CN102593603B - A kind of method for packing based on ceramic substrate metamaterial - Google Patents
A kind of method for packing based on ceramic substrate metamaterial Download PDFInfo
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- CN102593603B CN102593603B CN201210051074.9A CN201210051074A CN102593603B CN 102593603 B CN102593603 B CN 102593603B CN 201210051074 A CN201210051074 A CN 201210051074A CN 102593603 B CN102593603 B CN 102593603B
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- 239000000758 substrate Substances 0.000 title claims abstract description 22
- 239000000919 ceramic Substances 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 title claims abstract description 17
- 238000012856 packing Methods 0.000 title claims abstract description 15
- 239000011521 glass Substances 0.000 claims abstract description 36
- 238000005538 encapsulation Methods 0.000 claims abstract description 14
- 239000002184 metal Substances 0.000 claims description 4
- 230000015271 coagulation Effects 0.000 claims description 2
- 238000005345 coagulation Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 14
- 238000005516 engineering process Methods 0.000 abstract description 9
- 238000007712 rapid solidification Methods 0.000 abstract description 6
- 238000003466 welding Methods 0.000 abstract description 6
- 230000009172 bursting Effects 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 6
- 239000003292 glue Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
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- Laser Beam Processing (AREA)
- Ceramic Products (AREA)
Abstract
The invention provides a kind of method for packing based on ceramic substrate metamaterial, the multiple metamaterial sheet prepared are superimposed together, glass paste is evenly coated in the groove between metamaterial sheet, be coated with the position of glass paste with laser irradiation, after the fusing of glass paste short time, rapid solidification completes the encapsulation of multiple metamaterial sheet; Laser welding technology can the multi-disc metamaterial sheet of irradiation glass paste encapsulation quickly and accurately, ceramic substrate can also be avoided not mate with the thermal expansivity of glass and bursting apart of causing; And because the loss ratio of glass paste is lower, after encapsulation, the loss of Meta Materials can not increase because of the loss of glass in loss.
Description
[technical field]
The present invention relates to Meta Materials field, particularly relate to a kind of method for packing based on ceramic substrate metamaterial.
[background technology]
Meta Materials is material electromagnetic wave being played to modulating action grown up nearly ten years.Meta Materials be generally be attached to by the micro-structural of some there is certain mechanics, on substrate that electromagnetism requires, these micro-structurals with specific pattern and material can produce modulating action to the electromagnetic wave of the special frequency channel through its body.This modulating action can make electromagnetic direction, intensity changes, and even affects the time that electromagnetic wave passes through.In general, when the size of micro-structural and the electromagnetic wavelength of required modulation 1/10th quite time, the electromagnetic wave of this frequency or certain frequency range centered by this frequency could be modulated by this Meta Materials.Light is also a kind of electromagnetic wave, its wavelength is between 300 to 3000 nanometers, if design micro-structural size is between 30 to 300 nanometers, then this Meta Materials can be modulated light, to control the projection of light, reflection and deviation, thus, the Meta Materials of nanoscale microstructures can be used for the generating efficiency increasing solar cell.
In actual applications, need the function multiple metamaterial sheet stacked package being realized certain electromagnetic wave modulation, the most frequently used method for packing makes it bonding encapsulation with organic resin glue as adhesive cures, but the loss ratio of organic resin glue is higher, can not reach Meta Materials to low-loss requirement.If what the substrate of Meta Materials adopted is ceramic substrate, useable glass makes its encapsulating material, but general employing is sintering technology, the length that not only expends time in, process are complicated, must consider whether the metal micro structure on substrate can change because of the too high metal micro structure that makes of temperature in addition.
[summary of the invention]
Technical problem to be solved by this invention is: provide a kind of method for packing based on ceramic substrate metamaterial, low-loss glass paste is coated with between metamaterial sheet, after utilizing laser welding technology that the glass paste short time is melted, rapid solidification completes the encapsulation of multiple metamaterial sheet.
The present invention solves the problems of the technologies described above adopted technical scheme: a kind of method for packing based on ceramic substrate metamaterial, comprises the following steps:
The multiple metamaterial sheet prepared are superimposed together;
Glass paste is evenly coated in the groove between metamaterial sheet;
Be coated with the position of glass paste with laser irradiation, glass paste fusing after coagulation completes the encapsulation of multiple metamaterial sheet.
