CN102702481A - Low dielectric resin composition, prepreg and film, copper foil laminate and printed circuit board - Google Patents

Abstract

The invention provides a low-dielectric resin composition, which comprises the following components in part by weight: a component : a primary resin comprising: component (A-1): an epoxy resin; and component (A-2): a low dielectric resin, wherein the ratio of the component (A-2) to the component (A-1) may be between 0 and 20; a component (B): a halogen-free hardener; and component (C): a chain extender. The present invention also provides a low dielectric resin composition comprising: a component : a primary resin comprising: component (A-1): a halogen epoxy resin; and component (A-2): a low dielectric resin, wherein the ratio of the component (A-2) to the component (A-1) may be between 0 and 20; and component (C): a chain extender. The invention also provides a prepreg and a film prepared by impregnating or coating the base material in the low-dielectric resin composition, a copper-clad laminate prepared by applying the prepreg and the film to hot pressing, and a printed circuit board prepared by applying the copper-clad laminate to hot pressing and wet processes.

Description

Low dielectric resin composition, prepreg and film, copper foil laminate and printed circuit board

technical field

The present invention relates to a kind of low dielectric resin composition, prepreg and film, copper foil laminated board and its printed circuit board, especially relates to a kind of main resin that mixes low dielectric resin and epoxy resin, in order to improve film A low dielectric resin composition with the electrical characteristics of a laminate. the

Background technique

At present, printed circuit boards are used in a wide range of fields and fields. Electronic components in general electronic products are inserted on printed circuit boards. Today's printed circuit boards are designed to meet the application range of high-power and high-calorie components. Conduct development and research on the heat dissipation effect of printed circuit boards to improve the heat dissipation efficiency and high power of circuit boards. the

Due to the rise of environmental protection awareness in recent years, many consumer electronics products have gradually replaced halogen-free copper foil substrates instead of halogen-containing copper foil substrates. Halogen-free copper foil substrates often add phosphorus-containing components to compensate for the flame-retardant effect. Traditionally, phosphorus-containing materials can be added in the main resin composition structure, or by adding additional phosphorus-containing compounds to the resin formulation. way to achieve, to gain the effect of flame retardancy. the

Taiwan Invention Patent No. I297346 discloses a thermosetting resin composition of cyanate ester resin, dicyclopentadienyl epoxy resin, fumed silica and thermoplastic resin. The composition of this thermosetting resin has low dielectric constant and low Dissipation coefficient properties. However, this manufacturing method must use flame retardants containing halogens (such as Br), such as tetrabromocyclohexane, hexabromocyclodecane, and 2,4,6-tris(tribromophenoxy)-1 , 3,5-Triazabenzene, and these bromine-containing flame retardants are easy to cause pollution to the environment when the product is manufactured, used, or even recycled or discarded. the

In addition, many researchers use styrene-maleic anhydride (styrene-maleic anhydrides, SMA) resin as a hardener for epoxy resin, thereby increasing the glass transition temperature (Tg) of electronic printed boards; however, when using styrene When maleic anhydride resin is used as hardener, it will reduce the transmission efficiency of electrons and increase the complexity of the process when its consumption is high; another traditional method is to directly blend SMA resin into the bisphenol A (bisphenol A , bisphenol A) type epoxy resin, and then add a catalyst to activate the reaction, but similar methods may lead to problems such as short life (service life, lifetime) of the resin composition and weak interlayer bonding. As disclosed in U.S. Patent No. 6,509,414, the use of a copolymer of styrene and maleic anhydride (SMA) as a resin hardener (curing agent, curing agent) can make a general bifunctional epoxy resin improve the heat resistance of the material, and then use a co-polymer to improve the heat resistance of the material. The method of crosslinking agent, such as the use of styrene-maleic anhydride copolymer (SMA) and co-crosslinking agent tetrabromobisphenol A (TBBA), tetrabromobisphenol A diglycidyl ether (TBBADGE), to improve the vitrification of the plate Transition temperature (Tg). It can be seen from the disclosed content that when the equivalence ratio increases from 70% to 110%, the DSC glass transition temperature (Tg) increases from 122°C to 155°C, and when the equivalence ratio increases from 110% to 150%, the DSC The glass transition temperature (Tg) decreased from 155°C to 137°C instead. From this phenomenon, it can be known that the equivalent ratio exceeds about 110%, and the cross-linking agent will no longer be able to increase the cross-linking density to increase the DSC glass transition temperature (Tg). the

