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CN102615554A - Processing method of miniature spherical or aspherical lens array - Google Patents

Processing method of miniature spherical or aspherical lens array Download PDF

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Publication number
CN102615554A
CN102615554A CN2012101085455A CN201210108545A CN102615554A CN 102615554 A CN102615554 A CN 102615554A CN 2012101085455 A CN2012101085455 A CN 2012101085455A CN 201210108545 A CN201210108545 A CN 201210108545A CN 102615554 A CN102615554 A CN 102615554A
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micro
grinding
spherical
lens
ultrasonic wave
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CN102615554B (en
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马仁祥
李长华
李彦
姚振罡
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Jilin Ju Hong Intelligent Technology Co ltd
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CCRSPARK Co Ltd
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Abstract

本发明一种微型球面或非球面透镜阵列的加工方法,通过带有多条沟槽磨刃的砂轮在玻璃基片上分别研磨出相互垂直横向、纵向沟槽形成了端面为正方形的长方柱体矩阵;对长方柱体再用凹形磨刃的磨头旋转研磨成球面或非球面面形的微型透镜基本体;换用粒度较小的同结构微型磨头对微型透镜基本体进行精研磨;利用微型抛光头对已经过精研磨的微型透镜基本体进行抛光,抛光时需不断加入研磨剂,研磨剂的粒度要由粗到细依次不断更换,直至光洁度达到设计要求。

Figure 201210108545

The invention relates to a processing method of a micro-spherical or aspheric lens array, which uses a grinding wheel with multiple grooves to grind the vertical grooves on the glass substrate respectively to form a rectangular cylinder with a square end face. Matrix; the rectangular cylinder is then rotated and ground into a spherical or aspheric micro-lens basic body with a concave-shaped grinding head; the micro-lens basic body is finely ground with a micro-grinding head of the same structure with a smaller particle size ; Use the micro-polishing head to polish the micro-lens basic body that has been finely ground. During polishing, abrasives must be added continuously, and the particle size of the abrasives must be changed from coarse to fine until the finish meets the design requirements.

Figure 201210108545

Description

The processing method of a kind of micro-spherical surface or non-spherical lens array
 
