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CN102617155A - Method for manufacturing inductance porcelain core substrate - Google Patents

Method for manufacturing inductance porcelain core substrate Download PDF

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Publication number
CN102617155A
CN102617155A CN2012101100934A CN201210110093A CN102617155A CN 102617155 A CN102617155 A CN 102617155A CN 2012101100934 A CN2012101100934 A CN 2012101100934A CN 201210110093 A CN201210110093 A CN 201210110093A CN 102617155 A CN102617155 A CN 102617155A
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CN
China
Prior art keywords
porcelain
inductance
core substrate
porcelain core
ceramic
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Granted
Application number
CN2012101100934A
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Chinese (zh)
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CN102617155B (en
Inventor
覃杰勇
曾向东
王清华
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Shenzhen Sunlord Electronics Co Ltd
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Shenzhen Sunlord Electronics Co Ltd
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Priority to CN201210110093.4A priority Critical patent/CN102617155B/en
Publication of CN102617155A publication Critical patent/CN102617155A/en
Application granted granted Critical
Publication of CN102617155B publication Critical patent/CN102617155B/en
Expired - Fee Related legal-status Critical Current
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Abstract

The invention relates to a method for manufacturing an inductance porcelain core substrate, which comprises the following steps of: preparing porcelain casting slurry through a ball-milling compounding manner; casting the prepared porcelain casting slurry on a release liner through a casting machine, and forming porcelain green tapes with a certain thickness after drying; stacking a plurality of porcelain green tapes; laminating the stacked porcelain green tapes through a warm water isostatic pressing machine; forming grooves of the inductance porcelain core substrate at equal intervals on the porcelain green tapes through a hobbing cutter cutting machine; and cutting the porcelain green tapes with the grooves into independent inductance porcelain core substrates through a fodder chopper cutting machine. According to the method for manufacturing the inductance porcelain core substrate, casting can be realized through using ball-milling mixed with solvent in the compounding manner, and spray granulation is unnecessary, so that the production efficiency is improved; a stacking manner is used for forming, so that 2000Pcs of inductance porcelain core substrates can be manufactured simultaneously at a time, and the forming efficiency is greatly improved; and the grooves of the porcelain green tapes are manufactured in a cutting manner, so that equipment loss is less, and equipment maintenance cost is lower.

