CN102638947A - Production technology of silver paste over-line printed circuit board - Google Patents
Production technology of silver paste over-line printed circuit board Download PDFInfo
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- CN102638947A CN102638947A CN2012101207289A CN201210120728A CN102638947A CN 102638947 A CN102638947 A CN 102638947A CN 2012101207289 A CN2012101207289 A CN 2012101207289A CN 201210120728 A CN201210120728 A CN 201210120728A CN 102638947 A CN102638947 A CN 102638947A
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Abstract
The invention relates to a production technology of a silver paste over-line printed circuit board. The technology comprises the steps of: cutting, edging, NC (numerical control) drilling, deburring, printing pretreatment, and printing of reverse-side solder mask ink; UV (ultraviolet) curing, and printing of graphics ink; UV curing and etching; ink removing, solder mask printing pretreatment and printing of front-side solder mask ink; UV curing and printing of front-side text; UV curing and printing of reverse-side text; UV curing, printing pretreatment and printing of insulating layer 1 ink; UV curing and printing of insulating layer 2 ink; UV curing, silver paste over-line printing pretreatment and printing of silver paste over-line, silver paste hot-wind curing, printing pretreatment, and printing of silver paste protection layer 1 ink; UV curing and printing of silver paste protection layer 2 ink; and hot-wind curing, lead hot-wind leveling, punching, on/off detection, low-resistance detection, finished product inspection, and packaging and shipment.
Description
Technical field:
The present invention relates to a kind of silver slurry cross-line production process of printed circuit board.
Background technology
Traditional plated-through hole double sided board is to use double face copper; The production technology that becomes copper, electro-coppering with chemistry through holing connects into a loop with the copper wire of substrate different facial; It need use double face copper, and can produce poisonous waste liquid and contaminated environment at chemistry and plating production process, and production cost is than high yield in addition; Production cycle is longer, and production efficiency is lower.
Summary of the invention
In order to overcome above-mentioned defective; The purpose of this invention is to provide a kind of silver slurry cross-line production process of printed circuit board; Adopt this technology can on single-side coated copper plate, process double-deck conducting wire, promptly being printed as cross-line with silver slurry, non-conterminous a plurality of loops are unified into one almost is the loop of same potential, and; Silver slurry cross-line and beneath copper conductor have quite high insulation impedance, can the intrinsic instructions for use of adaptive circuit.
To achieve these goals; The present invention adopts following technical scheme: silver slurry cross-line production process of printed circuit board, it is: open material-edging-NC boring-deburring-printing pre-treatment-printing reverse side resistance solder paste China ink, UV curings-printed pattern printing ink, UV curings-etching, removal ink-resistance weldering printing pre-treatment-printing front and hinder solder paste China ink, UV curing-printing front literal, UV curing-printing reverse side literal, UV curing-printing pre-treatment-printing insulating barrier 1 printing ink, UV curing-printing insulating barrier 2 printing ink, UV curing-silver and starch cross-line and print pre-treatment-printed silver and starch cross-line-silver and starch hot blast curing-printing pre-treatment-printed silver and starch that protective layer 1 printing ink, UV curing-printed silver are starched protective layer 2 printing ink, hot blast solidifies-have plumbous hot air leveling-die-cut-break-make road detection-low resistance detection-product inspection-packing, shipment.
For surface of insulating layer stress is reduced, the light energy working control when solidifying the ground floor dielectric ink is at 650～750mj/cm
2, make printing ink be in semi-cured state, make its pencil hardness between HB～1H, improved the adherence of silver-colored slurry cross-line and insulating barrier, eliminated silver-colored slurry and insulating barrier segregation phenomenon.
The UV light energy of second layer insulating barrier ink solidification is controlled at 700～800mj/cm
2Semi-cured state, the adhesion of reinforced insulation layer and silver slurry cross-line.
Silver slurry cross-line: adopt single face PCB silk-screen printing technique; Select to satisfy the silver-colored 170 order silk screens and the 40 μ m thickness films of starching the resistance requirement of cross-line and process printing screen plate; Make the silver slurry cross-line thickness of each printing keep consistent relatively, to keep product silver slurry cross-line resistance stability.
The UV light energy of ground floor silver slurry cross-line protective layer printing ink is controlled at 700～800mj/cm
2Semi-cured state, the adhesion of reinforced insulation layer and silver slurry cross-line.
