CN102656244B - Anisotropic conductive adhesive - Google Patents
Anisotropic conductive adhesive Download PDFInfo
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- CN102656244B CN102656244B CN201080056864.5A CN201080056864A CN102656244B CN 102656244 B CN102656244 B CN 102656244B CN 201080056864 A CN201080056864 A CN 201080056864A CN 102656244 B CN102656244 B CN 102656244B
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- 239000000853 adhesive Substances 0.000 title claims abstract description 32
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 32
- 229920001971 elastomer Polymers 0.000 claims abstract description 31
- 239000000806 elastomer Substances 0.000 claims abstract description 26
- 239000004952 Polyamide Substances 0.000 claims abstract description 21
- 229920002647 polyamide Polymers 0.000 claims abstract description 21
- 239000000843 powder Substances 0.000 claims abstract description 14
- 239000002904 solvent Substances 0.000 claims abstract description 14
- 239000000203 mixture Substances 0.000 claims description 107
- 150000001875 compounds Chemical class 0.000 claims description 14
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 12
- 238000007747 plating Methods 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 238000007650 screen-printing Methods 0.000 claims description 8
- 239000002994 raw material Substances 0.000 claims description 6
- 239000012766 organic filler Substances 0.000 claims description 5
- 235000021122 unsaturated fatty acids Nutrition 0.000 claims description 5
- 150000004670 unsaturated fatty acids Chemical class 0.000 claims description 5
- 238000012360 testing method Methods 0.000 abstract description 49
- 239000002245 particle Substances 0.000 abstract description 14
- 239000000463 material Substances 0.000 abstract description 9
- 238000009413 insulation Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 12
- 239000007787 solid Substances 0.000 description 12
- 229920002799 BoPET Polymers 0.000 description 10
- 239000011521 glass Substances 0.000 description 10
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 239000003795 chemical substances by application Substances 0.000 description 9
- 238000007731 hot pressing Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 238000009826 distribution Methods 0.000 description 6
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 description 6
- 238000011068 loading method Methods 0.000 description 6
- 229920000728 polyester Polymers 0.000 description 6
- 235000010724 Wisteria floribunda Nutrition 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 239000005060 rubber Substances 0.000 description 5
- 238000002844 melting Methods 0.000 description 4
- -1 polyethylene terephthalate Polymers 0.000 description 4
- 229920003225 polyurethane elastomer Polymers 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000005382 thermal cycling Methods 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 125000003368 amide group Chemical group 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000012790 confirmation Methods 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000007602 hot air drying Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 229920000620 organic polymer Polymers 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- 235000012222 talc Nutrition 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- KXDHJXZQYSOELW-UHFFFAOYSA-M Carbamate Chemical compound NC([O-])=O KXDHJXZQYSOELW-UHFFFAOYSA-M 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004709 Chlorinated polyethylene Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229920002449 FKM Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000004902 Softening Agent Substances 0.000 description 1
- 229920006311 Urethane elastomer Polymers 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 229910021502 aluminium hydroxide Inorganic materials 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 235000019445 benzyl alcohol Nutrition 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000013530 defoamer Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000012764 mineral filler Substances 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 description 1
- 238000010189 synthetic method Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
- C09J177/12—Polyester-amides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00013—Fully indexed content
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0221—Insulating particles having an electrically conductive coating
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
An anisotropic conductive adhesive is a material which comprises a highly insulating adhesive and electroconductive particles uniformly dispersed therein, and such a material is used in electronic components for the purpose of electrical connection between electrodes that face with each other, insulation between adjacent electrodes, or fixing. Conventional anisotropic conductive adhesives exhibited low durability in terms of creep test, and it was therefore difficult for conventional anisotropic conductive adhesives to attain stable circuit resistance. Disclosed is a non-reactive anisotropic conductive adhesive which comprises (A) a polyamide elastomer, (B) a powder composed of spherical electroconductive particles, and (C) a solvent and which exhibits excellent creep characteristics and conducting properties.
Description
Technical field
The present invention relates to a kind of anisotropic conductive adhesive.
