股份有限公司 | Substrate holder and fixing member thereof |
| EP2213415A1 (en) * | 2009-01-29 | 2010-08-04 | S.O.I. TEC Silicon | Device for polishing the edge of a semiconductor substrate |
| JP5466102B2 (en) * | 2010-07-08 | 2014-04-09 | セイコーインスツル株式会社 | Manufacturing method of glass substrate with through electrode and manufacturing method of electronic component |
| CN202640111U (en) * | 2012-05-29 | 2013-01-02 | 深圳莱宝高科技股份有限公司 | Substrate treating device |
-
2012
- 2012-05-29 CN CN201210171635.9A patent/CN102717324B/en active Active
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| Publication number | Publication date |
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| CN102717324A (en) | 2012-10-10 |
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