CN102622143A - Touch panel - Google Patents

Abstract

The invention discloses a touch panel, which comprises a substrate, a first patterned conductive layer and a second patterned conductive layer. The substrate is provided with an upper surface, a first sensing area, a first circuit bonding area and a lower surface opposite to the upper surface, wherein the first sensing area and the first circuit bonding area are positioned on the upper surface. The first patterned conductive layer is disposed on the upper surface, and the second patterned conductive layer is disposed on the lower surface. The first patterned conductive layer includes a plurality of first sensing strings located in the first sensing regions and a plurality of first dummy patterns located in the first circuit bonding regions. The first sensing serials are electrically insulated from each other and have first ends extending to the first circuit bonding area. The first simulated pattern surrounds each first end and is electrically insulated from each first end. In the first circuit bonding area, a plurality of first pseudo patterns are arranged between any two adjacent first ends. The touch panel can help to improve the production yield.

Description

touch panel

technical field

The invention relates to a touch panel, and in particular to a capacitive touch panel.

Background technique

In recent years, with the rapid development and application of information technology, wireless mobile communications and information home appliances, in order to achieve the purpose of more convenient portability, lighter volume and more humanized operation, many information products have been input by traditional keyboards or mice. device, converted to use a touch device as an input device. Touch panels are roughly classified into resistive touch panels, capacitive touch panels, optical touch panels, acoustic wave touch panels, and electromagnetic touch panels according to their sensing methods. Since the capacitive touch panel has the advantages of fast response time, good reliability and high durability, the capacitive touch panel has been widely used in electronic products.

Generally speaking, the capacitive touch panel includes a plurality of first sensing series and a plurality of second sensing series insulated from each other. When the user touches the touch panel with a finger, the first sensing series and the second sensing series of the touch panel will produce a change in capacitance at the position touched by the finger, and the change in capacitance will be converted into a control The signal is sent to the external circuit, and the appropriate command is outputted to operate the electronic device after being processed. In order to transmit the control signal of the capacitance change to the external circuit, it is usually implemented by electrically connecting each sensing series on the touch panel and the external circuit (such as a control circuit board) through a flexible printed circuit. In other words, the pins on the flexible printed circuit are aligned with the ends of the sensing series on the touch panel one by one, and the flexible wiring is attached to the end of the sensing series, so that the flexible printed circuit Each pin on the printed circuit can be in contact with the end of each sensing series. However, when misalignment occurs, the pins on the flexible printed circuit will contact the conductive layer around the end of the sensing series, and the conductive layer will cause different sensing series to bridge each other to generate The phenomenon of abnormal short circuit causes the manufacturing yield of the touch panel to drop.

Contents of the invention

The purpose of the present invention is to provide a touch panel, which has a plurality of dummy patterns located in the circuit bonding area.

The invention provides a touch panel, which includes a substrate, a first patterned conductive layer and a second patterned conductive layer. The substrate has an upper surface, a first sensing region, a first circuit bonding region and a lower surface opposite to the upper surface, and the first sensing region and the first circuit bonding region are located on the upper surface. The first patterned conductive layer is configured on the upper surface, and the second patterned conductive layer is configured on the lower surface. The first patterned conductive layer includes a plurality of first sensing series located in the first sensing area and a plurality of first dummy patterns located in the first line bonding area. Each first sensing series is electrically insulated from each other and has a first end extending to the first line bonding area. The first dummy pattern surrounds each first end and is electrically insulated from each first end. In the first circuit bonding area, there are a plurality of first dummy patterns between any two adjacent first ends.

In one embodiment of the present invention, the distance between each of the above-mentioned first ends and the adjacent first dummy patterns is between 10 μm and 200 μm, and the distance between two adjacent first dummy patterns is between 10 μm and 200 μm. Between 10μm and 200μm.

In an embodiment of the present invention, the above-mentioned first circuit bonding area has a first area and a second area, and the first area surrounds the first end and is located between the first end and the second area. The average size of the first dummy patterns located in the first area is smaller than the average size of the first dummy patterns located in the second area.

In an embodiment of the present invention, the above-mentioned first patterned conductive layer further includes a plurality of first pseudo-conductive patterns, and each first pseudo-conductive pattern is arranged between two adjacent first sensing series and connected to the first sensing series. The sensing series is electrically isolated.

In an embodiment of the present invention, the above-mentioned substrate has a first peripheral region on the upper surface, and the first patterned conductive layer further includes a plurality of first quasi-peripheral patterns, and the first pseudo-peripheral patterns are located in the first peripheral region. And electrically insulated from the first sensing series.