Background technology
Anisotropic conductive adhesive (following, also referred to as ACP), is that conducting particles is dispersed in to the material in the caking agent that insulativity is high, and it is intended to for the insulativity between electrical connection, adjacent electrode between electronic unit comparative electrode and fixing.The ACP that contains solvent is printed on to the upper also heat drying of flexible print wiring (hereinafter referred to as FPC), thereby on FPC, forms the film of ACP.The FPC that contains film is known to hot sealing junctor (heat seal connector, hot pressed paper) parts (Japanese kokai publication sho 60-170177 communique).The electrode part of display element and the electrode part of hot sealing connector component are carried out after position overlaps, can optionally connecting by adding hot pressing each electrode.In addition sometimes also under the state of FPC that forms ACP film, carry.
Connect the electronic unit of 2 kinds of parts with ACP, can confirm its weather resistance by reliability test.In these test subjects, as the method for confirming bonding force, known have a creep test that applies loading under heated condition, as the method for confirming electrical connection, the known resistance value method that has mensuration circuit, and place the resistance value after the reliability tests such as test, thermal cycling test by comparing initial stage resistance value and high temperature, can confirm the stability of conducting.
As the constituent of ACP, known have rubber is dissolved in to varnish in solvent as caking agent (Japanese kokai publication hei 5-247424 communique).In addition, the non-reactive materials such as elastomerics, thermoplastic resin is also general mostly.But, the film that solvent evaporates is formed, owing to being hot-melting type caking agent, even if therefore add hot pressing, its bonding force is also lower than response type caking agent.And, even if it has shown initial stage cementability, also cannot bear reliability test.Apply on direction of delaminate at the test film that stripping test is used in the creep test of placing at 85 ℃ under the state of loading, owing to being hot-melting type, while therefore placement, produce and soften, and bonded object having mostly occurred and peels off greatly.
In addition, in order to improve reliability, the known ACP that has no-solvent type response type.Wherein have and use the flat 8-511570 communique of ACP(Japanese Unexamined Patent Application Publication of epoxy resin), use the ACP(Japanese kokai publication sho 61-47760 communique of carbamate resins).Owing to recently using polyethylene terephthalate (PET) etc. in FPC, therefore the heat resisting temperature of bonded object is just in low temperature.Thus, be difficult to be heated to reacting initial temperature, and if guarantee the time that reaction finishes, cause productivity to decline.
Summary of the invention
ACP in the past, low for the weather resistance of creep test, be difficult to make circuit resistance stable.
The inventor has carried out active research to achieve these goals, found that polyamide elastomer has been improved to reliability especially for the ACP of caking agent, and complete thus the present invention.
First method of the present invention is to contain following (A)～(C) anisotropic conductive adhesive of composition,
(A) composition: polyamide elastomer,
(B) composition: spherical electric conduction powder and
(C) composition: solvent.
Second method of the present invention is anisotropic conductive adhesive as above, the polyamide elastomer that wherein (A) composition is raw material synthesized by the compound in 1 molecule with more than 2 carboxyl forms, and the compound in described 1 molecule with more than 2 carboxyl is synthetic by the polyreaction of unsaturated fatty acids.
Third Way of the present invention is anisotropic conductive adhesive as above, and wherein the fusing point of (A) composition is 90 ℃～140 ℃.
Cubic formula of the present invention is anisotropic conductive adhesive as above, and wherein (B) composition is the conductive metal plating powder take organic filler as core.
The 5th mode of the present invention is anisotropic conductive adhesive as above, the wherein amount of (B) composition, be 1～100 mass parts with respect to 100 mass parts (A) composition, (C) amount of composition, is 1～1000 mass parts with respect to 100 mass parts (A) composition.
The 6th mode of the present invention is flexible print wiring parts, by by above-mentioned anisotropic conductive adhesive silk screen printing or be coated on flexible print wiring, and then the volatilization of (C) composition is obtained.
