CN102668074A - Circuit module manufacturing method, circuit module, and electronic apparatus including circuit module - Google Patents
Circuit module manufacturing method, circuit module, and electronic apparatus including circuit module Download PDFInfo
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- CN102668074A CN102668074A CN2010800593666A CN201080059366A CN102668074A CN 102668074 A CN102668074 A CN 102668074A CN 2010800593666 A CN2010800593666 A CN 2010800593666A CN 201080059366 A CN201080059366 A CN 201080059366A CN 102668074 A CN102668074 A CN 102668074A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5383—Multilayer substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5385—Assembly of a plurality of insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
- H01L25/162—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
A method of manufacturing a plurality of circuit modules includes cutting a mother board including a plurality of electronic components mounted on at least a single surface thereof, and cutting out a plurality of circuit boards from the mother board. A plurality of terminal electrode boards, each of which is arranged so as to straddle at least the circuit boards that are adjacent to each other, are mounted onto one surface of the mother board. The mother board including the terminal electrode boards mounted on the one surface, and the electronic components, mounted on the at least single surface, is diced at positions where the circuit boards are to be cut out.
Description
Technical field
The present invention relates to cut apart and go out a plurality of circuit substrates, make method, the circuit module of a plurality of circuit modules and comprise the electronic equipment of circuit module from integrated substrate cut through the integrated substrate that will be at least a plurality of electronic devices and components be installed at single face.
Background technology
In recent years, along with miniaturization, the lightweight of electronic equipment, the circuit module self that is installed on electronic equipment also needs miniaturization, lightweight.Therefore, in circuit module, through utilizing lead terminal, soldered ball, cavity (cavity) structure etc., the mounting electronic on the two sides, thus realize miniaturization, lightweight.The manufacturing approach of utilizing cavity structure circuit module of mounting electronic on the two sides is disclosed in patent documentation 1 and patent documentation 2.
In the manufacturing approach of patent documentation 1 disclosed circuit module; Preparation cuts out the 1st integrated substrate of a plurality of circuit substrates and cuts out the 2nd integrated substrate that is provided with a plurality of terminal electrode substrates in hole at central portion; The 1st integrated substrate and the 2nd integrated substrate are fitted, the 1st and the 2nd integrated substrate after fitting is cut apart.The circuit module that is manufactured by the manufacturing approach of patent documentation 1 disclosed circuit module will be installed on circuit substrate at the terminal electrode substrate that central portion is provided with the hole, form cavity structure, the mounting electronic on the two sides of circuit substrate.
In addition, in the manufacturing approach of patent documentation 2 disclosed circuit modules,, four terminal electrode substrates are installed, the integrated substrate that the terminal electrode substrate is installed is cut apart along the neighboring of each circuit substrate for the integrated substrate that cuts out a plurality of circuit substrates.Circuit module by the manufacturing approach of patent documentation 2 disclosed circuit modules manufactures is installed four terminal electrode substrates along the neighboring of circuit substrate, forms cavity structure, the mounting electronic on the two sides of circuit substrate.
The prior art document
Patent documentation
Patent documentation 1: Japanese Patent Laid is opened the 2008-206173 communique
Patent documentation 2: Japanese Patent Laid is opened the 2009-123869 communique
Summary of the invention
The technical problem that the present invention will solve
In the manufacturing approach of patent documentation 1 disclosed circuit module; Owing to prepare area identical substantially the 1st integrated substrate and the 2nd integrated substrate; The 1st integrated substrate and the 2nd integrated substrate fitted make; Therefore, the terminal electrode substrate that goes out from the 2nd integrated substrate cut can only obtain and the identical quantity of circuit substrate that goes out from the 1st integrated substrate cut.In addition; From the terminal electrode substrate that the 2nd integrated substrate cut goes out, porose owing to being provided with at central portion, therefore; Do not utilize as the part of terminal electrode substrate more; This terminal electrode substrate is installed on circuit substrate and is formed with in the circuit module of cavity structure, and fee of material increases, and existence can't the cheap problem of making.
In addition; In the manufacturing approach of patent documentation 2 disclosed circuit modules; Because four terminal electrode substrates with elongated shape need be installed respectively along the neighboring of each circuit substrate; Therefore, the problem that has coplanarity (Coplanarity) variation of the inclination of terminal electrode substrate, circuit module.
The present invention In view of the foregoing accomplishes; Its purpose is to provide a kind of manufacturing approach, circuit module of circuit module and comprises the electronic equipment of circuit module; It does not utilize the part as the terminal electrode substrate through in cutting out the integrated substrate of terminal electrode substrate, reducing; Thereby can suppress fee of material with the cheapness manufacturing, and can improve the coplanarity of circuit module.
The technological means that is used for the technical solution problem
In order to achieve the above object; The manufacturing approach of the related circuit module of the 1st invention is that the integrated substrate that at single face a plurality of electronic devices and components is installed is at least cut apart; Go out a plurality of circuit substrates from said integrated substrate cut; Thereby make a plurality of circuit modules, comprising: the 1st operation, the 1st operation will be configured at least to be installed on the face of said integrated substrate across a plurality of terminal electrode substrates of adjacent a plurality of said circuit substrates; The 2nd operation, the 2nd operation are cut apart the said integrated substrate that a plurality of said terminal electrode substrates is installed and at single face a plurality of said electronic devices and components are installed at least at a face in the position that cuts out a plurality of said circuit substrates.