Technical field
The present invention provides the processing method of a kind of micro-spherical surface or non-spherical lens array, is used for the processing and manufacturing of minitype optical device, belongs to the optics manufacture field.
Technical background
Along with expanding economy, more and more stronger to the demand of microdevice.The demand of the optics of micro-scale is also increasing sharply, and for example is applied to key areas such as space flight, national defence, medical treatment.Therefore, micro fabrication and Study on Technology are inquired into, received people's attention deeply.
Along with reducing of processing dimension, array type device particularly, because structural symmetry is poor, difficulty of processing significantly increases, and continues to use traditional processing method processing minitype optical device and often is difficult to realize.At present, the hyperfine processing of minitype optical device has been become the research direction in advanced manufacturing technology field, minitype optical device is made and is still belonged to cutting edge technology.
In recent years, people are inquiring into the worker of the whole bag of tricks Calais minitype optical devices such as employing chemical etching, hot melt casting, ion beam etching, electron beam lithography.But these methods also all exist some drawbacks separately, for example implement difficulty big, be not easy control, having problems aspect efficient, effect, the cost, also do not obtain the method for gratifying maturation yet.
Summary of the invention
The processing method of a kind of micro-spherical surface of the present invention or non-spherical lens array solves normal miniature optics processing method and is difficult to process problem miniature and the array type lens.
Of the present invention Technical solution is following:Carrying out the micro-lens array device fabrication and at first will adopt the grinding tool that is used for machine-shaping, is to adopt the suitable skive of granularity, processes many rectangle grooves at the working face of emery wheel; Process miniature bistrique according to product structure feature.Process several kinds of miniature bistriques that the material granularity is different, add grinding successively from coarse to fine in man-hour, the face molded dimension of making reaches requirement and improves the device surface smoothness gradually; Process miniature rubbing head, rubbing head is to utilize spring clamping polishing cloth material to process.Rubbing head with this special processing needs constantly to add grinding agent when polishing.The granularity of grinding agent is wanted from coarse to fine and is constantly changed successively, reaches designing requirement until fineness.
The processing method of micro-spherical surface provided by the invention or non-spherical lens array, concrete steps are following:
1) on glass substrate, grinding out mutual vertical transverse, longitudinal groove respectively through the emery wheel that has many groove sharpenings, to have formed end face be foursquare rectangular cylinder matrix;
2) utilize ultrasonic wave bistrique, under the process conditions of using outstanding abrasive material supernatant liquid and being correlated with, will grind to form cylindric at the rectangular cylinder of glass surface with cylindrical pit;
3) utilize diamond dust ultrasonic wave bistrique and outstanding abrasive material supernatant liquid, the cylindrical glass cylinder is ground to form spherical minute surface (or aspheric surface) micromirror body; It is littler to use a step granularity instead, and lens mirror body is carried out smooth grinding, makes the appearance and size of mirror body and flatness reach designing requirement
4) utilize miniature rubbing head and grinding agent that the minute surface of micro lens body is polished, make fineness reach designing requirement.
The skive that described method adopted processes many grooves at its working face, and the width of groove equals the diameter of lenticule body, and gash depth is slightly larger than the height of lenticule body.
Described ultrasonic wave grinding head working face is provided with several cylindrical pits, and dimple size is corresponding with micro lens.
The lower end of said miniature rubbing head is connected with spring, and the polishing fibrous material inserts between the steel wire ring of spring tail end, and bonded adhesives is coated in the outside, will polish fiber and be fixed in the spring; Simultaneously, with bonded adhesives spring and cylinder are cemented.
Good effect of the present invention is:Through adopting special type diamond dust grinding tool, ultrasonic wave grinding tool and miniature rubbing head to carry out whole processing and local monomer lens being processed the method that combines one by one, can be relatively easy to process array element.The depth-to-width ratio of this processing method is very high, can on each element, process the structure of different depth-to-width ratios; At the equipment input cost or all much lower aspect the production and processing cost, than being easier to the application that puts it over than other method; Solve conventional optical-mechanical processing method and be difficult to process problem miniature and the array type lens.
Description of drawings
Fig. 1 is used base material (optical glass substrate) sketch map of processing miniature array optical lens;
Fig. 2 is an emery wheel grinding process sketch map;
Fig. 3 is the square cylinder array of figure;
Fig. 4 is ultrasonic variable amplitude bar and grinding head;
Fig. 5 is the ultrasonic working head that has a plurality of cylindrical pits;
Fig. 6 is a ultrasonic wave lapping device structural representation;
Fig. 7 is the little array of cylinders figure of glass;
Fig. 8 has the miniature bistrique of ultrasonic wave of single pit and the microcylinder of being processed
Fig. 9 is miniature rubbing head structural representation;
Figure 10 shows the structure intention for the miniature non-spherical lens arra;