Contents of the invention

One of the purposes of the present invention is to provide a low dielectric resin composition (low dielectric resin composition, low dielectric resin composition), wherein the main resin is composed of low dielectric resin and epoxy resin, so using The low dielectric resin replaces part of the epoxy resin to improve the electrical properties of the film/laminated plate (laminated plate) made of the low dielectric resin composition, such as reducing the dissipation factor. the

The embodiment of the present invention provides a low dielectric resin composition, comprising: component (A): main resin, which includes: component (A-1): halogen-free epoxy resin; and component (A-2) : low dielectric resin, wherein the ratio of component (A-2) to component (A-1) can be between 0 and 20; component (B): halogen-free hardener; and component ( C): Chain extenders. the

Wherein component (A-2): low dielectric resin is the compound shown in following formula (1):

式(1) 

Formula 1)

Wherein, n is 0 to 3, and R is _H or a carbon chain with more than one carbon.

Component (B) is phosphorus-containing phenolic resin hardening agent, and it is the compound of following formula (2):

式(2) 

Formula (2)

Wherein n, m are all 0 or 1; R ₁ is hydrogen or alkyl; HCA is formula (2-1) compound:

式(2-1) 

Formula (2-1)

wherein R _is H or a substituted group of 0 to 5 carbons.

According to the low dielectric resin composition of the present invention, in one embodiment, the sum of the solid content of component (A), component (B) and component (C) is 100 parts by weight, component (B ) content is 5 to 60% by weight, and the content of component (C) is 5 to 75% by weight. the

According to the low dielectric resin composition of the present invention, in one embodiment, the sum of the solid content of component (A), component (B) and component (C) is 100 parts by weight, component (B ) content is 10 to 45% by weight, and the content of component (C) is 5 to 50% by weight. the

According to the low dielectric resin composition of the present invention, in one embodiment, the sum of the solid content of component (A), component (B) and component (C) is 100 parts by weight, component (B ) content is 15 to 30% by weight, and the content of component (C) is 5 to 25% by weight. the

According to the low-dielectric resin composition of the present invention, in one embodiment, it also includes component (D): inorganic powder, with the solid of component (A), component (B) and component (C) The sum of the contents is 100 parts by weight, and component (D) is added in an amount of 5 to 75% by weight. the

According to the low dielectric resin composition of the present invention, in one embodiment, the low dielectric resin of component (A-2) is the compound shown in the following formula (1):

式(1) 

Formula 1)

Wherein n is 0 to 3, R ₁ is H.

According to the low dielectric resin composition of the present invention, component (C) is dicyandiamide, diaminodiphenyl sulfone, phenolic resin, melamine phenolic resin, benzoxazine resin, bisphenol A/F type benzoxazine One or a combination of two or more of oxazine resins and bis/multifunctional polyphenylene ether resins. the

According to the low dielectric resin composition of the present invention, component (D) can be silicon dioxide, aluminum nitride, aluminum hydroxide, aluminum borate, hydrogen Magnesium oxide, boron nitride, calcium carbonate, talcum powder, zinc borate, calcined kaolin, aluminum oxide, titanium dioxide glass powder, mica powder or a combination of two or more, the particle size of the powder is about 0.1 to 40 μm . the

Another embodiment of the present invention provides a low dielectric resin composition, comprising: component (A): main resin, which includes: component (A-1): halogen-containing epoxy resin; and component (A- 2): low dielectric resin, wherein the ratio of component (A-2) to component (A-1) can be between 0 and 20; and component (C): chain extender. the

Wherein component (A-2): low dielectric resin is the compound shown in following formula (1):

式(1) 

Formula 1)

Wherein, n is 0 to 3, and R is _H or a carbon chain with more than one carbon.