In the 1st invention; Through the structure of a plurality of terminal electrode substrates is installed on the face that is employed in the integrated substrate that cuts out a plurality of circuit substrates; Thereby need not to go out the quantity terminal electrode substrate identical with the circuit substrate that goes out from an integrated substrate cut from an integrated substrate cut; Can select to go out from an integrated substrate cut shape of more terminal electrode substrate; Do not utilize part through in cutting out the integrated substrate of terminal electrode substrate, reducing, can suppress fee of material, can cheaply make circuit module as the terminal electrode substrate.In addition; Through the terminal electrode substrate being configured at least across adjacent a plurality of circuit substrates; Thereby can a terminal electrode substrate be installed to a plurality of circuit substrates; With to each circuit substrate respectively the situation of mounting terminal electrode base board compare, the flatness of terminal electrode substrate increases, and can improve the coplanarity of circuit module.
In addition; The manufacturing approach of the circuit module that the 2nd invention is related is in the 1st invention; Profile during the overlooking of the said circuit substrate that goes out from said integrated substrate cut is a rectangle, and said the 1st operation disposes said terminal electrode substrate on the relative both sides of the neighboring of said circuit substrate.
In the 2nd invention; Profile during the overlooking of the circuit substrate that goes out from integrated substrate cut is a rectangle; Relative both sides in the neighboring of circuit substrate dispose the terminal electrode substrate; Thereby the working hour number that the terminal electrode substrate is installed on integrated substrate reduces, and can suppress running cost, can cheaply make circuit module.
In addition; The manufacturing approach of the circuit module that the 3rd invention is related is in the 1st invention; Profile during the overlooking of the said circuit substrate that goes out from said integrated substrate cut is a rectangle, and said the 1st operation disposes said terminal electrode substrate on four limits of the neighboring of said circuit substrate.
In the 3rd invention; Profile during the overlooking of the circuit substrate that goes out from integrated substrate cut is a rectangle; Four limits in the neighboring of circuit substrate dispose the terminal electrode substrate, thereby can make the circuit module with more terminal electrode that can engage with the terminal of external equipment.
In addition; The manufacturing approach of the related circuit module of the 4th invention is in the 1st to the 3rd invention each; Said terminal electrode substrate has a plurality of terminal electrodes; Said the 1st operation is configured said terminal electrode substrate with the identical mode of quantity as far as each said circuit substrate, said terminal electrode, and is installed on said integrated substrate.
In the 4th invention; The terminal electrode substrate has a plurality of terminal electrodes; The terminal electrode substrate so that the identical mode of the quantity of each circuit substrate, terminal electrode is configured, and is installed on integrated substrate, thereby when the terminal electrode substrate is installed on integrated substrate; Produce because of the engaging force of terminal electrode substrate and integrated substrate, each circuit substrate becomes impartial to the stress of terminal electrode substrate, improves the positional precision of terminal electrode substrate to circuit substrate.
In addition; The manufacturing approach of the related circuit module of the 5th invention is that terminal electrode that said terminal electrode substrate is had is the via hole conductor that on the internal face at least of the via hole that is formed at said terminal electrode substrate, is coated with conductive paste in the 1st to the 4th invention each.
In the 5th invention; Terminal electrode is the via hole conductor that on the internal face at least of the via hole that is formed at the terminal electrode substrate, is coated with conductive paste; Thereby can guarantee to be installed on the conducting between the terminal electrode of terminal electrode and opposition side of a side of circuit substrate, easily circuit module is installed to external equipment.
In addition, the manufacturing approach of the related circuit module of the 6th invention is that said terminal electrode substrate forms side at grade at the lateral surface with said circuit substrate, and said terminal electrode is exposed in the 1st to the 5th invention each.
In the 6th invention; The terminal electrode substrate forms side at grade at the lateral surface with circuit substrate; Terminal electrode is exposed, thereby circuit module is being installed under the situation of external equipment the terminal electrode that exposes in the side of terminal electrode substrate capable of using; Observe the terminal electrode of terminal electrode substrate and the engagement state of external equipment easily, thereby can confirm the engagement state of circuit module and external equipment.
In order to achieve the above object, the related electronic equipment of the 7th invention comprises the circuit module that the manufacturing approach of utilizing each the described circuit module in the claim 1 to 6 is made.
In the 7th invention, comprise the circuit module that utilizes each the manufacturing approach of circuit module in the 1st to the 6th invention to make, thereby can make electronic equipment realize miniaturization, lightweight, and can cheaply make.
In order to achieve the above object, the related circuit module of the 8th invention comprises: circuit substrate; Be installed on a plurality of electronic devices and components on the single face at least of said circuit substrate; And the lateral surface of side and said circuit substrate disposed at grade mode, to be installed in a plurality of terminal electrode substrates on the face of said circuit substrate.
In the 8th invention, comprising: circuit substrate; Be installed on a plurality of electronic devices and components on the single face at least of circuit substrate; And the lateral surface of side and circuit substrate disposed at grade mode, to be installed in a plurality of terminal electrode substrates on the face of circuit substrate; Thereby can constitute when integrated substrate cut goes out a plurality of circuit substrate; Also the terminal electrode substrate is cut apart, the dimensional accuracy that can obtain lateral surface is circuit module preferably.
In addition, the related circuit module of the 9th invention is that the profile during the overlooking of said circuit substrate is a rectangle in the 8th invention, and said terminal electrode substrate is configured in the relative both sides of the neighboring of said circuit substrate.
