CN102591409A - Circuit board fixing mechanism - Google Patents
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- CN102591409A CN102591409A CN2011100063505A CN201110006350A CN102591409A CN 102591409 A CN102591409 A CN 102591409A CN 2011100063505 A CN2011100063505 A CN 2011100063505A CN 201110006350 A CN201110006350 A CN 201110006350A CN 102591409 A CN102591409 A CN 102591409A
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- 230000007246 mechanism Effects 0.000 title claims abstract description 29
- 239000002184 metal Substances 0.000 abstract description 6
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- 238000010438 heat treatment Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
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Abstract
Description
技术领域 technical field
本发明有关于一种固定机构,且特别是有关于一种电路板固定机构。The present invention relates to a fixing mechanism, and in particular to a circuit board fixing mechanism.
背景技术 Background technique
随着科技的发展,人们对于计算机系统的功能以及要求均越来越高。由于复杂的集成电路设计将会消耗大量的电能,而这些消耗的电能将会转换成为热量造成温度的上升,因此使得计算机系统中温度上升更形严重。当热量聚集在机壳内部而无法实时散掉时,将造成电子组件无法正常工作。With the development of science and technology, people have higher and higher requirements for the functions and requirements of computer systems. Since the complex integrated circuit design will consume a large amount of electric energy, and the consumed electric energy will be converted into heat to cause a temperature rise, thus making the temperature rise in the computer system more serious. When heat accumulates inside the casing and cannot be dissipated in real time, it will cause electronic components to fail to work properly.
随着无线通讯技术发展,如WiFi、蓝牙、GPS等通讯技术已经成为笔记型计算机中常见的辅助功能。因此,笔记型计算机中需设置有对应的天线电路板,以提供如WiFi、蓝牙、GPS等功能。为了收讯质量的考虑,这些天线电路板往往是设置在显示壳体的外框部分,现有的天线电路板多是通过螺丝固定并使用散热座对其散热,会增加零件的数量以及组装成本。With the development of wireless communication technologies, communication technologies such as WiFi, Bluetooth, and GPS have become common auxiliary functions in notebook computers. Therefore, a corresponding antenna circuit board needs to be provided in the notebook computer to provide functions such as WiFi, Bluetooth, and GPS. For the sake of receiving quality, these antenna circuit boards are often installed on the outer frame of the display case. Most of the existing antenna circuit boards are fixed by screws and dissipated by heat sinks, which will increase the number of parts and assembly costs. .
发明内容 Contents of the invention
因此本发明的目的就是在提供一种电路板固定机构,用以无需螺丝而固定电路板。Therefore, the object of the present invention is to provide a circuit board fixing mechanism for fixing the circuit board without screws.
依照本发明一实施例,提出一种电路板固定机构,用以固定一电路板,包含第一壳体,第一壳体的材料为金属。第一壳体包含底面以及夹持件。夹持件设置于底面上,夹持件具有压制面,压制面平行于底面,压制面与底面之间具有间隔,其中电路板容置于间隔之中,压制面接触电路板以定位。According to an embodiment of the present invention, a circuit board fixing mechanism is provided for fixing a circuit board, which includes a first casing, and the material of the first casing is metal. The first shell includes a bottom surface and a clamping part. The clamping piece is arranged on the bottom surface. The clamping piece has a pressing surface parallel to the bottom surface. There is a space between the pressing surface and the bottom surface. The circuit board is accommodated in the space, and the pressing surface contacts the circuit board for positioning.