One. U.S. ACHESON 976-SSHV (or Korea S sun NS-FSP04) the silver slurry of selecting low-resistivity for use has relatively low potential difference as the cross-line printing material to guarantee the circuit that cross-line connects;
Two. select for use the lower Shanghai of pencil hardness auspicious Le Tian village USR-11G-11 ultraviolet curing type welding resistance printing ink as insulating barrier printing ink between two conductive layers and silver slurry protective layer; And the light energy technological parameter of control ink solidification; Can guarantee insulating properties, accomplish that again insulating barrier and silver slurry cross-line have good adherence;
Three. cleaning fluid and the washing selecting to have degreasing and remove the Copper Foil oxidation are made up as silver-colored slurry cross-line printing pre-treating technology, and assurance silver is starched with the copper dish has stronger adherence, reduces the contact resistance of silver-colored slurry and copper dish.
Four. select for use hot curing resistance solder paste China ink as the last slurry of silver together cross-line protective layer printing ink; With better protection silver slurry cross-line; Improve the resistance to sudden heating of product, product is after process has the high temperature impact of plumbous hot air leveling, Reflow Soldering and wave-soldering, and silver slurry cross-line resistance has less rate of change.
Silver slurry cross-line printed wiring board of the present invention and plated-through hole double sided board compare: silver slurry cross-line production process of printed circuit board technology is through silk-screen printing technique; Cover the double-deck wiring board of formation on the copper sheet at single face; It is shorter than the life cycle of the product of plated-through hole double sided board explained hereafter; Efficient is high, more adapts to product and produces in enormous quantities; Most importantly do not use chemical plating process; The waste liquid that does not also just destroy environment produces, and has practiced thrift 50% copper raw material than plated-through hole double sided board, also greatly reduces product boring cost; The theory that meets cleaner production has positive meaning to environmental protection.
Embodiment
Further specify below in conjunction with accompanying drawing:
A kind of real electrical equipment N300 printed wire panel products is used for automobile instrument panel, and this wiring board adopts silver slurry cross-line single side printed wiring board production technology process to produce.
Silver slurry cross-line production process of printed circuit board: it is: open material-edging-NC boring-deburring-printing pre-treatment-printing reverse side resistance solder paste China ink; UV curing-printed pattern printing ink; UV curing-etching; Removal ink-resistance weldering printing pre-treatment-positive the resistance of printing solder paste China ink; UV curing-printing front literal; UV curing-printing reverse side literal; UV curing-printing pre-treatment-printing insulating barrier 1 printing ink; UV curing-printing insulating barrier 2 printing ink; UV curing-silver slurry cross-line printing pre-treatment-printed silver slurry cross-line-silver slurry hot blast curing-printing pre-treatment-printed silver slurry protective layer 1 printing ink; UV curing-printed silver slurry protective layer 2 printing ink; Hot blast solidifies-has plumbous hot air leveling-die-cut-break-make road detection-low resistance detection-product inspection-packing; Shipment.
For surface of insulating layer stress is reduced, the light energy working control when solidifying the ground floor dielectric ink is at 650～750mj/cm
2, make printing ink be in semi-cured state, make its pencil hardness between HB～1H, improved the adherence of silver-colored slurry cross-line and insulating barrier, eliminated silver-colored slurry and insulating barrier segregation phenomenon, solved a key issue.
The UV light energy of second layer insulating barrier ink solidification is controlled at 700～800mj/cm
2Semi-cured state, the adhesion of reinforced insulation layer and silver slurry cross-line.
Silver slurry cross-line: adopt single face PCB silk-screen printing technique; Select to satisfy the silver-colored 170 order silk screens and the 40 μ m thickness films of starching the resistance requirement of cross-line and process printing screen plate; Make the silver slurry cross-line thickness of each printing keep consistent relatively, to keep product silver slurry cross-line resistance stability.
The UV light energy of ground floor silver slurry cross-line protective layer printing ink is controlled at 700～800mj/cm
2Semi-cured state, the adhesion of reinforced insulation layer and silver slurry cross-line.
One. we are in the insulating barrier ink printing of production process, curing process; Select Shanghai auspicious Le Tian village USR-11G-11 resistance solder paste China ink for use; And the special control through the ink solidification light energy; Improve the adherence of silver-colored slurry cross-line and insulating barrier, eliminated silver-colored slurry and insulating barrier segregation phenomenon, solved a key issue.