In the 9th invention; Profile during the overlooking of the circuit substrate that goes out from integrated substrate cut is a rectangle; Relative both sides in the neighboring of circuit substrate dispose the terminal electrode substrate; Thereby the working hour number that the terminal electrode substrate is installed on integrated substrate reduces, and can suppress running cost, can cheaply make circuit module.
In order to achieve the above object, the related electronic equipment of the 10th invention comprises claim 8 or 9 described circuit modules.
In the 10th invention, comprise the 8th invention or the 9th inventive circuit module, thereby can make electronic equipment realize miniaturization, lightweight, and can cheaply make.
The invention effect
In the manufacturing approach of circuit module involved in the present invention; Through the structure of a plurality of terminal electrode substrates is installed on the face that is employed in the integrated substrate that cuts out a plurality of circuit substrates; Thereby need not to go out the quantity terminal electrode substrate identical with the circuit substrate that goes out from an integrated substrate cut from an integrated substrate cut; Can select to go out from an integrated substrate cut shape of more terminal electrode substrate; Do not utilize part through in cutting out the integrated substrate of terminal electrode substrate, reducing, can suppress fee of material, can cheaply make circuit module as the terminal electrode substrate.In addition; Through the terminal electrode substrate being configured at least across adjacent a plurality of circuit substrates; Thereby can a terminal electrode substrate be installed to a plurality of circuit substrates; With to each circuit substrate respectively the situation of mounting terminal electrode base board compare, the flatness of terminal electrode substrate increases, and can improve the coplanarity of circuit module.
In addition; Circuit module involved in the present invention comprise with at grade mode of the lateral surface of side and circuit substrate configuration, be installed in a plurality of terminal electrode substrates on the face of circuit substrate; Thereby can constitute when integrated substrate cut goes out a plurality of circuit substrate; Also the terminal electrode substrate is cut apart, the dimensional accuracy that can obtain lateral surface is circuit module preferably.In addition, because electronic equipment involved in the present invention comprises circuit module that the manufacturing approach by circuit module involved in the present invention manufactures or circuit module involved in the present invention, therefore, can realize miniaturization, lightweight, and can cheaply make.
Description of drawings
Fig. 1 is the cutaway view of the structure of the related circuit module of expression execution mode of the present invention 1.
Fig. 2 is the stereogram that expression is formed with the integrated substrate of terminal electrode.
Fig. 3 is the stereogram of a plurality of terminal electrode substrates of going out from integrated substrate cut.
Fig. 4 is the stereogram of representing the formation bond pad, the integrated substrate of electronic devices and components being installed at a face.
Fig. 5 is the stereogram that expression is equipped with the integrated substrate of a plurality of terminal electrode substrates.
The stereogram of Fig. 6 integrated substrate that to be expression place with face that electronic devices and components and terminal electrode substrate are installed and the contacted mode of supporting station.
Fig. 7 is the A-A cutaway view of integrated substrate shown in Figure 6.
Fig. 8 is illustrated in the stereogram that bond pad is equipped with the integrated substrate of electronic devices and components.
Fig. 9 is the B-B cutaway view of integrated substrate shown in Figure 8.
Figure 10 is the stereogram that is illustrated in the integrated substrate that has carried out cutting apart in the position that cuts out circuit substrate.
Figure 11 is the C-C cutaway view of integrated substrate shown in Figure 10.
Figure 12 be the expression circuit module that can obtain from an integrated substrate number, with the working hour number that integrated substrate and terminal electrode substrate are engaged between the curve chart of relation.
Figure 13 is the cutaway view of the structure of the related circuit module of expression execution mode of the present invention 2.
Figure 14 is the stereogram of the related terminal electrode substrate of expression execution mode of the present invention 2.
Figure 15 is the stereogram of the related integrated substrate that a plurality of terminal electrode substrates are installed of expression execution mode of the present invention 3.
Figure 16 is the stereogram of the related integrated substrate that a plurality of terminal electrode substrates are installed of expression execution mode of the present invention 4.
Embodiment
Below, with reference to accompanying drawing, specify execution mode of the present invention.
(execution mode 1)
Fig. 1 is the cutaway view of the structure of the related circuit module of expression execution mode of the present invention 1.Execution mode 1 related circuit module 1 of the present invention comprises: the circuit substrate 11 that is formed by pottery, glass, epoxy resin etc.; Be installed on the electronic devices and components 12,13 such as semiconductor element, capacitor, resistor, SAW filter on the two sides of circuit substrate 11; And be installed on the terminal electrode substrate 14 of the lower surface (face) of circuit substrate 11.In addition, electronic devices and components 12,13 are not limited to be installed in the situation on the two sides of circuit substrate 11, also can be installed in the single face at least of circuit substrate 11.
Profile during the overlooking of circuit substrate 11 is a rectangle, comprises being used for carrying out bond pad 15 that electricity engages, and the wiring layer 16 that bond pad 15 is electrically connected with the pattern of stipulating each other in inside with the electronic devices and components that are installed in the two sides 12,13.The bond pad 15 of circuit substrate 11, wait through closing line, scolder with the terminal of electronic devices and components 12,13 and to engage.
In addition, terminal electrode substrate 14 configuration and be installed on the two ends of a face of circuit substrate 11.On the circuit substrate 11 of the part of being clamped, electronic devices and components 13 are installed by the terminal electrode substrate 14 and the terminal electrode substrate 14 at the two ends that are installed on a face.Because the side of terminal electrode substrate 14 and the configuration of the lateral surface of circuit substrate 11 are at grade; Therefore; Can constitute when going out a plurality of circuit substrate 11 from integrated substrate cut, also cut apart terminal electrode substrate 14, the dimensional accuracy that forms lateral surface is circuit module 1 preferably.In addition, on circuit substrate 11 mounting electronic 12, after 13, also can wait the face or the two sides of potted circuit substrate 11 with synthetic resin, with overlay electronic components and parts 12,13.