Invention effect
According to the present invention, can obtain the good non-response type ACP of creep properties and conduction.
accompanying drawing explanation
Fig. 1 is the explanatory view that represents the measuring method of peeling strength test.
Fig. 2 is the explanatory view that represents the measuring method of creep test.
Fig. 3 is the explanatory view that represents the measuring method of conduction test.
Embodiment
Below, describe the present invention in detail.As operable in the present invention (A) composition, it is the polyamide elastomer with amido linkage.Be particularly preferably with the Raolical polymerizable synthesized by unsaturated fatty acids, have and in side chain and 1 molecule, there is the polyamide elastomer that the compound of more than 2 carboxyl is raw material.As the example in 1 molecule with more than 2 synthetic method of the compound of carboxyl, can enumerate general formula 1, but be not limited to this.As general polyamide resin, nylon is well-known, and normally synthetic by the polycondensation of lactan, or synthetic by the condensation reaction of representative examples of saturated aliphatic diamines and saturated aliphatic dicarboxylic acids.Because nylon is the straight chain shape resin without side chain, therefore different with (A) composition.
In formula, R
1for the alkyl of divalent, and separately can be identical or different.R
2for organic residue of polymerization starter.As R
1, the aliphatic alkyl that preferably carbon number is 1～20, and be particularly preferably straight chain shape aliphatic alkyl.
As mentioned above, (A) composition is preferably the compound in side chain and 1 molecule with more than 2 carboxyl that has that makes the Raolical polymerizable synthesized by unsaturated carboxylic acid, is combined the polyamide elastomer with amido linkage of gained with polyamide elastomer.This combination is normally reacted and is carried out by above-mentioned carboxyl and polyamide elastomer amino.
In addition,, in order to make (A) composition have patience in the reliability test heating, its fusing point is preferably more than 80 ℃, and is particularly preferably more than 90 ℃.In addition, (A) composition melting in the time adding hot pressing, if at this moment consider the thermotolerance of bonded object, the fusing point of (A) composition is particularly preferably below 140 ℃.In elastomerics, also have the type that cannot confirm fusing point, once and under the atmosphere of such elastomerics more than room temperature, improve temperature, will show softening situation, be not therefore suitable for the present invention yet.As the method for confirming fusing point, can enumerate differential scanning calorimeter (DSC), TG/DTA(differential thermobalance) etc., but be not limited to these.
As (A) of the present invention composition, can use the segmented copolymer of polyethers, polyester etc. and polymeric amide etc., and also can residual functional group's amino, carboxyl etc.In addition (A) of more than two kinds composition can also be mixed.As the object lesson of (A) composition, can enumerate Fuji and change into the manufacture ト ー マ イ of Industrial Co., Ltd De PA series, TPAE series, but be not limited to these.
As operable in the present invention (B) composition, can use spherical electroconductive particle.So-called spherical, comprise the particle of proper sphere shape or the irregular spherical particle of tool from the teeth outwards.Material can be used the metal powders such as gold and silver, platinum, nickel, palladium or the plating particle of covered by metallic film on organic polymer particle.
In the present invention, preferably use take soft organic polymer particle as core, and carry out the material of plating by conductive metal.In addition, known particle is distinguished its median size according to the spacing width between connected electrode of substrate, thickness of electrode.Spacing width is narrower, preferably uses (B) composition that median size is less.As median size, be preferably 1～50 μ m, and the particle particularly preferably having sharp grain size distribution.
As the addition of (B) composition, with respect to 100 mass parts (A) composition, preferably add (B) composition of 1～100 mass parts, when it is that 100 mass parts are when above, (B) composition is too much, possibly cannot fully guarantee interelectrode insulativity, and when it is 1 mass parts below time, possibly cannot obtain stable conduction.Due to the median size changing in size-grade distribution, or change core in plating powder or during as the kind of the metal of plating composition proportion also can change, therefore the addition of (B) composition has certain limit.
