CN102625591A - Method for manufacturing solder mask of unit plate by using electrostatic spray coating machine - Google Patents
Method for manufacturing solder mask of unit plate by using electrostatic spray coating machine Download PDFInfo
- Publication number
- CN102625591A CN102625591A CN2012100926684A CN201210092668A CN102625591A CN 102625591 A CN102625591 A CN 102625591A CN 2012100926684 A CN2012100926684 A CN 2012100926684A CN 201210092668 A CN201210092668 A CN 201210092668A CN 102625591 A CN102625591 A CN 102625591A
- Authority
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- China
- Prior art keywords
- cell board
- solder mask
- framework
- inside casing
- making
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 50
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 238000005507 spraying Methods 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 title claims abstract description 10
- 239000002390 adhesive tape Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 238000003384 imaging method Methods 0.000 claims description 4
- 238000005554 pickling Methods 0.000 claims description 4
- 238000002203 pretreatment Methods 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 238000007639 printing Methods 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 3
- 230000005611 electricity Effects 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract description 3
- 239000002699 waste material Substances 0.000 abstract description 3
- 239000000976 ink Substances 0.000 description 12
- 238000005516 engineering process Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
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- Screen Printers (AREA)
Abstract
The invention discloses a method for manufacturing a solder mask of a unit plate by using an electrostatic spray coating machine. A frame is manufactured, an inner frame with same shape and size of the unit plate is arranged on the frame and is used for fixing the unit plate, and a clamping force to the frame is formed by the electrostatic spray coating machine, so that the problems of easily scratched plate surface and ink tightness caused by the direct contact between a clamp and the unit plate are avoided. Compared with the prior art, the method provided by the invention has the advantages: printing ink cannot enter into a hole because the printing ink of the electrostatic spray coating machine has negative electricity and achieves an electrostatic shielding effect while acting on the hole, the production quality is ensured, the operation in such a manner is convenient, the complex operations, such as manual net filling, 'hand pushing' silk printing, are omitted, and the production efficiency is increased. The frame is used for preventing labor from directly contacting the surface of the unit plate, so that the quality of product is ensured and the unnecessary material waste is avoided.
Description
Technical field:
The invention belongs to the printed wiring board manufacture technology field, what be specifically related to is a kind of method of making the cell board solder mask through electrostatic sprayer, is mainly used in wiring board and completes the back because of the solder mask problem, the process modification that need do over again to solder mask.
Background technology:
When wiring board is made; All be earlier one or more cell board to be pieced together a big plate to carry out each operation making; At last in " moulding " operation with the invalid edges of boards mill off on the big plate; Thereby form needed cell board, be designed with the needed edges of boards figure of various operations on the invalid edges of boards of usually big plate, utilize these figures can accomplish the location work of exposure, boring, pressing and resistance welder preface.When finding after the moulding that there is resistance weldering problem in cell board, then need be to the solder mask processing of doing over again.
Do over again because of resistance weldering problem for cell board at present and carry out the mode that solder mask is made, mainly adopt silk-screen resistance weldering, the cell board that this mode is at first done over again needs is positioned on the machine deck, uses the screen frame ink for screen printing then.This mode can only be carried out through the mode of artificial hand push; Resistance solder paste China ink evenly is coated on the plate face of cell board through the silk-screen half tone, and its troublesome poeration is had relatively high expectations to operating personnel; Cause cell board plate face printing ink to wipe flower easily; But also can cause half tone to break, ink plugging but the problem of oil increases cost of manufacture.
Summary of the invention:
In view of this; The object of the present invention is to provide a kind of method of making the cell board solder mask through electrostatic sprayer; Do over again when making to solve present cell board solder mask, the troublesome poeration of existence and cost height, the easy consent of printing ink, plate face are prone to wipe colored and wet goods quality problem only.