In an embodiment of the present invention, the above-mentioned substrate has a second sensing region and a second circuit bonding region, and the second sensing region and the second circuit bonding region are located on the lower surface. The second patterned conductive layer includes a plurality of second sensing series located in the second sensing area and a plurality of second dummy patterns located in the second line bonding area. Each second sensing series is electrically insulated from each other and has a second end extending to the second line bonding area. The second dummy pattern surrounds each second end and is electrically insulated from each second end, and in the second line bonding area, there are multiple second dummy patterns between any two adjacent second ends.

In one embodiment of the present invention, the distance between each second end and each adjacent second dummy pattern is between 10 μm and 200 μm, and the distance between two adjacent second dummy patterns is between 10 μm and 200 μm. Between 10μm and 200μm.

In an embodiment of the present invention, the above-mentioned second circuit bonding area has a third area and a fourth area, and the third area surrounds the second end and is located between the second end and the fourth area. The average size of the second dummy patterns located in the third area is smaller than the average size of the second dummy patterns located in the fourth area.

In an embodiment of the present invention, the above-mentioned second patterned conductive layer further includes a plurality of second pseudo-conductive patterns, and each second pseudo-conductive pattern is arranged between two adjacent second sensing series and connected to the second The sensing series is electrically isolated.

In an embodiment of the present invention, the above-mentioned substrate has a second peripheral region on the lower surface, and the second patterned conductive layer further includes a plurality of second pseudo-peripheral patterns, and the second pseudo-peripheral patterns are located in the second peripheral region. And electrically insulated from the second sensing series.

In an embodiment of the present invention, the above-mentioned first patterned conductive layer and the second patterned conductive layer are made of a transparent conductive material.

The present invention further provides a touch panel, which includes a substrate, a first patterned conductive layer, and a second patterned conductive layer. The substrate has an upper surface, a first sensing region, a first circuit bonding region and a lower surface opposite to the surface, and the first sensing region and the first circuit bonding region are located on the upper surface. The first patterned conductive layer is configured on the upper surface, and the second patterned conductive layer is configured on the lower surface. The first patterned conductive layer has a plurality of first isolation trenches located in the first sensing area and a plurality of second isolation trenches located in the first line bonding area. The first isolation trench defines a plurality of first sensing series and first pseudo-conductive patterns that are electrically insulated from each other. The second isolation trench communicates with the first isolation trench to define a plurality of first ends connected to the first sensing series and a plurality of first dummy patterns surrounding each first end, and any two adjacent first ends There are multiple first dummy patterns between one end.

In an embodiment of the present invention, the extension directions of the above-mentioned second isolation trenches are respectively transverse, vertical or oblique.

In an embodiment of the present invention, the width of each of the above-mentioned first isolation trenches and each of the second isolation trenches is between 10 μm and 200 μm.

In an embodiment of the present invention, the above-mentioned first line bonding area has a first area and a second area, the first area surrounds the first end and is located between the first end and the second area, wherein the The distribution density of the second isolation trenches is greater than the distribution density of the second isolation trenches located in the second region.

In an embodiment of the present invention, the above-mentioned substrate has a first peripheral area on the upper surface, and the first patterned conductive layer has a plurality of first peripheral isolation trenches located in the first peripheral area, and the first peripheral isolation The trench defines a plurality of first quasi-peripheral patterns, and the first quasi-peripheral patterns are electrically insulated from the first sensing series.

In an embodiment of the present invention, the above-mentioned substrate has a second sensing region and a second circuit bonding region, and the second sensing region and the second circuit bonding region are located on the lower surface. The second patterned conductive layer has a plurality of third isolation trenches located in the second sensing area and a plurality of fourth isolation trenches located in the second line bonding area. The third isolation trench defines a plurality of second sensing series and second pseudo-conductive patterns that are electrically insulated from each other. The fourth isolation trench communicates with the third isolation trench to define a plurality of second ends connected to the second sensing series and a plurality of second dummy patterns surrounding each second end, and any two adjacent first ends There are multiple second pseudo-patterns between the two ends.

In an embodiment of the present invention, the extension directions of the above-mentioned fourth isolation trenches are respectively transverse, vertical or oblique.

In an embodiment of the present invention, the width of each of the above-mentioned third isolation trenches and each of the fourth isolation trenches is between 10 μm and 200 μm.

In an embodiment of the present invention, the above-mentioned second circuit bonding area has a third area and a fourth area, and the third area surrounds the second end and is located between the second end and the fourth area. The distribution density of the fourth isolation trenches located in the third area is greater than the distribution density of the fourth isolation trenches located in the fourth area.

In an embodiment of the present invention, the above-mentioned substrate has a second peripheral area on the lower surface, and the second patterned conductive layer has a plurality of second peripheral isolation trenches located in the second peripheral area, and the second peripheral isolation The trench defines a plurality of second quasi-peripheral patterns, and the second quasi-peripheral patterns are electrically insulated from the second sensing series.

In an embodiment of the present invention, the material of the first patterned conductive layer and the second patterned conductive layer includes a transparent conductive material.