As operable in the present invention (C) composition, as long as the solvent that can dissolve (A) composition just can use.As object lesson, can enumerate methyl alcohol, methylethylketone, toluene, dimethylbenzene, isophorone, ethyl acetate, benzyl alcohol etc., but be not limited to these.In addition, (C) composition, also can add for adjusting viscosity, viscosity.If addition is many, viscosity, viscosity declines simultaneously.In addition, if addition is few, maintained viscosity high, and also high state of viscosity.
As the addition of (C) composition, with respect to 100 mass parts (A) composition, preferably add 1～1000 mass parts (C) composition, and (C) more preferably 50～900 mass parts of composition.When (C) composition is 900 mass parts when above, the viscosity of caking agent too declines, and causes the violent sedimentation of electroconductive particle, and below it is 50 mass parts time, viscosity is excessive, is difficult to use.
The use of ACP of the present invention, can be coated with or silk screen printing is coated with by divider.For film is fixed, solvent evenly volatilizees simultaneously, particularly preferably silk screen printing.In addition,, by the ACP being coated in the bonded object with electrode is put in hot-air drying stove or conveyor type IR stove etc., make solvent evaporates.By the dry film that has formed ACP.Overlap and heat pressing by carrying out position with the bonded object with another electrode, caking agent composition is once dissolved, electroconductive particle being expressed to simultaneously and on two sides' electrode, guaranteeing electrical connection, and mechanically fixing under the state that returns to room temperature.
As forming the object of film, can enumerate by the FPC of the manufacturing such as polyamide resin, pet resin etc.In some cases, the FPC that forms film is after carrying for some time and substrates while stacking heat pressing.Therefore, film is at room temperature necessary for solid, and more than preferably the fusing point of (A) composition or softening temperature are necessary for room temperature.
Do not damaging under the scope of characteristic of the present invention, can add the resinous principles such as elastomerics beyond (A) composition, rubber, thermoplastic resin, specifically have as the urethane rubber of thermoplastic elastomer, organo-silicone rubber, chlorosulphonation rubber, chloroprene rubber, chlorinatedpolyethylene, acrylic rubber, viton, ethylene vinyl acetate etc.By adding these materials, can obtain the excellent composition such as mechanical strength of resin, bonding strength, workability, keeping quality and dry after also excellent film.
In addition, do not damaging under the scope of characteristic of the present invention, can coordinate the appropriate tinting material such as pigment, dyestuff, the mineral fillers such as metal powder, calcium carbonate, talcum, silica, aluminum oxide, aluminium hydroxide, fire retardant, organic filler, softening agent, antioxidant, defoamer, coupling agent, flow agent, the additives such as rheology control agent.By adding these additives, can obtain excellent composition and the cured article thereof such as mechanical strength of resin, bonding strength, workability, keeping quality.In addition,, by adjusting conducting particles particle diameter, adhesive solids composition, can obtain the composition corresponding with the telegraph circuit with various spacing and film thereof.
Embodiment
Below, the present invention will be described in more detail to enumerate embodiment, but the present invention is not only defined in these embodiment.
In order to modulate anisotropic conductive adhesive, prepare following compositions.In addition, (A) result that composition and (A ') composition are measured fusing point by TG/DTA gathers and is shown in table 1.
(A) composition: polyamide elastomer (meeting general formula 1)
Polyamide elastomer (solids component is 100%)
(TPAE-32 Fuji changes into Industrial Co., Ltd and manufactures)
Polyamide elastomer (solids component is 100%)
(TPAE-31 Fuji changes into Industrial Co., Ltd and manufactures)
Polyamide elastomer (solids component is 100%)
(PA-201 Fuji changes into Industrial Co., Ltd and manufactures)
Polyamide elastomer (solids component is 100%)
(PA-200 Fuji changes into Industrial Co., Ltd and manufactures)
(B) composition: spherical electric conduction powder
Median size is the spherical plating powder of 30 μ m
(the special 6GNR30-BHB(Block of Imre Pulai ラ イ ト 6GNR30-BHB) Nippon Chemical Ind manufactures)
(C) composition: solvent
Industrial toluene (toluene Japan alcohol is sold Co., Ltd. and manufactured)
Industrial methyl alcohol (manufacture of aerochemistry Co., Ltd. of methyl alcohol Mitsubishi)
Other composition: filler
The Japanese talcum of talcum powder (micro mist goods P-2(ミ Network ロ エ ー ス P-2) Co., Ltd. manufactures)
The Japanese ア エ ロ ジ Application of amorphous silicon oxide (A Ailaojien R972(ア エ ロ ジ Application) Co., Ltd. manufactures)
Comparative example 1～7
In order to modulate anisotropic conductive adhesive, prepare following compositions.Composition except (A ') composition, uses the raw material identical with embodiment.