According to the low dielectric resin composition of the present invention, in one embodiment, the total solid content of component (A) and component (C) is 100 parts by weight, and the content of component (C) is 5 to 75% by weight. the

According to the low dielectric resin composition of the present invention, in one embodiment, the total solid content of component (A) and component (C) is 100 parts by weight, and the content of component (C) is 15 to 60% by weight. the

According to the low dielectric resin composition of the present invention, in one embodiment, the total solid content of component (A) and component (C) is 100 parts by weight, and the content of component (C) is 30 to 45% by weight. the

According to the low dielectric resin composition of the present invention, in one embodiment, it also includes component (D): inorganic powder, with the sum of the solid content of component (A) and component (C) being 100 weight parts, component (D) is added in an amount of 5 to 75% by weight. the

According to the low dielectric resin composition of the present invention, in one embodiment, the low dielectric resin of component (A-2) is the compound shown in the following formula (1):

式(1) 

Formula 1)

Wherein n is 0 to 3, R ₁ is H.

According to the low dielectric resin composition of the present invention, component (C) comprises dicyandiamide, diaminodiphenyl sulfone, phenolic resin, melamine phenolic resin, benzoxazine resin, bisphenol A/F type benzoxazine One or a combination of two or more of oxazine resins and bis/multifunctional polyphenylene ether resins. the

According to the low dielectric resin composition of the present invention, in one embodiment, component (D) can be silicon dioxide, aluminum nitride, hydrogen One or more combination of alumina, aluminum borate, magnesium hydroxide, boron nitride, calcium carbonate, talc, zinc borate, calcined kaolin, aluminum oxide, titanium dioxide glass powder, mica powder, powder The particle size is about 0.1 to 40 μm. the

The present invention also provides a film and a prepreg (prepreg) formed by impregnating or coating the base material in the above-mentioned low-dielectric resin composition, followed by curing and drying. the

The present invention also provides a laminate made of the film and the prepreg through a pressing process (such as a hot pressing process), such as a copper foil laminate. The present invention also provides a printed circuit board manufactured by using the aforementioned copper foil laminate at least by hot pressing process and wet process. the

The present invention has the following beneficial effects: the present invention mainly uses low dielectric resin to replace halogen-free or halogen-containing main resin to achieve better electrical characteristics. In addition, the present invention also transfers the main supply route of phosphorus or nitrogen atoms with flame retardant properties from epoxy resin to hardener or chain extender, so halogen-free epoxy resin can be selected, which has a wide range of glass transition temperatures Applicability, thereby improving the characteristics of the film/laminate produced. the

In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and accompanying drawings of the present invention. However, the accompanying drawings are provided for reference and illustration purposes only, and are not intended to limit the present invention. the

Detailed ways

The present invention provides a kind of low dielectric resin composition, and it selects suitable low dielectric resin to replace part of epoxy resin, so as to have good electrical characteristics such as low dissipation coefficient; And, the combination of epoxy resin and low dielectric resin It can solve the problems of low glass transition temperature (Tg) of the halogen-free substrate made of epoxy resin and poor interlayer bonding force of the substrate made of low dielectric resin. In addition, the present invention uses a specific halogen-free hardener, which has good flame retardant properties, and has the advantages of high dimensional stability and low hygroscopicity; it also has other excellent properties with the selection of appropriate epoxy resin and chain extender. Such as good electrical characteristics, such as low dissipation coefficient; good processing characteristics, suitable for punchable process; good heat dissipation characteristics, suitable for heat dissipation substrates. the

The low dielectric resin composition provided by the present invention includes component (A): main resin, component (B): halogen-free hardener and component (C): chain extender, wherein component (A): main Resin is made up of component (A-1): epoxy resin and component (A-2): low dielectric resin, and main resin of the present invention utilizes the low dielectric resin of chemical formula (1) to replace epoxy resin, In order to achieve better electrical characteristics. the

