CN102595782A - Aluminum-based PCB (Printed Circuit Board) - Google Patents
Aluminum-based PCB (Printed Circuit Board) Download PDFInfo
- Publication number
- CN102595782A CN102595782A CN2012100441594A CN201210044159A CN102595782A CN 102595782 A CN102595782 A CN 102595782A CN 2012100441594 A CN2012100441594 A CN 2012100441594A CN 201210044159 A CN201210044159 A CN 201210044159A CN 102595782 A CN102595782 A CN 102595782A
- Authority
- CN
- China
- Prior art keywords
- aluminum
- wiring board
- circuit board
- component
- components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 37
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 37
- 239000004411 aluminium Substances 0.000 claims description 16
- 239000000758 substrate Substances 0.000 abstract description 7
- 230000017525 heat dissipation Effects 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to an aluminum-based PCB (Printed Circuit Board). The aluminum-based PCB comprises an aluminum substrate, a single-sided circuit board, a component and a bonding pad, wherein the component is tightly attached and connected with the aluminum substrate, the single-sided circuit board is adhered on the aluminum substrate and connected with the component through the bonding pad. The component is directly attached and connected on the aluminum substrate, so that when the aluminum-based PCB works, the component transmits heat to the aluminum substrate, and the heat dissipation efficiency of the component is improved.
Description
Technical field
The present invention relates to a kind of electronic product, particularly relate to a kind of aluminum base PCB plate.
Background technology
Along with development of electronic technology and progress, electronic product has become inexorable trend to light, thin, little, personalized, high reliability, multifunction, and aluminium base is complied with this trend and is born; This product is with the thermal diffusivity of excellence, the machine work type, and dimensional stability and electric property are used widely in fields such as hybrid integrated circuit, automobile, office automation, high-power electrical equipment, power-supply devices; At present; The traditional aluminum base PCB plate comprises components and parts, substrate, pad and dielectric layer, and substrate is connected with pad through dielectric layer; It is poor in the use of reality, to exist radiating effect, and components and parts need provide the deficiency of heat abstractor in addition.
Summary of the invention
For solving the problems of the technologies described above, the present invention provides a kind of aluminum base PCB plate of good heat dissipation effect.
A kind of aluminum base PCB plate of the present invention; Comprise aluminium base, single face wiring board, components and parts and pad, said components and parts are close to said aluminium base and are connected; Said single face wiring board is bonded on the said aluminium base, and said single face wiring board is connected with said components and parts through pad.
Aforesaid aluminum base PCB plate, said single face wiring board is the FR-4 tabula rasa.
Aforesaid aluminum base PCB plate, said single face wiring board is bonded on the said aluminium base through gummosis pressing not.
Beneficial effect compared with prior art of the present invention is: through components and parts directly are close on the said aluminium base; Components and parts are close to the connection aluminium base; During work, said components and parts to said aluminium base, and then have improved the radiating efficiency of components and parts with heat transferred.
Description of drawings
Fig. 1 is the structural representation of aluminum base PCB plate of the present invention.
Embodiment
Below in conjunction with accompanying drawing and embodiment, specific embodiments of the invention describes in further detail.Following examples are used to explain the present invention, but are not used for limiting scope of the present invention.
As shown in Figure 1, a kind of aluminum base PCB plate comprises aluminium base 4; Single face wiring board 3, components and parts 1 and pad 2, components and parts 1 are close to aluminium base 4 and are connected, during work; Components and parts 1 transmit heat by aluminium base 4 and are dispersed in the air, have improved radiating rate, the useful life of also having improved product simultaneously; Single face wiring board 3 is bonded on the said aluminium base 4 through gummosis pressing not, and single face wiring board 3 is connected with components and parts 1 through pad 2, and pad 2 is fixed on the single face wiring board 3.
Certainly, another design of the present invention is that single face wiring board 3 is the FR-4 tabula rasa.
The above only is a preferred implementation of the present invention; Should be pointed out that for those skilled in the art, under the prerequisite that does not break away from know-why of the present invention; Can also make some improvement and modification, these improve and modification also should be regarded as protection scope of the present invention.
Claims (3)
1. the aluminum base PCB plate comprises aluminium base, single face wiring board, components and parts and pad; It is characterized in that; Said components and parts are close to said aluminium base and are connected, and said single face wiring board is bonded on the said aluminium base, and said single face wiring board is connected with said components and parts through pad.
2. aluminum base PCB plate according to claim 1 is characterized in that, said single face wiring board is the FR-4 tabula rasa.