(A ') composition: (A) elastomerics beyond composition
Polyurethane elastomer (solids component is 100%)
(manufacture of the large Japanese ink of パ Application テ ッ Network ス T-5202 Industrial Co., Ltd)
Polyurethane elastomer (solids component is 100%)
(manufacture of the large Japanese ink of パ Application テ ッ Network ス T-5210 Industrial Co., Ltd)
Polyurethane elastomer (solids component is 100%)
(meter La Ku cover draws P22SRNAT(ミ ラ Network ト ラ Application P22SRNAT))
Polyester elastomer (solids component is 60%)
(the strange cream polyester of Buddhist nun TP-290(ニ チ ゴ ー Port リ エ ス タ ー TP-290) the Nippon Synthetic Chemical Industry Co., Ltd manufactures)
Polyester elastomer (solids component is 60%)
(the strange cream polyester of Buddhist nun TP-293(ニ チ ゴ ー Port リ エ ス タ ー TP-293) the Nippon Synthetic Chemical Industry Co., Ltd manufactures)
SEBS rubber elastomer (solids component is 100%)
(Ku Laiyitaoen FG1901X(Network レ イ ト Application FG1901X) Network レ イ ト Application polymkeric substance Amada Co., Ltd. manufactures)
(C) composition: solvent
Industrial isophorone (manufacture of isophorone ゴ ー ド ー solvent Co., Ltd.)
Table 1
| (A) composition or (A ') composition | Fusing point (℃) |
| TPAE-32 | 124 |
| TPAE-31 | 118 |
| PA-201 | 122 |
| PA-200 | 85 |
| T-5202 | 43 |
| T-5210 | 38 |
| P22SRNAT | Nothing |
| TP-290 | Nothing |
| TP-293 | 31 |
| FG1901X | Nothing |
[fusing point test method]
The fusing point test condition of measuring by TG/DTA in table 1 is as described below.To the sample that adds 1mg～10mg in aluminium cup, heat-up rate with 10 ℃/min under nitrogen atmosphere is measured under the temperature range of-40 ℃～150 ℃, and the change point temperature that sharply reduces of the temperature that differential heat (DTA) is reduced or differential differential heat (DDTA) value is as " fusing point (℃) ".In the time that fusing point cannot be confirmed, for example, because DTA, DDTA slowly change cannot find out clear and definite change point time, be designated as " nothing ".
Device manufacturers: Seiko Instr Inc (Seiko Instrument Inc.)
Device: EXSTAR6000TG/DTA6200
Aluminium cup: Open Sample Pan φ 5
The manufacture method of embodiment 1～6 and comparative example 1～7 is as described below.In the container of (C) composition, bit by bit add (A) composition or (A ') composition to having added.Add after all (A) compositions or (A ') composition, stir 3 hours.When (A) composition dissolves when residual, extend churning time until residual without dissolving.Or, heat while stir.Then, add (B) composition and the filler as other composition, stir after 1 hour, in the three-roll mill of having carried out 40 μ m gaps adjustment (Network リ ア ラ Application ス), pass through 2 times.Detailed modulation voltage reference table 2, its numerical value all represents with mass parts.
Table 2
For the anisotropic conductive adhesive of embodiment 1～6 and comparative example 1～7, make test film according to test film making method, and implement peeling strength test, creep test, Electrical conductivity tests.Its result gathers and is shown in table 3.
