CN102629567B - Substrate fixing device and manufacturing method thereof and method for fixing substrate - Google Patents
Substrate fixing device and manufacturing method thereof and method for fixing substrate Download PDFInfo
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- CN102629567B CN102629567B CN201110319335.6A CN201110319335A CN102629567B CN 102629567 B CN102629567 B CN 102629567B CN 201110319335 A CN201110319335 A CN 201110319335A CN 102629567 B CN102629567 B CN 102629567B
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Abstract
Disclosed in the invention is a substrate fixing device, which is used for fixing a substrate (1) in processing equipment. The substrate accommodation groove (13) is arranged on the surface of the substrate fixing device to fix the substrate (1); and the overall dimension of the substrate fixing device is arranged as one enabling the device itself to be fixed on the processing equipment. Besides, provided is a method for fixing a substrate. According to the invention, the substrate fixing devices are employed on different processing equipment, so that an adaptive range of a same substrate to the different processing equipment is enlarged, accurate positioning of the substrate on the different processing equipment is ensured and a problem of dislocation caused by dimension inconsistency between the same substrate and substrate brackets of the different processing equipment can be solved.
Description
Technical Field
The invention belongs to the technical field of manufacturing of flat panel display equipment, and particularly relates to a substrate fixing device for fixing a substrate in process equipment in the manufacturing process of the display equipment, a method for fixing the substrate, and a manufacturing method of the substrate fixing device.
Background
The Organic electroluminescent device is also called an Organic light emitting Diode (OLED for short), and is a novel flat panel display device, and compared with a liquid crystal display device, the OLED has many advantages of active light emission, low driving voltage, low power consumption, high light emitting brightness and efficiency, ultra-thinness, simple manufacturing process, easy realization of full-color flat panel display and flexible display, wide viewing angle, wide working temperature range, and the like, and is considered as a new application technology of a next-generation flat panel display.
Since the discovery of the light emitting principle of organic electroluminescent devices in 1979 by doctor c.w.tang, countries around the world have been devoted to research and application thereof with a great deal of manpower and material resources. At present, the OLED technology in China is in the coexistence stage of laboratory research and development and pilot-scale development vector product conversion, wherein the research and development achievements in laboratory research and development and the experimental results in pilot-scale development play a crucial role in the quality of mass-produced products, so that on one hand, the product performance of the OLED is continuously improved, and on the other hand, the OLED is required to be produced in batch, which requires that OLED manufacturing equipment can be standardized to further reduce the cost. In order to fully utilize the advantages of enterprises, schools, scientific research units and other different environments and resources, the industries and research circles carry out wide technical cooperation.
The OLED display device is classified into an active driving mode (AMOLED) and a passive driving mode (PMOLED), in the manufacturing of the OLED display device, a substrate is used as a carrier of all components and is processed in a flowing mode in the whole manufacturing flow, and the manufacturing of the OLED display device of the AMOLED mode or the PMOLED mode involves three major steps of substrate preparation, evaporation, packaging and the like. In the experimental process of laboratory research and pilot-scale development, the number of manufactured OLED display device samples of each cooperative unit is small, and the substrate size has respective specifications to adapt to respective manufacturing equipment.
For example, in the substrate preparation step, the PMOLED display device only uses the photolithography process and the corresponding device; the AMOLED display device integrates a group of Thin Film Transistors (TFTs) and storage capacitors for each pixel on a substrate, and the entire system of the peripheral driving circuit and the display array is integrated on the same substrate, so that the AMOLED display device not only uses a photolithography process, but also involves various processes such as Film formation, exposure, and etching, and various devices, so that the AMOLED display device requires more devices and requires higher precision in device processes than the PMOLED display device. In actual production and manufacturing, substrates need to be fixed in process equipment of different processes such as a film forming device, an exposure device, an etching device and the like for processing, the substrate fixing of the devices is realized through substrate brackets (used for accommodating and supporting the substrates) of different process equipment, and because the sizes of the substrates of different models are different, in a certain process equipment, only one or a limited number of substrate brackets are adopted, and in the process of processing the substrates of different models, sometimes the substrates cannot be fixed on the substrate brackets of the process equipment because the sizes of the substrates are too small (relative to the substrate brackets). Meanwhile, since the sizes of different substrate brackets in different processes may have a large difference, when a substrate of a certain type is processed, a certain type of substrate may be adapted to the size of the substrate bracket used in the process in some processes, but may not be adapted to the size of the substrate bracket used in the process in other processes, and when the size of the substrate is not adapted to the size of the substrate bracket, the fixing effect of the substrate in the process equipment is not good, or even the substrate may not be fixed in the process equipment, thereby affecting the processing quality of the substrate. In addition, there are also size differences between the devices in the respective cooperating units in the research and development, and these differences directly result in large differences between the sizes of the different substrate carriers of the different process devices, especially the differences between the sizes of the substrate carriers in the substrate preparation device in the AMOLED mode and the sizes of the substrate carriers in the substrate preparation device in the PMOLED mode are larger, and these devices are expensive, and the cost of replacing the devices is too high for laboratory research and development and pilot-scale development of experimental samples with small substrate manufacturing quantities. With the enhancement of the cooperation between research and development and the industrial field, the connection of the same substrate between different process equipment becomes more important, so that the problem of difficult fixing of the same substrate between different equipment due to the inconsistent sizes of substrate brackets between different process equipment is more prominent, and the factors further obstruct the communication and improvement of the development process of the OLED display equipment, so that the bottleneck of the transplantation and cooperation of the technology is caused.