Description

A kind of method of making inductance porcelain core substrate
Technical field
The present invention relates to a kind of method of making inductance porcelain core substrate.
Background technology
In recent years, along with the progress of science and technology, electronic devices and components obtain application more and more widely, when paying attention to element function, the efficient and the reduction manufacturing cost that improve manufacturing processed are also more and more paid close attention to.
Traditional inductance porcelain core substrate making method is, makes slurry with ball milling method, and then processes dry-pressing formed required powder through sponging granulator, obtains inductance porcelain core substrate with the die stamping molding mode again.The shortcoming of using this method to make the inductance porcelain core has: 1) when mist projection granulating, very high to the flowability requirement of its powder, general dry-pressing formed powder granularity is distributed between 100~300 orders; 2) because the limitation of dry-pressing formed mould and technology makes that its each dry-pressing formed efficient is lower; 3) owing to dry-pressing formed bigger, so its mould maintenance cost is also higher to die wear.
Summary of the invention
The object of the present invention is to provide a kind of method of efficient that provide with the making inductance porcelain core substrate that reduces cost.
For solving above-mentioned purpose, the invention provides a kind of method of making inductance porcelain core substrate, comprise the steps:
1) prepares ceramic casting slurry with the ball milling batching mode;
On dicing film, the oven dry back forms certain thickness ceramic green sheet to the ceramic casting slurry that 2) will prepare with casting machine stream;
3) a plurality of ceramic green sheets are stacked together;
4) with the warm water isostatic pressing machine with the ceramic substrate pressing of folding;
5) with the groove of leaving inductance porcelain core substrate at hobboing cutter cutting machine equidistant interval on ceramic substrate;
6) ceramic substrate that will hold groove successfully with the chopper cutting machine cuts into independently inductance porcelain core substrate.
Said step 2) thickness of ceramic green sheet is preferably 10~100 μ m in.
In the said step 3), the number of the said ceramic green sheet that stacks is preferably 20~100.
The parametric optimization that said warm water isostatic pressing machine is set is: pressurize 6 minutes under pressure 25MPa earlier, then pressurize 10 minutes under pressure 35MPa.
Be preferably 200~10000 μ m with the thickness after the pressing of warm water isostatic pressing machine in the said step 4).
Said ceramic casting slurry is preferably by MGA powder, high-performance phosphite antioxidant S9228, ETHYLE ACETATE, ROHM AND HAAS Paraloid TMLao Baila thermoplastic acrylic resin A-21, Virahol and hexanodioic acid dibutyl ester are formed.
MGA powder, high-performance phosphite antioxidant S9228, ETHYLE ACETATE, ROHM AND HAAS Paraloid TMThe weight proportion of Lao Baila thermoplastic acrylic resin A-21, Virahol and hexanodioic acid dibutyl ester was followed successively by 1: 0.015: 2: 0.3: 0.1: 0.1.
The temperature of said oven dry preferably is divided into five stages: the fs: 45~51 ℃; Subordinate phase: 52~58 ℃; Phase III: 62~68 ℃; Stage: 69~75 ℃; Five-stage: 62~68 ℃, each stage drying time is 2~4min.
The present invention makes inductance porcelain core substrate with range upon range of cutting mode, and this method is than the improvements of traditional method: 1) batching mode gets final product curtain coating after using the ball milling solubilizing agent to mix, and need not carry out mist projection granulating, enhances productivity; 2) overlapped way is used in moulding, can once make 2000Pc s inductance porcelain core substrate simultaneously, and shaping efficiency improves greatly; Less when 3) making the porcelain core wafer pockets to equipment loss with cutting mode, so its cost of equipment maintenance is also lower.
Description of drawings
Fig. 1 is an inductance porcelain core substrate front view of the present invention;
Fig. 2 makes inductance porcelain core substrate overlapped way synoptic diagram for the present invention with range upon range of cutting mode;
Fig. 3 is range upon range of and warm water isostatic pressing machine compacting back ceramic substrate figure for the present invention;
Fig. 4 leaves inductance porcelain core wafer pockets figure for the present invention with the hobboing cutter cutting machine on ceramic substrate.
Embodiment
Followingly the present invention is elaborated with reference to accompanying drawing.
Ceramic casting slurry of the present invention is made up of glass powder, tackiness agent, dispersion agent, solvent and softening agent.Specifically, glass powder adopts the MGA powder, and particle diameter D50 is 1~3 μ m, and said tackiness agent can adopt ROHM AND HAAS Paraloid TMLao Baila thermoplastic acrylic resin A-21; Said dispersion agent can adopt high-performance phosphite antioxidant S9228; Said solvent can adopt the mixture of ETHYLE ACETATE and Virahol; Said softening agent can adopt the hexanodioic acid dibutyl ester, more than each material be that the weight proportion of MGA powder, dispersion agent, ETHYLE ACETATE, adhesive A-21, Virahol and hexanodioic acid dibutyl ester was followed successively by 1: 0.015: 2: 0.3: 0.1: 0.1;