Since the present invention transfers the main supply route of phosphorus or nitrogen atoms having flame retardant properties from the epoxy resin to the hardener (component (B)) or the chain extender (component (C)), the component (A -1) The epoxy resin is not particularly limited, for example, the halogen-free epoxy resin used in laminated boards, preferred examples include but not limited to: bisphenol epoxy resin, novolak type (novolac) Epoxy resin, four-functional epoxy resin, phosphorus-containing epoxy resin, which can be used alone or in combination of two or more; the epoxy resin of component (A-1) can also be a halogen-containing epoxy resin (as experimental example 5,6 of table 2). the

Wherein, the so-called bisphenol epoxy resin refers to the use of compounds with bisphenol structure in the molecule, for example: bisphenol A epoxy resin, bisphenol F epoxy resin, brominated bisphenol epoxy resin. the

Among them, the so-called novolak type epoxy resin refers to the use of compounds with novolak type structure in the molecule, such as: phenol novolak type epoxy resin, cresol novolak type epoxy resin, naphthol novolak type epoxy resin, bisphenol A phenolic epoxy resin. the

Among them, the so-called phosphorus-containing epoxy resin can use any epoxy resin and organic cyclic phosphide (HCA) to react with the side chain phosphorus-containing epoxy resin, such as: bisphenol A epoxy resin, bisphenol F Epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, naphthol novolac type epoxy resin, bisphenol A novolac type epoxy resin, etc., obtained by reacting with organic cyclic phosphide (HCA) The side chain of phosphorus-containing epoxy resin. the

Among them, the so-called four-functional epoxy resin, for example: 1,1,2,2-tetra(p-hydroxyphenyl)ethane tetraglycidyl ether, N,N,N,N-diaminodiphenylmethane tetraglycidyl ether ether. the

And component (A-2): low dielectric resin can select the epoxy resin produced by Japan's Dai Ink Chemical Industry Co., Ltd., and the product model is "EPI-CLON HP-7200 series", which is shown in the following formula (1): compound,

式(1) 

Formula 1)

Wherein, n is 0 to 3 (but not limited thereto, it can be adjusted according to the difference in functionality), R ₁ is H. However, in products provided by other suppliers, R in formula ( ₁ ) can be a carbon chain with more than one carbon.

Please refer to the following table 1, which shows the characteristics of EPI-CLON HP-7200 series products, wherein it can be seen that the average functionality (per molecule, per molecular) of the selected low dielectric resin of the present invention is 2.6, 2.9 and 3.3, but as long as It can be between 2.6 and 4, and the preferred range is greater than 3 but less than 4 for better performance. In addition, the softening point temperature of the low dielectric resin of component (A-2) can be between 70 and 120 degrees (°C), preferably, the softening point temperature is greater than 100 degrees (°C) and less than 120 degrees (°C) have better performance. the

Table 1

On the other hand, according to the examples described below, the ratio of component (A-2) to component (A-1) may be between 0 and 20. the

Component (B): The halogen-free hardener is a compound of the following formula (2):

式(2) 

Formula (2)

Among them, n and m are both 0 or 1. When n and m are both 0, it means that the chemical bond is connected to hydrogen; R1 is hydrogen or alkyl; HCA is the compound of the following formula (2-1):

式(2-1) 

Formula (2-1)

wherein R _is H or a substituted group of 0 to 5 carbons.