Disclosure of Invention
The invention aims to solve the technical problem that in the manufacturing process of OLED display equipment in the prior art, the same substrate is difficult to fix or can not be fixed due to the fact that the sizes of process equipment substrate brackets are different between different process equipment, and provides a substrate fixing device which can effectively fix and accurately align any type of substrate on the substrate brackets with different sizes of different process equipment, a method for fixing the substrate in the process equipment by adopting the substrate fixing device, and a manufacturing method of the substrate fixing device.
In order to solve the technical problems of the present invention, a preferred technical solution is the substrate fixing device for fixing a substrate in a process equipment, wherein a substrate accommodating groove is formed in an upper surface of the substrate fixing device to fix the substrate, and the substrate fixing device has an outer dimension set to be capable of being fixed on the process equipment.
Preferably, the substrate fixing device is provided with a process alignment point corresponding to the optical alignment point on the substrate.
It is further preferred that the length, width and depth of the substrate accommodating groove are adapted to the length, width and height of the substrate fixed by the substrate accommodating groove.
Another preferred technical scheme is that the substrate fixing device comprises a positioning plate and a processing matching unit, wherein a substrate accommodating groove is formed in the upper surface of the positioning plate to fix the substrate, and the substrate is connected with the substrate fixing device through the processing matching unit; the processing matching unit comprises a positioning protrusion and a positioning groove matched with the positioning protrusion.
Preferably, the depth of the substrate accommodating groove in the positioning plate is matched with the height of the substrate fixed by the positioning plate.
Preferably, the positioning protrusion is arranged in the substrate accommodating groove of the positioning plate and corresponds to the positioning groove on the bottom surface of the substrate; or the positioning groove is arranged in the substrate accommodating groove of the positioning plate and corresponds to the position of the positioning bulge on the bottom surface of the substrate.
More preferably, the positioning protrusion has a pointed shape, a square shape or a conical shape, and the positioning groove has a pointed shape, a square shape or a conical shape that fits the positioning protrusion.
Meanwhile, the substrate fixing devices in the two preferred technical schemes are preferably made of transparent materials.
A method for fixing a substrate by adopting any one of the above technical schemes comprises the following steps:
1) fixing a substrate in a substrate accommodating groove in the substrate fixing device;
2) fixing the substrate fixing device with the substrate on a substrate bracket of the processing equipment;
or,
1) fixing the substrate fixing device on a substrate bracket of the process equipment;
2) and fixing the substrate in the substrate accommodating groove in the substrate fixing device, so that the substrate is fixed in the processing equipment.
Preferably, the method of fixing a substrate further includes corresponding a process alignment point in the substrate fixing device to an optical alignment point on the substrate.
Further preferably, the fixing of the substrate in the substrate accommodating groove in the substrate fixing device further includes: putting a viscous substance between the substrate fixing device and the substrate to bond and fix the substrate fixing device and the substrate; and/or the presence of a gas in the gas,
when the substrate fixing apparatus includes the positioning plate and the process fitting unit, the method further includes: the positioning groove and the positioning protrusion are matched in an alignment way, so that the substrate fixing device and the substrate are relatively fixed.
The manufacturing method of the substrate fixing device comprises the following steps:
A) selecting a transparent plate as a substrate fixing device, and cutting the transparent plate to enable the shape and size of the transparent plate to be suitable for the size of a substrate bracket in the process equipment of the process where the substrate is located;
B) a mask plate made of a transparent plate is selected to cover the substrate fixing device, and the mask plate is provided with a substrate accommodating groove mark matched with the outline dimension of the substrate, an optical alignment mark in the area of the substrate accommodating groove mark, a positioning mark having a fixed position relation with the optical alignment mark, and a process alignment mark outside the area of the substrate accommodating groove mark;
C) manufacturing process contraposition points on the substrate fixing device by using the process contraposition marks on the mask plate;
D) and taking the process alignment point as a base point, and forming a substrate accommodating groove on the upper surface of the substrate fixing device by using a substrate accommodating groove mark on the mask plate, wherein the depth of the substrate accommodating groove is matched with the height of the substrate fixed by the substrate accommodating groove.
The manufacturing method of the substrate fixing device further comprises the following steps:
E) manufacturing a positioning bulge or a positioning groove in the substrate accommodating groove by using a positioning mark on the mask plate;
or,
E) the length and the width of the substrate accommodating groove are matched with those of the substrate fixed by the substrate accommodating groove mark on the mask plate.
