CN102569154A - Wafer clamping device - Google Patents
Wafer clamping device Download PDFInfo
- Publication number
- CN102569154A CN102569154A CN201110459560XA CN201110459560A CN102569154A CN 102569154 A CN102569154 A CN 102569154A CN 201110459560X A CN201110459560X A CN 201110459560XA CN 201110459560 A CN201110459560 A CN 201110459560A CN 102569154 A CN102569154 A CN 102569154A
- Authority
- CN
- China
- Prior art keywords
- substrate
- locating piece
- clamping device
- wafer clamping
- fixed teeth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000005489 elastic deformation Effects 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims description 49
- 210000002421 cell wall Anatomy 0.000 claims description 8
- 230000006835 compression Effects 0.000 claims description 6
- 238000007906 compression Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 abstract description 3
- 238000000926 separation method Methods 0.000 abstract 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a wafer clamping device which is characterized by comprising a base plate, a positioning column, a positioning block and an elastic resetting device, wherein the positioning column is arranged on the surface of the base plate and protrudes out of the surface of the base plate; the positioning block is arranged at the edge of the base plate and the positioning block is provided with a separation blade which extends to the center of the base plate from the edge of the base plate; the positioning block can move away from the edge of the base plate and can move back to be buckled at the edge of the base plate; the elastic resetting device can generate an elastic deformation force when the positioning block moves away from the edge of the base plate; and the elastic deformation force can drive the positioning block back to move back to be buckled at the edge of the base plate. The wafer clamping device, disclosed by the invention, has the advantages of simple structure, convenience for use, short time for clamping and detaching the wafer, fewer work procedures and time saving.
Description
Technical field
The present invention relates to a kind of wafer clamping device.
Background technology
In the wafer large-scale production process, need each step operation can both be fast, save time.Wafer is because therefore thin thickness needs clamps in most of processing procedure.But clamp structure of the prior art is complicated, uses inconvenience, and clamping and dismounting are inconvenient, and the operating time is long, operation is many, efficient is low.
Summary of the invention
The objective of the invention is in order to overcome deficiency of the prior art, a kind of simple in structure, easy to operate wafer clamping device is provided.
For realizing above purpose, the present invention realizes through following technical scheme:
The wafer clamping device is characterized in that, comprising:
Substrate;
Reference column, said reference column are arranged at substrate surface and protrude in substrate surface;
Locating piece, said locating piece is arranged on substrate edges, and locating piece is provided with the catch that extends to substrate center from substrate edges, and said locating piece can and can return back to away from the substrate edges motion and be fastened on the setting of substrate edges ground;
Elasticity reset device, said elasticity reset device produce the elastic deformation force when locating piece moves away from substrate edges, this elastic deformation force has the trend that locating piece is returned back to be fastened on the position of substrate edges.
Preferably, said locating piece is provided with groove; Substrate edges embeds in the groove along thickness direction, and said catch is the cell wall of groove.
Preferably, said substrate comprises substrate body and is arranged on the fixed teeth on the substrate body, and the number of described fixed teeth is more than two, and plural fixed teeth is along the circumferential direction arranged; Locating piece is arranged on one of them fixed teeth at least.
Preferably, said locating piece is sleeved on the fixed teeth end.
Preferably, the groove of said locating piece shape along its length matches with fixed teeth shape along the circumferential direction.
Preferably, the length of the groove of said locating piece is greater than the thickness of fixed teeth.
Preferably, described elasticity reset device is a spring.
Preferably, said elasticity reset device is the compression spring, and said substrate is provided with screw rod, and said locating piece is provided with first through hole, is provided with step in first through hole; Screw rod passes first through hole and substrate threaded engagement; Said compression spring housing is contained on the screw rod and is restricted between screw rod end and the step.
Preferably, said locating piece can screw rod be that axle is provided with rotationally.
Preferably, said substrate is provided with second through hole along thickness direction.
Preferably, described reference column is provided with the termination, and termination and substrate surface have the gap that adapts with wafer thickness.
Preferably, between termination and the substrate surface be draw-in groove.
Wafer clamping device among the present invention, simple in structure, easy to use, clamping and dismounting wafer time are short, and operation is few, saves time.
Description of drawings
Fig. 1 is a structural representation of the present invention.
Fig. 2 is an end view of the present invention.
Fig. 3 is the A-A cutaway view among Fig. 2.