Fig. 2 to Figure 11 is stereogram or the cutaway view that is used to explain the manufacturing approach of the circuit module 1 that execution mode of the present invention 1 is related.At first, the operation that forms terminal electrode substrate 14 is described.Fig. 2 is the stereogram that expression is formed with the integrated substrate of terminal electrode 17.In Fig. 2, be illustrated in and form the operation that many groups are arranged in the terminal electrode 17 of 2 row, 4 row on the integrated substrate 20 that cuts out a plurality of terminal electrode substrates 14.In addition, the arrangement that is formed at the terminal electrode 17 of integrated substrate 20 is not limited to the arrangement of 2 row, 4 row, gets final product so long as can guarantee the arrangement of the quantity of terminal electrode required in the circuit module 1 17.In addition, terminal electrode 17 conducts form via hole in integrated substrate 20, the via hole conductor of coating conductive paste forms on the internal face at least of formed via hole.Through forming, thereby can guarantee to be installed on the conducting between the terminal electrode 17 of terminal electrode 17 and opposition side of a side of circuit substrate 11, easily circuit module 1 is installed to external equipment as the via hole conductor.
Fig. 3 is the stereogram of a plurality of terminal electrode substrates 14 of cutting out from integrated substrate 20 of expression.In Fig. 3, the operation of utilizing cutting machine to wait to cut apart integrated substrate 20, cutting out a plurality of terminal electrode substrates 14 from integrated substrate 20 is shown.Respectively the do for oneself shape of cuboid of the terminal electrode substrate 14 that cuts out has the terminal electrode 17 that is arranged in 2 row, 4 row.In addition, the shape of the terminal electrode substrate 14 that cuts out from integrated substrate 20 is not limited to cuboid, so long as can be installed on circuit substrate 11 and can get final product from the shape that integrated substrate 20 cuts out more terminal electrode substrate 14.
Next, the operation that forms circuit module 1 is described.Fig. 4 is the stereogram of representing formation bond pad 15, the integrated substrate of electronic devices and components 13 being installed at a face.In Fig. 4, be illustrated on the integrated substrate 30 that cuts out a plurality of circuit substrates 11 that according to the rules pattern forms a plurality of bond pads 15 and the operation of the mode mounting electronic 13 that engages with the part with formed a plurality of bond pads 15.In order to cut out four circuit substrates 11 shown in the dotted line, on integrated substrate 30, to each circuit substrate 11 mounting electronic 13.Electronic devices and components 13 engage with the bond pad that is formed at integrated substrate 30 15 through scolder etc.
Fig. 5 is the stereogram that expression is equipped with the integrated substrate 30 of a plurality of terminal electrode substrates 14.In Fig. 5, illustrate so that the operation of terminal electrode substrate 14 shown in Figure 2 to be installed across the mode of adjacent a plurality of circuit substrates 11.Profile when overlooking is the circuit substrate 11 of rectangle, and terminal electrode substrate 14 is configured in four limits of the neighboring of circuit substrate 11, to surround the electronic devices and components of being installed 13.Four limits through in the neighboring of circuit substrate 11 dispose terminal electrode substrate 14, thereby can make the circuit module 1 with more terminal electrode 17 that can engage with the terminal of external equipment.In addition, the profile when overlooking is the circuit substrate 11 of rectangle, and terminal electrode substrate 14 need not necessarily to be configured in all four limits of the neighboring of circuit substrate 11, one side be configured in the getting final product of neighboring of circuit substrate 11 at least.Bond pad 15 through utilizing scolder to wait will to be formed at integrated substrate 30 engages with terminal electrode 17, thereby terminal electrode substrate 14 is installed on circuit substrate 11.In addition; Because terminal electrode substrate 14 is configured with the identical mode of quantity as far as each circuit substrate 11, terminal electrode 17; And be installed on integrated substrate 30; Therefore, when terminal electrode substrate 14 being installed on integrated substrate 30, because of the engaging force stress that produce, 11 pairs of terminal electrode substrates 14 of each circuit substrate of terminal electrode substrate 14 and integrated substrate 30 become impartial.Thus, further improve the coplanarity of circuit module 1, and, the positional precision of 14 pairs of circuit substrates 11 of raising terminal electrode substrate.For example; Situation for terminal electrode substrate 14 with the terminal electrode 17 that is arranged in 2 row, 4 row; Terminal electrode substrate 14 is configured to respectively across adjacent a plurality of circuit substrates 11; And be installed on integrated substrate 30, thereby divisible conduct has the terminal electrode substrate 14 of the terminal electrode 17 that is arranged in 1 row, 4 row.Because as far as each circuit substrate 11, the terminal electrode substrate of being installed 14 has junction surface equal number, bond pad 15 and terminal electrode 17, therefore, applies the stress in each circuit substrate 11 equably.