The present invention further provides a touch panel, which includes a substrate, a first patterned conductive layer, and a second patterned conductive layer. The substrate has an upper surface, a first sensing region, a first circuit bonding region and a lower surface opposite to the upper surface, and the first sensing region and the first circuit bonding region are located on the upper surface. The first patterned conductive layer is configured on the upper surface, and the second patterned conductive layer is configured on the lower surface. The first patterned conductive layer includes a plurality of first sensing series and a plurality of isolation trenches electrically insulating the first sensing series from each other. The first sensing series are located in the first sensing area, and each first sensing series is electrically insulated from each other and has a first end extending to the first line bonding area. The isolation trenches are composed of multiple repeating patterns.

In an embodiment of the present invention, each of the above repeated patterns includes a circle, an ellipse or a rectangle.

The beneficial effect of the present invention is that, based on the above, the touch panel of the present invention has a plurality of dummy patterns electrically insulated from each other in the circuit bonding area and surrounds the end of the sensing series, thus effectively preventing pins on the circuit layer. Misalignment with the end of the sensing series causes problems such as short circuits. In this way, the touch panel of the present invention can help to improve the production yield.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail together with the accompanying drawings.

Description of drawings

1A and 1B are schematic top and bottom views of a touch panel according to an embodiment of the present invention, respectively.

FIG. 2A is a partially enlarged schematic diagram of area A in FIG. 1A .

FIG. 2B and FIG. 2C are partial enlarged schematic diagrams of the area M and the area N of FIG. 2A respectively.

FIG. 3 is a schematic cross-sectional view along line I-I in FIG. 2A .

FIG. 4 is a partially enlarged schematic view of area B in FIG. 1B .

FIG. 5 is a partially enlarged schematic diagram of area C in FIG. 1A .

FIG. 6A , FIG. 6B and FIG. 6C are partial enlarged schematic views of the region P of FIG. 2A according to different embodiments.

Wherein, the reference signs are explained as follows:

100: touch panel

102: Substrate

102a: upper surface

102b: lower surface

104: the first patterned conductive layer

106: the second patterned conductive layer

108: The first sensing area

109: The first peripheral area

110: First Line Engagement Area

110a: District 1

110b: Second District

112: Second sensing area

113: The second peripheral area

114: Second Line Bonding Area

114a: The third area

114b: District 4

116: first sensing series

116a: first end

118, 118a, 118b: the first imitation pattern

120: the first quasi-conductive pattern

122: First Isolation Ditch

122a: Repeat pattern

124: Second isolation trench

126: Second sensing series

126a: second end

128, 128a, 128b: the second imitation pattern

130: second quasi-conductive pattern

132: The third isolation ditch

134: Fourth Isolation Ditch

136: First Perimeter Isolation Ditch

138: The first quasi-surrounding pattern

A, B, C, M, N, P: area

D1: first direction

D2: Second direction

Detailed ways

1A and 1B are schematic top and bottom views of a touch panel according to an embodiment of the present invention, respectively. FIG. 2A is a partially enlarged schematic diagram of area A in FIG. 1A . FIG. 2B and FIG. 2C are partial enlarged schematic diagrams of the area M and the area N of FIG. 2A respectively. FIG. 3 is a schematic cross-sectional view along line I-I in FIG. 2A .

Please refer to FIG. 1A and FIG. 1B at the same time. The touch panel 100 includes a substrate 102 , a first patterned conductive layer 104 and a second patterned conductive layer 106 . The substrate 102 has an upper surface 102a and a lower surface 102b opposite to the upper surface 102a. The first patterned conductive layer 104 is disposed on the upper surface 102a, and the second patterned conductive layer 106 is disposed on the lower surface 102b. The substrate 102 also has a first sensing region 108 , a first peripheral region 109 , a first circuit bonding region 110 , a second sensing region 112 , a second peripheral region 113 and a second circuit bonding region 114 . The first sensing region 108 , the first peripheral region 109 and the first circuit bonding region 110 are located on the upper surface 102 a, and the second sensing region 112 , the second peripheral region 113 and the second circuit bonding region 114 are located on the lower surface 102 b. Specifically, the first peripheral region 109 is, for example, an edge region located outside the first sensing region 108 and the first circuit bonding region 110 , and the second peripheral region 113 is, for example, located at the second sensing region 112 and the second circuit bonding region. The edge area outside zone 114.

The substrate 102 is, for example, a transparent substrate, and its material can be glass or plastic. The material of the first patterned conductive layer 104 and the second patterned conductive layer 106 includes a transparent conductive material such as indium tin oxide (ITO), indium zinc oxide (IZO), oxide Aluminum zinc (Aldoped ZnO, AZO), Ga doped zinc oxide (GZO), indium oxide (In ₂ O ₃ ), zinc oxide (ZnO), titanium dioxide (TiO ₂ ) or tin dioxide (SnO ₂ ) wait.