The invention has the beneficial effects that: aiming at different substrate brackets in different process equipment, the same substrate is difficult to adapt to the contradiction of various process equipment at the same time, and the substrate fixing device which is suitable for the external dimensions of the substrate brackets of different process equipment and is provided with a substrate accommodating groove suitable for the substrate is manufactured to be used as an intermediate transition piece of the dimension difference between the substrate brackets of different process equipment and the substrate, so that the same substrate is well fixed on the substrate brackets of different process equipment; meanwhile, aiming at the substrates with different specifications and sizes, the substrate fixing device is provided with the substrate containing groove which is suitable for the specifications and sizes of the substrates, so that the substrates with different specifications and sizes can be well fixed on the same substrate bracket of the same equipment. Therefore, the purpose of fixing the substrates with different specifications and sizes in different process equipment can be conveniently realized by flexibly adjusting the external dimension of the substrate fixing device or the specification and size of the substrate accommodating groove according to the actual use condition, the application range of the process equipment and the substrate is greatly expanded, the accurate positioning of the substrate in different process equipment is ensured, the problem of processing dislocation of the same substrate in different process equipment due to inconsistent substrate bracket size or inconsistent substrate size of different substrates in the same process equipment is solved, the substrate fixing device is particularly suitable for being used in process equipment with the substrate bracket size larger than the processed substrate size, and is particularly suitable for being matched and connected among different process equipment when the same substrate is in a laboratory research and development stage and a pilot test stage.
Drawings
FIG. 1 is a sectional view of a substrate fitted in a positioning plate in embodiment 1 of the present invention;
FIG. 2 is a schematic structural diagram of the substrate 1 in FIG. 1;
FIG. 3 is a schematic structural view of the positioning plate 2 in FIG. 1;
fig. 4 is a schematic structural diagram of the mask plate 9.
In the figure: 1-a substrate; 2, positioning a plate; 3-positioning the groove; 4-positioning the projection; 5-display device pattern area; 6-process docking site; 7-optical pair site; 8-a localization marker; 9-a mask plate; 10-substrate receiving groove mark; 11-process alignment marking; 12-optical alignment mark; 13-substrate receiving groove.
Detailed Description
In order to make the technical solutions of the present invention better understood, the substrate fixing apparatus, the method for fixing the substrate in the processing equipment, and the method for manufacturing the substrate fixing apparatus according to the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
The basic technical scheme is that the substrate fixing device for fixing the substrate in the process equipment is characterized in that a substrate accommodating groove 13 is formed in the upper surface of the substrate fixing device to fix the substrate, and the substrate fixing device is set to be capable of being fixed on the process equipment in the shape and size.
Generally, the front surface of the substrate 1 is provided with a display device pattern region 5, and the non-display device pattern region of the front surface of the substrate is provided with two or more optical alignment points 7. Correspondingly, the substrate fixing device is provided with a process alignment point 6 corresponding to the optical alignment point 7 on the substrate 1, the process alignment point 6 is generally arranged at a position where the substrate fixing device is not provided with the substrate accommodating groove 13, and two or more process alignment points 6 are adopted.
In addition, the length, width and depth of the substrate accommodating groove 13 are adapted to the length, width and height of the substrate 1 fixed thereto.
Another technical solution is as shown in fig. 1, a substrate fixing device for fixing a substrate 1 in a process equipment includes a positioning plate 2 and a processing matching unit, wherein the positioning plate 2 has an outer dimension set so that it can be fixed on a substrate bracket of the process equipment, a substrate accommodating groove 13 capable of accommodating the substrate 1 is provided on the positioning plate 2, the substrate 1 is fixed in the substrate accommodating groove 13 through the processing matching unit, and the shape of the substrate accommodating groove 13 is adapted to the shape of the substrate 1 accommodated therein.
The depth of the substrate accommodating groove 13 in the positioning plate 2 is matched with the height of the substrate 1 fixed by the positioning plate, so that the surface of the substrate and the surface of the substrate fixing device are in the same horizontal plane, and the processing is facilitated; the length and width of the substrate accommodating groove 13 can be matched with the length and width of the substrate 1 so as to fix the substrate 1 better, and the length and width of the substrate accommodating groove 13 can be slightly larger than the length and width of the substrate 1 so as to be convenient for putting in and taking out the substrate.
Preferably, the processing matching unit comprises a positioning protrusion 4 and a positioning groove 3 matched with the positioning protrusion, the positioning protrusion 4 is arranged in the substrate accommodating groove 13 in the positioning plate 2, and the positioning groove 3 is arranged on the bottom surface of the substrate 1 and corresponds to the positioning protrusion 4; or the positioning protrusion is arranged on the bottom surface of the substrate 1, and the positioning groove is arranged in the substrate accommodating groove of the positioning plate and corresponds to the positioning protrusion. The positioning groove and the positioning bulge adopt two or more matched pairs.
The substrate fixing device is preferably made of transparent materials, so that the observation operation is more convenient, and the alignment precision and the operation precision are improved.