The stereogram of Fig. 6 integrated substrate 30 that to be expression place with face that electronic devices and components 13 and terminal electrode substrate 14 are installed and the contacted mode of supporting station.Fig. 7 is the A-A cutaway view of integrated substrate 30 shown in Figure 6.In Fig. 6 and Fig. 7, illustrate in the back side mounting electronic 12 of the face that electronic devices and components 13 and terminal electrode substrate 14 are installed, with the operation of integrated substrate 30 with respect to supporting station 60 upsets.Also form a plurality of bond pads 15 at the back side of integrated substrate 30; In order electronic devices and components 12 to be installed on this bond pad 15, integrated substrate 30 is positioned on the supporting station 60 with face and the supporting station 60 contacted modes that electronic devices and components 13 and terminal electrode substrate 14 are installed.As shown in Figure 7; Because the height of the integrated substrate 30 of terminal electrode substrate 14 distances and the height of electronic devices and components 13 are roughly the same; Therefore; Integrated substrate 30 being positioned under the situation on the supporting station 60, can integrated substrate 30 stably be placed with respect to supporting station 60, thereby carry out electronic devices and components 12 are installed to the fitting operation of integrated substrate 30 easily with face and the supporting station 60 contacted modes that electronic devices and components 13 and terminal electrode substrate 14 are installed.
Fig. 8 is illustrated in the stereogram that bond pad 15 is equipped with the integrated substrate 30 of electronic devices and components 12.Fig. 9 is the B-B cutaway view of integrated substrate 30 shown in Figure 8.In Fig. 8 and Fig. 9, be illustrated in the operation of the back side mounting electronic 12 of the face that electronic devices and components 13 and terminal electrode substrate 14 are installed.Electronic devices and components 12 engage with the bond pad that is formed at integrated substrate 30 15 through scolder etc.Four circuit substrates 11 that cut out from integrated substrate 30 shown in the dotted line are separately installed with a plurality of electronic devices and components 12.In addition, for the quantity of the electronic devices and components that are installed on circuit substrate 11 12, layout etc.,, just can freely set as long as physical restriction allows.
Figure 10 is the stereogram that is illustrated in the integrated substrate 30 that has carried out cutting apart in the position that cuts out circuit substrate 11.Figure 11 is the C-C cutaway view of integrated substrate 30 shown in Figure 10.In Figure 10 and Figure 11, utilize cutting machine etc. the integrated substrate 30 that a plurality of terminal electrode substrates 14 is installed at a face and a plurality of electronic devices and components 12,13 are installed on the two sides to be cut apart the operation that forms monolithic integrated circuit module 1 in the position that cuts out a plurality of circuit substrates 11 thereby illustrate.Because terminal electrode substrate 14 is configured to across adjacent a plurality of circuit substrates 11, therefore, when integrated substrate 30 was cut apart, divisible conduct had the terminal electrode substrate 14 of the terminal electrode 17 that is arranged in 1 row, 4 row.In addition, owing to utilize same operation to cut apart integrated substrate 30 and terminal electrode substrate 14, therefore, the side of terminal electrode substrate 14 forms at grade with the lateral surface of the circuit substrate 11 that cuts out from integrated substrate 30.
In addition; In the manufacturing approach of the related circuit module 1 of execution mode of the present invention 1; Owing to will be configured to be installed on integrated substrate 30 across the terminal electrode substrate 14 of adjacent a plurality of circuit substrates 11; Therefore, compare, can reduce the working hour number that integrated substrate 30 and terminal electrode substrate 14 are engaged with the situation of mounting terminal electrode base board 14 on each circuit substrate 11.Figure 12 be the expression circuit module 1 that can obtain from an integrated substrate 30 number, with the working hour number (installation number of times) that integrated substrate 30 and terminal electrode substrate 14 are engaged between the curve chart of relation.In Figure 12; If transverse axis is the number of circuit module; The longitudinal axis is with the number of times of terminal electrode substrates on integrated substrate, illustrates under the situation that the manufacturing approach of utilizing the related circuit module 1 of this execution mode 1 makes respectively and utilizes the data under the situation that the manufacturing approach of existing circuit module makes.
For example; As shown in Figure 5; In that integrated substrate 30 cuts out under the situation of four circuit substrates 11 (number of the circuit module that can obtain from an integrated substrate 30 is 4 a situation) from one; In the manufacturing approach of the related circuit module 1 of this execution mode 1, because terminal electrode substrate 14 is configured to across adjacent a plurality of circuit substrates 11, therefore; The quantity that is installed on the terminal electrode substrate 14 of integrated substrate 30 becomes 12, and the number of times that terminal electrode substrate 14 is bonded on the integrated substrate 30 becomes 12 times.But; In the manufacturing approach of existing circuit module; Because four limits along the neighboring of each circuit substrate engage four terminal electrode substrates; Therefore, the quantity that is engaged in the terminal electrode substrate of integrated substrate becomes 16, and the number of times that the terminal electrode substrate is installed on the integrated substrate becomes 16 times.Likewise; Be under 64 the situation in the number of the circuit module 1 that can be from one integrated substrate 30 obtains; In the manufacturing approach of the related circuit module 1 of this execution mode 1; The number of times that terminal electrode substrate 14 is bonded on the integrated substrate 30 is 144 times, but in the manufacturing approach of existing circuit module, the number of times of terminal electrode substrates on integrated substrate is become 256 times.