Two. the 2nd key issue is to guarantee that the silver slurry has good adhesion with the copper dish, makes the contact resistance≤20m Ω of silver slurry and copper dish, and product is through after having plumbous hot air leveling, and silver slurry cross-line loop resistance value rate of change wants≤30%, and this is the most key.For this reason, we have adopted at silver slurry cross-line printing pretreatment procedure has degreasing and the cleaning fluid of removing Copper Foil oxidation effect and washing optimum organization, makes product before printed silver slurry cross-line, and clean copper face is arranged.Through detecting the actual contact resistance＜15m Ω of silver slurry and copper dish.Product is after process has plumbous hot air leveling, and silver is starched actual rate of change≤20% of cross-line loop resistance value.
Three. we have relative " zero " current potential in order to make the loop that is connected together by silver slurry cross-line in the product; Select U.S. ACHESON 976-SSHV (or Korea S sun NS-FSP04) conductive silver paste; And adopt suitable half tone to carry out the printed silver slurry; To guarantee that printed silver slurry cross-line has certain thickness, finally reaches the low resistance requirement.After testing, the actual side resistance＜20m Ω of silver slurry cross-line (product side's resistance standard≤40m Ω) on our product.
Four. we are in order to make product after plumbous hot air leveling is arranged; Silver slurry cross-line loop resistance value keeps relative stability; Selected hot curing resistance solder paste China ink as last silver slurry cross-line protective layer, improved the resistance to sudden heating of product, through detecting; Product is after having plumbous hot air leveling, and silver is starched resistance varying-ratio＜20% in cross-line loop.
Claims (5)
1. a silver is starched the cross-line production process of printed circuit board: it is: open material-edging-NC boring-deburring-printing pre-treatment-printing reverse side resistance solder paste China ink; UV curing-printed pattern printing ink; UV curing-etching; Removal ink-resistance weldering printing pre-treatment-positive the resistance of printing solder paste China ink; UV curing-printing front literal; UV curing-printing reverse side literal; UV curing-printing pre-treatment-printing insulating barrier 1 printing ink; UV curing-printing insulating barrier 2 printing ink; UV curing-silver slurry cross-line printing pre-treatment-printed silver slurry cross-line-silver slurry hot blast curing-printing pre-treatment-printed silver slurry protective layer 1 printing ink; UV curing-printed silver slurry protective layer 2 printing ink; Hot blast solidifies-has plumbous hot air leveling-die-cut-break-make road detection-low resistance detection-product inspection-packing; Shipment.
2. silver slurry cross-line production process of printed circuit board according to claim 1, it is characterized in that: the light energy working control when solidifying the ground floor dielectric ink is at 650～750mj/cm
2, make printing ink be in semi-cured state, make its pencil hardness between HB～1H, improved the adherence of silver-colored slurry cross-line and insulating barrier, eliminated silver-colored slurry and insulating barrier segregation phenomenon, solved a key issue.
3. silver slurry cross-line production process of printed circuit board according to claim 1, it is characterized in that: the UV light energy of second layer insulating barrier ink solidification is controlled at 700～800mj/cm
2Semi-cured state, the adhesion of reinforced insulation layer and silver slurry cross-line.
4. silver slurry cross-line production process of printed circuit board according to claim 1; It is characterized in that: silver slurry cross-line: adopt single face PCB silk-screen printing technique; Select to satisfy the silver-colored 170 order silk screens and the 40 μ m thickness films of starching the resistance requirement of cross-line and process printing screen plate; Make the silver slurry cross-line thickness of each printing keep consistent relatively, to keep product silver slurry cross-line resistance stability.
