CN102595863A - A shield can fixing clip for protecting emi having part-plating layer - Google Patents
A shield can fixing clip for protecting emi having part-plating layer Download PDFInfo
- Publication number
- CN102595863A CN102595863A CN2011103106038A CN201110310603A CN102595863A CN 102595863 A CN102595863 A CN 102595863A CN 2011103106038 A CN2011103106038 A CN 2011103106038A CN 201110310603 A CN201110310603 A CN 201110310603A CN 102595863 A CN102595863 A CN 102595863A
- Authority
- CN
- China
- Prior art keywords
- protective cover
- plating layer
- geometrical clamp
- electromagnetic wave
- blocking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title claims abstract description 33
- 230000001681 protective effect Effects 0.000 claims description 90
- 238000003466 welding Methods 0.000 claims description 33
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 27
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 25
- 238000000576 coating method Methods 0.000 claims description 21
- 239000011248 coating agent Substances 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 17
- 230000000694 effects Effects 0.000 claims description 16
- 229910052759 nickel Inorganic materials 0.000 claims description 13
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 11
- 238000009713 electroplating Methods 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 8
- 230000008569 process Effects 0.000 claims description 7
- 238000005452 bending Methods 0.000 claims description 3
- 239000006071 cream Substances 0.000 abstract 3
- 229910000679 solder Inorganic materials 0.000 abstract 3
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000012216 screening Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 208000032365 Electromagnetic interference Diseases 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
- H05K9/0035—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids with retainers mounted beforehand on the PCB, e.g. clips
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Clamps And Clips (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
A shield can fixing clip with a partial plating layer for preventing an electromagnetic wave is provided, including: a base unit attached to a printed circuit board; a pair of elastic pieces bent on both sides of the base unit, The pair of elastic pieces griping the sidewall of a shield can and an plating layer minimizing the surface resistance of a solder cream. The plating layer increases the surface resistance of the solder cream on the upper side of the base unit and prevents the entry of the solder cream. The playing layer is plated on the lower side of the base unit.
Description
Technical field
The blocking-up electromagnetic wave that the present invention relates to have the parcel plating layer is used the protective cover geometrical clamp; Particularly; Just the local bottom surface part of bonding pedestal is electroplated and is formed the parcel plating layer contacting with tellite, thereby can prevent that welding paste from getting into to the top of pedestal; If during the protective cover of electroplating with certain material, in order to reduce contact impedance, with the protective cover contact portion form with the plated material of protective cover just as part second electrodeposited coating, and can strengthen the interchangeability with protective cover.
Background technology
Usually electromagnetic wave is by useful radio communication or the radar etc. of being used in; But also can play negative effect to the running of electronic equipments; This phenomenon is called Electromagnetic Interference (EMI:Electro Magnetic Interference) phenomenon, and this EMI not only produces the communication obstacle signal of electrical equipment but also is harmful key element.
Thereby; To be built in recently the inner tellite of electrical equipment electronic component-uses such as semiconductor element fixed protective cover cover; And the EMI that blocking-up produces from above-mentioned electronic unit, thereby not only can not self electrical equipment be exerted an influence, and can not exert an influence to the running of other electrical equipment.
This protective cover is usually in order to clamp the sidewall of protective cover, and the protective cover geometrical clamp is arranged on the tellite.
Below with reference to the existing protective cover geometrical clamp of accompanying drawing simple declaration.
Fig. 7 is the cutaway view of existing protective cover geometrical clamp.Like Fig. 7; Protective cover geometrical clamp 1 roughly is made up of 4 parts; Comprise that the fixed part that contacts with tellite is the center, with connecting portion 5 clamping section 3 that to be media isolated the pedestal 4 that forms and the lateral vertical complications of said base 4 are formed by last direction and fixed part between fixed part 2 and connecting portion.
At this, being provided with usually of existing protective cover geometrical clamp 1 accomplished through the automatic welding sequence of surface-mounted technology (Surface Mount Technology) equipment.