In addition; In the manufacturing approach of existing circuit module; Owing to utilize cutting machine to come integrated substrate is cut apart; When integrated substrate cut goes out a plurality of circuit substrate, the terminal electrode substrate is not being cut apart, therefore, need avoided the position that cutting edge passes through and the terminal electrode substrate is installed on integrated substrate.But; If it is relatively poor the terminal electrode substrate to be installed on the precision of integrated substrate; Then can the terminal electrode substrate be installed on the position that cutting edge passes through; Thereby have following problem: cutting edge contacts with the terminal electrode substrate that need not to contact, the dimensional accuracy variation of the lateral surface of circuit module.Thereby; In the manufacturing approach of the related circuit module 1 of this execution mode 1; Utilize cutting machine to come integrated substrate 30 is cut apart through constituting, when cutting out a plurality of circuit substrate 11 from integrated substrate 30, also terminal electrode substrate 14 is cut apart; Thereby can not take place that cutting edge contacts with the terminal electrode substrate that need not to contact, the situation of the dimensional accuracy variation of the lateral surface of circuit module, can improve the dimensional accuracy of the lateral surface of circuit module 1.
As stated; In the manufacturing approach of the related circuit module 1 of execution mode of the present invention 1; Through the structure of a plurality of terminal electrode substrates 14 is installed on the face that is employed in the integrated substrate 30 that cuts out a plurality of circuit substrates 11; Thereby need not to cut out the identical terminal electrode substrate 14 of quantity and the circuit substrate that cuts out from an integrated substrate 30 11, can select to cut out from an integrated substrate 20 shape of more terminal electrode substrate 14, do not utilize part as terminal electrode substrate 14 through in integrated substrate 20, reducing from an integrated substrate 20; Fee of material can be suppressed, circuit module 1 can be cheaply made.In addition; Through terminal electrode substrate 14 being configured at least across adjacent a plurality of circuit substrates 11; Thereby can a terminal electrode substrate 14 be installed to a plurality of circuit substrates 11; With to each circuit substrate 11 respectively the situation of mounting terminal electrode base board 14 compare, the flatness of terminal electrode substrate 14 increases, and can improve the coplanarity of circuit module 1.In addition, the working hour number that integrated substrate 30 and terminal electrode substrate 14 are engaged reduces, and can suppress running cost, can cheaply make circuit module 1.
In addition, be installed to the quantity of the terminal electrode substrate 14 of integrated substrate 30, can suppress the deviation of terminal electrode substrate 14, improve the coplanarity of circuit module 1 apart from the height of circuit substrate 1 through minimizing.Moreover; Through the integrated substrate 30 that a plurality of terminal electrode substrates 14 is installed at a face and a plurality of electronic devices and components 12,13 are installed on the two sides being cut apart, thereby can be accurately the side of terminal electrode substrate 14 lateral surface with the circuit substrate 11 that cuts out from integrated substrate 30 be formed at grade in the position that cuts out a plurality of circuit substrates 11.
In addition, the manufacturing approach of foregoing circuit module 1 illustrates for example, and the order of mounting electronic 12,13, terminal electrode substrate 14 is not limited to above-mentioned example on integrated substrate 30.
(execution mode 2)
Figure 13 is the cutaway view of the structure of the related circuit module 1 of expression execution mode of the present invention 2.Shown in figure 13; In the structure of the circuit module 1 that execution mode of the present invention 2 is related; Terminal electrode substrate 14 forms side at grade at the lateral surface with circuit substrate 11; Terminal electrode 17 is exposed, in addition, identical with the structure of the related circuit module 1 of execution mode shown in Figure 11.Therefore, in the related circuit module 1 of execution mode of the present invention 2,, and omit its detailed description to same structure mark same numeral.
In the related circuit module 1 of execution mode of the present invention 2; Terminal electrode substrate 14 forms side at grade at the lateral surface with circuit substrate 11; Terminal electrode 17 is exposed; Thereby circuit module 1 is being installed under the situation of external equipment, can confirming the engagement state of circuit module 1 and external equipment.Particularly; Through utilize scolder etc. with the terminal electrode 17 of terminal electrode substrate 14 engage with external equipment, circuit module 1 is installed under the situation of external equipment; Because the leg (fillet) of the scolder that engages etc. is formed at lateral surface terminal electrode substrate 14 and circuit substrate 11 and forms the terminal electrode 17 that expose side at grade; Therefore; The leg of formed scolder etc. can be observed easily, thereby the engagement state of circuit module 1 and external equipment can be confirmed.
Next, form at grade side to being manufactured on, an example of the method for the terminal electrode substrate 14 that terminal electrode 17 exposes is described with the lateral surface of circuit substrate 11.In addition, below the manufacturing approach of explanation is an example, so long as can be manufactured on the lateral surface of circuit substrate 11 method that forms at grade side, makes the terminal electrode substrate 14 that terminal electrode 17 exposes, just can be arbitrary manufacturing approach.
At first, as shown in Figure 3, utilize cutting machine etc. that integrated substrate 20 is cut apart, cut out a plurality of terminal electrode substrates 14 from integrated substrate 20, be shaped as terminal electrode substrate 14 cuboid, that have the terminal electrode 17 that is arranged in 2 row, 4 row.In addition, in this execution mode 2, formed each terminal electrode substrate 14 has peristome between the row of the row of terminal electrode 17 and terminal electrode 17.Figure 14 is the stereogram of the related terminal electrode substrate 14 of expression execution mode of the present invention 2.Shown in figure 14, terminal electrode substrate 14 has peristome 18 between the row of the row of terminal electrode 17 and terminal electrode 17.Peristome 18 is corresponding with each row of terminal electrode 17, is formed at a part of equitant position with each each terminal electrode 17 of going.In addition, because peristome 18 is formed at a part of equitant position with each terminal electrode 17, therefore, terminal electrode 17 exposes from the internal face 18a of peristome 18.