5. silver slurry cross-line production process of printed circuit board according to claim 1 is characterized in that: the UV light energy of ground floor silver slurry cross-line protective layer printing ink is controlled at 700～800mj/cm
2Semi-cured state, the adhesion of reinforced insulation layer and silver slurry cross-line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201210120728.9A CN102638947B (en) | 2012-04-24 | 2012-04-24 | Production technology of silver paste over-line printed circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210120728.9A CN102638947B (en) | 2012-04-24 | 2012-04-24 | Production technology of silver paste over-line printed circuit board |
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| CN102638947A true CN102638947A (en) | 2012-08-15 |
| CN102638947B CN102638947B (en) | 2014-12-31 |
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| CN201210120728.9A Active CN102638947B (en) | 2012-04-24 | 2012-04-24 | Production technology of silver paste over-line printed circuit board |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103152989A (en) * | 2013-03-01 | 2013-06-12 | 杭州新三联电子有限公司 | Production process for screen printed circuit board |
| CN103367011A (en) * | 2013-07-17 | 2013-10-23 | 深圳市则成电子工业有限公司 | Membrane switch secrete-divulging-prevention method and secrete-divulging-prevention membrane switch |
| CN104202907A (en) * | 2014-07-21 | 2014-12-10 | 本立遠東有限公司 | A UV printing method for manufacturing double-sided circuit boards with sinking copper electroplating via holes |
| CN104995023A (en) * | 2013-03-08 | 2015-10-21 | 富士胶片株式会社 | Multilayer structure, multilayer structure manufacturing method and composition set |
| CN109275264A (en) * | 2018-09-18 | 2019-01-25 | 镇江华印电路板有限公司 | A kind of preparation process of film key carbon film printed circuit board |
| TWI672086B (en) * | 2017-10-13 | 2019-09-11 | 大陸商宏啟勝精密電子（秦皇島）有限公司 | Method for manufacturing circuit board |
| CN110602879A (en) * | 2019-10-11 | 2019-12-20 | 深圳市恒翊科技有限公司 | Intra-film electronic circuit structure with flat cable |
| CN113733723A (en) * | 2021-08-23 | 2021-12-03 | 连城县中触电子有限公司 | Automatic line body of touch-sensitive screen anterior segment printing |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0071375A2 (en) * | 1981-07-25 | 1983-02-09 | Kazuo Kay | Method for manufacturing a circuit board with a through hole |
| JP2010140214A (en) * | 2008-12-11 | 2010-06-24 | Brother Ind Ltd | Wireless tag communication device and printed matter creation system |
| WO2010140214A1 (en) * | 2009-06-02 | 2010-12-09 | ソニーケミカル＆インフォメーションデバイス株式会社 | Method for manufacturing multilayer printed wiring board |
-
2012
- 2012-04-24 CN CN201210120728.9A patent/CN102638947B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0071375A2 (en) * | 1981-07-25 | 1983-02-09 | Kazuo Kay | Method for manufacturing a circuit board with a through hole |
| JP2010140214A (en) * | 2008-12-11 | 2010-06-24 | Brother Ind Ltd | Wireless tag communication device and printed matter creation system |
| WO2010140214A1 (en) * | 2009-06-02 | 2010-12-09 | ソニーケミカル＆インフォメーションデバイス株式会社 | Method for manufacturing multilayer printed wiring board |
Non-Patent Citations (2)
| Title |
|---|
| 朱民: "单面双层印制板制造技术", 《电子工艺技术》 * |
| 李昌国: "银/铜导电浆料的特性及其在印制板方面的应用", 《印制电路信息》 * |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103152989A (en) * | 2013-03-01 | 2013-06-12 | 杭州新三联电子有限公司 | Production process for screen printed circuit board |
| CN103152989B (en) * | 2013-03-01 | 2015-12-02 | 杭州新三联电子有限公司 | Silk screen printing wiring board production technology |
| CN104995023A (en) * | 2013-03-08 | 2015-10-21 | 富士胶片株式会社 | Multilayer structure, multilayer structure manufacturing method and composition set |
| CN104995023B (en) * | 2013-03-08 | 2017-08-22 | 富士胶片株式会社 | Multilayer construct, the manufacture method of multilayer construct and composition group |
| CN103367011A (en) * | 2013-07-17 | 2013-10-23 | 深圳市则成电子工业有限公司 | Membrane switch secrete-divulging-prevention method and secrete-divulging-prevention membrane switch |
| CN103367011B (en) * | 2013-07-17 | 2016-02-17 | 深圳市则成电子工业有限公司 | Anti-method and a kind of anti-thin film switch of divulging a secret of divulging a secret of a kind of thin film switch |
| CN104202907A (en) * | 2014-07-21 | 2014-12-10 | 本立遠東有限公司 | A UV printing method for manufacturing double-sided circuit boards with sinking copper electroplating via holes |
| CN104202907B (en) * | 2014-07-21 | 2017-11-07 | 本立遠東有限公司 | A UV printing method for manufacturing double-sided circuit boards with sinking copper electroplating via holes |
| TWI672086B (en) * | 2017-10-13 | 2019-09-11 | 大陸商宏啟勝精密電子（秦皇島）有限公司 | Method for manufacturing circuit board |
| CN109275264A (en) * | 2018-09-18 | 2019-01-25 | 镇江华印电路板有限公司 | A kind of preparation process of film key carbon film printed circuit board |
| CN110602879A (en) * | 2019-10-11 | 2019-12-20 | 深圳市恒翊科技有限公司 | Intra-film electronic circuit structure with flat cable |
| CN113733723A (en) * | 2021-08-23 | 2021-12-03 | 连城县中触电子有限公司 | Automatic line body of touch-sensitive screen anterior segment printing |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102638947B (en) | 2014-12-31 |
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