Among the figure, 10, glass substrate; 11, groove; 12, microcylinder; 13, square cylinder; 14, mirror body side surface; 20, emery wheel; 30, the miniature bistrique of ultrasonic wave; 31, pit; 40, polished rod; 41, spring; 42, polyester fiber; 43, bonded adhesives; 44, polishing agent; 51, ultrasonic grinding head; 52, ultrasonic variable amplitude bar; 51, ultrasonic grinding head; 10, optical glass substrate; 50, abrasive suspension; 51, ultrasonic grinding head; 52, ultrasonic variable amplitude bar; 53, ultrasonic head; 54, supersonic generator; 61, body; 62, agitator; 63, tank.
The specific embodiment
Embodiment 1
In said method, Fig. 1 is the optical glass substrate 10 that is used to process microlens array, and its upper surface need carry out polishing in advance, reaches the optical mirror plane requirement.
Grind two group orthogonal grooves 11 with the emery wheel 20 that has many grooves at glass surface by Fig. 2, between two groups of grooves, formed some square cylinders, formed the square column array by the square cylinder of these queueing disciplines, as shown in Figure 3.
Ultrasonic wave grinding head 51 shown in Figure 4 is connected with ultrasonic variable amplitude bar 52, and ultrasonic wave grinding head 51 is made up of a plurality of cylindrical pits 31, and its shape is seen Fig. 5.Grind to form cylinder to square cylinder with this bistrique, as Fig. 7, shown in Figure 8 be to have the miniature bistrique 30 of ultrasonic wave of single pit and the microcylinder of being processed 12, on the bistrique degree of depth of pit 31 equaled the height of glass cylinder.Bistrique 51 all adopts tool steel to make with bistrique 30.
What carry out that the ultrasonic wave attrition process adopts is ultrasonic wave lapping device shown in Figure 6, and wherein the operating frequency of supersonic generator 54, power output adjustable continuously from 15 kHz to 40kHz is 1500W.The body 61 of ultrasonic wave lapping device can be changed a social system with plane drill press, can control ultrasonic wave bistrique 51 and steadily move up and down.Glass substrate 10 is fixed in the flat tank 63, has wherein added abrasive suspension 50, and liquid level exceeds about 10mm than glass substrate 10.Abrasive suspension 50 is that ratio is 1:3.5 (weight) with 200 purpose silicon carbide abrasives and water configuration.Do not stop to stir through agitator 62, abrasive material is evenly distributed in water and circulates.Need apply the pressure of about 1kg during grinding to ultrasonic working head 51.Fig. 7 is the array of cylinders sketch map.
Shown in Figure 9 40~44 is the structure of miniature rubbing head, be ring that polyester fiber 42 is embedded springs 41 1 ends with ring between, and coat bonded adhesives 43 in spring 41 outsides, polyester fiber 42 and spring 41 are fixed.Simultaneously, with spring 41 and polished rod 40 fix tightlies.Aim at polished glass micro-cylinder 12 with rubbing head 40 and be rotated grinding and polishing.Polishing process will often add polishing agent 44.Treat to have polished all microcylinders 12, then the lens arra device is with regard to completion of processing.Figure 10 is non-array of spherical lenses sketch map.
Embodiment 2
Process a miniature nonlinear optics lens arra, the height that the device monnolithic case is of a size of 32mm * 32mm * 4.5mm, single lens microcylinder 14 be on 2.5mm, the microcylinder 12 the garden diameter be under the 2.6mm garden diameter be 3.0mm be nonlinear change, lens arrangement is that 5 * 5 arrays, lens material are G9 optical glass.
Several steps below manufacturing process is divided:
One, ultrasonic four hole grinding machine heads 51 of (1) Design and Machining, the degree of depth of its cylindrical pit are that 3.5mm, diameter are that 3.1mm, adjacent pits back gauge are 3.0mm.The used material of bistrique is a tool steel.(2) Design and Machining ultrasonic wave single hole bistrique 30, and with reference to 31 among Fig. 8, the axis of great circle material of pit is 3.0, and axis of small circle is 2.7mm.Material is a tool steel.(3) with reference to Fig. 9 Design and Machining rubbing head 40, the internal diameter of spring 41 is 7mm.(4) by shown in Figure 2, on the working face of emery wheel 20, process the sharpening of 5 grooves, its degree of depth is 1.8mm, the width 2.2mm of groove, the width of lug boss is 1.2mm between two adjacent grooves.
Two, on optical glass substrate 10, carrying out horizontal and vertical grinding respectively with emery wheel on the precision horizontal surface grinding machine, grind rectangle cylinder 13, as shown in Figure 3.
Three, use the ultrasonic grinding head 51 ground sample glass of ultrasonic wave lapping device, grind one by one for 20 microcylinders of 5 * 5 dot matrix and make it to become cylindric, during grinding bistrique applied the pressure of about 1kg with four holes.
Four, use 30 pairs of cylinders of single hole ultrasonic wave grinding head to grind one by one then, make column become among Fig. 8 12 shape.
Five, use 40 pairs of rubbing heads to polish with reference to Fig. 9 through the microtrabeculae 12 that above step grinds to form sphere shape.Use earlier granularity 220 purpose polishing powders slightly to throw, and then to use granularity be that 320 purpose polishing powders carry out essence throwing, till fineness reaches requirement.Finished product is referring to Figure 10.
Embodiment 3
Process a micro-spherical surface optical lens array, the height that the device monnolithic case is of a size of 23mm * 20mm * 4.5mm, single lens microcylinder 14 is that the garden diameter is that the garden diameter is that the side of 2.4mm, microcylinder is that spherical diameter 2.4mm, lens arrangement are that 5 * 4 arrays, lens material are G9 optical glass under the 1.9mm on 1.2mm, the microcylinder 12.Process relevant grinding tool according to above-mentioned parameter:
(1) ultrasonic four hole grinding machine heads 51 of Design and Machining, the degree of depth of its cylindrical pit 31 are that 1.6mm, diameter are that 2.6mm, adjacent pits back gauge are 2.8mm; The used material of bistrique is a tool steel.
2) Design and Machining ultrasonic wave single hole bistrique 30, and in Fig. 8, the axis of great circle of pit 31 is 2.5, and axis of small circle is 2.0mm; Material is a tool steel.
(3) with reference to Fig. 9 Design and Machining rubbing head 40, the internal diameter of spring 41 is 5.0mm.
(4) on the working face of emery wheel 2.0, process the sharpening of 5 grooves, its degree of depth is 1.6mm, the width 2.6mm of groove, and the width of lug boss is 2.4mm between two adjacent grooves.
Its process is with embodiment 1.