A method for fixing a substrate in process equipment by adopting any one of the substrate fixing devices in the technical scheme comprises the following steps:
1) fixing the substrate 1 in the substrate accommodating groove 13 in the substrate fixing device;
2) fixing the substrate fixing device provided with the substrate 1 on a substrate bracket of the process equipment;
or,
1) fixing the substrate fixing device on a substrate bracket of the process equipment;
2) the substrate 1 is fixed in the substrate accommodating groove 13 in the substrate fixing device, so that the substrate 1 is fixed in the process equipment.
To ensure accurate positioning, the process registration sites 6 in the substrate fixture should correspond to the optical registration sites 7 on the substrate 1.
Meanwhile, in order to ensure stable positioning, fixing the substrate 1 in the substrate accommodating groove of the substrate fixing device further comprises: a viscous substance is put between the substrate fixing device and the substrate 1 to ensure that the substrate fixing device and the substrate 1 are bonded and fixed, and meanwhile, the working procedures can be reduced, and the operation is convenient; and/or, when the substrate positioning device comprising the positioning plate 2 and the processing matching unit is adopted, the fixing of the substrate in the substrate accommodating groove of the substrate fixing device further comprises: the positioning groove and the positioning protrusion are aligned and matched, so that the substrate fixing device and the substrate 1 are relatively fixed. Of course, it should be ensured at this point that the process alignment points 6 in the substrate fixture correspond to the optical alignment points 7 on the substrate 1.
The manufacturing method of the substrate fixing device comprises the following steps:
A) selecting a transparent glass plate with the overall dimension larger than that of the substrate as a substrate fixing device, and cutting the transparent glass plate to ensure that the overall dimension of the substrate fixing device is matched with the dimension of a substrate bracket in the process equipment;
B) a mask plate 9 made of a transparent plate is selected to cover the substrate fixing device, the mask plate 9 is provided with a substrate accommodating groove mark 10 matched with the outline dimension of the substrate 1, an optical alignment mark 12 in the area of the substrate accommodating groove mark 10, a positioning mark 8 in a fixed position relation with the optical alignment mark, and a process alignment mark 11 outside the area of the substrate accommodating groove mark 10;
C) covering a mask plate 9 on the substrate fixing device, and manufacturing a process contraposition point 6 on the substrate fixing device by using a process contraposition mark 11 on the mask plate 9;
in this step, the process pair site 6 on the substrate fixing apparatus may be various, and specifically, may be an evaporation pair site or a sputtering pair site or an ion pair site.
D) And etching a substrate accommodating groove 13 on the substrate fixing device by using the substrate accommodating groove mark 10 on the mask plate 9 with the process opposite point 6 as a base point, wherein the depth of the substrate accommodating groove 13 is matched with the height of the substrate 1 fixed by the substrate accommodating groove 13.
Correspondingly, the manufacturing method of the substrate fixing device further comprises the following steps:
E) in the process of etching the substrate accommodating groove 13, positioning bulges or positioning grooves are formed at corresponding positions in the substrate accommodating groove 13 by using the positioning marks 8 on the mask plate 9;
or,
E) the length and width of the substrate accommodating groove 13 are adapted to the length and width of the substrate 1 fixed to the substrate accommodating groove by using the substrate accommodating groove mark 10 on the mask plate 9.
The manufacturing method of the processing matching unit on the substrate comprises the following steps:
A) covering a mask plate 9 on the substrate 1, and aligning an optical alignment mark 12 on the mask plate 9 with an optical alignment point 7 in a non-display device pattern area on the front surface of the substrate 1;
B) a substrate positioning groove or a positioning protrusion is formed on the bottom surface of the substrate 1 by using the positioning mark 8 on the mask plate 9 with the optical alignment point 7 as a base point.
It should be understood that the mask plate for manufacturing the substrate fixing device and the processing matching unit on the substrate is the same mask plate 9, and the manufacturing of the processing matching unit on the substrate 1 and the manufacturing of the substrate fixing device are independent from each other. The positioning bulge and the positioning groove manufactured by the manufacturing method are directly formed on the corresponding positions of the substrate fixing device and the substrate. Of course, the positioning protrusions and the positioning grooves may be independent and then adhered to the corresponding positions of the substrate fixture and the substrate by adhesive, respectively.
Meanwhile, the manufacturing method of the mask plate 9 used for manufacturing the processing matching unit on the substrate fixing device and the substrate is introduced as follows, which mainly comprises the following steps:
A) selecting a transparent glass plate, and manufacturing a substrate accommodating groove mark 10 on the transparent glass plate according to the external dimension of the substrate 1;
C) manufacturing an optical alignment mark 12 in the area of the substrate accommodating groove mark 10, wherein the optical alignment mark 12 corresponds to the optical alignment point 7 on the front surface of the substrate 1;
D) with the optical alignment mark 12 as a reference, the positioning mark 8 is formed in the area of the substrate accommodating groove mark 10, and the process alignment mark 11 is formed outside the area of the substrate accommodating groove mark 10.