Employed casting machine is from Zhaoqing Honghua Electronic Technique Co., Ltd., and model is HHLY0020.
Employed dicing film is from Dongguan City Dongyuan County Science and Technology Ltd., and model is SRC-T50-1L, and specification is 50 μ m * 150mm * 150mm.
Employed warm water isostatic pressing machine is from the Foshan City hundred million Polyurethane hydraulic machinery ltds of fighting, and model is DJY-GB-L.
Employed hobboing cutter cutting machine is from Wuhan three worker's photoelectricity ltds, and model is SES15.
Employed scribing machine converges from Shenyang wins equipment manufacturing company, and model is ZSH508
Employed chopper cutting machine is from Zhaoqing Honghua Electronic Technique Co., Ltd., and model is 0402.
Embodiment 1
The invention provides a kind of method of making inductance porcelain core substrate, comprise the steps:
1) prepares ceramic casting slurry with the ball milling batching mode;
At first prepare ceramic casting slurry, take by weighing following each material: MGA powder, high-performance phosphite antioxidant S9228, ETHYLE ACETATE, ROHM AND HAAS Paraloid with the ball milling batching mode TMLao Baila thermoplastic acrylic resin A-21, Virahol and hexanodioic acid dibutyl ester, its weight proportion was followed successively by 1: 0.015: 2: 0.3: 0.1: 0.1, use the ball mill ball milling, drum's speed of rotation is 40~50r/min, the ball milling time is 39~41h.
On dicing film, the oven dry back forms certain thickness ceramic green sheet to the ceramic casting slurry that 2) will prepare with casting machine stream;
Then the above-mentioned ceramic casting slurry for preparing is flowed on dicing film with casting machine, the curtain coating speed of casting machine is 2.9~3.5m/mi n, and edge of a knife height is 95~195 μ m, and extraction flow is 185~215m 3/ h, oven dry then, bake out temperature is divided into five stages: the fs: 45~51 ℃; Subordinate phase: 52~58 ℃; Phase III: 62~68 ℃; Stage: 69~75 ℃; Five-stage: 62~68 ℃, each stage drying time is 2~4min, promptly forms the ceramic green sheet 201 of following specification after the oven dry: long is 160mm, and wide is 160mm, and height is 50 μ m (see figure 2)s.
3) a plurality of ceramic green sheets are stacked together;
Then 13 ceramic green sheets 201 are stacked together;
4) with the warm water isostatic pressing machine with the ceramic substrate pressing of folding;
With the ceramic substrate pressing (see figure 3) of folding, the parameter that the warm water isostatic pressing machine is set is: pressurize is 6 minutes under pressure 25MPa with the warm water isostatic pressing machine, then pressurize 10 minutes under pressure 35MPa, and the thickness after the pressing is 0.55-0.6mm.
5) with the groove of leaving inductance porcelain core substrate at hobboing cutter cutting machine equidistant interval on ceramic substrate;
On ceramic substrate, leave the groove 401 of inductance porcelain core substrate then with hobboing cutter cutting machine and scribing machine, see Fig. 4, the specification of groove 401 is: long 160mm, and wide 0.56mm, high 0.1mm, the distance between the adjacent grooves is 0.5mm.
6) ceramic substrate that will hold groove successfully with the chopper cutting machine cuts into independently inductance porcelain core substrate.
The ceramic substrate that to hold groove 401 successfully with the chopper cutting machine at last cuts into independently inductance porcelain core substrate 101 (Fig. 1), and this moment, inductance ceramic chip 101 specification was: 1005 models (long 1.0mm, wide 0.5mm, high 0.5mm).
Embodiment 2
The difference of this embodiment and embodiment 1 is: the number that ceramic green sheet 201 stacks in the step 3) is 18; Thickness in the step 4) after the pressing of warm water isostatic pressing machine is 0.8-0.85mm; The specification of leaving groove 401 in the step 5) is: long 160mm, wide 1.02mm, high 0.2mm; Distance between the adjacent grooves is 0.75mm, and the specification that obtains inductance ceramic chip 101 in the step 6) thus is: 1608 models (long 1.6mm, wide 0.8mm, high 0.8mm).
Embodiment 3
The difference of this embodiment and embodiment 1 is: the number that ceramic green sheet 201 stacks in the step 3) is 27; Thickness in the step 4) after the pressing of warm water isostatic pressing machine is 1.24-1.27mm; The specification of leaving groove 401 in the step 5) is: long 160mm, and wide is 1.21mm, height is 0.6mm; Distance between the adjacent grooves is 1.2mm, and the specification that obtains inductance ceramic chip 101 in the step 6) thus is: 2012 models (long 2.0mm, wide 1.2mm, high 0.8mm)
Above content is to combine concrete preferred implementation to the further explain that the present invention did, and can not assert that practical implementation of the present invention is confined to these explanations.For the those of ordinary skill of technical field under the present invention, conceive under the prerequisite not breaking away from the present invention, can also make some simple deduction or replace, all should be regarded as protection domain of the present invention.