For realizing above-mentioned purpose, the present invention mainly adopts following technical scheme:
A kind of method of making the cell board solder mask through electrostatic sprayer comprises step:
S1, making are used for fixing the framework of cell board, are provided with inside casing identical with the cell board shape, of the same size in this framework;
S2, the cell board that will make solder mask place the inside casing of framework respectively according to correspondingly-shaped and size, fix;
S3, the framework that will be fixed with cell board place electrostatic sprayer, carry out the single face spraying, make cell board simultaneously form solder mask;
S4, take off the said units plate, it is carried out exposure imaging, keep 150 ℃ afterwards, toasted 20 minutes, above-mentioned solder mask is solidified, take out then;
S5, cell board is carried out the pickling pre-treatment, then it has been made forming one of solder mask and face down, place the inside casing of framework, fix;
S6, framework is placed electrostatic sprayer, carry out the single face spraying, make the another side of cell board form solder mask;
S7, the said units board to explosure is developed, keep 150 ℃ afterwards, toast 60 minutes, above-mentioned solder mask is solidified, take out the making of completion cell board solder mask then.
Preferably, said framework both sides are provided with the clamping zone that supplies electrostatic sprayer clip fixed clamp and width to be not less than 1.5cm, have Copper Foil on the said clamping zone.
Preferably, among the step S1: inside casing is at least one in the said framework, and said inside casing is identical with the cell board shape, the size consistent.
Preferably, step S2 specifically comprises:
The cell board of needs being made solder mask places the inside casing of framework respectively according to correspondingly-shaped and size, and bonds together through non-spraying face and the framework of adhesive tape with cell board, and the spraying face of making belongs to the plane with framework and flushes.
Preferably, step S5 specifically comprises:
Cell board has been made one of formation solder mask faced down, placed the inside casing of framework, and this face and framework are adhesively fixed together, and cell board another side and plane, framework place are flushed through adhesive tape.
The present invention is through making a framework; And on framework, offer inside casing identical with the cell board shape, of the same size; Be used for fixing cell board, make electrostatic sprayer form chucking power, avoid the direct plate face that causes that contacts with cell board of clip to be prone to wipe flower and only oily problem framework.Compared with prior art, because electrostatic sprayer ink band negative electricity of the present invention, when acting on the hole; Can form the electrostatic screen effect; So printing ink can hand-hole, has guaranteed the production quality, this mode is easy to operate simultaneously; Save troublesome operation such as people's frock net, " hand push " silk-screen, improved production efficiency; And the use framework, can avoid artificial directly osculating element plate face, guarantee product quality, and avoided unnecessary material waste.
Description of drawings:
Fig. 1 is the structural representation of framework of the present invention.
Fig. 2 is the structural representation of fixed cell plate in the framework of the present invention.
Fig. 3 is a process chart of the present invention.
Identifier declaration among the figure: framework 1, inside casing 2, clamping zone 3, cell board 4.
Embodiment:
For setting forth thought of the present invention and purpose, will combine accompanying drawing and specific embodiment that the present invention is done further explanation below.
See also Fig. 1, Fig. 2, shown in Figure 3, Fig. 1 is the structural representation of framework of the present invention; Fig. 2 is the structural representation of fixed cell plate in the framework of the present invention; Fig. 3 is a process chart of the present invention.The present invention is to provide a kind of method of making the cell board solder mask through electrostatic sprayer; Be mainly used in to solve and adopt the silk-screen half tone to hinder the troublesome poeration that the solder paste ink print exists at present, cost is high, operating personnel are had relatively high expectations and cause cell board plate face printing ink to wipe the problem of flower, ink plugging easily.
Wherein should specifically include following steps through the method for electrostatic sprayer making cell board solder mask:
S1, making are used for fixing the framework of cell board, are provided with inside casing identical with the cell board shape, of the same size in this framework;
Framework as shown in Figure 1; Be provided with one or more inside casings 2 in this framework 1; The shape of these inside casings 2 can be identical, also can be inequality, like rectangle, circle or other shapes etc.; But the shape of inside casing 2 must be with to carry out the cell board shape that solder mask does over again consistent, so that cell board can be put into inside casing 2 smoothly.