Described each metamaterial sheet upper surface is or/and four angles of lower surface have groove.
Described each metamaterial sheet upper surface is or/and four edges of lower surface have groove.
Described groove is V-type groove.
Described groove is semi-circular groove.
Described groove is square groove.
Described each metamaterial sheet has location hole.
Beneficial effect of the present invention is: be coated with low-loss glass paste between metamaterial sheet, and because the loss ratio of glass paste is lower, after encapsulation, the loss of Meta Materials can not increase because of the loss of glass in loss; After utilizing laser welding technology that the glass paste short time is melted, rapid solidification completes the encapsulation of multiple metamaterial sheet, laser welding technology can the multi-disc metamaterial sheet of irradiation glass paste encapsulation quickly and accurately, ceramic substrate can also be avoided not mate with the thermal expansivity of glass and bursting apart of causing.
[accompanying drawing explanation]
The first schematic diagram of Fig. 1 embodiment of the present invention metamaterial sheet;
Fig. 2 embodiment of the present invention metamaterial sheet the second schematic diagram;
The third schematic diagram of Fig. 3 embodiment of the present invention metamaterial sheet;
Fig. 4 embodiment of the present invention metamaterial sheet the 4th kind of schematic diagram;
Fig. 5 embodiment of the present invention metamaterial sheet the 5th kind of schematic diagram;
Fig. 6 embodiment of the present invention metamaterial sheet the 6th kind of schematic diagram.
[embodiment]
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
Based on a method for packing for ceramic substrate metamaterial, comprise the following steps:
The multiple metamaterial sheet prepared accurately are superimposed together, and each metamaterial sheet has location hole;
Glass paste is evenly coated in the groove between metamaterial sheet; Because the loss ratio of glass paste is lower, after encapsulation, the loss of Meta Materials can not increase because of the loss of glass in loss;
Be coated with the position of glass paste with laser irradiation, after the fusing of glass paste short time, rapid solidification makes multiple metamaterial sheet encapsulate, the CO of the laser adopted to be wavelength be 1064nm
2laser, its power is 5 ~ 25W, the speed of travel is 1 ~ 6000mm/s, frequency is 1Hz ~ 6000Hz, the time of staying is 20 ~ 1000 μ s, spot diameter is 25 ~ 250 μm
Described each metamaterial sheet upper surface is or/and four angles of lower surface have groove or four edges have groove, described groove is the groove of V-type groove, semi-circular groove, square groove or other shapes, metamaterial sheet also can not recessing, directly glass paste is coated in the gap between metamaterial sheet.
After utilizing laser welding technology that the glass paste short time is melted, rapid solidification completes the encapsulation of multiple metamaterial sheet, laser welding technology can the multi-disc metamaterial sheet of irradiation glass paste encapsulation quickly and accurately, ceramic substrate can also be avoided not mate with the thermal expansivity of glass and bursting apart of causing.
Embodiment one
V-type groove is processed at four angles of the upper surface of each metamaterial sheet prepared and lower surface, as shown in Figure 1;
Metal bar or peg are inserted in the location hole of metamaterial sheet, prevent metamaterial sheet generation relative movement, then use clamp;
Glass paste is evenly coated in the V-type groove between metamaterial sheet;
Be the CO of 1064nm with wavelength
2irradiation is coated with the position of glass paste, power 15W, the speed of travel 3000mm/s of laser, frequency 3000Hz, the time of staying 500 μ s, spot diameter 150 μm, glass paste instant melting, after laser scanning, glass paste rapid solidification after short time fusing, makes multiple metamaterial sheet complete whole encapsulation process.
The shape of groove can also be semi-circular groove, square groove, as shown in Figure 2,3.
Embodiment two
Embodiment two is relative to the difference of embodiment one: V-type groove is only arranged on the upper surface of each metamaterial sheet or four angles of lower surface, as shown in Figure 4; Same, groove also can be semi-circular groove, square groove, as shown in Figure 5,6;
Embodiment three
Embodiment three is relative to the difference of embodiment one and embodiment two: the upper surface of each metamaterial sheet and four of lower surface edges are processed into V-type groove, semi-circular groove, square groove; Four edges that also can be upper surface or lower surface are processed into V-type groove, semi-circular groove, square groove.
In the above-described embodiments; only to invention has been exemplary description; but those skilled in the art can carry out various amendment and retouching to the present invention without departing from the spirit and scope of the present invention after reading present patent application, all belong to protection scope of the present invention.
Claims (7)
1. based on a method for packing for ceramic substrate metamaterial, it is characterized in that, comprise the following steps:
The multiple metamaterial sheet prepared are superimposed together;
Low-loss glass paste is evenly coated in and is coated in the gap between metamaterial sheet in the groove between metamaterial sheet or by low-loss glass paste;
Be coated with the position of glass paste with laser irradiation, glass paste fusing after coagulation completes the encapsulation of multiple metamaterial sheet;
Wherein, described ceramic substrate is provided with metal micro structure;
Wherein, described laser power is 5 ~ 25W, the speed of travel is 1 ~ 6000mm/s, frequency is 1Hz ~ 6000Hz, the time of staying is 20 ~ 1000 μ s, spot diameter is 25 ~ 250 μm.
2. the method for packing based on ceramic substrate metamaterial according to claim 1, is characterized in that: described each metamaterial sheet upper surface is or/and four angles of lower surface have groove.
3. the method for packing based on ceramic substrate metamaterial according to claim 1, is characterized in that: described each metamaterial sheet upper surface is or/and four edges of lower surface have groove.
4. the method for packing based on ceramic substrate metamaterial according to Claims 2 or 3, is characterized in that: described groove is V-type groove.
5. the method for packing based on ceramic substrate metamaterial according to Claims 2 or 3, is characterized in that: described groove is semi-circular groove.
6. the method for packing based on ceramic substrate metamaterial according to Claims 2 or 3, is characterized in that: described groove is square groove.
7. the method for packing based on ceramic substrate metamaterial according to claim 1, is characterized in that: described each metamaterial sheet has location hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210051074.9A CN102593603B (en) | 2012-02-29 | 2012-02-29 | A kind of method for packing based on ceramic substrate metamaterial |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210051074.9A CN102593603B (en) | 2012-02-29 | 2012-02-29 | A kind of method for packing based on ceramic substrate metamaterial |
Publications (2)
| Publication Number | Publication Date |
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| CN102593603A CN102593603A (en) | 2012-07-18 |
| CN102593603B true CN102593603B (en) | 2016-01-20 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2329546A1 (en) * | 2000-12-22 | 2002-06-22 | Robert W. Musk | Attaching and fixing components to mems type structures |
| CN1210749C (en) * | 1997-10-01 | 2005-07-13 | 全显示解法有限公司 | Visual display |
| CN100409392C (en) * | 2003-04-16 | 2008-08-06 | 康宁股份有限公司 | Glass enclosure sealed with glass frit and manufacturing method thereof |
| CN101221910B (en) * | 2007-01-12 | 2011-07-20 | 三星移动显示器株式会社 | Method of manufacturing flat panel display device |
-
2012
- 2012-02-29 CN CN201210051074.9A patent/CN102593603B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1210749C (en) * | 1997-10-01 | 2005-07-13 | 全显示解法有限公司 | Visual display |
| CA2329546A1 (en) * | 2000-12-22 | 2002-06-22 | Robert W. Musk | Attaching and fixing components to mems type structures |
| CN100409392C (en) * | 2003-04-16 | 2008-08-06 | 康宁股份有限公司 | Glass enclosure sealed with glass frit and manufacturing method thereof |
| CN101221910B (en) * | 2007-01-12 | 2011-07-20 | 三星移动显示器株式会社 | Method of manufacturing flat panel display device |
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| CN102593603A (en) | 2012-07-18 |
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Effective date of registration: 20210421 Address after: 518057 2 / F, software building, No.9, Gaoxin Middle Road, Nanshan District, Shenzhen, Guangdong Province Patentee after: KUANG-CHI INSTITUTE OF ADVANCED TECHNOLOGY Address before: 518034. A, 18B, CIC international business center, 1061 Mei Xiang Road, Shenzhen, Guangdong, Futian District Patentee before: KUANG-CHI INNOVATIVE TECHNOLOGY Ltd. |
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