This existing protective cover geometrical clamp 1 is placed on the welding paste of the surface of tellite through the processing of screening, and is fixed on the tellite automatically through the nozzle thermal vacuum absorption of surface-mounted technical equipment.
At this moment, existing protective cover geometrical clamp 1 is convenient to be bonded in welding paste in order to reduce surface impedance, forms through nickel/tin electroplating processes on the whole.
But because this nickel/tin electroplating processes; Can make welding paste be bonded at the top of pedestal 4 when bonding geometrical clamp 1 and welding paste; For part pedestal 4 and tellite are isolated, be that the center is that media forms warp architecture with connecting portion 5 with the fixed part 2 that contacts with tellite.
Thereby, the field of on tellite, smearing welding paste, promptly pad (soldering pad) is corresponding with above-mentioned warp architecture and form, and has therefore reduced the interchangeability with the geometrical clamp with different structure 1.
And this pedestal 4 warp architectures existence spills electromagnetic problem from insulating space, and has the problem because of the high stability reduction of height of whole protective roof.
And existing protective cover geometrical clamp 1 has been because integral body has been carried out nickel/tin electroplating processes, when therefore existing the protective cover of the electrodeposited coating that will have certain material to be installed in geometrical clamp 3, and the problem that makes geometrical clamp 3 damaged or be not easy to install because of contact impedance.
Summary of the invention
The present invention develops in order to achieve the above object; First purpose of the present invention is; Provide a kind of blocking-up electromagnetic wave with parcel plating layer to use the protective cover geometrical clamp, just the part of bonding base bottom surface is electroplated and is formed the parcel plating layer contacting with tellite, and can prevent that welding paste from getting into the top of pedestal; Therefore need not remove the operation of welding paste, can make the outward appearance of tellite keep clean.
Second purpose of the present invention is; Provide a kind of blocking-up electromagnetic wave to use the protective cover geometrical clamp with parcel plating layer; During the protective cover electroplated with certain material; In order to reduce contact impedance, forming identical part second electrodeposited coating of plated material with protective cover with the contact portion of protective cover, thereby can strengthen the interchangeability with protective cover.
The 3rd purpose of the present invention is; Provide a kind of blocking-up electromagnetic wave to use the protective cover geometrical clamp with parcel plating layer; Groove through forming in base bottom surface is taken in welding paste; Reduce the whole height of protective cover, thereby can realize the tellite slimming, and the height step-down of whole protective roof and make electromagnetic screening effect realize maximization.
Technical solution of the present invention is:
In order to achieve the above object, the invention is characterized in that first invention relates to the blocking-up electromagnetic wave with parcel plating layer and uses the protective cover geometrical clamp, comprises pedestal, it contacts with above-mentioned tellite and bonding; A pair of flexure strip, it upwards prolongs bending in order to clamp the sidewall of above-mentioned protective cover with the pliers form, forms relatively in the both sides of said base; And electrodeposited coating; It is electroplated and forms in the said base bottom surface; Be used for and will and minimize and strengthen bonding force carrying out surface impedance between the welding paste of cover reason on the above-mentioned tellite, and strengthen the surface impedance between said base top and the welding paste and block the entering of welding paste.
Preferably; In first invention, above-mentioned each flexure strip comprise with pedestal by the vertical component effect of 90 ° of bendings of vertical direction, above-mentioned vertical component effect crooked to the inside and pressurization part that the sidewall of protective cover is pressurizeed, be basic point and open laterally guidance part with above-mentioned pressurization part.
The 3rd invention preferably, when having carried out electroplating processes on the surface of above-mentioned protective cover with certain material in second invention, forms second electrodeposited coating identical with above-mentioned material at the pressurization part medial surface with above-mentioned protective cover contact.
The 4th invention is that preferably, in first invention or the 3rd invention, above-mentioned electrodeposited coating is to carry out nickel and tin successively to electroplate and form.
The 5th the invention do, preferably, the 4th the invention in, the thickness of above-mentioned nickel dam is 0.1 to 0.5, above-mentioned tin thickness is 2.1 to 2.5.