Example 1:
the embodiment has the problems that in the process of preparing the substrate of the OLED display device developed in a laboratory, the outline dimension of the substrate 1 is matched with the dimension of the substrate bracket in the substrate preparation device, so that the substrate 1 can be well fixed on the substrate bracket in the substrate preparation device; however, the size of the substrate holder in the evaporation apparatus is larger than that of the substrate holder in the substrate preparation apparatus, so that the size of the substrate 1 is smaller than that of the substrate holder in the evaporation apparatus, and if the substrate 1 after the substrate preparation process is directly fixed on the substrate holder of the evaporation apparatus, unstable substrate fixation is likely to occur in the evaporation process, so that the evaporation of the display device on the substrate is dislocated, and the processing quality of the substrate 1 is finally affected. By adopting the substrate fixing device, the substrate 1 which finishes the corresponding preparation process from the substrate preparation equipment can be easily suitable for the evaporation equipment of which the substrate bracket size is larger than that of the substrate 1.
As shown in fig. 2, in the present embodiment, at least two optical alignment points 7 are disposed on the front surface of the substrate 1, i.e., the surface of the substrate 1 having the display device pattern region 5, and a display device pattern or a metal electrode pattern can be formed on the front surface of the substrate 1 with the optical alignment points 7 as a base point.
As shown in fig. 3, the substrate fixing apparatus in this embodiment includes a positioning plate 2 and a processing positioning unit, wherein the positioning plate 2 has a shape and size suitable for the substrate bracket of the evaporation apparatus, and a substrate accommodating groove 13 is formed in the positioning plate 2 for accommodating the substrate 1 after the corresponding preparation process is completed in the substrate preparation apparatus. The length, width and depth of the substrate accommodating groove 13 are matched with the length, width and height of the substrate 1, so that the substrate 1 can be just embedded in the substrate accommodating groove 13, and the display device pattern arranged on the substrate 1 is just in the same plane with the part of the positioning plate 2, which is not provided with the substrate accommodating groove. In the present embodiment, the outer shape of the substrate 1 is a rectangular parallelepiped, and thus the shape of the substrate accommodation groove 13 is also a rectangular parallelepiped.
The substrate 1 is fixed in the substrate accommodating groove 13 through the processing matching unit, the processing matching unit comprises a positioning protrusion 4 and a positioning groove 3 matched with the positioning protrusion, in this embodiment, the positioning protrusion 4 is arranged in the substrate accommodating groove 13 in the positioning plate 2, and the positioning groove 3 is arranged on the bottom surface of the substrate 1 and corresponds to the position of the positioning protrusion 4. Wherein, the positioning groove 3 and the positioning bulge 4 adopt two pairs which are matched with each other.
In this embodiment, the positioning protrusion 4 is pointed, and the positioning groove 3 is pointed and matched with the positioning protrusion. The positioning protrusions 4 on the positioning plate 2 are embedded and fixed with the positioning grooves 3 formed in the bottom surface of the substrate 1, so that the positioning plate 2 and the substrate 1 can keep strict fixed positions, and the substrate 1 can be bonded and fixed in the substrate accommodating groove 13 to ensure that the fixation of the positioning plate 2 and the substrate 1 is more stable.
Wherein, the display device pattern area on the front side of the substrate 1 is externally provided with two optical alignment points 7; the positioning plate 2 is provided with two process alignment points 6 at positions where the substrate accommodating grooves are not formed. In this embodiment, the process docking points 6 are evaporation docking points, and the two evaporation docking points are disposed on two sides of the substrate accommodating groove 13. By keeping the optical alignment point 7 on the substrate 1 and the evaporation alignment point on the positioning plate 2 at a relatively fixed distance, the evaporation equipment can ensure that the display device pattern on the substrate 1 can be accurately evaporated after the substrate 1 is fixed in the positioning plate 2 and the positioning plate 2 is fixed on the substrate bracket of the evaporation equipment.
The fabrication of the alignment plate 2 and the fabrication of the alignment grooves 3 and the optical alignment points on the substrate 1 accommodated by the alignment plate can be realized by means of a mask plate 9 shown in fig. 4. In the semiconductor and display device industry, various optical marks and patterns are typically first provided on a mask plate, and then the various optical marks and patterns are mapped onto a substrate or other similar flat panel by exposure, development, etching, and other processes.
In this embodiment, the mask plate 9 is made of special glass, and the chromium metal film is disposed on the surface of the glass, so that various optical marks and patterns can be formed on the mask plate 9 by performing special processing on the chromium metal film. As shown in fig. 4, in the present embodiment, the mask plate 9 is provided with a substrate accommodating groove mark 10, an alignment mark and a positioning mark 8, wherein the alignment mark includes a process alignment mark 11 and an optical alignment mark 12. In practical applications, the substrate receiving groove marks 10 are used for manufacturing the substrate receiving grooves 13 in the positioning plate 2 for receiving the substrate 1, the process alignment marks 11 are used for manufacturing the process alignment points 6 on the positioning plate 2, the optical alignment marks 12 are used for aligning with the optical alignment points 7 on the substrate 1, and the positioning marks 8 are used for manufacturing the positioning grooves 3 on the bottom surface of the substrate 1 and the positioning plate positioning protrusions 4 on the positioning plate 2. The optical marks and patterns can be made on the mask plate 9 in advance according to the actual application.