Claims (4)

1. the preparation method of micro-spherical surface or non-spherical lens array may further comprise the steps:
1) on glass substrate, grinding out mutual vertical transverse, longitudinal groove respectively through the emery wheel that has many groove sharpenings, to have formed end face be foursquare rectangular cylinder matrix;
2) utilize ultrasonic wave bistrique, under the process conditions of using outstanding abrasive material supernatant liquid and being correlated with, will grind to form cylindric at the rectangular cylinder of glass surface with cylindrical pit;
3) utilize diamond dust ultrasonic wave bistrique and outstanding abrasive material supernatant liquid, the cylindrical glass cylinder is ground to form spherical minute surface or aspheric micromirror body; It is littler to use a step granularity instead, and lens mirror body is carried out smooth grinding, makes the appearance and size of mirror body and flatness reach designing requirement
4) utilize miniature rubbing head and grinding agent that the minute surface of micro lens body is polished, make fineness reach designing requirement.
2. method according to claim 1, it is characterized in that: the skive that is adopted processes many grooves at its working face, and the width of groove equals the diameter of lenticule body, and gash depth is slightly larger than the height of lenticule body.
3. method according to claim 1 is characterized in that: the working face of ultrasonic wave grinding head is provided with several cylindrical pits.
4. the rubbing head that relates to of the said preparation method of claim 1, it is characterized in that: the lower end of miniature rubbing head is connected with spring, and the polishing fibrous material inserts between the steel wire ring of spring tail end, and bonded adhesives is coated in the outside, will polish fiber and be fixed in the spring; Simultaneously, with bonded adhesives spring and cylinder are cemented.
CN201210108545.5A 2012-04-15 2012-04-15 Processing method of miniature spherical or aspherical lens array Expired - Fee Related CN102615554B (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104708502A (en) * 2015-03-11 2015-06-17 浙江工业大学 Method for machining tiny grooves through ultrasonic grinding
CN104723175A (en) * 2015-03-11 2015-06-24 浙江工业大学 Ultrasonic grinding micro female die machining device
CN105364640A (en) * 2015-11-19 2016-03-02 浙江工业大学 Chemical-mechanical grading compound manufacturing method for micro-semi-ring concave die array
CN105479275A (en) * 2015-11-19 2016-04-13 浙江工业大学 Micro half ring die array micro ultrasonic classification polishing method
CN108747609A (en) * 2018-06-27 2018-11-06 天津大学 A kind of accurate grinding processing method of aspherical array structure

