CN102601529A - Method for improving machining efficiency of micro-channel preparation through femtosecond laser - Google Patents
Method for improving machining efficiency of micro-channel preparation through femtosecond laser Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 39
- 238000003754 machining Methods 0.000 title claims abstract description 20
- 238000002360 preparation method Methods 0.000 title abstract description 4
- 238000003384 imaging method Methods 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 230000011514 reflex Effects 0.000 claims description 4
- 239000003989 dielectric material Substances 0.000 claims description 3
- 230000009972 noncorrosive effect Effects 0.000 claims description 2
- 238000012545 processing Methods 0.000 abstract description 13
- 238000001208 nuclear magnetic resonance pulse sequence Methods 0.000 abstract description 7
- 238000005286 illumination Methods 0.000 abstract 1
- 238000002474 experimental method Methods 0.000 description 6
- 238000001228 spectrum Methods 0.000 description 6
- 238000003672 processing method Methods 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 241000931526 Acer campestre Species 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
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- 230000003287 optical effect Effects 0.000 description 3
- 230000010287 polarization Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
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Abstract
本发明涉及一种提高飞秒激光制备微通道加工效率的方法，属于飞秒激光应用技术领域。包括如下步骤：步骤一：利用飞秒激光系统产生飞秒脉冲激光，利用半波片和偏振片的组合调整能量，通过脉冲整形器把飞秒激光调制为飞秒间隔的脉冲序列；步骤二：把步骤一所得到的脉冲序列激光通过反射镜反射到物镜中聚焦，并借助CCD和照明光源成像，移动6维精密电控平台，使激光焦点位于水平放置于6维精密电控平台的样品的下表面；步骤三：计算机控制6维精密电控平台沿激光的传播方向运动，即可在样品上加工出微通道。本发明通过脉冲整形器把飞秒激光调制为飞秒间隔的脉冲序列，从而提高了微通道的制备效率。而且无需引入振动源，所以该方法不会降低精密加工的可控性。
The invention relates to a method for improving the processing efficiency of microchannels prepared by a femtosecond laser, and belongs to the technical field of femtosecond laser applications. The method includes the following steps: step 1: using a femtosecond laser system to generate a femtosecond pulse laser, using a combination of a half-wave plate and a polarizer to adjust the energy, and modulating the femtosecond laser into a femtosecond interval pulse sequence through a pulse shaper; step 2: The pulse sequence laser obtained in step 1 is reflected into the objective lens through the mirror to focus, and is imaged with the help of CCD and illumination source, and the 6-dimensional precision electronic control platform is moved so that the laser focus is located on the sample placed horizontally on the 6-dimensional precision electronic control platform. The lower surface; Step 3: The computer controls the 6-dimensional precision electronic control platform to move along the propagation direction of the laser, and the microchannel can be processed on the sample. In the invention, the femtosecond laser is modulated into a femtosecond-interval pulse sequence through a pulse shaper, thereby improving the preparation efficiency of the microchannel. Moreover, there is no need to introduce a vibration source, so this method will not reduce the controllability of precision machining.
Description
Technical field
The present invention relates to a kind of method that femtosecond laser prepares the microchannel working (machining) efficiency that improves, belong to the femtosecond laser applied technical field.
Background technology
The microchannel of big aspect ratio has a wide range of applications in fields such as gas or liquid microfluidic device, microreactor, electrophoresis, micro-full analytical systems.Silicon is because of its ripe mass production technology, is the matrix material of desirable preparation microchannel, yet at some light transmission had the field of specific (special) requirements, and silicon is substituted by polymer such as transparent dielectric material such as quartz glass, PMMA.
Femtosecond laser is because its high peak power has a wide range of applications at the little/manufacture field of receiving, and it promptly is one of them hot research problem that femtosecond laser is processed big aspect ratio microchannel.At document Y.Li, K.Itoh, W.Watanabe, K.Yamada; D.Kuroda, J.Nishii, Y.Jiang:Opt.Lett.26 is in 23 (2001); The author utilizes the auxiliary method of femtosecond laser water, processes with mode from bottom to top, has prepared inlet diameter～5 μ m; The microchannel of aspect ratio～1: 50, but process velocity has only 0.3 μ m/s, and efficient is lower; At document D.J.Hwang, T.Y.Choi, C.P.Grigoropoulos.Appl.Phys.A; 79; Among the 605-612 (2004), the author is utilized in and introduces the auxiliary method of ultrasonic wave in the water, is increased to 30 μ m/s to the speed of femtosecond laser processing microchannel; But in system of processing, introduce the ultrasonic vibration meeting and bring uncertain factor, reduce precision machined controllability to Precision Machining.