Please refer to FIG. 1A, FIG. 2A to FIG. 2C and FIG. The first imitation pattern 118 of. The first sensing series 116 extends along the first direction D1 and is arranged in parallel, as shown in FIG. 1A . The method of forming the first sensing series 116 and the first dummy pattern 118 is, for example, to form a conductive layer on the upper surface 102a of the substrate 102, and pattern it by laser engraving, and form multiple layers in the conductive layer. an isolation trench exposing the upper surface 102a. In one embodiment, the total area of the upper surface 102 a exposed by the isolation trench accounts for about 90%-98% of the entire area of the first patterned conductive layer 104 , which depends on the line width of the isolation trench.

In detail, the first patterned conductive layer 104 has a plurality of first isolation trenches 122 located in the first sensing area 108 and a plurality of second isolation trenches 124 located in the first line bonding area 110 . The first isolation trenches 122 define a plurality of first sensing series 116 that are electrically isolated from each other. The second isolation trench 124 communicates with the first isolation trench 122 to define a plurality of first ends 116 a connected to the first sensing series 116 and a plurality of first dummy patterns 118 surrounding each first end 116 a. In one embodiment, the width of each of the first isolation trenches 122 and each of the second isolation trenches 124 is between 10 μm and 200 μm. That is to say, the distance between each first end 116a and each adjacent first dummy pattern 118 is between 10 μm and 200 μm, and the distance between two adjacent first dummy patterns 118 is between 10 μm and 200 μm. between.

According to the above, each first sensing series 116 is electrically insulated from each other and has a first end 116 a extending to the first line bonding area 110 . That is to say, the first sensing series 116 is, for example, electrically connected to the outer circuit layer (not shown) at the first circuit bonding area 110, so that the electrical signal of the first sensing series 116 is transmitted through the circuit layer. To the touch sensor chip, and then control the electronic device. In practice, the aforementioned circuit layer is, for example, a flexible printed circuit (Flexible Printed Circuit, FPC), and the flexible printed circuit can be attached to the first on the first end 116 a of the sensing series 116 .

In one embodiment, the first patterned conductive layer 104 further includes a plurality of first pseudo conductive patterns 120, and each first pseudo conductive pattern 120 is arranged between two adjacent first sensing series 116 and connected to the first sensing series 116. The test series 116 is electrically insulated. It is explained here that the first isolation trench 122 defines a plurality of first pseudo conductive patterns 120 in addition to the first sensing series 116 , so the first sensing series 116 and the first pseudo conductive patterns 120 For example, use the same material for production. In the above embodiment, by disposing the first pseudo-conductive pattern 120 between the adjacent first sensing series 116, the overall light transmission uniformity of the touch panel can be improved to further improve the visual effect, so that the first sensing series The pattern of columns 116 is not easily recognized by the user.

Please refer to FIG. 2A to FIG. 2C and FIG. 3 , the first dummy pattern 118 surrounds each first end 116 a and is electrically insulated from each first end 116 a due to the configuration of the second isolation trench 124 . In addition, in the first circuit bonding area 110 , there are a plurality of first dummy patterns 118 between any two adjacent first ends 116 a. The first line bonding area 110 can be further divided into a first area 110a and a second area 110b, the first area 110a surrounds the first end 116a, and the second area 110b is located at the edge of the upper surface 100a of the substrate 100, and The first region 110a is sandwiched between the first end 116a and the second region 110b. In one embodiment, the distribution density of the second isolation trenches 124 located in the first region 110a is greater than the distribution density of the second isolation trenches 124 located in the second region 110b. In other words, the average size of the first dummy patterns 118a located in the first region 110a is, for example, smaller than the average size of the first dummy patterns 118b located in the second region 110b.

It is worth mentioning that the extending direction of the second isolation trench 124 can be horizontal, vertical or oblique respectively. In other words, the shape of the first pseudo-pattern 118 defined by the second isolation trenches 124 may be a rectangle, trapezoid, triangle, L-shape, ㄇ-shape, or other suitable shapes formed by interlacing the second isolation trenches 124 in different directions. As shown in FIG. 2A , in this embodiment, the first patterned conductive layer 104 has a plurality of second isolation trenches 124 extending horizontally and vertically and interlacedly for illustration, but the present invention is not limited thereto. In other embodiments, the first patterned conductive layer 104 may also have a plurality of second isolation trenches 124 extending obliquely to define the first dummy pattern 118 with other shapes. Of course, the number of the second isolation trenches 124 is not limited to that shown in the drawings, and those skilled in the art can make adjustments according to their needs.

