CN102593092A - Lead frame - Google Patents
Lead frame Download PDFInfo
- Publication number
- CN102593092A CN102593092A CN2012100773373A CN201210077337A CN102593092A CN 102593092 A CN102593092 A CN 102593092A CN 2012100773373 A CN2012100773373 A CN 2012100773373A CN 201210077337 A CN201210077337 A CN 201210077337A CN 102593092 A CN102593092 A CN 102593092A
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- CN
- China
- Prior art keywords
- lead frame
- rows
- pin
- stress
- packaging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000013461 design Methods 0.000 claims description 6
- 238000004806 packaging method and process Methods 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 239000000969 carrier Substances 0.000 abstract 1
- 230000032798 delamination Effects 0.000 abstract 1
- 238000011010 flushing procedure Methods 0.000 abstract 1
- 238000012858 packaging process Methods 0.000 abstract 1
- 238000004080 punching Methods 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000002994 raw material Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 210000003205 muscle Anatomy 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention relates to the technical field of semiconductor package, in particular to an IPAK/TO-251 lead frame. A connecting part of two rows (or four rows, or six rows, or eight rows) of carriers of the frame is provided with a stress release groove; and a flushing runner groove is formed in a connecting rod area in the same column. The lead frame has the basic functions of preventing leakage, water, tripping and reversion, precisely positioning and the like, and stress generated be the deformation of the lead frame in a punching or packaging process can be released in a concentrating way, so delamination caused after a plastic packaging body and the lead frame are stressed by an internal stress is prevented, and the reliability of a product is ensured; the problem that materials are difficult to unload from a plurality of pouring passages is also solved at the same time, and blockage of the product in the next track conveying process is avoided; and the production efficiency is improved, and the packaging yield is also improved at the same time.
Description
Technical field
The present invention relates to the semiconductor packaging field, particularly a kind of IPAK/TO-251 lead frame.
Background technology
Lead frame (Lead Frame) is the carrier of carries chips, plays the transmitting effect of chip internal circuit and external electric signal behind the lead bonding, in encapsulation process and installation process, plays location, mechanical support effect; And when work conduction of heat.Therefore lead frame is a part important in the power device encapsulation field.
As the consumer market in recent years, the demand for power devices, expanding the product reliability requirements continue to increase; give power device packaging industry has brought development opportunities, but also to the power device packaging industry presents new challenges.So whether the design of lead frame that power device uses has rationally played critical effect to the power device Packaging Industry.
In existing domestic and international IPAK/TO-251 power device, all be to adopt single lead-frame packages, this kind framework production efficiency is low; Raw materials consumption is big, and framework is yielding, and rate of finished products can not get improving; Reliability is difficult to factors such as assurance, has seriously retrained the large-scale production of this series products.
Through verification, have the IPAK/TO-251 lead frame of stress relief grooves, industry does not all have both at home and abroad at present.
Summary of the invention
The invention provides a kind of novel lead frame, this framework has been avoided plastic-sealed body and framework to receive to produce layering after the internal stress and has been ensured reliability of products;
For this reason, adopt following technical scheme:
A kind of lead frame, the connecting portion of the carrier of said lead frame is designed with stress relief grooves.
Be designed with swash of wave road groove in the said lead frame in the tie bar regions of same column.
Described leadframe design is: two rows～eight rows.
Described lead frame I/O pin: be designed with 3 pin～5 pin.
The present invention has adopted many row's designs; Make it outside having basic functions such as leakproof, waterproof, anticreep, counnter attack, fine positioning; The design of its stress relief grooves; The stress that produces behind the frame deformation is concentrated discharged, thereby avoided plastic-sealed body and framework to receive to produce layering after the internal stress, ensured reliability of products; The design of swash of wave groove has solved the difficult problem of encapsulation back many running channels discharging, and then has avoided the resistance material phenomenon of appearance in time operation track conveying.And the present invention compares single lead frame, equals to two or is integrated into a lead frame to eight lead frames, therefore strengthened the physical property of framework, improved production efficiency, promoted raw-material utilance.Thereby reduced the cost of power device encapsulating products, improved production efficiency, also improved packaging yield simultaneously.For example: when said lead frame adopts double arrangement, but 56 of lead frame package power devices; But eight rows' 228 of lead frame package power devices, and single have only 28.And after the moulding of described IPAK/TO-251 lead frame plastic packaging 3～5 I/O pins are arranged, can be fabricated to simultaneously and partly seal direct insertion assembling and surface-mount type assembling.
Description of drawings
Fig. 1 is the overall schematic (is example with 3 I/O pin) of the present invention's two row's formulas;
Fig. 2 is the left view of Fig. 1;
Fig. 3 is an A place partial enlarged drawing among Fig. 1;
Fig. 4 is 5 sketch map for the present invention's two row's formulas and I/O pin;
Fig. 5 is the partial schematic diagram (is example with 3 I/O pin) of the present invention's eight row's formulas;
Fig. 6 a to 6c is that the master of the IPAK/TO-251 plastic packaging product of framework of the present invention encapsulation looks, side-looking, schematic rear view (SMD installation and be example with 3 I/O pin).
Embodiment:
Below in conjunction with accompanying drawing the present invention is further specified.
With reference to Fig. 3, a kind of lead frame, the connecting portion of the carrier 4 of said lead frame 1 is designed with stress relief grooves 5.
Be designed with swash of wave road groove 7 in the said lead frame 1 in the tie bar regions of same column.
Among Fig. 3: 2 is the fine positioning hole; 3 is pin; 6 is middle muscle; 8 for making up the shape location hole and being the waist type.
Said lead frame 1 is designed with two rows～eight rows, can strike out double or 4 rows or 6 rows or 8 row's frameworks.
The I/O pin of said lead frame 1 is designed with 3 or 4 or 5 pin, has expanded the scope of application of framework.
Claims (4)
1. lead frame, it is characterized in that: the connecting portion of the carrier (4) of said lead frame (1) is designed with stress relief grooves (5).
2. a kind of lead frame according to claim 1 is characterized in that: be designed with swash of wave road groove (7) in the tie bar regions of same column in the said lead frame (1).
3. a kind of lead frame according to claim 1 and 2 is characterized in that: said leadframe design has two rows～eight rows.
4. a kind of lead frame according to claim 3 is characterized in that: said lead frame I/O pin is designed with 3 pin～5 pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100773373A CN102593092A (en) | 2012-03-22 | 2012-03-22 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100773373A CN102593092A (en) | 2012-03-22 | 2012-03-22 | Lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102593092A true CN102593092A (en) | 2012-07-18 |
Family
ID=46481542
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100773373A Pending CN102593092A (en) | 2012-03-22 | 2012-03-22 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102593092A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102956596A (en) * | 2012-11-20 | 2013-03-06 | 无锡市威海达机械制造有限公司 | Lead frame structure |
| CN103617990A (en) * | 2013-11-21 | 2014-03-05 | 沈健 | Double-row plastic package lead frame |
| CN104617074A (en) * | 2013-11-01 | 2015-05-13 | 无锡华润安盛科技有限公司 | Frame packaging structure and application method thereof |
| CN104681528A (en) * | 2013-10-28 | 2015-06-03 | 德克萨斯仪器股份有限公司 | Method and apparatus for stopping resin bleed and mold flash on integrated circit lead finishes |
| CN106158812A (en) * | 2016-08-31 | 2016-11-23 | 无锡罗姆半导体科技有限公司 | A kind of TO 251 type four rejects shape lead frame group |
| CN107346763A (en) * | 2016-05-06 | 2017-11-14 | 无锡华润安盛科技有限公司 | A kind of lead frame of IPM modules |
| CN110349922A (en) * | 2019-07-22 | 2019-10-18 | 上海灿集电子科技有限公司 | A kind of intensity lead frame |
| CN114121866A (en) * | 2021-11-10 | 2022-03-01 | 广东汇芯半导体有限公司 | Lead frame assembly and method of manufacturing semiconductor circuit |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6329706B1 (en) * | 1999-08-24 | 2001-12-11 | Fairchild Korea Semiconductor, Ltd. | Leadframe using chip pad as heat conducting path and semiconductor package adopting the same |
| CN1371127A (en) * | 2001-02-15 | 2002-09-25 | 松下电器产业株式会社 | Wire frame and the manufacture of resin sealed semiconductor unit with the wire frame |
| CN201215803Y (en) * | 2008-10-07 | 2009-04-01 | 宁波华龙电子股份有限公司 | Double-row double-column transistor lead frame plate piece |
| CN201215804Y (en) * | 2008-10-07 | 2009-04-01 | 宁波华龙电子股份有限公司 | Four-row double-column transistor lead frame plate piece |
| CN201417769Y (en) * | 2009-06-09 | 2010-03-03 | 铜陵丰山三佳微电子有限公司 | Array type high-power integrated circuit lead wire frame |
| CN201773837U (en) * | 2010-05-24 | 2011-03-23 | 潍坊市汇川电子有限公司 | Lead frame for high-power MOS device |
| CN201853694U (en) * | 2010-10-28 | 2011-06-01 | 宁波华龙电子股份有限公司 | Multiple anti-cracking triode lead frame |
| CN202549827U (en) * | 2012-03-22 | 2012-11-21 | 天水华天微电子股份有限公司 | Lead frame |
-
2012
- 2012-03-22 CN CN2012100773373A patent/CN102593092A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6329706B1 (en) * | 1999-08-24 | 2001-12-11 | Fairchild Korea Semiconductor, Ltd. | Leadframe using chip pad as heat conducting path and semiconductor package adopting the same |
| CN1371127A (en) * | 2001-02-15 | 2002-09-25 | 松下电器产业株式会社 | Wire frame and the manufacture of resin sealed semiconductor unit with the wire frame |
| CN201215803Y (en) * | 2008-10-07 | 2009-04-01 | 宁波华龙电子股份有限公司 | Double-row double-column transistor lead frame plate piece |
| CN201215804Y (en) * | 2008-10-07 | 2009-04-01 | 宁波华龙电子股份有限公司 | Four-row double-column transistor lead frame plate piece |
| CN201417769Y (en) * | 2009-06-09 | 2010-03-03 | 铜陵丰山三佳微电子有限公司 | Array type high-power integrated circuit lead wire frame |
| CN201773837U (en) * | 2010-05-24 | 2011-03-23 | 潍坊市汇川电子有限公司 | Lead frame for high-power MOS device |
| CN201853694U (en) * | 2010-10-28 | 2011-06-01 | 宁波华龙电子股份有限公司 | Multiple anti-cracking triode lead frame |
| CN202549827U (en) * | 2012-03-22 | 2012-11-21 | 天水华天微电子股份有限公司 | Lead frame |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102956596A (en) * | 2012-11-20 | 2013-03-06 | 无锡市威海达机械制造有限公司 | Lead frame structure |
| CN104681528A (en) * | 2013-10-28 | 2015-06-03 | 德克萨斯仪器股份有限公司 | Method and apparatus for stopping resin bleed and mold flash on integrated circit lead finishes |
| CN104681528B (en) * | 2013-10-28 | 2019-08-23 | 德克萨斯仪器股份有限公司 | Stop the method and apparatus of resin spilling and mold flashing on leads of IC finished product |
| CN104617074A (en) * | 2013-11-01 | 2015-05-13 | 无锡华润安盛科技有限公司 | Frame packaging structure and application method thereof |
| CN103617990A (en) * | 2013-11-21 | 2014-03-05 | 沈健 | Double-row plastic package lead frame |
| CN107346763A (en) * | 2016-05-06 | 2017-11-14 | 无锡华润安盛科技有限公司 | A kind of lead frame of IPM modules |
| CN107346763B (en) * | 2016-05-06 | 2020-04-17 | 无锡华润安盛科技有限公司 | Lead frame of IPM module |
| CN106158812A (en) * | 2016-08-31 | 2016-11-23 | 无锡罗姆半导体科技有限公司 | A kind of TO 251 type four rejects shape lead frame group |
| CN110349922A (en) * | 2019-07-22 | 2019-10-18 | 上海灿集电子科技有限公司 | A kind of intensity lead frame |
| CN114121866A (en) * | 2021-11-10 | 2022-03-01 | 广东汇芯半导体有限公司 | Lead frame assembly and method of manufacturing semiconductor circuit |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20120718 |