Summary of the invention
To the objective of the invention is in order addressing the above problem, thereby a kind of method that femtosecond laser prepares the microchannel working (machining) efficiency that improves to be provided.
The objective of the invention is to realize through following technology:
A kind of method that femtosecond laser prepares the microchannel working (machining) efficiency that improves of the present invention, concrete steps are following:
Step 1: utilize fs-laser system to produce femtosecond pulse, utilize the combination adjustment energy of half-wave plate and polarizer, be modulated to femtosecond pulse train at interval to femtosecond laser through pulse shaper;
Step 2: in focusing objective len, focus on through mirror reflects the resulting pulse train laser of step 1; And by CCD and lighting source imaging; Move the accurate automatically controlled platform of 6 dimensions, laser spot is positioned at be placed horizontally at the lower surface of the sample of the accurate automatically controlled platform of 6 dimensions.
Step 3: the accurate automatically controlled platform of computer control 6 dimensions moves along the direction of propagation of laser, can on sample, process the microchannel.
Said specimen material is transparent dielectric material, and thickness of sample must be less than the focal length of focusing objective len.
After said sample levels is fixed on the transparent slide, be positioned over again on the accurate automatically controlled platform of 6 dimensions.
Can inject non-corrosive liquid in the gap of said sample and slide.The lower surface of sample contacts with liquid, utilizes the chip that produces in the wicks microchannel process of liquid.
Realize the device of the inventive method, comprising: fs-laser system, half-wave plate, polarizer, pulse shaper, speculum, focusing objective len, sample, the accurate automatically controlled platform of 6 dimensions.
Its annexation is: the trend according to laser connects in order.Fs-laser system produces femtosecond laser, utilize the combination adjustment energy of half-wave plate and polarizer after, the entering pulse shaper is modulated to pulse train, is gone in the focusing objective len to focus on by the mirror reflects of 45 ° of placements then.
Beneficial effect
1, a kind of method that femtosecond laser prepares the microchannel working (machining) efficiency that improves of the present invention is modulated to femtosecond pulse train at interval to femtosecond laser through pulse shaper, thereby has improved the preparation efficiency of microchannel.
2, a kind of method that femtosecond laser prepares the microchannel working (machining) efficiency that improves of the present invention is compared with traditional femtosecond laser processing method, and under the energy of 20 μ J, the material of 500 femtoseconds pulse train is at interval removed efficient and improved 60 times than traditional pulse.
3, a kind of method that femtosecond laser prepares the microchannel working (machining) efficiency that improves of the present invention; Compare with traditional femtosecond laser processing method, under the energy of 35 μ J, pulse train is with the process velocity of 100 μ m/s; The about 20 μ m of inlet diameter have been prepared, 40: 1 microchannel of aspect ratio.And traditional femtosecond laser can't reach this processing effect under this speed.
4, the present invention need not to introduce vibration source, so this method can not reduce precision machined controllability.
Description of drawings
Fig. 1 is femto-second laser pulse sequence processing light path sketch map:
Fig. 2 places partial enlarged drawing for sample
Wherein, 1-fs-laser system, 2-half-wave plate, 3-polarizer, 4-pulse shaper, 5-speculum, 6-imaging CCD, 7-speculum, 8-focusing objective len, 9-sample, 10-6 tie up space, 14-slide between accurate automatically controlled platform, 11-lighting source, 12-double faced adhesive tape, 13-sample and the slide.
The specific embodiment
Below in conjunction with accompanying drawing and embodiment the present invention is further specified.
Embodiment 1
What fs-laser system 1 adopted is the laser instrument that U.S.'s spectrum physics (Spectrum Physics) company produces, optical maser wavelength 800nm, and pulse width 50 femtoseconds, repetition rate 1KHz, pulse ceiling capacity 3mJ, light distribution is a Gaussian, linear polarization.
Test specimen 9 is a K9 glass, and its thickness is 1.5mm.