When the circuit layer is bonded to the first circuit bonding area 110 of the touch substrate 100, even if an alignment error occurs and the pins on the circuit layer touch the conductive layer other than the first terminal 116a, the plurality of first terminals 116a will not be caused. A sensing series 116 is electrically connected and short-circuited. It is explained here that since the first end 116a is surrounded by a plurality of first dummy patterns 118 electrically insulated from each other, the pins on the circuit layer contacting one or more first dummy patterns 118 will not cause a ground connection. The electrical conduction between the foot and other first dummy patterns 118 or other first ends 116a. In addition, the average size of the first dummy pattern 118a located around the first end 116a is smaller, which can help to more effectively prevent short circuits caused by misalignment between pins on the circuit layer and the first end 116a. question.

In one embodiment, the second patterned conductive layer 106 may optionally have a structure similar to that shown in FIG. 2A , so as to effectively prevent misalignment between the pins on the wiring layer and the ends of the sensing series. The shift causes problems such as electrical conduction or short circuit between the sensing series. Next, it will be further described in a top view. FIG. 4 is a partially enlarged schematic diagram of area B in FIG. 1B .

Please refer to FIG. 1B and FIG. 4 at the same time, the second patterned conductive layer 106 includes a plurality of second sensing series 126 located in the second sensing area 112 and a plurality of second dummy patterns 128 located in the second line bonding area 114 . The second sensing series 126 extends along the second direction D2 and is arranged in parallel, and the first direction D1 and the second direction D2 are not parallel, as shown in FIG. 1B . In this embodiment, the first direction D1 and the second direction D2 are substantially orthogonal. The first sensing series 116 and the second sensing series 126 are located on the upper surface 102 a and the lower surface 102 b of the substrate 102 respectively, and are electrically insulated from each other. Therefore, the coupling capacitance between the overlapping portion of the first sensing series 116 and the second sensing series 126 can be changed by touching to generate a signal, thereby realizing the capacitive touch sensing function.

Similarly, the method of forming the second sensing series 126 and the second dummy pattern 128 is, for example, to form another conductive layer on the lower surface 102b of the substrate 102, and pattern it by laser engraving. A plurality of third isolation trenches 132 and fourth isolation trenches 134 exposing the lower surface 102b are formed in the layer. In one embodiment, the total area of the lower surface 102b exposed by the third isolation trench 132 and the fourth isolation trench 134 accounts for about 90%-98% of the entire area of the second patterned conductive layer 106, which depends on the isolation trench line width.

The above-mentioned third isolation trench 132 is located in the second sensing area 112 , and the fourth isolation trench 134 is located in the second line bonding area 114 . The third isolation trenches 132 define a plurality of second sensing series 126 and second pseudo-conductive patterns 130 that are electrically insulated from each other. The fourth isolation trench 134 communicates with the third isolation trench 132 to define a plurality of second ends 126 a connected to the second sensing series 126 and a plurality of second dummy patterns 128 surrounding each second end 126 a. In one embodiment, the width of each third isolation trench 132 and each fourth isolation trench 134 is between 10 μm and 200 μm. That is to say, the distance between each second end 126a and each adjacent second dummy pattern 128 is between 10 μm and 200 μm, and the distance between two adjacent second dummy patterns 128 is between 10 μm and 200 μm. between.

The second sensing series 126 defined by the third isolation trench 132 are electrically insulated from each other and have a second end 126 a extending to the second line bonding region 114 . That is to say, the pins on the circuit layer (not shown) are, for example, electrically connected to the second end 126a of the second sensing series 126, so that the electrical signal of the second sensing series 126 is transmitted through the circuit layer. To the touch sensor chip, and then control the electronic device. The second pseudo conductive pattern 130 also defined by the third isolation trench 132 is disposed between two adjacent second sensing series 126 . In the above embodiment, by disposing the second pseudo-conductive pattern 130 between the adjacent second sensing series 126, the overall light transmission uniformity of the touch panel can be improved to further improve the visual effect, so that the first sensing series The pattern of columns 116 is not easily recognized by the user.

As shown in FIG. 4 , the second dummy pattern 128 defined by the fourth isolation trench 134 surrounds each second end 126 a and is electrically insulated from each second end 126 a. In the second circuit bonding area 114 , there are a plurality of second dummy patterns 128 between any two adjacent second ends 126 a. In addition, the second circuit bonding area 114 can be further divided into a third area 114a and a fourth area 114b, the third area 114a surrounds the second end 126a, and the fourth area 114b is located at the edge of the lower surface 100b of the substrate 100 , and the third region 114a is sandwiched between the second end 126a and the fourth region 114b. In one embodiment, the distribution density of the third isolation trenches 132 located in the third region 114 a is greater than the distribution density of the fourth isolation trenches 134 located in the fourth region 114 b. In other words, the average size of the second dummy patterns 128a located in the third area 114a is, for example, smaller than the average size of the second dummy patterns 128b located in the fourth area 114b.