[test film making method (silk screen printing, dry, add hot pressing)]
Anisotropic conductive adhesive, towards PET film or FPC, is carried out to silk screen printing under following condition.
Screen cloth specification: SUSmesh#80
Print speed: 40mm/sec
Coining: 0.2MPa
The PET film or the FPC that have printed anisotropic conductive adhesive are joined in hot-air drying stove, at 120 ℃, be dried 10 minutes, make the volatilization of (C) composition, on the surface of PET film or FPC, form uniform composition film.Adjustment has formed the position of PET film or FPC and the substrate of film, then by adding under the following conditions hot pressing, the test film of making in peeling strength test, creep test, conduction test is carried out bonding.While making test film, under setting, optimal conditions carry out.
Head contact area: 3mm × 60mm
Heating condition: 110～160 ℃
Pressurized conditions: 3～5MPa
Heating pressing time: 10～30sec
[peeling strength test]
Printing, dry on PET film, and as Fig. 1, be heated and press on ito glass, test film made.Adhesive portion is of a size of 3mm × 10mm.Place after 30 minutes, carry out peeling strength test.Take the angle as 90 degree with respect to ito glass, and with the trial speed of 50mm/min, PET film is measured to stretch release intensity.Measure 4 test films.Mean value and width (10mm) by maximum strength (N) calculate, and set it as " stripping strength (N/m) ".The form of PET film and ito glass is as described below.
PET film: width is 10mm, thickness is 38 μ m
Ito glass: refer to the glass with vapor-deposited film.60mm × 25mm × 1.1mm, area resistance is 10 Ω/ (the every square of ohm) (following, ito glass is same form)
The evaluation of " stripping strength (N/m) " is as described below, is summarized in table 2.
Zero: more than 800N/m
△：400～800N/m
×: less than 400N/m
[creep test]
Use PET film and the ito glass identical with peeling strength test, and picture adds hot pressing, making test film as shown in Figure 2.Place after 30 minutes, the unnecessary adhesive portion of tearing, makes 3mm × 50mm, in Fig. 25: in loading direction with 3gf/mm(width) ratio apply loading, and test film is placed in the atmosphere of 85 ℃.Place 5 test films simultaneously.Under loading, peel off whole test films, measure, and by following judgment standard evaluation " creep properties ", be summarized in table 2.
Zero: more than 24 hours time, all peel off
△: all peeled off at 12～24 hours
×: in the time of 12 hours, all peel off
[electroconductibility confirmation]
Use following FPC and the ito glass with peeling strength test and creep test same form, carry out conduction confirmation.As Fig. 3, the end of conductive coating paint is remained to the distance of 7mm to the pressing portion of FPC, add hot pressing.Place after 30 minutes, test film is put in thermal cycling test device, take-40 ℃ × 30 minutes+85 ℃ × 30 minutes as 1 circulation, carry out continuously 100 hours, repeatedly carry out thermal cycling.After off-test, by its taking-up and place 30 minutes, then the electrode of tester is placed in Fig. 3 to 8: on the film that silver is stuck with paste and the electrode of 9:FPC, measure resistance value.Using the average electrical resistance of 50 distributions as " conduction (Ω) ".
The material of FPC: polyimide
The thickness of FPC: 25 μ m
Distribution: be to carry out gold-plated processing on the copper of 35 μ m at thickness
The spacing of distribution: 0.4mm(L/S=0.2mm/0.2mm)
The radical of distribution: 50
Silver is stuck with paste: ThreeBond 3350C(drying at room temperature type)
By following judgment standard evaluation " conduction (Ω) ", be summarized in table 2.
Zero: mean value is less than 15 Ω
△: mean value is 15～20 Ω
×: mean value is more than 20 Ω
[comprehensive evaluation]
According to counting below, the result of statistics peeling strength test, creep test, conduction test, as " comprehensive evaluation ".