In one embodiment, component (B) is a halogen-free hardener, for example, it can be obtained by reacting bisphenol A phenolic resin or bisphenol F phenolic resin with HCA, specifically, the phosphorus-containing phenolic resin hardener can be Use the halogen-free hardener produced by SHIN-A T&C company, the molecular weight is 700 to 2200g/mol; the phosphorus content can be 5 to 12%, preferably about 9.4%. the

The chain extender of component (C) can also be used as the main supply component of phosphorus or nitrogen atoms with flame retardant properties, which can be used as an auxiliary hardener. Specifically, the chain extenders commonly used in laminated boards are all Applicable to the present invention, preferred examples include but are not limited to: dicyandiamide (dicyandiamide), diphenyl diphenyl sulfone (diphenyl diamino sulfone), phenolic resin (novolac resin), melamine phenolic resin (melamine phenolic resin, melamine phenol novolac resin), benzoxazine resin, bisphenol A/F type benzoxazine resin, bis/multifunctional polyphenylene oxide resin (polyphenylene oxide). the

The low-dielectric resin composition of the present invention may also include component (D): inorganic powder, and the addition amount of component (D) is 5 to 75% by weight, which is based on components (A), (B) and ( C) is 100 parts by weight, preferably 20 to 60% by weight. The above-mentioned inorganic powders can be one or a combination thereof in crystalline, spherical, molten or crystalline water-free powders. More specifically, the selected inorganic powders in the present invention can be silicon dioxide , aluminum nitride, aluminum hydroxide, aluminum borate, magnesium hydroxide, boron nitride, calcium carbonate, talcum powder, zinc borate, calcined kaolin, aluminum oxide, titanium dioxide glass powder, mica powder, the powder particle size is about 0.1 to 40 μm. the

In the present invention, the base material can also be impregnated with the varnish prepared from the aforementioned low-dielectric resin composition, and a prepreg (prepreg) can be obtained after the base material is heated and dried. The immersion body can also be stacked to make a laminate body (also called a film), and copper foil can be placed on one or both sides of the laminate body, and further made into a composite material laminate under pressure and heating conditions. Wherein, the example of aforementioned base material includes but not limited to: fiber base material, as glass fiber, metal fiber, carbon fiber, aramid fiber, PBO fiber, LCP fiber, Kevlar fiber and cellulose etc.; , Mat) substrates, such as glass fiber mats; and paper substrates, such as aramid fiber paper, LCP paper and Kevlar paper, etc. the

Several sets of embodiments will be described below with respect to the above-mentioned low-dielectric resin composition, in order to illustrate that the optimal film/laminate properties can be achieved by adjusting the composition ratio of the low-dielectric resin composition. Please refer to Table 2 below:

Table 2

From the experimental examples 1 to 3 described in Table 2, the above-mentioned low dielectric resin composition does not add the low dielectric epoxy resin (DCPD) of component (A-2), that is, component (A-2) and The ratio of component (A-1) is zero, but by adjusting component (D): the composition of inorganic powder, such as adding synthetic powder, melting powder, can also improve the Dk/ Df characteristic; And experimental example 4,7 described in table 2, then be the specific embodiment that replaces the halogen-free epoxy resin of part with low dielectric resin, wherein the component (A-2) in the experimental example 4 and group The ratio of point (A-1) is 0.4; The ratio of component (A-2) and component (A-1) in Experimental Example 7 is 20, according to the experimental results, the Dk/ Df characteristics are greatly improved. On the other hand, experimental examples 5 and 6 described in table 2 are specific examples of low dielectric resin and bromine-containing epoxy resin, wherein component (A-2) and component (A-2) in experimental example 5 and component ( The ratio of A-1) is 1.0; the ratio of component (A-2) and component (A-1) in Experimental Example 6 is 19.6, according to the experimental results, the Dk/Df characteristics of the made substrate/film can be substantially increased. the