S2, the cell board that will make solder mask place the inside casing of framework respectively according to correspondingly-shaped and size, fix;
As shown in Figure 2; The cell board 4 that at first will make solder mask places the inside casing 2 of framework 1 respectively according to correspondingly-shaped and size; And bond together, and make and need the one side of spraying to flush with plane, framework 1 place through the non-spraying face and the framework of adhesive tape with cell board.
S3, the inside casing that will be fixed with cell board place electrostatic sprayer, carry out the single face spraying, make cell board simultaneously form solder mask;
Wherein grasp the clamping zone 3 of framework 1 both sides through the clip correspondence of electrostatic sprayer, and clip do not contact with cell board 4, then according to carrying out the single face spraying with the thick spray parameters that is complementary of substrate copper, and only spraying does not have the one side of jointing tape.
S4, take off the said units plate, it is carried out exposure imaging, keep 150 ℃ afterwards, toasted 20 minutes, above-mentioned solder mask is solidified, take out then;
After the single face spraying was accomplished, the adhesive tape of tearing and pasting took off cell board, then this cell board is carried out exposure imaging, keeps 150 ℃ afterwards, toasts 20 minutes, and above-mentioned solder mask is solidified.
S5, at first cell board is carried out the pickling pre-treatment, then it has been made forming one of solder mask and face down, place the inside casing of framework, fix;
Cell board is carried out the pickling pre-treatment, then cell board has been made one of formation solder mask and faced down, place the inside casing of framework, and this face and framework are adhesively fixed together, and cell board another side and plane, framework place are flushed through adhesive tape.
S6, framework is placed electrostatic sprayer, carry out the single face spraying, make the another side of cell board form solder mask;
S7, the said units board to explosure is developed, keep 150 ℃ afterwards, toast 60 minutes, above-mentioned solder mask is solidified, take out the making of completion cell board solder mask then.
Electrostatic sprayer ink band negative electricity of the present invention when acting on the hole, can form the electrostatic screen effect; So printing ink can hand-hole, therefore guaranteed the production quality, the present invention simultaneously is easy to operate; Save troublesome operation such as people's frock net, " hand push " silk-screen, improved production efficiency; And framework used in the present invention can be directly be milled later through big plate invalid edges and directly formed, and can avoid artificial directly osculating element plate face, guaranteed product quality, avoided unnecessary material waste.
More than be that a kind of method through electrostatic sprayer making cell board solder mask provided by the present invention has been carried out detailed introduction; Used concrete example among this paper structural principle of the present invention and execution mode are set forth, above embodiment just is used for helping to understand method of the present invention and core concept thereof; Simultaneously, for one of ordinary skill in the art, according to thought of the present invention, the part that on embodiment and range of application, all can change, in sum, this description should not be construed as limitation of the present invention.
Claims (5)
1. one kind is passed through the method that electrostatic sprayer is made the cell board solder mask, it is characterized in that comprising step:
S1, making are used for fixing the framework of cell board, are provided with inside casing identical with the cell board shape, of the same size in this framework;
S2, the cell board that will make solder mask place the inside casing of framework respectively according to correspondingly-shaped and size, fix;
S3, the framework that will be fixed with cell board place electrostatic sprayer, carry out the single face spraying, make cell board simultaneously form solder mask;
S4, take off the said units plate, it is carried out exposure imaging, keep 150 ℃ afterwards, toasted 20 minutes, above-mentioned solder mask is solidified, take out then;
S5, cell board is carried out the pickling pre-treatment, then it has been made forming one of solder mask and face down, place the inside casing of framework, fix;
S6, framework is placed electrostatic sprayer, carry out the single face spraying, make the another side of cell board form solder mask;
S7, the said units board to explosure is developed, keep 150 ℃ afterwards, toast 60 minutes, above-mentioned solder mask is solidified, take out the making of completion cell board solder mask then.
2. method of making the cell board solder mask through electrostatic sprayer according to claim 1; It is characterized in that said framework both sides are provided with the clamping zone that supplies electrostatic sprayer clip fixed clamp and width to be not less than 1.5cm, have Copper Foil on the said clamping zone.