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WO1989008535A1 (en) * 1988-03-10 1989-09-21 Extrude Hone Corporation Ultrasonic polishing
CN1373698A (en) * 2000-07-13 2002-10-09 机械设计有限公司 Micro burnishing apparatus using ultrasonic vibration
US20030211014A1 (en) * 2002-03-20 2003-11-13 Michael Jacquorie Method of making micro titer plates and micro titer plates made thereby
CN1569396A (en) * 2003-07-16 2005-01-26 上海新华霞实业有限公司 Grind process for optical sapphire crystal substrate
CN1846937A (en) * 2005-04-13 2006-10-18 云南北方光学电子集团有限公司 Processing method of optical glass and silicon single crystal aspheric optical element
CN2873414Y (en) * 2005-11-04 2007-02-28 鸿富锦精密工业(深圳)有限公司 Round rolling device
CN201020638Y (en) * 2007-04-10 2008-02-13 哈尔滨工大奥瑞德光电技术有限公司 Ultrasonic vibration abrasive machining composite processing tool
CN101762836A (en) * 2008-10-13 2010-06-30 赵云峰 Production method of miniature concave lens

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1989008535A1 (en) * 1988-03-10 1989-09-21 Extrude Hone Corporation Ultrasonic polishing
CN1373698A (en) * 2000-07-13 2002-10-09 机械设计有限公司 Micro burnishing apparatus using ultrasonic vibration
US20030211014A1 (en) * 2002-03-20 2003-11-13 Michael Jacquorie Method of making micro titer plates and micro titer plates made thereby
CN1569396A (en) * 2003-07-16 2005-01-26 上海新华霞实业有限公司 Grind process for optical sapphire crystal substrate
CN1846937A (en) * 2005-04-13 2006-10-18 云南北方光学电子集团有限公司 Processing method of optical glass and silicon single crystal aspheric optical element
CN2873414Y (en) * 2005-11-04 2007-02-28 鸿富锦精密工业(深圳)有限公司 Round rolling device
CN201020638Y (en) * 2007-04-10 2008-02-13 哈尔滨工大奥瑞德光电技术有限公司 Ultrasonic vibration abrasive machining composite processing tool
CN101762836A (en) * 2008-10-13 2010-06-30 赵云峰 Production method of miniature concave lens

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104708502A (en) * 2015-03-11 2015-06-17 浙江工业大学 Method for machining tiny grooves through ultrasonic grinding
CN104723175A (en) * 2015-03-11 2015-06-24 浙江工业大学 Ultrasonic grinding micro female die machining device
CN104723175B (en) * 2015-03-11 2016-12-07 浙江工业大学 Ultrasonic grinding small die process equipment
CN105364640A (en) * 2015-11-19 2016-03-02 浙江工业大学 Chemical-mechanical grading compound manufacturing method for micro-semi-ring concave die array
CN105479275A (en) * 2015-11-19 2016-04-13 浙江工业大学 Micro half ring die array micro ultrasonic classification polishing method
CN105479275B (en) * 2015-11-19 2017-12-05 浙江工业大学 A kind of micro- semi-ring cavity plate array micro ultrasound classification polishing method
CN108747609A (en) * 2018-06-27 2018-11-06 天津大学 A kind of accurate grinding processing method of aspherical array structure

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