In summary, according to specific embodiments of the present invention, as summarized in Table 3(a) below, when the above-mentioned low-dielectric resin composition is applied to a halogen-free epoxy resin, the content of component (B) is 5 to 60 wt. %, preferably 10 to 45% by weight, most preferably 15 to 30% by weight, the content of component (C) is 5 to 75% by weight, preferably 5 to 50% by weight, most preferably 5 to 25% by weight, Wherein the sum of the solid contents of components (A), (B) and (C) is 100 parts by weight. In addition, the ratio of component (A-2) to component (A-1) can be between 0 and 20, so the low dielectric resin of component (A-2) can be used to replace part of the epoxy resin, so that all The substrate/film made has better electrical properties; In addition, component (D): inorganic powder, relative to the sum of the solid content of component (A) and component (B) and component (C) is Component (D) is added in an amount of 5 to 75% by weight per 100 parts by weight. As shown in Table 3(b) below, when the above-mentioned low dielectric resin composition is applied to bromine-containing epoxy resin, there is no need to add component (B), and the content of component (C) is 5 to 75% by weight. It is preferably 15 to 60% by weight, most preferably 30 to 45% by weight, wherein the total solid content of components (A) and (C) is 100 parts by weight. Similarly, the ratio of component (A-2) to component (A-1) can be between 0 and 20, so the low dielectric resin of component (A-2) can be used to replace part of the epoxy resin, so that The prepared substrate/film has better electrical properties; in addition, component (D): inorganic powder, relative to the sum of the solid content of component (A) and component (C) is 100 parts by weight, the composition Component (D) is added in an amount of 5 to 75% by weight. the

Table 3(a)

Solid (Solid) (wt%) Maximum range preferred range Most preferred range Component (B) 5～60 10～45 15～30 Component (C) 5～75 5～50 5～25

Table 3(b)

Solid (Solid) (wt%) Maximum range preferred range Most preferred range Component (C) 5～75 15～60 30～45

In summary, the present invention has at least the following advantages:

1. The present invention uses a low-dielectric resin to replace part of the epoxy resin to improve the electrical properties of the film/laminate made of the low-dielectric resin composition. Moreover, the low-dielectric resin composition of the present invention can solve the problem of poor interlayer bonding strength (peeling strength) caused by using the low-dielectric resin alone, and can prolong the life of the resin composition. the

2. On the other hand, the present invention utilizes resin hardeners or chain extenders to provide phosphorus or nitrogen atoms with flame-retardant properties, so component (A-1) can be used without flame-retardant properties (such as no phosphorus) The glass transition temperature of the epoxy resin is widely applicable, for example, any epoxy resin with normal or high glass transition temperature can be used. the

3. As mentioned above, due to the wide range of epoxy resins that can be used, the characteristics of the formed film/laminated board can be improved by using a specific type of epoxy resin, such as manufacturing a film/laminated board suitable for the punching process. the

The above descriptions are only preferred feasible embodiments of the present invention, and are not intended to limit the protection scope of the present invention. Therefore, all equivalent replacements or modifications made by using the description of the present invention and the accompanying drawings should be included in the scope of the present invention. Inside. the

Claims (20)

1. A low dielectric resin composition, characterized in that, comprising: Component (A): the main resin, which includes: Component (A-1): epoxy resin; and Component (A-2): low dielectric resin, wherein, the ratio of component (A-2) to component (A-1) can be between 0 and 20, and the low The dielectric resin is a compound shown in the following formula (1):

Formula 1) Wherein, n is 0 to 3, and _R is a carbon chain of H or more than one carbon; Component (B): a halogen-free hardener; and Component (C): chain extender. 2. low dielectric resin composition according to claim 1, is characterized in that, component (B) is phosphorus-containing phenolic resin curing agent, and it is the compound of following formula (2): Formula (2) Wherein, n, m are all 0 or 1; R ₁ is hydrogen or alkyl; HCA is formula (2-1) compound: Formula (2-1) Wherein, R ₂ is H or a substituted group of 0 to 5 carbons. 3. The low dielectric resin composition according to claim 1, characterized in that, the sum of the solid content of component (A), component (B) and component (C) is 100 parts by weight, component The content of (B) is 5 to 60% by weight, and the content of component (C) is 5 to 75% by weight. 4. the low dielectric resin composition according to claim 3, is characterized in that, with the sum of the solid content of component (A), component (B) and component (C) being 100 parts by weight, component The content of (B) is 10 to 45% by weight, and the content of component (C) is 5 to 50% by weight. 5. the low dielectric resin composition according to claim 4, is characterized in that, with the sum of the solid content of component (A), component (B) and component (C) being 100 parts by weight, component The content of (B) is 15 to 30% by weight, and the content of component (C) is 5 to 25% by weight. 6. the low dielectric resin composition according to claim 2, is characterized in that, also comprises component (D): inorganic powder, with component (A), component (B) and component (C) The total solid content of the components is 100 parts by weight, and the added amount of component (D) is 5 to 75% by weight. 7. low dielectric resin composition according to claim 1, is characterized in that, the low dielectric resin of component (A-2) is the compound shown in following formula (1):