As stated, in the execution mode 2 of the present invention, because terminal electrode substrate 14 forms side at grade at the lateral surface with circuit substrate 11; Terminal electrode 17 is exposed, therefore, circuit module 1 is being installed under the situation of external equipment; Because terminal electrode 17 exposes in the side of terminal electrode substrate 14; Therefore, the terminal electrode 17 of terminal electrode substrate 14 and the engagement state of external equipment can be observed easily, thereby the engagement state of circuit module 1 and external equipment can be confirmed.
(execution mode 3)
Figure 15 is the stereogram of the related integrated substrate 30 that a plurality of terminal electrode substrates 14 are installed of expression execution mode of the present invention 3.Shown in figure 15; In the integrated substrate 30; That kind of profile shown in dotted line during the overlooking of the circuit substrate 11 that cuts out is rectangle, and the profile when the overlooking of each circuit substrate 11 is the relative both sides of neighboring of the circuit substrate 11 of rectangle, and configuration is equipped with terminal electrode substrate 14.In addition; In the related integrated substrate 30 of this execution mode 3; Because except the relative both sides configuration in the neighboring of each circuit substrate 11 is equipped with the terminal electrode substrate 14, the related integrated substrate 30 of structure and execution mode shown in Figure 51 is identical, therefore; To same structure mark same numeral, and omit its detailed description.In addition; In the manufacturing approach of the circuit module 1 that execution mode of the present invention 3 is related; Because except the relative both sides configuration mounting terminal electrode base board 14 of the neighboring of each circuit substrate 11; The manufacturing approach of the circuit module of explaining in operation and the execution mode 11 is identical, therefore, omits its detailed description.
As stated; Because the profile when the overlooking of each circuit substrate 11 is the relative both sides of neighboring of the circuit substrate 11 of rectangle, disposes terminal electrode substrate 14, therefore; Reduce the quantity of the terminal electrode substrate of being installed 14; Thereby the working hour number that integrated substrate 30 and terminal electrode substrate 14 are engaged reduces, and can suppress running cost, can cheaply make circuit module 1.
(execution mode 4)
Figure 16 is the stereogram of the related integrated substrate 30 that a plurality of terminal electrode substrates 14 are installed of expression execution mode of the present invention 4.Shown in figure 16, the profile when 30 configurations of integrated substrate are equipped with at least than the overlooking of the circuit substrate that will cut out 11 is the long terminal electrode substrate 14 of length on one side of neighboring of the circuit substrate 11 of rectangle.In addition; In the related integrated substrate 30 of this execution mode 4; Because except configuration is equipped with at least than the long terminal electrode substrate 14 of the length on one side of the neighboring of the circuit substrate that will cut out 11, the related integrated substrate 30 of structure and execution mode shown in Figure 51 is identical, therefore; To same structure mark same numeral, and omit its detailed description.In addition; In the manufacturing approach of the circuit module 1 that execution mode of the present invention 4 is related; Because except configuration is installed at least than the long terminal electrode substrate 14 of the length on one side of the neighboring of the circuit substrate that will cut out 11; The manufacturing approach of the circuit module of explaining in operation and the execution mode 11 is identical, therefore, omits its detailed description.
For example, form the terminal electrode substrate 14 have with the corresponding length in both sides of the neighboring of circuit substrate 11, and configuration is installed on integrated substrate 30.Terminal electrode substrate 14 is under situation about having with the corresponding length in both sides of the neighboring of circuit substrate 11; Because configurable one-tenth is across four the circuit substrate 11 of being to the maximum that comprises non-conterminous circuit substrate 11; Therefore; Compare with having, can further reduce the quantity of the terminal electrode substrate 14 that is installed on integrated substrate 30 with the situation of the corresponding length in one side of the neighboring of circuit substrate 11.
As stated; Because the profile when disposing at least than the overlooking of the circuit substrate that will cut out 11 is the long terminal electrode substrate 14 of length on one side of neighboring of the circuit substrate 11 of rectangle; Therefore, can further reduce the quantity of the terminal electrode substrate 14 that is installed on integrated substrate 30, thereby the working hour number that integrated substrate 30 and terminal electrode substrate 14 are engaged reduces; Running cost can be suppressed, circuit module 1 can be cheaply made.In addition; Circuit module 1 through explaining in the circuit module 1 that will be manufactured by the manufacturing approach of the circuit module of explaining in this execution mode 1 to 41 or this execution mode 1 to 4 is installed on electronic devices and components; Thereby can make electronic equipment realize miniaturization, lightweight, and can cheaply make.
Label declaration
1 circuit module
11 circuit substrates
12,13 electronic devices and components
14 terminal electrode substrates
15 bond pads
16 wiring layers
17 terminal electrodes
18 peristomes
20 integrated substrates
30 integrated substrates
60 supporting stations
Claims (10)
1. the manufacturing approach of a circuit module, this method are that the integrated substrate that at single face a plurality of electronic devices and components is installed is at least cut apart, and go out a plurality of circuit substrates from said integrated substrate cut, thereby make a plurality of circuit modules, it is characterized in that, comprising:
The 1st operation, the 1st operation will be configured at least to be installed on the face of said integrated substrate across a plurality of terminal electrode substrates of adjacent a plurality of said circuit substrates; And
The 2nd operation, the 2nd operation are cut apart the said integrated substrate that a plurality of said terminal electrode substrates is installed and at single face a plurality of said electronic devices and components are installed at least at a face in the position that cuts out a plurality of said circuit substrates.