Fig. 4 is the locating piece structure cutaway view among the present invention.
Fig. 5 is the present invention's first use principle sketch map.
Fig. 6 is the present invention's second use principle sketch map.
Fig. 7 is the present invention's the 3rd use principle sketch map.
Fig. 8 is the present invention's the 4th use principle sketch map.
Embodiment
Below in conjunction with accompanying drawing the present invention is carried out detailed description:
Like Fig. 1, Fig. 2 and shown in Figure 3, the wafer clamping device comprises substrate 1.Substrate 1 comprises basic body 11 and is arranged on the fixed teeth 12 on the substrate body 11.Fixed teeth 12 numbers are six.Six fixed teeth 12 are along the circumferential direction arranged.Wherein four fixed teeth 12 are provided with reference column 2.Reference column 2 protrudes in fixed teeth 12 surfaces 121.Reference column 2 has termination 21.Have the gap that adapts with wafer thickness between termination 21 and the substrate body 11, between termination 21 and substrate body 11, form draw-in groove 22.Substrate body 11 is provided with second through hole 13 along the thickness T direction.
Wherein be respectively arranged with a locating piece 3 on two fixed teeth 12.Locating piece 3 structures are as shown in Figure 4, and locating piece 3 is provided with groove 31.Groove 31 matches with fixed teeth 12 circumferencial direction shapes along length L direction shape.Groove 31 length L are greater than the thickness T of fixed teeth 12.First cell wall 32 of groove 31 and second cell wall 33 extend selected length along the edge of fixed teeth 12 to the center O of substrate body 1.Locating piece 3 is provided with first through hole 34.Be provided with step 35 in first through hole 34.
The fixed teeth 12 that is provided with locating piece 3 is equipped with screw 4.Screw 4 passes first through hole 34 and fixed teeth 12 threaded engagement.Compression spring 5 is sleeved on the screw 4 and between screw 4 ends 41 and step 35, and is restricted between end 41 and the step 35.Locating piece 3 among Fig. 2 and Fig. 3 serves as that axle has rotated 90 degree with respect to the state among Fig. 1 with screw 4.
Be illustrated in figure 1 as and do not place wafer clamping device before.At this moment, the groove 31 length L directions of locating piece 3 match with the shape of fixed teeth 12 circumferencial directions, and locating piece 3 is fastened on the fixed teeth 12.Locating piece 12 protrudes in substrate body 11 surfaces unlike reference column 2 that kind.As shown in Figure 5, when needing the clamping wafer, can wafer 6 be placed on 11 of substrate body, four reference columns 2 are held wafer 6.As shown in Figure 6, on the basis of Fig. 5, pulling locating piece 3 makes itself and fixed teeth 12 edges draw back certain distance.Compress spring 5 this moment and be compressed the generation elastic deformation force, this elastic deformation force can make locating piece 3 return back to and fixed teeth 12 position contacting.As shown in Figure 7, on the basis of Fig. 6, positioning of rotating piece 3 revolves it and turn 90 degrees, and the length L direction of groove 31 is consistent with the thickness T direction of substrate body 11.As shown in Figure 8, on the basis of Fig. 7, unclamp locating piece 3 after, locating piece 3 is under elastic deformation force's the effect of compression spring 5, near fixed teeth 12 and finally be fastened on the fixed teeth 12.Because locating piece 3 has rotated 90 degree with respect to the state among Fig. 1; Therefore; First cell wall 32 and second cell wall 33 of groove 3 have extended certain length from the edge of fixed teeth 12 to the center O of substrate body 11, and push down wafer 6, can prevent that wafer 6 breaks away from from substrate 1 surface.The length that first cell wall 32 and second cell wall 33 extend to the center of substrate body 11 from the edge of fixed teeth 12 can be definite according to the distance at the edge of wafer 6 edges and fixed teeth 12.Among the present invention, utilize fixedly wafer 6 of four reference columns 2 and two locating pieces 3.
In the time of need taking off wafer 6, the mode of operation reverse operating during according to the clamping wafer gets final product.
Embodiment among the present invention only is used for that the present invention will be described, does not constitute the restriction to the claim scope, and other substituting of being equal in fact that those skilled in that art can expect are all in protection range of the present invention.