Technique effect of the present invention is:
According to the first embodiment of the present invention; Just bonding electroplating of base bottom surface forms the parcel plating layer contacting with tellite; And can prevent that welding paste from getting into pedestal top, and therefore need not remove the operation of welding paste, can make the outward appearance of tellite keep clean.
And; According to the first embodiment of the present invention, if the protective cover of electroplating with certain material, in order to reduce contact impedance; Form the second identical electrodeposited coating of plated material with protective cover with the certain fields part of the contact of protective cover, thereby can strengthen the interchangeability with protective cover; And can the contact impedance of foundation be minimized, and make the assembling of protective cover and pressurization part smooth, and the contact impedance of contact portion is low more, electromagnetic screening effect is big more, therefore also can be with electromagnetic barrier effect maximization.
And, according to the first embodiment of the present invention and second embodiment, need not to make pedestal to form warp architecture, in the time of therefore can be with manufacturing process's simplification applicable to the pad of any form, thereby strengthened interchangeability.
And, in a second embodiment, take in welding paste through the groove that the bottom surface at pedestal forms; Reduced the height of whole protective roof; Can realize the slimming of tellite, and make the whole height step-down of protective cover, and make electromagnetic shielding effect obtain maximization.
Description of drawings
Fig. 1 is the user mode figure with blocking-up electromagnetic wave of parcel plating layer with the protective cover geometrical clamp of the present invention;
Fig. 2 is the cutaway view of the blocking-up electromagnetic wave with parcel plating layer of the first embodiment of the present invention with the protective cover geometrical clamp;
Fig. 3 is the ground plan of Fig. 2;
Fig. 4 for the blocking-up electromagnetic wave of first embodiment with parcel plating layer with the protective cover geometrical clamp on the cross section structure figure of state of joint protective cover;
Fig. 5 is the bottom sectional view of the blocking-up electromagnetic wave of the second embodiment of the present invention with the groove of another embodiment of protective cover geometrical clamp;
Fig. 6 is the cross section structure figure of the state that combines with protective cover with the protective cover geometrical clamp of the blocking-up electromagnetic wave with parcel plating layer of second embodiment;
Fig. 7 is the cutaway view of existing protective cover geometrical clamp.
Symbol description
1: existing protective cover geometrical clamp 2: fixed part
3: clamping section 4: pedestal
5: connecting portion 10: pedestal
11: groove 20: flexure strip
21: vertical component effect 22: pressurization part
23: guidance part 30: electrodeposited coating
31: nickel dam 32: the tin layer
40: the second electrodeposited coatings
50: the blocking-up electromagnetic wave with parcel plating layer is used the protective cover geometrical clamp
60: tellite 61: welding paste
70: protective cover 80: electronic unit
Embodiment
Specify blocking-up electromagnetic wave according to the present invention below with reference to accompanying drawing and use the protective cover geometrical clamp.
[embodiment 1]
Fig. 1 is the user mode figure with blocking-up electromagnetic wave of parcel plating layer with the protective cover geometrical clamp of the present invention; Fig. 2 is the cutaway view of the blocking-up electromagnetic wave with parcel plating layer of the first embodiment of the present invention with the protective cover geometrical clamp; Fig. 3 is the ground plan of Fig. 2; Fig. 4 for the blocking-up electromagnetic wave of first embodiment with parcel plating layer with the protective cover geometrical clamp on the cross section structure figure of state of joint protective cover.
Extremely shown in Figure 4 like Fig. 1; The blocking-up electromagnetic wave that the present invention relates to have the parcel plating layer is with protective cover geometrical clamp 50; Be to be used for fixing the protective cover that covers the electronic unit 80 that is built in tellite in order to block electromagnetic wave; The part bottom surface of bonding pedestal is electroplated and is formed electrodeposited coating contacting with tellite, and can prevent that welding paste from getting into the upper end of geometrical clamp; In order to reduce and carry out the contact impedance between the protective cover that tin electroplates, form electrodeposited coating in contact portion, thereby can strengthen the interchangeability of carrying out between the protective cover that tin electroplates with protective cover.