Because the positioning groove 3 on the bottom surface of the substrate 1, the substrate accommodating groove 13 on the front surface of the positioning plate 2 and the positioning protrusion 4 in the substrate accommodating groove are all made of the same mask plate 9, the positioning position of the positioning plate 2 to the substrate 1 in the process equipment can be ensured to be accurately corresponding.
After the positioning plate 2 is prepared, the substrate 1 can be placed in the substrate accommodating groove 13 in the positioning plate 2, and the positioning groove 3 on the substrate 1 is aligned with the positioning protrusion 4 in the substrate accommodating groove in the positioning plate 2, so that the substrate 1 is accurately aligned and embedded on the positioning plate 2; before the embedding, an adhesive can be coated on the bottom surface of the substrate 1 and the substrate accommodating groove, so that the substrate 1 and the positioning plate 2 are fixed into a whole, and the relative positions of the substrate 1 and the positioning plate 2 are firmly and precisely fixed. Then, the positioning plate 2 with the substrate 1 is fixed on a substrate bracket of the evaporation equipment, and the display device pattern area 5 and the optical alignment point 7 on the front surface of the substrate 1 are fixed with the relative positions of the two oppositely arranged process alignment points 6 on the positioning plate 2, so that the substrate 1 and the metal mask plate for evaporation can be accurately aligned through the process alignment points 6 on the positioning plate 2, the evaporation of organic materials of the display device on the substrate 1 is realized, and the evaporation of the OLED is completed.
In the practical application process, the manufacturing of the positioning plate and the processing matching unit is between the substrate preparation process and the evaporation process, and the specific manufacturing method comprises the following steps:
11) manufacturing a mask plate 9:
A) selecting a glass plate, and manufacturing a substrate accommodating groove mark 10 on the glass plate according to the external dimension of the substrate 1;
B) manufacturing an optical alignment mark 12 in the area of the substrate accommodating groove mark 10, wherein the optical alignment mark 12 corresponds to the optical alignment point 7 on the substrate 1;
C) taking the optical alignment mark 12 as a reference, manufacturing a positioning mark 8 in the area of the substrate accommodating groove mark 10, and manufacturing a process alignment mark 11 outside the area of the substrate accommodating groove mark 10, wherein the process alignment mark 11 corresponds to the process alignment point 6 on the substrate fixing device, and the process alignment mark 11 is an evaporation alignment mark in the embodiment;
12) the machining engagement unit is directly formed on the substrate 1:
A) after the substrate preparation process is completed, the side of the substrate 1 on which the display device pattern is disposed is the front side, and the front side of the substrate 1 is also provided with the optical alignment points 7. In the present embodiment, the display device in the substrate 1 is an OLED, and the display device pattern in the display device pattern region 5 on the front surface of the substrate 1 includes OLED electrodes and their wiring patterns;
B) a mask plate 9 is covered on a substrate 1, an optical alignment mark 12 on the mask plate 9 is aligned with an optical alignment point 7 on the front surface of the substrate 1, and a positioning groove 3 is formed on the bottom surface of the substrate 1 by using a positioning mark 8 on the mask plate 9 with the optical alignment point 7 as a base point. In the present embodiment, the substrate positioning groove 3 is pointed. The base plate is made of glass and has perspective property, so that the pointed positioning groove 3 can be easily manufactured at the corresponding position on the bottom surface of the base plate 1 by etching or sand blasting and other processes;
13) manufacturing a positioning plate, and directly forming a processing matching unit on the positioning plate:
A) a glass plate with the overall dimension larger than that of the substrate 1 is selected as a positioning plate 2, and the positioning plate is cut to enable the overall dimension to be matched with that of a substrate bracket in the substrate of the evaporation equipment. In the present embodiment, the positioning plate 2 has a rectangular parallelepiped shape;
B) the positioning plate 2 is covered with a mask plate 9, the process alignment points 6 are manufactured on the positioning plate 2 by using the process alignment marks 11 on the mask plate 9, the process alignment points 6 can be different in shape and size, and the process alignment points 6 are formed by covering the mask plate 9 on the positioning plate 2 and performing exposure, development, etching and other steps. In this embodiment, the process docking point 6 is an evaporation docking point;
C) by taking the process alignment point 6 as a base point, etching a substrate accommodating groove 13 on the positioning plate 2 by using the substrate accommodating groove mark 10 on the mask plate 9, wherein the shape and the size of the formed substrate accommodating groove 13 are matched with those of the substrate 1, and the depth of the substrate accommodating groove 13 can be controlled by the concentration and the etching time of the etching liquid;
D) in the process of etching the accommodating groove, the positioning mark 8 on the mask plate 9 is utilized to form a pointed positioning protrusion 4 at a corresponding position in the substrate accommodating groove 13 in the positioning plate 2, and the positioning protrusion 4 can be formed by etching or sand blasting and other processes.