电路板固定机构还包含至少一凸肋,凸肋设置于底面,凸肋接触电路板的侧面以定位。电路板包含有发热组件,压制面接触发热组件。电路板固定机构可还包含导热垫,导热垫设置于压制面接触电路板的一面。电路板包含孔,第一壳体包含设置于底面的凸点,凸点与孔卡合。压制面可具有导引斜面,背向底面延伸。其中第一壳体可为笔记型计算机的显示器后框件,电路板为天线电路板。电路板固定机构还包含有第二壳体以及多个卡合部。卡合部分别设置于第一壳体与第二壳体,藉以卡合第一壳体与第二壳体。第二壳体包含多个挡墙,挡墙延伸向第一壳体。第二壳体包含多个凸点,与电路板上的孔卡合。The circuit board fixing mechanism also includes at least one protruding rib. The protruding rib is arranged on the bottom surface, and the protruding rib contacts the side of the circuit board for positioning. The circuit board contains heating components, and the pressing surface is in contact with the heating components. The circuit board fixing mechanism may further include a heat conduction pad, and the heat conduction pad is arranged on a pressing surface contacting the circuit board. The circuit board includes holes, and the first casing includes bumps arranged on the bottom surface, and the bumps are engaged with the holes. The pressing surface can have a guide bevel extending away from the bottom surface. Wherein the first casing can be a display rear frame of a notebook computer, and the circuit board is an antenna circuit board. The circuit board fixing mechanism also includes a second casing and a plurality of engaging parts. The engaging parts are respectively disposed on the first casing and the second casing, so as to engage the first casing and the second casing. The second casing includes a plurality of retaining walls, and the retaining walls extend toward the first casing. The second housing includes a plurality of protruding points, which are engaged with the holes on the circuit board.
第一壳体与其上的各部组件可以为一体成形地制作,电路板夹持在挟持件与底面之间,并通过凸肋固定电路板,第一壳体上的凸点可与电路板上的孔卡合以定位电路板,相较于过去需要使用螺丝将电路板锁固壳体上的固定方式,本发明可以有效降低零件的成本以及组装工时。除此之外,压制面与电路板进行热交换,使电路板产生的热量经由第一壳体散逸,达成散热的功效而不需额外使用散热座。The first housing and the various components on it can be made in one piece, the circuit board is clamped between the holding member and the bottom surface, and the circuit board is fixed by the ribs, and the bumps on the first housing can be aligned with the circuit boards. The holes are engaged to position the circuit board. Compared with the previous method of fixing the circuit board to the housing with screws, the present invention can effectively reduce the cost of parts and the man-hours for assembly. In addition, heat exchange is performed between the pressing surface and the circuit board, so that the heat generated by the circuit board is dissipated through the first casing, thereby achieving the effect of heat dissipation without additional use of a heat sink.
附图说明 Description of drawings
为让本发明的上述和其它目的、特征、优点与实施例能更明显易懂,所附图式的详细说明如下:In order to make the above and other objects, features, advantages and embodiments of the present invention more obvious and understandable, the detailed description of the accompanying drawings is as follows:
图1绘示本发明的电路板固定机构一实施例的立体视图。FIG. 1 shows a perspective view of an embodiment of the circuit board fixing mechanism of the present invention.
图2绘示将电路板置入图1的电路板固定机构的立体视图。FIG. 2 is a perspective view of placing a circuit board into the circuit board fixing mechanism of FIG. 1 .
图3绘示图2中的电路板固定机构的剖面图。FIG. 3 is a cross-sectional view of the circuit board fixing mechanism in FIG. 2 .
图4绘示本发明的电路板固定机构另一实施例的示意图。FIG. 4 is a schematic diagram of another embodiment of the circuit board fixing mechanism of the present invention.
图5绘示与图4中的第一壳体110搭配的第二壳体180的示意图。FIG. 5 is a schematic diagram of the
主要附图标记说明Explanation of main reference signs
100:第一壳体100: first case
110:底面110: bottom surface
120:夹持件120: clamping piece
122:支撑部122: support part
124:压制面124: Pressed surface
126:导引斜面126: Guide slope
130:凸肋130: convex rib
140:凸点140: bump
160:电路板160: circuit board
162:孔162: hole
164:发热组件164: Heating components
170:导热垫170: thermal pad
180:第二壳体180: second shell
182:挡墙182: Retaining Wall
190:凸块190: Bump
200:笔记型计算机200: notebook computer
210:液晶显示面板210: Liquid crystal display panel
g:间隔g: interval
具体实施方式 Detailed ways
以下将以图式及详细说明清楚说明本发明的精神,任何所属技术领域中具有通常知识者在了解本发明的较佳实施例后,当可由本发明所教示的技术,加以改变及修饰,其并不脱离本发明的精神与范围。The following will clearly illustrate the spirit of the present invention with drawings and detailed descriptions. Anyone with ordinary knowledge in the technical field can change and modify the technology taught by the present invention after understanding the preferred embodiments of the present invention. without departing from the spirit and scope of the present invention.