3. method of making the cell board solder mask through electrostatic sprayer according to claim 1, it is characterized in that among the step S1: inside casing is at least one in the said framework, and said inside casing is identical with the cell board shape, the size consistent.
4. method of making the cell board solder mask through electrostatic sprayer according to claim 1 is characterized in that step S2 specifically comprises:
The cell board of needs being made solder mask places the inside casing of framework respectively according to correspondingly-shaped and size, and bonds together through non-spraying face and the framework of adhesive tape with cell board, and the spraying face of making belongs to the plane with framework and flushes.
5. method of making the cell board solder mask through electrostatic sprayer according to claim 1 is characterized in that step S5 specifically comprises:
Cell board has been made one of formation solder mask faced down, placed the inside casing of framework, and this face and framework are adhesively fixed together, and cell board another side and plane, framework place are flushed through adhesive tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210092668.4A CN102625591B (en) | 2012-03-31 | 2012-03-31 | Method for manufacturing solder mask of unit plate by using electrostatic spray coating machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210092668.4A CN102625591B (en) | 2012-03-31 | 2012-03-31 | Method for manufacturing solder mask of unit plate by using electrostatic spray coating machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102625591A true CN102625591A (en) | 2012-08-01 |
| CN102625591B CN102625591B (en) | 2014-09-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210092668.4A Expired - Fee Related CN102625591B (en) | 2012-03-31 | 2012-03-31 | Method for manufacturing solder mask of unit plate by using electrostatic spray coating machine |
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| Country | Link |
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| CN (1) | CN102625591B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105101660A (en) * | 2014-05-09 | 2015-11-25 | 深圳崇达多层线路板有限公司 | Large-size backboard solder mask manufacturing method |
| CN106142874A (en) * | 2016-06-23 | 2016-11-23 | 江门崇达电路技术有限公司 | The method of circuit board silk-screen indigo plant glue |
| CN108668460A (en) * | 2017-03-29 | 2018-10-16 | 北大方正集团有限公司 | Circuit board solder resist processing method and circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101765298A (en) * | 2010-01-04 | 2010-06-30 | 深南电路有限公司 | Processing technology of printed circuit board |
| CN102098878A (en) * | 2009-12-09 | 2011-06-15 | 深南电路有限公司 | Printed circuit board (PCB) spraying fixture |
| CN101959372B (en) * | 2010-05-24 | 2012-03-14 | 大连太平洋多层线路板有限公司 | Super-thick copper circuit board solder resisting processing method |
-
2012
- 2012-03-31 CN CN201210092668.4A patent/CN102625591B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102098878A (en) * | 2009-12-09 | 2011-06-15 | 深南电路有限公司 | Printed circuit board (PCB) spraying fixture |
| CN101765298A (en) * | 2010-01-04 | 2010-06-30 | 深南电路有限公司 | Processing technology of printed circuit board |
| CN101959372B (en) * | 2010-05-24 | 2012-03-14 | 大连太平洋多层线路板有限公司 | Super-thick copper circuit board solder resisting processing method |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105101660A (en) * | 2014-05-09 | 2015-11-25 | 深圳崇达多层线路板有限公司 | Large-size backboard solder mask manufacturing method |
| CN105101660B (en) * | 2014-05-09 | 2018-05-11 | 深圳崇达多层线路板有限公司 | A kind of large scale backboard solder-resisting manufacturing methods |
| CN106142874A (en) * | 2016-06-23 | 2016-11-23 | 江门崇达电路技术有限公司 | The method of circuit board silk-screen indigo plant glue |
| CN108668460A (en) * | 2017-03-29 | 2018-10-16 | 北大方正集团有限公司 | Circuit board solder resist processing method and circuit board |
| CN108668460B (en) * | 2017-03-29 | 2020-06-23 | 北大方正集团有限公司 | Circuit board solder mask processing method and circuit board |
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| Publication number | Publication date |
|---|---|
| CN102625591B (en) | 2014-09-03 |
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Granted publication date: 20140903 Termination date: 20200331 |