The mask plates in the steps 12) and 13) are the same mask plate 9. The step 12) is mainly related to the manufacture of the processing matching unit on the substrate 1, namely, the step is mainly used for manufacturing the positioning groove 3; the step 13) is mainly related to the manufacturing of the positioning plate 2 and the manufacturing of the processing matching unit on the positioning plate 2, namely, the step is mainly used for manufacturing the evaporation contraposition point, the substrate accommodating groove 13 and the positioning protrusion 4 in the positioning plate. The above-described processing of the substrate 1 and the processing of the positioning plate 2 are independent from each other, and in actual operation, the processing may be performed in the order of steps 11), 12), 13), or 11), 13), 12).
When the positioning plate in the embodiment is used for fixing the substrate 1 in the evaporation equipment, the substrate 1 is firstly placed in the substrate accommodating groove 13 in the positioning plate 2, the pointed positioning groove 3 on the substrate 1 is embedded with the pointed positioning protrusion 4 on the positioning plate 2, so that the substrate 1 and the positioning plate 2 are accurately positioned and firmly bonded, and at the moment, the optical alignment point 7 on the substrate 1 and the process alignment point 6 on the positioning plate 2 are accurately positioned, so that the patterns of the display device on the substrate 1 and the process alignment point 6 on the positioning plate 2 are accurately positioned; then the positioning plate 2 with the substrate 1 is fixed on a substrate bracket of the evaporation equipment, and then the substrate 1 is subjected to evaporation treatment according to a normal flow.
Example 2:
the present embodiment is different from embodiment 1 in that the substrate holder in the vapor deposition apparatus is circular, and therefore the positioning plate 2 has a circular outer shape corresponding to the substrate holder in the vapor deposition apparatus, and the positioning recesses 3 on the substrate 1 and the positioning protrusions 4 on the positioning plate 2 have a conical shape corresponding to each other.
Other structures and manufacturing processes in this embodiment are the same as those in embodiment 1, and are not described herein again.
It should be understood that the shapes of the positioning groove 3 and the positioning protrusion 4 are not limited to the shapes listed in the above embodiments, and any mutually-matched shapes that can combine the substrate and the positioning plate and facilitate the handling are included in the scope of the present invention.
Meanwhile, it should be understood that the shape of the substrate 1 and the shape of the substrate accommodating groove 13 in the present invention are not limited to the shapes described in the above embodiments; the outer shape of the aligning plates 2 is not limited to the shape described in the above embodiments, and any combination of the shape and size of the substrate accommodating grooves 13 adapted to the shape and size of the substrate 1 and the outer shape and size of the aligning plates 2 adapted to the shape and size of the substrate holder is included in the scope of the present invention. At this time, a mask plate suitable for the substrate bracket is manufactured according to the shape and the size of the substrate and the shape and the size of the device substrate bracket, and a corresponding positioning plate, a substrate accommodating groove for matching the positioning plate with the substrate and a processing matching unit are manufactured. For example: the process equipment in the substrate preparation is a circular substrate bracket, the substrate is circular, and the substrate accommodating groove in the positioning plate is circular and has a size determined according to the size of the substrate; and the technological equipment in the evaporation equipment is a circular substrate bracket, the shape of the positioning plate is set to be circular, and the size of the positioning plate is determined according to the size of the substrate bracket in the evaporation equipment. In practical application, a user can design different mask plates according to specific conditions of the substrate and the process equipment substrate bracket to manufacture the positioning plate and arrange the matched processing and matching unit on the substrate.
The substrate in the embodiment 1 and the embodiment 2 is accurately positioned in the positioning plate through the positioning plate and the corresponding processing matching unit, and then the positioning plate is placed on the substrate bracket of the evaporation equipment, so that the substrate is accurately positioned in the subsequent large-size evaporation equipment, the application range of the evaporation equipment to different substrates is expanded, the purpose of accurately evaporating organic materials and metal electrodes of a display device on the substrate in the evaporation equipment is realized, the problem of positioning dislocation of the display device caused by the fact that the size of the substrate bracket of the same substrate is inconsistent in different process equipment (such as substrate preparation equipment and evaporation equipment) in the OLED preparation process, particularly in the active drive type OLED display preparation process is solved, and the OLED display device is high in operability, low in equipment investment and low in cost.