Likewise, the extending direction of the fourth isolation trench 134 can also be horizontal, vertical or oblique. In other words, the shape of the second pseudo-pattern 128 defined by the fourth isolation trenches 134 may be a rectangle, trapezoid, triangle, L-shape, ㄇ-shape, or other suitable shapes formed by interlacing fourth isolation trenches 134 in different directions. The present invention is not limited to the fourth isolation trenches 134 arranged horizontally and vertically in a staggered manner as shown in FIG. 4 . In other embodiments, the second patterned conductive layer 106 may also have a plurality of fourth isolation trenches 134 extending obliquely to define the second dummy pattern 128 with other shapes. Of course, the number of the fourth isolation trenches 134 is not limited to that shown in the drawings, and those skilled in the art can make adjustments according to their needs.

In addition, in an embodiment, in addition to the first isolation trench 122, the second isolation trench 124, the third isolation trench 132, and the fourth isolation trench 134, the first patterned conductive layer 104 can also be laser engraved. , The second patterned conductive layer 106 is patterned to form a plurality of peripheral isolation trenches in the first peripheral region 109 and the second peripheral region 113 . Next, it will be further described in a top view. FIG. 5 is a partially enlarged schematic diagram of area C in FIG. 1A .

Please refer to FIG. 1A and FIG. 5 at the same time, the first patterned conductive layer 104 can also have a plurality of first peripheral isolation trenches 136 located in the first peripheral region 109, and the first peripheral isolation trenches 136 define a plurality of first pseudo-peripheral Pattern 138. The first quasi-peripheral patterns 138 are, for example, electrically insulated from each other and distributed on the peripheral edge of the first sensing region 108 . The first quasi-peripheral pattern 138 is electrically insulated from the first sensing series 116 located in the first sensing region 108 , thus helping to reduce cross-talk between the first sensing series 116 . It should be noted here that the extension direction of the first peripheral isolation trench 136 can be horizontal, vertical or oblique respectively, and the shape of the first quasi-peripheral pattern 138 defined by the first peripheral isolation trench 136 can be a rectangle, a trapezoid, Triangular, L-shaped, ㄇ-shaped or other appropriate shapes. Moreover, the quantity, shape, size or distribution density of the first peripheral isolation trenches 136 and the first quasi-peripheral patterns 138 are not limited to those shown in the drawings, and those skilled in the art can make adjustments according to their needs.

Of course, in another embodiment, the second peripheral region 113 of the second patterned conductive layer 106 may also have a structure similar to that shown in FIG. 5 . That is to say, the second patterned conductive layer 106 can also have a plurality of second peripheral isolation trenches (not shown) located in the second peripheral region 113 to define a plurality of electrical connections with the second sensing series 126 . The insulating second quasi-peripheral pattern (not shown) further improves the crosstalk phenomenon between the second sensing series 126 .

It should be noted that the above-mentioned embodiments are mainly for detailing the first dummy pattern 118 located in the first line bonding area 110 , the second isolation trench 124 and the second dummy pattern 128 located in the second line bonding area 114 , The fourth isolation trench 134 is for those skilled in the art to implement, but is not intended to limit the scope of the present invention. As for other components of the touch panel 100, such as the structure, configuration and quantity of the first sensing series 116 and the second sensing series 126, etc., they are not limited to those shown in FIG. 1A and FIG. Made by techniques known to those skilled in the art.

Specifically, although the edges of the first isolation trench 122, the second isolation trench 124, the third isolation trench 132, the fourth isolation trench 134, and the first peripheral isolation trench 136 shown in the above embodiment are straight lines, this The invention is not limited thereto. Hereinafter, the details of the isolation trench according to the embodiment of the present invention will be described in detail by taking the first isolation trench 122 in FIG. 2A as an example. FIG. 6A , FIG. 6B and FIG. 6C are partial enlarged schematic views of the region P of FIG. 2A according to different embodiments.

Please refer to FIG. 6A to FIG. 6C at the same time. In one embodiment, the first isolation trench 122 may be formed by a plurality of repeated patterns 122a. Each of the repeating patterns 122 a partially overlaps to form a connected first isolation trench 122 . The repeating pattern 122a is, for example, a circle (as shown in FIG. 6A ), an ellipse (as shown in FIG. 6B ), or a rectangle (as shown in FIG. 6C ), and other arbitrary shapes. That is to say, the detailed enlargement of the edge of the first isolation trench 122 is, for example, a continuous arc formed by multiple circles or ellipses, or a straight line formed by multiple repeated rectangles. It is explained here that since the conductive layer is patterned by laser engraving to form the first isolation trench 122, during the laser engraving process, continuous pulses of the laser will form continuous trenches when removing the material of the conductive layer. grooves, and the grooves formed by a single laser pulse are the single repeating pattern 122a shown in FIGS. 6A to 6C .