The present invention proposes a kind ofly improves the method that femtosecond laser prepares the microchannel working (machining) efficiency, and processing light path sketch map is as shown in Figure 1, and concrete procedure of processing is following:
Step 1: utilize fs-laser system 1 to produce femtosecond pulse; 3 combinations are adjusted into 20 μ J to single pulse energy with polarizer to utilize half-wave plate 2; Be modulated to pulse train to traditional femtosecond laser through pulse shaper 4, comprise two sub-pulse in this sequence, the pulse spacing is 500 femtoseconds;
Step 2: be horizontally fixed on slide 14 on the accurate automatically controlled platform 10 of 6 dimensions, be horizontally fixed on sample 9 on the slide 14 with double faced adhesive tape 12, the fixed form of sample 9 is as shown in Figure 2; In the space 13 of sample 9 and slide 14, inject distilled water, the lower surface of sample 9 is contacted with water;
Step 3: reflex to focusing in 10 times of object lens 8 to the resulting pulse train laser of step 1 through speculum 7, by CCD 6 and lighting source 11 imagings; Move the relative position of accurate automatically controlled platform 10 adjustment focuses of 6 dimensions and sample 9; When the focusing focus is positioned at the lower surface of sample 9; The accurate automatically controlled platform 10 of control 6 dimensions moves 100 μ m along the opposite direction of laser propagation, makes laser spot be positioned at 100 μ m places under the lower surface of sample 9;
Step 4: the accurate automatically controlled platform 10 of computer control 6 dimensions moves 1000 μ m with the constant speed of 60 μ m/s along the direction of propagation of laser, promptly on sample 9, process the microchannel with the femto-second laser pulse sequence.
When closing pulse shaper, promptly be to process under the immovable situation of other experimental procedures with traditional femtosecond laser processing method, the about 0.5um3/s of its working (machining) efficiency; 500 femtoseconds that this experiment the is adopted about 30um3/s of pulse train working (machining) efficiency has at interval improved about 60 times, and this material removing rate of sentencing in the unit interval characterizes working (machining) efficiency.
Embodiment 2
What fs-laser system 1 adopted is the laser instrument that U.S.'s spectrum physics (Spectrum Physics) company produces, optical maser wavelength 800nm, and pulse width 50 femtoseconds, repetition rate 1KHz, pulse ceiling capacity 3mJ, light distribution is a Gaussian, linear polarization.
Test specimen 9 is a K9 glass, and its thickness is 1.5mm.
The present invention proposes a kind ofly improves the method that femtosecond laser prepares the microchannel working (machining) efficiency, and processing light path sketch map is as shown in Figure 1, and concrete procedure of processing is following:
Step 1: utilize fs-laser system 1 to produce femtosecond pulse; 3 combinations are adjusted into 36 μ J to single pulse energy with polarizer to utilize half-wave plate 2; Be modulated to pulse train to traditional femtosecond laser through pulse shaper 4, comprise two sub-pulse in this sequence, the pulse spacing is 900 femtoseconds;
Step 2: be horizontally fixed on slide 14 on the accurate automatically controlled platform 10 of 6 dimensions, be horizontally fixed on sample 9 on the slide 14 with double faced adhesive tape 12, the fixed form of sample 9 is as shown in Figure 2;
Step 3: reflex to focusing in 10 times of object lens 8 to the resulting pulse train laser of step 1 through speculum 7, by CCD 6 and lighting source 11 imagings; Move the relative position of accurate automatically controlled platform 10 adjustment focuses of 6 dimensions and sample 9; When the focusing focus is positioned at the lower surface of sample 9; The accurate automatically controlled platform 10 of control 6 dimensions moves 100 μ m along the opposite direction of laser propagation, makes laser spot be positioned at 100 μ m places under the K9 lower glass surface;
Step 4: the accurate automatically controlled platform 10 of computer control 6 dimensions moves 1200 μ m with the constant speed of 100 μ m/s along the direction of propagation of laser, promptly on sample 9, process the microchannel with the femto-second laser pulse sequence.
When closing pulse shaper, promptly be to process under the immovable situation of other experimental procedures with traditional femtosecond laser processing method; 900 femtoseconds that this experiment is adopted pulse train at interval can process the about 20 μ m of diameter, the microchannel that aspect ratio is about 15: 1, and traditional with this understanding femtosecond laser can't reach this processing effect.