Of course, it should be understood that the substrate fixing device of the present invention is not only suitable for the switching connection of the same substrate between different processing equipments in the substrate preparation process of the OLED display device, but also suitable for any other processing equipment with limited substrate size, that is, when only one size of substrate is allowed to be fixed in the equipment, the substrate fixing device can be used to expand the size range of the substrate that can be fixed, for example: in the manufacturing process of the liquid crystal display substrate, when the size of the substrate which can be supported by the substrate bracket in the sputtering equipment for sputtering the thin film is different from the size of the substrate which can be supported by the substrate bracket in the ion implantation equipment for ion implantation, the substrate fixing device can be adopted to ensure that the same substrate can be simultaneously adapted to the process equipment with the different sizes of the two substrate brackets, thereby expanding the application range of the sputtering equipment and the ion implantation equipment.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (2)
1. A method of fixing a substrate in a process equipment, characterized in that a substrate fixing device is used, which comprises a positioning plate (2), wherein a substrate receiving groove (13) is provided on the upper surface of the positioning plate (2) to fix the substrate (1), and the substrate (1) is connected with the positioning plate (2) via a positioning protrusion and a positioning groove adapted to the positioning protrusion; the method for fixing the substrate comprises the following steps:
1) fixing a substrate (1) in a substrate accommodating groove (13) in the substrate fixing device, so that a process alignment point (6) in the substrate fixing device corresponds to an optical alignment point (7) on the substrate (1);
2) a viscous substance is put between the substrate fixing device and the substrate (1), so that the positioning groove and the positioning bulge are in contraposition fit, the substrate fixing device and the substrate (1) are relatively fixed, and the substrate fixing device and the substrate (1) are bonded and fixed;
3) fixing a substrate fixing device provided with a substrate (1) on a substrate bracket of process equipment, wherein the external dimension of the substrate fixing device is set to enable the substrate fixing device to be fixed on the process equipment;
or,
1) fixing the substrate fixing device on a substrate bracket of the process equipment, wherein the substrate fixing device is provided with an external dimension which can be fixed on the process equipment;
2) fixing a substrate (1) in a substrate accommodating groove (13) in the substrate fixing device, so that a process alignment point (6) in the substrate fixing device corresponds to an optical alignment point (7) on the substrate (1);
3) a viscous substance is put between the substrate fixing device and the substrate (1), so that the positioning groove and the positioning bulge are in contraposition fit, the substrate fixing device and the substrate (1) are relatively fixed, and the substrate fixing device and the substrate (1) are bonded and fixed;
wherein: the manufacturing method of the substrate fixing device comprises the following steps:
A) selecting a transparent plate as a substrate fixing device, and cutting the transparent plate to enable the shape and size of the transparent plate to be suitable for the size of a substrate bracket in the process equipment of the process of the substrate (1);
B) a mask plate (9) made of a transparent plate is selected to cover the substrate fixing device, and the mask plate (9) is provided with a substrate accommodating groove mark (10) matched with the outline dimension of the substrate (1), an optical alignment mark (12) in the area of the substrate accommodating groove mark (10), a positioning mark (8) having a fixed position relation with the optical alignment mark (12), and a process alignment mark (11) outside the area of the substrate accommodating groove mark (10);
C) manufacturing a process contraposition point (6) on the substrate fixing device by using a process contraposition mark (11) on a mask plate (9);
D) and (3) taking the process alignment point (6) as a base point, and forming a substrate accommodating groove (13) on the upper surface of the substrate fixing device by utilizing a substrate accommodating groove mark (10) on the mask plate (9), wherein the depth of the substrate accommodating groove (13) is matched with the height of the substrate (1) fixed by the substrate accommodating groove.
2. The method of claim 1, wherein the method of fabricating the substrate fixture further comprises:
E) positioning bulges or positioning grooves are manufactured in the substrate accommodating groove by utilizing positioning marks (8) on a mask plate (9);
or,
E) the length and the width of the substrate accommodating groove (13) are matched with the length and the width of the substrate (1) fixed by the substrate accommodating groove mark (10) on the mask plate (9).
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| CN201110319335.6A CN102629567B (en) | 2011-10-19 | 2011-10-19 | Substrate fixing device and manufacturing method thereof and method for fixing substrate |
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| CN201110319335.6A CN102629567B (en) | 2011-10-19 | 2011-10-19 | Substrate fixing device and manufacturing method thereof and method for fixing substrate |
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| CN102629567A CN102629567A (en) | 2012-08-08 |
| CN102629567B true CN102629567B (en) | 2015-06-24 |
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Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103852241B (en) * | 2012-11-30 | 2016-12-21 | 中国科学院光电研究院 | A kind of vee-block position shifter |
| CN103805962B (en) * | 2014-03-06 | 2016-03-02 | 上海华虹宏力半导体制造有限公司 | Chip position truing tool and calibration steps, chemical vapour deposition reaction chamber |
| CN105296957B (en) * | 2014-06-04 | 2019-01-18 | 北京北方华创微电子装备有限公司 | A kind of reaction chamber |
| CN104561892B (en) * | 2014-12-04 | 2016-11-23 | 深圳市华星光电技术有限公司 | OLED material vacuum thermal evaporation mask plate |
| CN104726839B (en) | 2015-03-27 | 2017-06-16 | 京东方科技集团股份有限公司 | Apparatus for fixing substrate |
| JP6771092B2 (en) * | 2017-03-30 | 2020-10-21 | 本田技研工業株式会社 | Headlight device for saddle-mounted vehicles |
| CN110048026B (en) * | 2018-01-17 | 2022-09-30 | 视涯科技股份有限公司 | OLED panel manufacturing system and device for forming temporary matching unit |
| CN109023234B (en) * | 2018-08-09 | 2020-08-28 | 深圳市华星光电半导体显示技术有限公司 | Mask plate replacing device and replacing method |
| CN115377177A (en) * | 2022-09-30 | 2022-11-22 | 京东方科技集团股份有限公司 | A display device and its manufacturing method |
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| US20100225011A1 (en) * | 2009-03-06 | 2010-09-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | System and Method for Integrated Circuit Fabrication |
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