Claims (8)

1. a method of making inductance porcelain core substrate is characterized in that, comprises the steps:
1) prepares ceramic casting slurry with the ball milling batching mode;
On dicing film, the oven dry back forms certain thickness ceramic green sheet to the ceramic casting slurry that 2) will prepare with casting machine stream;
3) a plurality of ceramic green sheets are stacked together;
4) with the warm water isostatic pressing machine with the ceramic substrate pressing of folding;
5) with the groove of leaving inductance porcelain core substrate at hobboing cutter cutting machine equidistant interval on ceramic substrate;
6) ceramic substrate that will hold groove successfully with the chopper cutting machine cuts into independently inductance porcelain core substrate.
2. according to the method for the said making inductance of claim 1 porcelain core substrate, it is characterized in that said step 2) in the thickness of ceramic green sheet be 10~100 μ m.
3. according to the method for the said making inductance of claim 2 porcelain core substrate, it is characterized in that in the said step 3), the number of the said ceramic green sheet that stacks is 20~100.
4. according to the method for each said making inductance porcelain core substrate in the claim 1 to 3, it is characterized in that the parameter that said warm water isostatic pressing machine is set is: pressurize 6 minutes under pressure 25MPa earlier, then pressurize 10 minutes under pressure 35MPa.
5. according to the method for the said making inductance of claim 4 porcelain core substrate, it is characterized in that the thickness in the said step 4) after the pressing of use warm water isostatic pressing machine is 200~10000 μ m.
6. according to the method for the said making inductance of claim 1 porcelain core substrate, it is characterized in that said ceramic casting slurry is by MGA powder, high-performance phosphite antioxidant S9228, ETHYLE ACETATE, ROHM AND HAAS Paraloid TMLao Baila thermoplastic acrylic resin A-21, Virahol and hexanodioic acid dibutyl ester are formed.
7. according to the method for the said making inductance of claim 6 porcelain core substrate, it is characterized in that said MGA powder, high-performance phosphite antioxidant S9228, ETHYLE ACETATE, ROHM AND HAAS Paraloid TMThe weight proportion of Lao Baila thermoplastic acrylic resin A-21, Virahol and hexanodioic acid dibutyl ester was followed successively by 1: 0.015: 2: 0.3: 0.1: 0.1.
8. according to the method for claim 6 or 7 said making inductance porcelain core substrates, it is characterized in that the temperature of said oven dry is divided into five stages: the fs: 45~51 ℃; Subordinate phase: 52~58 ℃; Phase III: 62~68 ℃; Stage: 69~75 ℃; Five-stage: 62~68 ℃, each stage drying time is 2~4min.
CN201210110093.4A 2012-04-16 2012-04-16 Method for manufacturing inductance porcelain core substrate Expired - Fee Related CN102617155B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105098300A (en) * 2015-09-11 2015-11-25 禾邦电子(中国)有限公司 Common-mode filter and manufacturing method therefor

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101266854A (en) * 2007-03-16 2008-09-17 西北工业大学 A method for preparing zinc oxide-based varistors
CN102122553A (en) * 2010-12-17 2011-07-13 深圳顺络电子股份有限公司 Low-resistance-value sheet-type negative-temperature-coefficient thermal resistor with horizontal structure and manufacturing method thereof
CN102129899A (en) * 2010-12-17 2011-07-20 深圳顺络电子股份有限公司 Low-resistance chip type negative temperature coefficient thermistor in vertical structure and manufacturing method thereof
CN102148082A (en) * 2010-11-26 2011-08-10 深圳顺络电子股份有限公司 Manufacturing methods and equipment of laminated type ceramic electronic element and cover plate layer

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101266854A (en) * 2007-03-16 2008-09-17 西北工业大学 A method for preparing zinc oxide-based varistors
CN102148082A (en) * 2010-11-26 2011-08-10 深圳顺络电子股份有限公司 Manufacturing methods and equipment of laminated type ceramic electronic element and cover plate layer
CN102122553A (en) * 2010-12-17 2011-07-13 深圳顺络电子股份有限公司 Low-resistance-value sheet-type negative-temperature-coefficient thermal resistor with horizontal structure and manufacturing method thereof
CN102129899A (en) * 2010-12-17 2011-07-20 深圳顺络电子股份有限公司 Low-resistance chip type negative temperature coefficient thermistor in vertical structure and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105098300A (en) * 2015-09-11 2015-11-25 禾邦电子(中国)有限公司 Common-mode filter and manufacturing method therefor

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Granted publication date: 20141105

Termination date: 20160416