Zero: 2 point
△: 1 point
×: 0 point
Table 3
, in comparative example 1～7, there is not the composition that simultaneously maintains creep properties and conduction, and in an embodiment, in creep properties and conduction and in depositing, also maintained stripping strength in comparing embodiment and comparative example.In addition, as shown in Table 1, because the fusing point of (A) composition of embodiment 6 is 85 ℃, identical with 85 ℃ of atmosphere temperature in creep test, therefore compared with embodiment 1～5, although some characteristics have declined, it has still maintained MIN stripping strength, creep properties, conduction.(A ') used in comparative example composition uses polyester elastomer, polyurethane elastomer, rubber elastomer general in ACP field and tests, but it cannot maintain characteristic in whole test subjects, and maintained the characteristic as ACP as the polyamide elastomer of (A) composition, therefore produce excellent especially effect.In addition, form the FPC of ACP film by silk screen printing, mostly under this state, carry, therefore also need to maintain the stability of film.Therefore, have if (A) composition of sharp melting point, ACP film is stable.
Industrial applicibility
For non-response type ACP, the creep properties that maintains 85 ℃ is very difficult, and ACP of the present invention is in maintaining creep properties, even if also demonstrated stable characteristic aspect conduction.After ACP is printed on FPC in a large number, be dried in large quantities by batch furnace, and by the hot pressing that adds of short period of time, can carry out a large amount of productions of electronic unit, also maintained the present invention with the close horizontal characteristic of response type ACP simultaneously, can think that it is also suitable for except the purposes of existing non-response type ACP.
Nomenclature
1:PET film
2:ITO glass
3: adhesive portion
4: direction of delaminate
5: loading direction
6：FPC
The conducting face of 7:ITO glass
8: the film that silver is stuck with paste
The electrode of 9:FPC
Claims (12)
1. flexible print wiring parts, by by the anisotropic conductive adhesive silk screen printing of non-response type or be coated on flexible print wiring, and then make (C) composition volatilization and obtain, the anisotropic conductive adhesive of wherein said non-response type contains following (A)～(C) composition
(A) composition: fusing point is the polyamide elastomer of 80 ℃～140 ℃,
(B) composition: spherical electric conduction powder, and
(C) composition: solvent.
2. flexible print wiring parts as claimed in claim 1, wherein (A) composition is made up of as the polyamide elastomer of raw material synthesized the compound to have more than 2 carboxyl in 1 molecule, and the compound in described 1 molecule with more than 2 carboxyl is by the compound of the polyreaction synthesized of unsaturated fatty acids.
3. flexible print wiring parts as claimed in claim 1, wherein (B) composition is the conductive metal plating powder take organic filler as core.
4. flexible print wiring parts as claimed in claim 1, wherein the amount of (B) composition is 1～100 mass parts with respect to 100 mass parts (A) composition, (C) amount of composition is 1～1000 mass parts with respect to 100 mass parts (A) composition.
5. a film, by silk screen printing or be coated with the anisotropic conductive adhesive of non-response type, and then forms the volatilization of (C) composition, and the anisotropic conductive adhesive of wherein said non-response type contains following (A)～(C) composition,
(A) composition: fusing point is the polyamide elastomer of 80 ℃～140 ℃,
(B) composition: spherical electric conduction powder, and
(C) composition: solvent.
6. film as claimed in claim 5, wherein (A) composition is made up of as the polyamide elastomer of raw material synthesized the compound to have more than 2 carboxyl in 1 molecule, and the compound in described 1 molecule with more than 2 carboxyl is by the compound of the polyreaction synthesized of unsaturated fatty acids.
7. film as claimed in claim 5, wherein (B) composition is the conductive metal plating powder take organic filler as core.
8. film as claimed in claim 5, wherein the amount of (B) composition is 1～100 mass parts with respect to 100 mass parts (A) composition, (C) amount of composition is 1～1000 mass parts with respect to 100 mass parts (A) composition.
9. contain following (A)～(C) anisotropic conductive adhesive of the non-response type of composition,
(A) composition: fusing point is the polyamide elastomer of 80 ℃～140 ℃,
(B) composition: spherical electric conduction powder and
(C) composition: solvent;
Wherein, described (A) composition does not comprise in TPAE-31 or TPAE-32 any one.