This type of blocking-up electromagnetic wave with parcel plating layer is to be used for fixing the protective cover that covers the electronic unit 80 that is built in tellite with protective cover geometrical clamp 50, comprises pedestal 10, flexure strip 20, electrodeposited coating 30.
At this, said base 10 bottom surfaces form with smooth state, have improved the interchangeability as the field of smearing of the pad in the field of smearing welding paste 61, and reduced and tellite 60 between height, thereby can reduce the height of whole protective roof 70.
In these type of pedestal 10 bottom surfaces electrodeposited coating 30 is carried out parcel plating, and can strengthen and welding paste 61 between bonding force.
Above-mentioned electrodeposited coating 30 is to carry out nickel dam 31 successively to electroplate and form with tin layer 32, and above-mentioned nickel dam 31 is for the range upon range of tin layer plating on the geometrical clamp surface of steel or stainless steel material.
The thickness of this type of above-mentioned nickel dam 31 constitutes with 0.1 to 0.5 scope, is 0.1 when following like the thickness of nickel dam 31, the zinc-plated layer of the surface electrical of nickel dam 31 will make in 32 o'clock electroplate unstable, therefore suitable; As 0.5 when above,, therefore also suitable because of the rising of electroplating expense does not have the actual benefit of manufacturing expense.
And above-mentioned tin layer 32 is in order to reduce and to shelter the surface impedance between the welding paste 61 of processing on the surface of tellite 60, and improves bonding force, and preferably, gold-plated scope is 2.1 to 2.5.
At this, above-mentioned tin layer 32 is because 2.1 when following, because of surface impedance make and welding paste 51 between bonding force reduce, the 2.5 reduction effects compared with surface impedance when above cause the rising of manufacturing cost and do not have actual benefit, so do not suit.
And; Just bonding pedestal 10 bottom surfaces will be electroplated parcel plating layer 30 contacting with tellite 60; Thereby the welding paste 61 that can prevent to shelter on tellite 60 surfaces processing gets into the top of pedestals 10; Need not the removal operation of welding paste, finally can make the outward appearance of tellite 60 keep clean.
And above-mentioned flexure strip 20 is in order to clamp the sidewall of protective cover 70 with the pliers form, the both sides of said base 10 relatively to above tortuous the prolongation.
Above-mentioned each flexure strip 20 comprises by being benchmark and open laterally guidance part 23 with the crooked to the inside and pressurization part 22 that protective cover 70 sidewalls are pressurizeed of the vertical component effect 21 of 90 ° of complications of pedestal 10 vertical direction, above-mentioned vertical component effect 21, with above-mentioned pressurization part 22.
This type of flexure strip 20 is the electronic unit 70 electromagnetic protective covers 70 that are built in tellite 60 in order to be fixed for blocking.
At this, above-mentioned flexure strip 20 is convenient to make protective cover 70 because of guidance part 23 and is got into, and pressurizes through the sidewall of 22 pairs of protective covers 70 of pressurization part, prevents that protective cover 70 breaks away from from flexure strip 20.
Simultaneously, when electroplating processes is carried out with certain material in protective cover 70 surfaces, at the medial surface formation of the pressurization part 22 that contacts with above-mentioned protective cover 70 and second electrodeposited coating 40 of above-mentioned material identical materials.
When electroplating processes is carried out with certain material in this class formation such as protective cover 70 surfaces,, also has second electrodeposited coating 40 of part same material at above-mentioned pressurization part 22 medial surfaces for contact impedance is minimized.Therefore, can the contact impedance of contact portion be minimized, thereby the assembling between protective cover 70 and the pressurization part 22 can be installed smoothly; And the contact impedance of contact portion is low more, and electromagnetic screening effect is big more, therefore also can improve the electromagnetic wave blocking effect.
In the nature of things, when not possessing electrodeposited coating 30, also can not possess second electrodeposited coating 40 at pressurization part 22 medial surfaces on above-mentioned protective cover 70 surfaces.
[embodiment 2]
Secondly, the second embodiment of the present invention is described.In the present embodiment, structural element corresponding to those in the first embodiment is used identical reference numeral.
Fig. 5 is the bottom sectional view of the blocking-up electromagnetic wave of the second embodiment of the present invention with the groove of another embodiment of protective cover geometrical clamp; Fig. 6 is the cross section structure figure of the state that combines with protective cover with the protective cover geometrical clamp of the blocking-up electromagnetic wave with parcel plating layer of second embodiment.
Like Fig. 5 and Fig. 6, second embodiment comprises first embodiment, and just pedestal 10 bottom surfaces also are formed for welding paste 61 is accommodated in inner groove 11.
This class formation will be accommodated in groove 11 at the welding paste 61 that tellite 60 is sheltered processing, and available welding paste 61 is bonded in pedestal 10 on the tellite 60 simultaneously.
This class formation can contact pedestal 10 and bonding with tellite 60, and can the height of whole geometrical clamp 50 be reduced, thereby can realize the slimming of tellite 60.And, make above-mentioned welding paste 61 be accommodated in the groove 11 of pedestal 10, the amount of smearing of welding paste 61 is minimized.
And second embodiment is different with first embodiment, can said base 10 be contacted with tellite 60 and bonding, makes the height step-down of whole geometrical clamp, and improves electromagnetic shielding effect.
Right of the present invention is not limited to above-mentioned illustrated example, and is defined according to the record in the claim, has common knowledge the knowledgeable in the field of the present invention and can in the interest field of claim record, carry out various distortion and transformation in the nature of things.
Claims (6)
1. the blocking-up electromagnetic wave with parcel plating layer is used the protective cover geometrical clamp; It is the protective cover geometrical clamp that is used for fixing the protective cover that covers the electronic unit that is built in tellite in order to block electromagnetic wave; It is characterized in that: comprise pedestal, it contacts with said tellite and is bonding; A pair of flexure strip, it prolongs complications in order to clamp the sidewall of said protective cover with the pliers form and make progress, and forms relatively in the both sides of said pedestal; And electrodeposited coating; It is electroplated in said base bottom surface; Be used for and will and minimize and strengthen bonding force carrying out surface impedance between the welding paste of cover reason on the said tellite, and said pedestal top strengthen and welding paste between surface impedance and block the entering of welding paste.
2. the blocking-up electromagnetic wave with parcel plating layer according to claim 1 is used the protective cover geometrical clamp, it is characterized in that: each said flexure strip comprise with pedestal by the vertical component effect of 90 ° of bendings of vertical direction, said vertical component effect crooked to the inside and pressurization part that the sidewall of protective cover is pressurizeed, be basic point and open laterally guidance part with said pressurization part.
3. the blocking-up electromagnetic wave with parcel plating layer according to claim 2 is used the protective cover geometrical clamp; It is characterized in that: the surface of said protective cover forms second electrodeposited coating identical with said material if when carrying out electroplating processes with certain material at the pressurization part medial surface with said protective cover contact.
4. use the protective cover geometrical clamp according to claim 1 or 3 described blocking-up electromagnetic waves with parcel plating layer, it is characterized in that: said electrodeposited coating is to carry out nickel dam and tin layer successively to electroplate and form.
5. the blocking-up electromagnetic wave with parcel plating layer according to claim 4 is used the protective cover geometrical clamp, it is characterized in that: the thickness of said nickel dam is 0.1 to 0.5 scope, and said tin layer is 2.1 to 2.5 scopes.