Claims (12)
1. the wafer clamping device is characterized in that, comprising:
Substrate;
Reference column, said reference column are arranged at substrate surface and protrude in substrate surface;
Locating piece, said locating piece is arranged on substrate edges, and locating piece is provided with the catch that extends to substrate center from substrate edges, and said locating piece can and can return back to away from the substrate edges motion and be fastened on the setting of substrate edges ground;
Elasticity reset device, said elasticity reset device produce the elastic deformation force when locating piece moves away from substrate edges, this elastic deformation force has the trend that locating piece is returned back to be fastened on the position of substrate edges.
2. wafer clamping device according to claim 1 is characterized in that said locating piece is provided with groove; Substrate edges embeds in the groove along thickness direction, and said catch is the cell wall of groove.
3. wafer clamping device according to claim 1 and 2 is characterized in that, said substrate comprises substrate body and be arranged on the fixed teeth on the substrate body, and the number of described fixed teeth is more than two, and plural fixed teeth is along the circumferential direction arranged; Locating piece is arranged on one of them fixed teeth at least.
4. wafer clamping device according to claim 3 is characterized in that said locating piece is sleeved on the fixed teeth end.
5. wafer clamping device according to claim 4 is characterized in that, the groove of said locating piece shape along its length matches with fixed teeth shape along the circumferential direction.
6. wafer clamping device according to claim 5 is characterized in that the length of the groove of said locating piece is greater than the thickness of fixed teeth.
7. wafer clamping device according to claim 1 is characterized in that, described elasticity reset device is a spring.
8. wafer clamping device according to claim 7 is characterized in that, said elasticity reset device is the compression spring, and said substrate is provided with screw rod, and said locating piece is provided with first through hole, is provided with step in first through hole; Screw rod passes first through hole and substrate threaded engagement; Said compression spring housing is contained on the screw rod and is restricted between screw rod end and the step.
9. wafer clamping device according to claim 8 is characterized in that, said locating piece can screw rod be that axle is provided with rotationally.
10. wafer clamping device according to claim 1 is characterized in that said substrate is provided with second through hole along thickness direction.
11. wafer clamping device according to claim 1 is characterized in that described reference column is provided with the termination, termination and substrate surface have the gap that adapts with wafer thickness.
12. wafer clamping device according to claim 11 is characterized in that, is draw-in groove between termination and the substrate surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110459560.XA CN102569154B (en) | 2011-12-31 | 2011-12-31 | Wafer clamping device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110459560.XA CN102569154B (en) | 2011-12-31 | 2011-12-31 | Wafer clamping device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102569154A true CN102569154A (en) | 2012-07-11 |
| CN102569154B CN102569154B (en) | 2015-05-13 |
Family
ID=46414235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110459560.XA Active CN102569154B (en) | 2011-12-31 | 2011-12-31 | Wafer clamping device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102569154B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0250064A2 (en) * | 1986-06-20 | 1987-12-23 | Varian Associates, Inc. | Wafer processing chuck using multiple thin clamps |
| CN101090087A (en) * | 2006-06-14 | 2007-12-19 | 西门子公司 | Clamping device for a wafer |
| CN201845753U (en) * | 2010-11-03 | 2011-05-25 | 颀中科技（苏州）有限公司 | Wafer clamp |
| CN201859863U (en) * | 2010-11-05 | 2011-06-08 | 中美矽晶制品股份有限公司 | Wafer Carrier |
| CN202495435U (en) * | 2011-12-31 | 2012-10-17 | 上海新阳半导体材料股份有限公司 | Wafer clamping device |
-
2011
- 2011-12-31 CN CN201110459560.XA patent/CN102569154B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0250064A2 (en) * | 1986-06-20 | 1987-12-23 | Varian Associates, Inc. | Wafer processing chuck using multiple thin clamps |
| CN101090087A (en) * | 2006-06-14 | 2007-12-19 | 西门子公司 | Clamping device for a wafer |
| CN201845753U (en) * | 2010-11-03 | 2011-05-25 | 颀中科技（苏州）有限公司 | Wafer clamp |
| CN201859863U (en) * | 2010-11-05 | 2011-06-08 | 中美矽晶制品股份有限公司 | Wafer Carrier |
| CN202495435U (en) * | 2011-12-31 | 2012-10-17 | 上海新阳半导体材料股份有限公司 | Wafer clamping device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102569154B (en) | 2015-05-13 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |