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CN102651427A - Guide device for bulk silicon wafers - Google Patents

Guide device for bulk silicon wafers Download PDF

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Publication number
CN102651427A
CN102651427A CN2012101181077A CN201210118107A CN102651427A CN 102651427 A CN102651427 A CN 102651427A CN 2012101181077 A CN2012101181077 A CN 2012101181077A CN 201210118107 A CN201210118107 A CN 201210118107A CN 102651427 A CN102651427 A CN 102651427A
Authority
CN
China
Prior art keywords
guide plate
side guide
guide plates
silicon wafers
silicon wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012101181077A
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Chinese (zh)
Inventor
许波涛
钟新华
龙会跃
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CETC 48 Research Institute
Original Assignee
CETC 48 Research Institute
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CETC 48 Research Institute filed Critical CETC 48 Research Institute
Priority to CN2012101181077A priority Critical patent/CN102651427A/en
Publication of CN102651427A publication Critical patent/CN102651427A/en
Pending legal-status Critical Current

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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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Abstract

The invention discloses a guide device for bulk silicon wafers, which solves the problems that the existing guide device is for one-dimension guiding, is easily affected by the outside, and is poor in guidance quality. The guide device for the bulk silicon wafers comprises bottom guide plates capable of ascending and descending; side guide plates are arranged above the two sides of each bottom guide plate; and the side guide plates are connected with side guide plate drive mechanisms capable of driving the side guide plates to perform straight reciprocating motion between the two side guide plates. When the silicon wafers move above the bottom guide plates, the bottom guide plates ascend stably; the silicon wafers in a silicon wafer box enter the guide grooves in the bottom guide plates; the bottom guide plates continue ascending to support the silicon wafers in the silicon wafer box and feed the silicon wafers to the guide grooves formed by the side guide plates; and then, the side guide plates can be adjusted laterally, so as to ensure that all of the silicon wafers can keep aligned and maintain an identical gap. In this way, the guiding of the bulk silicon wafers can be well accomplished, and the reliability in taking the wafers is improved.

Description

A kind of batch silicon wafer guider
Technical field
The present invention relates to photovoltaic equipment field, be specially a kind of batch silicon wafer guider, be particularly suitable for the quartz boat automatic loading and unloading sheet equipment in the photovoltaic equipment.
Background technology
In the solar battery sheet manufacture process, need the solar silicon wafers after the making herbs into wool be taken out in gaily decorated basket box and be encased in the quartz boat back-to-back then.Great majority adopt artificial load mode in the domestic present existing production line, and fragment rate pollution probability high, that silicon chip is caused is high.
In recent years; Quartz boat automatic loading and unloading sheet equipment also occurred, automatic loading and unloading sheet equipment adopts and replaces manual operation, reduces manual contact with silicon chip; Avoided the pollution of human factor to silicon chip; We can say that quartz boat automatic loading and unloading sheet equipment is of value to raising solar battery sheet rate of finished products and transfer ratio, can enhance productivity simultaneously.
In order to enhance productivity, quartz boat automatic loading and unloading sheet equipment need adopt the batch silicon wafer carrying, and in the quartz boat automatic loading and unloading sheet equipment, the silicon chip guiding adopts end guide plate to realize the location usually, realizes through the groove that distributes on the end guide plate.This guider is the one dimension guiding, in the guiding process, is vulnerable to ectocine, and guidance quality is poor, therefore must design more reliable, more effective batch silicon wafer guider, otherwise can't realize silicon chip carrying effectively reliably.
Summary of the invention
In the existing quartz boat automatic loading and unloading sheet equipment, the silicon chip guiding adopts end guide plate to realize the location, realizes through the groove of combination distribution on the end guide plate; Processing, installation accuracy require high and are vulnerable to ectocine,, the present invention aims to provide a kind of batch silicon wafer guider; This guider is through the both direction Union Movement; Can realize the batch silicon wafer guiding in the automatic sheet-fetching process, promote the reliability of whole quartz boat automatic loading and unloading sheet equipment, reduce cost simultaneously.
To achieve these goals, the technical scheme that the present invention adopted is:
A kind of batch silicon wafer guider; Comprise can oscilaltion end guide plate; Its design feature is; Top, the both sides of each guide plate of the said end is equipped with the side guide plate, this side guide plate with can drive the side guide plate driving mechanism that the side guide plate does reciprocating linear motion link to each other between the guide plate of two sides.
In order more accurately to realize guiding being equipped with many gathering sills on guide plate of the said end and the side guide plate, the quantity of groove is decided according to the specification of silicon box.
As a kind of concrete scheme, the gathering sill of guide plate of the said end is a V-shaped groove.
The gathering sill of said side guide plate is preferably dovetail groove.
Further, the gathering sill of guide plate of the said end and side guide plate and vertical direction are 3 ° of angles, and be consistent with the angle of currently used quartz boat groove.
Make the concrete mode of elevating movement as a kind of end guide plate of realizing, guide plate of the said end with can drive end guide plate and make the end guide plate driving mechanism of elevating movement and link to each other.
By said structure; The present invention realizes through end guide plate and side guide plate Union Movement; It mainly is made up of end guide plate, side guide plate and corresponding driving mechanism; The groove of even zonation V-arrangement opening above the end guide plate, the groove of even distribution trapezoid-shaped openings above the guide plate of side.Guide plate steadily rises at the bottom of the end guide plate drive mechanism; Silicon chip in the silicon box is introduced in the gathering sill of end guide plate; End guide plate continues to rise the silicon chip in the silicon box is held up and sends in the gathering sill of side guide plate formation; Regulate the side guide plate through side guide plate driving mechanism then, make all silicon chip alignment and keep equal gap.
Among the present invention, end guide plate can be one also can be two separately combination use guide plate at the bottom of corresponding one of two side guide plates.The preferred evenly groove of zonation V-arrangement opening on the end guide plate, the quantity of groove is decided according to the specification of silicon box, adopts the material that can not pollute silicon chip simultaneously.The preferred evenly groove of distribution trapezoid-shaped openings adopts the material that can not pollute silicon chip simultaneously on the guide plate of side, and two side guide plates are symmetrical, and combination is used.
End guide plate and side guide plate see from the side, the back is installed all is preferably 3 with level to spend angle lappings oblique, and promptly the median plane of each gathering sill on end guide plate and the side guide plate all becomes 3 to spend angle lappings oblique with vertical direction.
End guide plate and side guide plate can accurately be adjusted the guiding position and adapt to all size silicon chip all through corresponding driving institutional adjustment position.
Compared with prior art; Useful result of the present invention is: through two-dimensional guide device of the present invention, in silicon chip guiding process, be not subject to the influence of external factor, guiding is more accurately reliable; Significantly reduce part processing and installation difficulty simultaneously, reduced the device fabrication cost.
Below in conjunction with accompanying drawing and embodiment the present invention is done further elaboration.
Description of drawings
Fig. 1 is the structural representation of an embodiment of the present invention;
Fig. 2 is the structural representation of side according to the invention guide plate when separately using.
In the drawings
Guide plate at the bottom of the 1-; Guide plate driving mechanism at the bottom of the 2-; 3-side guide plate driving mechanism;
4-side guide plate.
Embodiment
A kind of batch silicon wafer guider, as shown in Figure 1, form by end guide plate 1, end guide plate driving mechanism 2, side guide plate driving mechanism 3, side guide plate 4.See that from the side end guide plate 1 is installed the back with side guide plate 4 and all become 3 degree angle lappings oblique with level.Silicon chip is contained in the silicon box 5; When silicon box 5 moves to end guide plate 1 top; Guide plate 1 steadily rises at the bottom of end guide plate driving mechanism 2 drivings; Silicon chip in the silicon box is introduced in the gathering sill of end guide plate 1, and end guide plate 1 continues to rise the silicon chip in the silicon box 5 is held up and sends in the gathering sill of side guide plate 4 formation, regulates side guide plate 4 through side guide plate driving mechanism 3 side directions then; Make all silicon chip alignment and keep equal gap, thereby realized the batch silicon wafer guide function.The end shown in Figure 1 guide plate 1 is two separately situation of combination use.
As shown in Figure 2, when 3 actions of side guide plate driving mechanism, the motion in the opposite direction simultaneously of the side guide plate 4 of inside and outside both sides.
The present invention is a kind of simple and effective batch silicon wafer guider, can effectively improve equipment dependability, reduces cost, and its advantage is fairly obvious.
The description of the specific embodiment of the invention only is in order to help to understand the present invention; Rather than be used for limiting the present invention; Any those skilled in the art thought of the present invention all capable of using is carried out the part change and is changed; But as long as its technological means does not break away from thought of the present invention and main points, must be within protection scope of the present invention.

Claims (6)

1. batch silicon wafer guider; Comprise can oscilaltion end guide plate (1); It is characterized in that; Top, the both sides of each guide plate of the said end (1) is equipped with side guide plate (4), this side guide plate (4) with can drive the side guide plate driving mechanism (3) that side guide plate (4) does reciprocating linear motion link to each other between the guide plate of two sides.
2. batch silicon wafer guider according to claim 1; It is characterized in that; Guide plate of the said end (1) and side guide plate (4) all adopt the material that can not pollute silicon chip, and should end guide plate (1) and top many gathering sills that all evenly distribute of side guide plate (4).
3. batch silicon wafer guider according to claim 2 is characterized in that, the gathering sill of guide plate of the said end (1) is a V-shaped groove.
4. batch silicon wafer guider according to claim 2 is characterized in that, the gathering sill of said side guide plate (4) is a dovetail groove.
5. batch silicon wafer guider according to claim 2 is characterized in that, the gathering sill and the vertical direction of guide plate of the said end (1) and side guide plate (4) are 3 ° of angles.
6. batch silicon wafer guider according to claim 1 is characterized in that, guide plate of the said end (1) with can drive end guide plate (1) and make the end guide plate driving mechanism (2) of elevating movement and link to each other.
CN2012101181077A 2012-04-21 2012-04-21 Guide device for bulk silicon wafers Pending CN102651427A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012101181077A CN102651427A (en) 2012-04-21 2012-04-21 Guide device for bulk silicon wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012101181077A CN102651427A (en) 2012-04-21 2012-04-21 Guide device for bulk silicon wafers

Publications (1)

Publication Number Publication Date
CN102651427A true CN102651427A (en) 2012-08-29

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012101181077A Pending CN102651427A (en) 2012-04-21 2012-04-21 Guide device for bulk silicon wafers

Country Status (1)

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CN (1) CN102651427A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107364719A (en) * 2017-08-31 2017-11-21 东莞市李群自动化技术有限公司 A kind of sheet glass feeding and conveying device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5501568A (en) * 1993-07-01 1996-03-26 Mitsubishi Denki Kabushiki Kaisha Wafer aligning apparatus
CN201266600Y (en) * 2008-09-26 2009-07-01 北京凯德石英塑料制品有限公司 Horizontal tapered slot quartz boat
CN101866990B (en) * 2010-06-18 2011-11-23 无锡尚德太阳能电力有限公司 Automatic wafer ascending and descending device of quartz boat
CN202172085U (en) * 2011-08-23 2012-03-21 无锡尚德太阳能电力有限公司 Quartz boat used for silicon slice insertion process of automatic feeding machine

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5501568A (en) * 1993-07-01 1996-03-26 Mitsubishi Denki Kabushiki Kaisha Wafer aligning apparatus
CN201266600Y (en) * 2008-09-26 2009-07-01 北京凯德石英塑料制品有限公司 Horizontal tapered slot quartz boat
CN101866990B (en) * 2010-06-18 2011-11-23 无锡尚德太阳能电力有限公司 Automatic wafer ascending and descending device of quartz boat
CN202172085U (en) * 2011-08-23 2012-03-21 无锡尚德太阳能电力有限公司 Quartz boat used for silicon slice insertion process of automatic feeding machine

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107364719A (en) * 2017-08-31 2017-11-21 东莞市李群自动化技术有限公司 A kind of sheet glass feeding and conveying device

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Application publication date: 20120829