Embodiment 3
What fs-laser system 1 adopted is the laser instrument that U.S.'s spectrum physics (Spectrum Physics) company produces, optical maser wavelength 800nm, and pulse width 50 femtoseconds, repetition rate 1KHz, pulse ceiling capacity 3mJ, light distribution is a Gaussian, linear polarization.
Test specimen 9 is a vitreous silica, and its thickness is 1.5mm.
The present invention proposes a kind ofly improves the method that femtosecond laser prepares the microchannel working (machining) efficiency, and processing light path sketch map is as shown in Figure 1, and concrete procedure of processing is following:
Step 1: utilize fs-laser system 1 to produce femtosecond pulse; 3 combinations are adjusted into 30 μ J to single pulse energy with polarizer to utilize half-wave plate 2; Be modulated to pulse train to traditional femtosecond laser through pulse shaper 4, comprise two sub-pulse in this sequence, the pulse spacing is 600 femtoseconds;
Step 2: be horizontally fixed on slide 14 on the accurate automatically controlled platform 10 of 6 dimensions, be horizontally fixed on sample 9 on the slide 14 with double faced adhesive tape 12, the fixed form of sample 9 is as shown in Figure 2; In the space 13 of sample 9 and slide 14, inject ethanol, the lower surface of sample 9 is contacted with ethanol;
Step 3: reflex to focusing in 10 times of object lens 8 to the resulting pulse train laser of step 1 through speculum 7, by CCD 6 and lighting source 11 imagings; Move the relative position of accurate automatically controlled platform 10 adjustment focuses of 6 dimensions and sample 9; When the focusing focus is positioned at the lower surface of sample 9; The accurate automatically controlled platform 10 of control 6 dimensions moves 100 μ m along the opposite direction of laser propagation, makes laser spot be positioned at 100 μ m places under the lower surface of sample 9;
Step 4: the accurate automatically controlled platform 10 of computer control 6 dimensions moves 1000 μ m with the constant speed of 80 μ m/s along the direction of propagation of laser, promptly on sample 9, process the microchannel with the femto-second laser pulse sequence.
When closing pulse shaper, promptly be to process under the immovable situation of other experimental procedures with traditional femtosecond laser processing method; 600 femtoseconds that this experiment is adopted pulse train at interval can process the about 18 μ m of diameter, the microchannel that aspect ratio is about 30: 1, and traditional with this understanding femtosecond laser can't reach this processing effect.
Claims (4)
1. one kind is improved the method that femtosecond laser prepares the microchannel working (machining) efficiency, it is characterized in that: comprise the steps:
Step 1: utilize fs-laser system 1 to produce femtosecond pulse, utilize the combination adjustment energy of half-wave plate 2 and polarizer 3, be modulated to femtosecond pulse train at interval to femtosecond laser through pulse shaper 4;
Step 2: reflex to focusing in the object lens 8 to the resulting pulse train laser of step 1 through speculum 7, and, move the accurate automatically controlled platform 10 of 6 dimensions, make laser spot be positioned at the lower surface of the sample 9 of horizontal positioned by CCD 6 and lighting source 11 imagings;
Step 3: the accurate automatically controlled platform 10 of computer control 6 dimensions moves along the direction of propagation of laser, can on sample 9, process the microchannel.
2. a kind of method that femtosecond laser prepares the microchannel working (machining) efficiency that improves as claimed in claim 1 is characterized in that: said sample 9 materials of step 2 are transparent dielectric material, and thickness of sample must be less than the focal length of focusing objective len.
3. a kind of method that femtosecond laser prepares the microchannel working (machining) efficiency that improves as claimed in claim 1 is characterized in that: after can also transparent slide 14 being horizontally fixed on the below of the said sample 8 of step 2, be positioned on the accurate automatically controlled platform 10 of 6 dimensions again.
4. a kind of method that femtosecond laser prepares the microchannel working (machining) efficiency that improves as claimed in claim 3 is characterized in that: can add non-corrosive liquid in the gap 13 of said sample 9 and slide 14.
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| CN103706955A (en) * | 2013-12-19 | 2014-04-09 | 北京理工大学 | Method for preparing high depth-diameter-ratio three-dimensional micro-channel through electronic dynamic control |
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| CN103639601A (en) * | 2013-12-19 | 2014-03-19 | 北京理工大学 | Three-dimensional periodic structure processing method based on electronic dynamic control |
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Application publication date: 20120725 |