参照图1,其绘示本发明的电路板固定机构一实施例的立体视图。电路板固定机构为用以固定一电路板(图中未绘示),其包含有第一壳体100,其中第一壳体100具有底面110以及夹持件120。其中夹持件120包含有相连的支撑部122以及压制面124,支撑部122连接压制面124与底面110,压制面124与底面110之间具有间隔g。电路板可以容置在此间隔g之中,压制面124则接触电路板以限制电路板在z方向的位移。压制面124上可还包含有导引斜面126,导引斜面126为背向底面110延伸,以方便电路板进入间隔g。Referring to FIG. 1 , it shows a perspective view of an embodiment of the circuit board fixing mechanism of the present invention. The circuit board fixing mechanism is used to fix a circuit board (not shown in the figure), which includes a
第一壳体100上还包含有至少一凸肋130,凸肋130设置于底面110上。凸肋130所设置的位置为对应于电路板的板边。当电路板置入间隔g之后,凸肋130可接触电路板的侧面,以限制电路板在x方向的位移。一般的电路板上多会设置有孔以供螺丝锁固,本发明的第一壳体100上则包含有设置在底面110上的凸点140。凸点140的位置则是对应于电路板上的孔,以在组装时与孔卡合而定位电路板。The
参照图2,其绘示将电路板置入图1的电路板固定机构的立体视图。电路板160已经放入夹持件120中,特别是容置于压制面124与底面110之间。压制面124与电路板160接触,以限制电路板160在z方向的位移。凸肋130分布在电路板160的周围,且与电路板160的侧面接触,以限制电路板160在x方向的位移。电路板160上具有孔162,凸点140与孔162卡合以定位电路板160。Referring to FIG. 2 , it illustrates a perspective view of placing the circuit board into the circuit board fixing mechanism of FIG. 1 . The
第一壳体100可以为一体成形的金属壳体,或是壳体中的金属件。夹持件120亦为金属材料,因此,当压制面124与电路板160接触时,压制面124可以与电路板160进行热交换。电路板160与其上的发热组件所产生的热量经由与之接触的压制面124送到第一壳体100,由于第一壳体100的材料为导热性佳的金属,且具有相当大的表面积,因此热量可以由第一壳体100散逸。换言之,此电路板固定机构除可固定电路板160之外,还具有散热的功效。The
参照图3,其绘示图2中的电路板固定机构的剖面图。夹持件120近似于L形结构,导引斜面126与支撑部122分别位于压制面124的相对两端。电路板160由导引斜面126的一端进入压制面124与底面110之间。压制面124可以直接接触电路板160,以对电路板160进行定位以及散热。或者,如本实施例一般,电路板固定机构还具有导热垫170,导热垫170设置于压制面124接触电路板160的一面上,使得压制面124通过导热垫170接触电路板160,进而提升热传导的效率。电路板160上具有发热组件164,压制面124可以接触发热组件164,以实时地将发热组件164所产生的热量带走。Referring to FIG. 3 , it shows a cross-sectional view of the circuit board fixing mechanism in FIG. 2 . The clamping
参照图4,其绘示本发明的电路板固定机构另一实施例的示意图。电路板固定机构为应用在笔记型计算机200之中,其中第一壳体100为笔记型计算机显示器的后框,特别是后框的金属件。液晶显示面板210设置在第一壳体100之中,电路板160位于液晶显示面板210的外围。Referring to FIG. 4 , it shows a schematic diagram of another embodiment of the circuit board fixing mechanism of the present invention. The circuit board fixing mechanism is applied in the notebook computer 200, wherein the
第一壳体100具有底面110以及夹持件120。其中夹持件120包含有压制面124,压制面124与底面110之间具有间隔。电路板160可以容置在此间隔之中,压制面124则接触电路板160以限制电路板160在z方向的位移。The
第一壳体100上还包含有凸肋130,凸肋130设置于底面110上。凸肋130所设置的位置为对应于电路板160的板边。当电路板160置入间隔g之后,凸肋130可接触电路板160的侧面,以限制电路板160在x方向的位移。电路板160上设置有孔162,第一壳体100上包含有设置在底面110上的凸点140。凸点140的位置则对应于电路板160上的孔162,以在组装时与孔162卡合而定位电路板160。The
同时参照图4与图5,图5绘示与图4中的第一壳体100搭配的第二壳体180的示意图。第二壳体180上还具有多个挡墙182,挡墙182向第一壳体100的方向延伸,挡墙182的位置可以与凸肋130的位置错开,以在组装完成之后接触电路板160的侧面,以限制电路板160在x方向与y方向的位移。第二壳体180上可还设置有凸块190,凸块190的位置对应于电路板160上的孔162的位置。凸块190可在组装时压制电路板160,定位电路板160。若搭配凸点140则有助于避免孔162因外力冲击而脱离凸点140。Referring to FIG. 4 and FIG. 5 at the same time, FIG. 5 shows a schematic diagram of the