3. aluminum base PCB plate according to claim 1 is characterized in that, said single face wiring board is bonded on the said aluminium base through gummosis pressing not.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100441594A CN102595782A (en) | 2012-02-24 | 2012-02-24 | Aluminum-based PCB (Printed Circuit Board) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100441594A CN102595782A (en) | 2012-02-24 | 2012-02-24 | Aluminum-based PCB (Printed Circuit Board) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102595782A true CN102595782A (en) | 2012-07-18 |
Family
ID=46483827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100441594A Pending CN102595782A (en) | 2012-02-24 | 2012-02-24 | Aluminum-based PCB (Printed Circuit Board) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102595782A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101068452A (en) * | 2007-05-15 | 2007-11-07 | 杭州裕兴层压板材有限公司 | Aluminium-based copper foil clad laminated board and producing technology |
| CN201270619Y (en) * | 2008-09-19 | 2009-07-08 | 康佳集团股份有限公司 | PCB board with micro reflection construction |
| CN101630096A (en) * | 2008-11-14 | 2010-01-20 | 超亮显示系统（深圳）有限公司 | Ultra bright LED side-type backlight module for LCD |
| CN101975343A (en) * | 2010-10-07 | 2011-02-16 | 东莞市万丰纳米材料有限公司 | Light source module and preparation method thereof |
| CN202026521U (en) * | 2011-02-28 | 2011-11-02 | 张�林 | Circuit board with heat dissipation metal |
| CN202535643U (en) * | 2012-02-24 | 2012-11-14 | 昆山华晨电子有限公司 | Aluminium printed circuit board |
-
2012
- 2012-02-24 CN CN2012100441594A patent/CN102595782A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101068452A (en) * | 2007-05-15 | 2007-11-07 | 杭州裕兴层压板材有限公司 | Aluminium-based copper foil clad laminated board and producing technology |
| CN201270619Y (en) * | 2008-09-19 | 2009-07-08 | 康佳集团股份有限公司 | PCB board with micro reflection construction |
| CN101630096A (en) * | 2008-11-14 | 2010-01-20 | 超亮显示系统（深圳）有限公司 | Ultra bright LED side-type backlight module for LCD |
| CN101975343A (en) * | 2010-10-07 | 2011-02-16 | 东莞市万丰纳米材料有限公司 | Light source module and preparation method thereof |
| CN202026521U (en) * | 2011-02-28 | 2011-11-02 | 张�林 | Circuit board with heat dissipation metal |
| CN202535643U (en) * | 2012-02-24 | 2012-11-14 | 昆山华晨电子有限公司 | Aluminium printed circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201426214Y (en) | PCB board with heat radiation structure capable of conducting heat and radiating ink | |
| CN205071462U (en) | Multilayer circuit board heat conduction radiation structure | |
| CN102098870A (en) | A kind of composite PCB board and manufacturing method thereof | |
| CN103763852B (en) | Power panel and there is the mainboard of power panel | |
| CN203151860U (en) | Bendable metal-base printed circuit board | |
| CN202535643U (en) | Aluminium printed circuit board | |
| CN107949160A (en) | A kind of hanging printed circuit board of the separated high heat conduction of thermoelectricity and its production method | |
| CN203167425U (en) | Metal printed circuit board | |
| CN202111936U (en) | Double-sided aluminum core circuit board with plughole resin | |
| CN204442828U (en) | A kind of PCB of high efficiency and heat radiation | |
| WO2012000371A1 (en) | Dc/dc module power supply | |
| CN104708869A (en) | Aluminum-based copper-clad plate with high thermal conductivity and manufacturing method thereof | |
| CN100420049C (en) | Substrate structure of LED module | |
| CN108124378A (en) | A kind of bent aluminum substrate | |
| CN102595782A (en) | Aluminum-based PCB (Printed Circuit Board) | |
| CN202738247U (en) | Circuit board provided with improved heat dissipation performance | |
| CN206650917U (en) | A kind of radiating printed circuit board structure | |
| CN205124125U (en) | Metal base copper clad laminate | |
| CN202738356U (en) | Driver | |
| CN206365149U (en) | A kind of bent aluminium base | |
| CN206302629U (en) | Silver paste cross-line printed wiring board | |
| CN206993475U (en) | A kind of PCB independent heat dissipation device | |
| CN207719183U (en) | The radiator structure of rectifier bridge on a kind of wiring board | |
| CN207459990U (en) | Power supply with PFC inductance | |
| CN205755047U (en) | The pcb board that a kind of thermal diffusivity is strong |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120718 |