10. anisotropic conductive adhesive as claimed in claim 9, wherein (A) composition is made up of as the polyamide elastomer of raw material synthesized the compound to have more than 2 carboxyl in 1 molecule, and the compound in described 1 molecule with more than 2 carboxyl is by the compound of the polyreaction synthesized of unsaturated fatty acids.
11. anisotropic conductive adhesives as claimed in claim 9, wherein (B) composition is the conductive metal plating powder take organic filler as core.
12. anisotropic conductive adhesives as claimed in claim 9, wherein the amount of (B) composition is 1～100 mass parts with respect to 100 mass parts (A) composition, (C) amount of composition is 1～1000 mass parts with respect to 100 mass parts (A) composition.
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| JP2009-291073 | 2009-12-22 | ||
| JP2009291073A JP5825503B2 (en) | 2009-12-22 | 2009-12-22 | Anisotropic conductive adhesive |
| PCT/JP2010/072307 WO2011077979A1 (en) | 2009-12-22 | 2010-12-06 | Anisotropic conductive adhesive |
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| CN102656244B true CN102656244B (en) | 2014-06-04 |
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| KR (1) | KR101727774B1 (en) |
| CN (1) | CN102656244B (en) |
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| JP5838674B2 (en) * | 2011-09-12 | 2016-01-06 | 住友電気工業株式会社 | Film-like anisotropic conductive adhesive |
| JP5964187B2 (en) | 2012-09-18 | 2016-08-03 | デクセリアルズ株式会社 | Anisotropic conductive film, connection method, and joined body |
| JP6164416B2 (en) * | 2013-09-25 | 2017-07-19 | 株式会社スリーボンド | Conductive adhesive composition |
| JP2017111978A (en) * | 2015-12-16 | 2017-06-22 | デクセリアルズ株式会社 | Anisotropic conductive film, connection method, and joined body |
| CN106905889A (en) * | 2017-03-08 | 2017-06-30 | 上海腾烁电子材料有限公司 | A kind of modified rubber heat cure reaction bonded thermoplasticity anisotropic conductive adhesive |
| JP6969165B2 (en) * | 2017-06-02 | 2021-11-24 | 昭和電工マテリアルズ株式会社 | An anisotropic conductive adhesive composition, an anisotropic conductive film, and a connecting structure. |
| JP2020077645A (en) * | 2020-01-29 | 2020-05-21 | デクセリアルズ株式会社 | Anisotropic conductive film, connection method, and joined body |
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| JP4236856B2 (en) * | 2002-03-20 | 2009-03-11 | 信越ポリマー株式会社 | Anisotropic conductive adhesive and heat seal connector |
| JP2007062126A (en) * | 2005-08-31 | 2007-03-15 | Dainippon Printing Co Ltd | Inkjet head and method for manufacturing the same |
| JP2008165034A (en) * | 2006-12-28 | 2008-07-17 | Sony Corp | Integrated module, display device, and electronic equipment |
| JP5286679B2 (en) * | 2007-03-15 | 2013-09-11 | 東レ株式会社 | Adhesive composition for electronic parts and adhesive sheet for electronic parts using the same |
| JP5226562B2 (en) * | 2008-03-27 | 2013-07-03 | デクセリアルズ株式会社 | Anisotropic conductive film, joined body and method for producing the same |
| JP4580021B2 (en) * | 2009-01-26 | 2010-11-10 | タツタ電線株式会社 | Adhesive composition |
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| Title |
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| JP昭61-32085A 1986.02.14 |
| JP特开2003-268344A 2003.09.25 |
| JP特开2007-62126A 2007.03.15 |
| JP特开2008-165034A 2008.07.17 |
| JP特开2008-222941A 2008.09.25 |
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| TWI493013B (en) | 2015-07-21 |
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| KR101727774B1 (en) | 2017-04-17 |
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| JP2011132304A (en) | 2011-07-07 |
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