Formula 1) Wherein, n is 0 to 3, R ₁ is H. 8. the low dielectric resin composition according to claim 1, is characterized in that, component (C) is dicyandiamide, diaminodiphenyl sulfone, phenolic resin, melamine phenolic resin, benzoxazine resin, One or a combination of two or more of bisphenol A/F benzoxazine resins and bis/multifunctional polyphenylene ether resins. 9. The low-dielectric resin composition according to claim 1, characterized in that, component (D) can be crystalline, spherical, molten, and silicon dioxide and aluminum nitride that do not contain water of crystallization. , aluminum hydroxide, aluminum borate, magnesium hydroxide, boron nitride, calcium carbonate, talcum powder, zinc borate, calcined kaolin, aluminum oxide, titanium dioxide glass powder, mica powder, or a combination of two or more, The particle size of the powder is about 0.1 to 40 μm. 10. A low dielectric resin composition, characterized in that, comprising: Component (A): the main resin, which includes: Component (A-1): halogen epoxy resin; and Component (A-2): low dielectric resin, wherein, the ratio of component (A-2) to component (A-1) can be between 0 and 20, and the low The dielectric resin is a compound shown in the following formula (1):

Formula 1) Wherein, n is 0 to 3, R is _H or a carbon chain of more than one carbon; and Component (C): chain extender. 11. The low dielectric resin composition according to claim 10, characterized in that, the sum of the solid content of component (A) and component (C) is 100 parts by weight, and the content of component (C) is 5 to 75% by weight. 12. low dielectric resin composition according to claim 11, is characterized in that, with the summation of the solid content of component (A) and component (C) being 100 parts by weight, the content of component (C) is 15 to 60% by weight. 13. The low dielectric resin composition according to claim 12, characterized in that, the sum of the solid content of component (A) and component (C) is 100 parts by weight, and the content of component (C) is 30 to 45% by weight. 14. The low dielectric resin composition according to claim 10, is characterized in that, also comprises component (D): inorganic powder, with the summation of the solid content of component (A) and component (C) being Component (D) is added in an amount of 5 to 75% by weight per 100 parts by weight. 15. the low dielectric resin composition according to claim 10, is characterized in that, the low dielectric resin of component (A-2) is the compound shown in following formula (1):

Formula 1) Wherein, n is 0 to 3, R ₁ is H. 16. the low dielectric resin composition according to claim 10, is characterized in that, component (C) comprises dicyandiamide, diaminodiphenyl sulfone, phenolic resin, melamine phenolic resin, benzoxazine resin, One or a combination of two or more of bisphenol A/F benzoxazine resins and bis/multifunctional polyphenylene ether resins. 17. The low-dielectric resin composition according to claim 10, characterized in that component (D) can be crystalline, spherical, molten, and silicon dioxide and aluminum nitride that do not contain water of crystallization , aluminum hydroxide, aluminum borate, magnesium hydroxide, boron nitride, calcium carbonate, talcum powder, zinc borate, calcined kaolin, aluminum oxide, titanium dioxide glass powder, mica powder, or a combination of two or more, The particle size of the powder is about 0.1 to 40 μm. 18. A prepreg and a film made by impregnating or coating a base material in the low-dielectric resin composition according to claim 1 or 10. 19. A copper foil laminate made by applying the prepreg and the film according to claim 18 through hot pressing. 20. A printed circuit board made by applying the copper foil laminate according to claim 19 through hot pressing and wet process.