Of course, in other embodiments, the second isolation trench 124, the third isolation trench 132, the fourth isolation trench 134, the first peripheral isolation trench 136, and the second peripheral isolation trench (not shown) may also be composed of multiple repeated Patterns, and the repeating pattern can be circular, elliptical, or rectangular and other arbitrary shapes, so that the detailed enlargement of the edge of these isolation trenches is not a straight line. Those skilled in the art will be able to know the variations and applications of the aforementioned embodiments, so details are not repeated here.

To sum up, in the touch panel of the present invention, a plurality of connected isolation trenches are formed in the conductive layer to respectively define a plurality of sensing series, a plurality of pseudo-conductive patterns and a plurality of pseudo-patterns. By making the dummy patterns surround the ends of each sensing series, and a plurality of electrically insulated dummy patterns are arranged between the ends of any two adjacent sensing series, it is possible to prevent the pins on the circuit layer from contacting with each other. The conductive layers other than the ends make the multiple sensing series electrically connected to each other and short circuit.

In addition, the manufacturing of the touch panel of the present invention can be integrated with the existing process, the process is simple and can help to improve the product yield.

Although the present invention has been disclosed above with the embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the present invention The scope of protection shall prevail as defined by the claims.

Claims (22)

1. contact panel comprises:

One substrate has a upper surface, one first sensing area, one first circuit bonding land and with respect to a lower surface of this upper surface, this first sensing area and this first circuit bonding land are positioned on this upper surface;

One first patterned conductive layer is disposed on this upper surface, and this first patterned conductive layer comprises:

A plurality of first sensing serials are positioned at this first sensing area, and respectively this first sensing serials is electrically insulated each other and has one first end and extends to this first circuit bonding land; And

A plurality of first graphoid cases; Be positioned at this first circuit bonding land; Said a plurality of first graphoid case is around respectively this is first terminal and be electrically insulated with this first end respectively, and in this first circuit bonding land, has a plurality of first graphoid cases between wantonly two adjacent first ends; And

One second patterned conductive layer is disposed on this lower surface.

2. contact panel as claimed in claim 1 is characterized in that, respectively this first terminal and adjacent respectively spacing between this first graphoid case is between 10 μ m to 200 μ m, and the spacing between the two adjacent first graphoid cases is between 10 μ m to 200 μ m.

3. contact panel as claimed in claim 1; It is characterized in that; This first circuit bonding land has one first district and one second district; This first district is terminal and between said first terminal and this second district around said first, and the average-size of said a plurality of first graphoid cases that wherein is positioned at this first district is less than the average-size of the said a plurality of first graphoid cases that are positioned at this second district.

4. contact panel as claimed in claim 1; It is characterized in that; This first patterned conductive layer comprises that also a plurality of first intends conductive pattern, and respectively this first plan conductive pattern is disposed between adjacent two first sensing serials and with said a plurality of first sensing serials and is electrically insulated.

5. contact panel as claimed in claim 1; It is characterized in that; This substrate has one first surrounding zone that is positioned on this upper surface; And this first patterned conductive layer comprises that also a plurality of first intends peripheral pattern, is positioned at this first surrounding zone, and said a plurality of first peripheral patterns of plan and said a plurality of first sensing serials are electrically insulated.

6. contact panel as claimed in claim 1 is characterized in that, this substrate has one second sensing area and one second circuit bonding land, and this second sensing area and this second circuit bonding land are positioned on this lower surface, and this second patterned conductive layer comprises:

A plurality of second sensing serials are positioned at this second sensing area, and respectively this second sensing serials is electrically insulated each other and has one second end and extends to this second circuit bonding land; And

A plurality of second graphoid cases; Be positioned at this second circuit bonding land; Said a plurality of second graphoid case is around respectively this is second terminal and be electrically insulated with this second end respectively, and in this second circuit bonding land, has a plurality of second graphoid cases between wantonly two adjacent second ends.

7. contact panel as claimed in claim 6 is characterized in that, respectively this second terminal and adjacent respectively spacing between this second graphoid case is between 10 μ m to 200 μ m, and the spacing between the two adjacent second graphoid cases is between 10 μ m to 200 μ m.

8. contact panel as claimed in claim 6; It is characterized in that; This second circuit bonding land has one the 3rd district and one the 4th district; The 3rd district is terminal and between said second terminal and the 4th district around said second, and the average-size of said a plurality of second graphoid cases that wherein is positioned at the 3rd district is less than the average-size of the said a plurality of second graphoid cases that are positioned at the 4th district.

9. contact panel as claimed in claim 6; It is characterized in that; This second patterned conductive layer comprises that also a plurality of second intends conductive pattern, and respectively this second plan conductive pattern is disposed between adjacent two second sensing serials and with said a plurality of second sensing serials and is electrically insulated.