2. the manufacturing approach of circuit module as claimed in claim 1 is characterized in that,
Profile during the overlooking of the said circuit substrate that goes out from said integrated substrate cut is a rectangle,
Said the 1st operation disposes said terminal electrode substrate on the relative both sides of the neighboring of said circuit substrate.
3. the manufacturing approach of circuit module as claimed in claim 1 is characterized in that,
Profile during the overlooking of the said circuit substrate that goes out from said integrated substrate cut is a rectangle,
Said the 1st operation disposes said terminal electrode substrate on four limits of the neighboring of said circuit substrate.
4. like the manufacturing approach of each the described circuit module in the claim 1 to 3, it is characterized in that,
Said terminal electrode substrate has a plurality of terminal electrodes,
Said the 1st operation is configured said terminal electrode substrate with the identical mode of quantity as far as each said circuit substrate, said terminal electrode, and is installed on said integrated substrate.
5. like the manufacturing approach of each the described circuit module in the claim 1 to 4, it is characterized in that,
The terminal electrode that said terminal electrode substrate is had is the via hole conductor that on the internal face at least of the via hole that is formed at said terminal electrode substrate, is coated with conductive paste.
6. like the manufacturing approach of each the described circuit module in the claim 1 to 5, it is characterized in that,
Said terminal electrode substrate forms side at grade at the lateral surface with said circuit substrate, and said terminal electrode is exposed.
7. an electronic equipment is characterized in that,
Comprise the circuit module that the manufacturing approach of utilizing each the described circuit module in the claim 1 to 6 is made.
8. a circuit module is characterized in that, comprising:
Circuit substrate;
Be installed on a plurality of electronic devices and components on the single face at least of said circuit substrate; And
With with at grade mode of the lateral surface of side and said circuit substrate configuration, be installed in a plurality of terminal electrode substrates on the face of said circuit substrate.
9. circuit module as claimed in claim 8 is characterized in that,
Profile during the overlooking of said circuit substrate is a rectangle, and said terminal electrode substrate is configured in the relative both sides of the neighboring of said circuit substrate.
10. an electronic equipment is characterized in that,
Comprise claim 8 or 9 described circuit modules.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009290919 | 2009-12-22 | ||
| JP2009-290919 | 2009-12-22 | ||
| PCT/JP2010/072199 WO2011077968A1 (en) | 2009-12-22 | 2010-12-10 | Circuit module manufacturing method, circuit module, and electronic apparatus provided with circuit module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102668074A true CN102668074A (en) | 2012-09-12 |
Family
ID=44195500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010800593666A Pending CN102668074A (en) | 2009-12-22 | 2010-12-10 | Circuit module manufacturing method, circuit module, and electronic apparatus including circuit module |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20120250265A1 (en) |
| JP (1) | JPWO2011077968A1 (en) |
| CN (1) | CN102668074A (en) |
| WO (1) | WO2011077968A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9190367B1 (en) | 2014-10-22 | 2015-11-17 | Advanced Semiconductor Engineering, Inc. | Semiconductor package structure and semiconductor process |
| US10685948B1 (en) * | 2018-11-29 | 2020-06-16 | Apple Inc. | Double side mounted large MCM package with memory channel length reduction |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0750357A (en) * | 1993-08-06 | 1995-02-21 | Fujitsu General Ltd | Surface mount hybrid ic |
| WO2007049417A1 (en) * | 2005-10-24 | 2007-05-03 | Murata Manufacturing Co., Ltd. | Circuit module manufacturing method and circuit module |
| CN101292347A (en) * | 2005-10-20 | 2008-10-22 | 株式会社村田制作所 | Circuit module and circuit device using such circuit module |
| US20090166863A1 (en) * | 2007-12-27 | 2009-07-02 | Elpida Memory, Inc. | Semiconductor device and method of manufacturing the same |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6404043B1 (en) * | 2000-06-21 | 2002-06-11 | Dense-Pac Microsystems, Inc. | Panel stacking of BGA devices to form three-dimensional modules |
| JP4158798B2 (en) * | 2005-10-12 | 2008-10-01 | 株式会社村田製作所 | Composite ceramic substrate |
| JP4776012B2 (en) * | 2006-01-27 | 2011-09-21 | オンセミコンダクター・トレーディング・リミテッド | Circuit board and semiconductor device |
-
2010
- 2010-12-10 WO PCT/JP2010/072199 patent/WO2011077968A1/en active Application Filing
- 2010-12-10 JP JP2011547467A patent/JPWO2011077968A1/en active Pending
- 2010-12-10 CN CN2010800593666A patent/CN102668074A/en active Pending
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2012
- 2012-06-18 US US13/525,573 patent/US20120250265A1/en not_active Abandoned
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0750357A (en) * | 1993-08-06 | 1995-02-21 | Fujitsu General Ltd | Surface mount hybrid ic |
| CN101292347A (en) * | 2005-10-20 | 2008-10-22 | 株式会社村田制作所 | Circuit module and circuit device using such circuit module |
| WO2007049417A1 (en) * | 2005-10-24 | 2007-05-03 | Murata Manufacturing Co., Ltd. | Circuit module manufacturing method and circuit module |
| US20090166863A1 (en) * | 2007-12-27 | 2009-07-02 | Elpida Memory, Inc. | Semiconductor device and method of manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2011077968A1 (en) | 2011-06-30 |
| JPWO2011077968A1 (en) | 2013-05-02 |
| US20120250265A1 (en) | 2012-10-04 |
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Application publication date: 20120912 |