由上述本发明较佳实施例可知,应用本发明具有下列优点。第一壳体与其上的各部组件可以为一体成形地制作,电路板夹持在挟持件与底面之间,并通过凸肋固定电路板,第一壳体上的凸点可与电路板上的孔卡合以定位电路板,相较于过去需要使用螺丝将电路板锁固壳体上的固定方式,本发明可以有效降低零件的成本以及组装工时。除此之外,压制面与电路板进行热交换,使电路板产生的热量经由第一壳体散逸,达成散热的功效而不需额外使用散热座。It can be known from the above preferred embodiments of the present invention that the application of the present invention has the following advantages. The first housing and the various components on it can be made in one piece, the circuit board is clamped between the holding member and the bottom surface, and the circuit board is fixed by the ribs, and the bumps on the first housing can be aligned with the circuit boards. The holes are engaged to position the circuit board. Compared with the previous method of fixing the circuit board on the housing with screws, the present invention can effectively reduce the cost of parts and the assembly man-hours. In addition, heat exchange is performed between the pressing surface and the circuit board, so that the heat generated by the circuit board is dissipated through the first casing, thereby achieving the effect of heat dissipation without additional use of a heat sink.
虽然本发明已以一较佳实施例揭露如上,然其并非用以限定本发明,任何本领域技术人员,在不脱离本发明的精神和范围内,当可作各种的更动与润饰,因此本发明的保护范围当视所附权利要求书所界定者为准。Although the present invention has been disclosed above with a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art may make various modifications and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be defined by the appended claims.
Claims (8)
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US12363847B2 (en) | 2021-01-05 | 2025-07-15 | Signify Holding B.V. | Housing part for a light generating device |
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CN200969719Y (en) * | 2006-11-08 | 2007-10-31 | 瑞轩科技股份有限公司 | Circuit board buckle device |
US20080024981A1 (en) * | 2006-07-25 | 2008-01-31 | Fujitsu Limited | Electronic apparatus |
CN101470497A (en) * | 2007-12-26 | 2009-07-01 | 英业达股份有限公司 | Electrical connection structure and method for heat sink and switching circuit board |
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US20080024981A1 (en) * | 2006-07-25 | 2008-01-31 | Fujitsu Limited | Electronic apparatus |
CN200969719Y (en) * | 2006-11-08 | 2007-10-31 | 瑞轩科技股份有限公司 | Circuit board buckle device |
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US12363847B2 (en) | 2021-01-05 | 2025-07-15 | Signify Holding B.V. | Housing part for a light generating device |
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Application publication date: 20120718 |