10. contact panel as claimed in claim 6; It is characterized in that; This substrate has one second surrounding zone that is positioned on this lower surface; And this second patterned conductive layer comprises that also a plurality of second intends peripheral pattern, is positioned at this second surrounding zone, and said a plurality of second peripheral patterns of plan and said a plurality of second sensing serials are electrically insulated.

11. a contact panel comprises:

One substrate has a upper surface, one first sensing area, one first circuit bonding land and with respect to a lower surface of this upper surface, this first sensing area and this first circuit bonding land are positioned on this upper surface;

One first patterned conductive layer; Be disposed on this upper surface; Wherein this first patterned conductive layer has a plurality of first isolation trenches and a plurality of second isolation trenches that are positioned at the first circuit bonding land that are positioned at this first sensing area; Said first isolation trenches defines a plurality of first sensing serials that are electrically insulated each other and first and intends conductive pattern; And said second isolation trenches is communicated with said first isolation trenches, and is first terminal and a plurality of around this first terminal first graphoid case respectively with what define that a plurality of and said a plurality of first sensing serials is connected, and has a plurality of first graphoid cases between wantonly two adjacent first ends; And

One second patterned conductive layer is disposed on this lower surface.

12. contact panel as claimed in claim 11 is characterized in that, respectively the bearing of trend of this second isolation trenches is respectively horizontal, vertical or oblique.

13. contact panel as claimed in claim 11 is characterized in that, respectively this first isolation trenches and respectively the width of this second isolation trenches between 10 μ m to 200 μ m.

14. contact panel as claimed in claim 11; It is characterized in that; This first circuit bonding land has one first district and one second district; This first district is terminal and between said first terminal and this second district around said first, and the distribution density of said second isolation trenches that wherein is positioned at this first district is greater than the distribution density of said second isolation trenches that is positioned at this second district.

15. contact panel as claimed in claim 11; It is characterized in that; This substrate has one first surrounding zone that is positioned on this upper surface; And this first patterned conductive layer has a plurality of first peripheral isolation trenches that are positioned at this first surrounding zone, and the said first peripheral isolation trenches defines a plurality of first and intends peripheral pattern, and said a plurality of first peripheral patterns of plan and said a plurality of first sensing serials are electrically insulated.

16. contact panel as claimed in claim 11; It is characterized in that; This substrate has one second sensing area and one second circuit bonding land; This second sensing area and this second circuit bonding land are positioned on this lower surface; This second patterned conductive layer has a plurality of the 3rd isolation trenches and a plurality of the 4th isolation trenches that are positioned at the second circuit bonding land that are positioned at this second sensing area, and said the 3rd isolation trenches defines a plurality of second sensing serials that are electrically insulated each other and second and intends conductive pattern, and said the 4th isolation trenches is communicated with said the 3rd isolation trenches; Second terminal and a plurality of with what define that a plurality of and said a plurality of second sensing serials is connected around this second terminal second graphoid case respectively, and have a plurality of second graphoid cases between wantonly two adjacent second ends.

17. contact panel as claimed in claim 16 is characterized in that, respectively the bearing of trend of the 4th isolation trenches is respectively horizontal, vertical or oblique.

18. contact panel as claimed in claim 16 is characterized in that, respectively the 3rd isolation trenches and respectively the width of the 4th isolation trenches between 10 μ m to 200 μ m.

19. contact panel as claimed in claim 16; It is characterized in that; This second circuit bonding land has one the 3rd district and one the 4th district; The 3rd district is terminal and between said second terminal and the 4th district around said second, it is characterized in that, the distribution density of said the 4th isolation trenches that is positioned at the 3rd district is greater than the distribution density of said the 4th isolation trenches that is positioned at the 4th district.

20. contact panel as claimed in claim 16; It is characterized in that; This substrate has one second surrounding zone that is positioned on this lower surface; And this second patterned conductive layer has a plurality of second peripheral isolation trenches that are positioned at this second surrounding zone, and the said second peripheral isolation trenches defines a plurality of second and intends peripheral pattern, and said a plurality of second peripheral patterns of plan and said a plurality of second sensing serials are electrically insulated.

21. a contact panel comprises:

One substrate has a upper surface, one first sensing area, one first circuit bonding land and with respect to a lower surface of this upper surface, this first sensing area and this first circuit bonding land are positioned on this upper surface;

One first patterned conductive layer is disposed on this upper surface, and this first patterned conductive layer comprises:

A plurality of first sensing serials are positioned at this first sensing area, and respectively this first sensing serials is electrically insulated each other and has one first end and extends to this first circuit bonding land; And

A plurality of isolation trenches that this first sensing serials respectively is electrically insulated each other, said a plurality of isolation trenches are to be made up of a plurality of repeat patterns; And

One second patterned conductive layer is disposed on this lower surface.

22. contact panel as claimed in claim 21 is characterized in that, respectively this repeat patterns comprises circle, ellipse or rectangle.

Images