6. the blocking-up electromagnetic wave with parcel plating layer according to claim 1 is used the protective cover geometrical clamp, it is characterized in that: said base bottom surface also comprises and is used for welding paste is accommodated in inner groove.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020110004219A KR101029221B1 (en) | 2011-01-14 | 2011-01-14 | Shield can fixing clip for electromagnetic shielding with partial plating layer |
| KR10-2011-0004219 | 2011-01-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102595863A true CN102595863A (en) | 2012-07-18 |
Family
ID=44050103
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103106038A Pending CN102595863A (en) | 2011-01-14 | 2011-10-13 | A shield can fixing clip for protecting emi having part-plating layer |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2012151437A (en) |
| KR (1) | KR101029221B1 (en) |
| CN (1) | CN102595863A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108463638A (en) * | 2015-12-25 | 2018-08-28 | 北川工业株式会社 | Fixture and fixed mechanism |
| US10165672B2 (en) | 2015-11-11 | 2018-12-25 | Sercomm Corporation | Shielding clip and electronic device |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101268088B1 (en) * | 2011-12-09 | 2013-05-29 | 김선기 | Clip for fixing shield case for shielding emi and shield apparatus using the same |
| EP3030067B1 (en) * | 2013-07-31 | 2019-05-01 | FUJI Corporation | Electronic component mounting device and mounting method |
| KR200484297Y1 (en) * | 2017-03-03 | 2017-08-22 | 주식회사 포콘스 | Clip for fixing cable |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003133786A (en) * | 2001-10-23 | 2003-05-09 | Sharp Corp | Mounting device of high frequency integrated circuit, and electronic circuit device |
| JP2004156147A (en) * | 2004-03-04 | 2004-06-03 | Kobe Steel Ltd | Tin or tin alloy plated copper alloy for multi-pole terminal, and method of producing the same |
| CN1717969A (en) * | 2003-03-31 | 2006-01-04 | 信越聚合物株式会社 | Shielding box and shielding method |
| JP2006114646A (en) * | 2004-10-14 | 2006-04-27 | Kyocera Corp | Circuit board equipment |
| JP2010272774A (en) * | 2009-05-22 | 2010-12-02 | Senju Metal Ind Co Ltd | Solder-coated component, its manufacturing method and its mounting method |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003110274A (en) | 2001-09-28 | 2003-04-11 | Matsushita Electric Ind Co Ltd | Electronic equipment equipped with shield structure |
| TW545707U (en) | 2002-11-18 | 2003-08-01 | Emi Stop Corp | Antenna conducting elastic sheet |
| KR200437540Y1 (en) | 2006-11-29 | 2007-12-11 | 주식회사 포콘스 | Shielding Case Fixture for Printed Circuit Board |
| JP5139735B2 (en) * | 2007-06-26 | 2013-02-06 | 積水化学工業株式会社 | Sealant for liquid crystal dropping method, vertical conduction material, and liquid crystal display element |
| KR100886591B1 (en) * | 2007-11-01 | 2009-03-05 | 주식회사 포콘스 | Shield can fixing clip |
-
2011
- 2011-01-14 KR KR1020110004219A patent/KR101029221B1/en not_active Expired - Fee Related
- 2011-10-07 JP JP2011222974A patent/JP2012151437A/en active Pending
- 2011-10-13 CN CN2011103106038A patent/CN102595863A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003133786A (en) * | 2001-10-23 | 2003-05-09 | Sharp Corp | Mounting device of high frequency integrated circuit, and electronic circuit device |
| CN1717969A (en) * | 2003-03-31 | 2006-01-04 | 信越聚合物株式会社 | Shielding box and shielding method |
| JP2004156147A (en) * | 2004-03-04 | 2004-06-03 | Kobe Steel Ltd | Tin or tin alloy plated copper alloy for multi-pole terminal, and method of producing the same |
| JP2006114646A (en) * | 2004-10-14 | 2006-04-27 | Kyocera Corp | Circuit board equipment |
| JP2010272774A (en) * | 2009-05-22 | 2010-12-02 | Senju Metal Ind Co Ltd | Solder-coated component, its manufacturing method and its mounting method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10165672B2 (en) | 2015-11-11 | 2018-12-25 | Sercomm Corporation | Shielding clip and electronic device |
| CN108463638A (en) * | 2015-12-25 | 2018-08-28 | 北川工业株式会社 | Fixture and fixed mechanism |
| CN108463638B (en) * | 2015-12-25 | 2020-04-21 | 北川工业株式会社 | Clamp and fixing mechanism |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101029221B1 (en) | 2011-04-14 |
| JP2012151437A (en) | 2012-08-09 |
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Application publication date: 20120718 |