CN102563460B - Light source structure and backlight module - Google Patents

Abstract

The invention discloses a light source structure and a backlight module. The light source structure comprises a circuit board, a plurality of light sources, a conducting wire and at least one through hole. The plurality of light sources are arranged on the circuit board. The wire is arranged on the circuit board and is blocked between the edge of the circuit board and the light source. At least one through hole is arranged on the path of the conducting wire for being matched and used with the metal back plate of the backlight module, and the side edge of the through hole is provided with at least one slotted structure so as to be convenient for sleeving. The conducting wire is provided with an exposed end at the through hole, and the exposed end comprises a conducting object arranged on the side wall opposite to the through hole. The invention discloses a backlight module, which comprises a metal back plate and the light source structure. The light source structure and the backlight module with the light source structure have better electrostatic discharge protection effect, and the light source structure can be conveniently assembled on the back plate of the backlight module.

Description

Light source structure and backlight module

This application is a divisional application. The filing date of the original application is: January 19, 2010; the application number is: 201010002591.8; the invention name is: light source structure and backlight module

technical field

The invention relates to a light source structure; specifically, the invention relates to a light source structure used in a liquid crystal display backlight module. the

Background technique

Liquid Crystal Display (LCD) is widely used in various electronic products such as computers, televisions, and mobile phones. The backlight module is one of the important components of the liquid crystal display. The structure of the light source used in the backlight module directly affects the performance and assembly cost of the backlight module. the

As shown in FIG. 1 , a conventional backlight module 80 includes a light source structure 20 and a metal backplane 70 . Wherein, the assembly alignment method of the light source structure 20 and the metal backplane 70 is to use the folding line 71 on the metal backplane 70 as an alignment reference. Using this method to assemble and align, the light source structure 20 is often shifted due to the difficult identification of the fold line 71 used for the alignment and the deviation of personnel assembly, which in turn causes poor contact of the electrical connection end (not shown) of the light source structure 20, and is difficult to insert or easily problems such as shedding. the

On the other hand, the existing light source structure 20 does not have a suitable electrostatic discharge (ESD) protection mechanism, so electrostatic discharge often occurs to attack the light source 23 on the light source structure 20, causing damage to the light source 23. There is room for improvement in the design of the above-mentioned light source structure 20 and the backlight module 80 . the

Contents of the invention

The main purpose of the present invention is to provide a light source structure with a better electrostatic discharge protection effect. the

Another object of the present invention is to provide a light source structure that can be more conveniently assembled on the backplane of the backlight module. the

Another object of the present invention is to provide a backlight module with a better electrostatic discharge protection effect. the

Another object of the present invention is to provide a backlight module that can be assembled more conveniently. the

In order to achieve the above object, the present invention provides a light source structure for use in a backlight module. The light source structure includes a circuit board, a plurality of light sources, wires, and at least one through hole. Multiple light sources are arranged on the circuit board. The wires are arranged on the circuit board and blocked between the edge of the circuit board and the light source. At least one through hole is arranged on the path of the wires for use in combination with the metal backplane of the backlight module. Wherein, the conductive wire has an outcrop at the through hole, and the outcrop includes a conductive material disposed on the opposite sidewall of the through hole. the

The metal backplane has a metal raised structure, and the circuit board contains a flexible circuit board. The circuit board is provided with two flanges on opposite sides of the through hole, respectively protruding from the circuit board to the inside of the through hole along the path of the wire. The conducting wire is extended to the edge of the through hole, and the outcropping is arranged on the opposite side wall of the two flanges to the through hole. When the through hole is assembled with the metal back plate, the metal protrusion structure is inserted in the through hole so that the two flanges are respectively bent, and the outcrops of the two flanges on the opposite side walls of the through hole contact the metal protrusion structure. The side wall enables the wire to form a path through the metal protrusion structure. the

The metal backplane has a metal protrusion structure, the circuit board includes a flexible circuit board, the aperture of the through hole of the circuit board is substantially smaller than the diameter of the metal protrusion structure, and the metal protrusion structure is penetrated in the through hole so that the circuit board surrounding the through hole Partially bent so that the wire forms a path through the metal bump structure. the

The outcrop is located at the bottom edge of the through hole of the circuit board. When the circuit board is sleeved on the metal protruding structure, the circuit board will be bent, and the bottom edge of the through hole of the circuit board can form a path with the metal protruding structure. At least one slit structure is provided on the side of the through hole to facilitate sheathing. the

The metal backplane has a metal raised structure, and the circuit board contains a rigid circuit board. When the through hole is assembled with the metal back plate, the metal protrusion structure is penetrated in the through hole, and the outcropping contacts the sidewall of the metal protrusion structure, so that the wire forms a path through the metal protrusion structure. The outcrops are disposed on opposite sidewalls of the through holes by electroplating. the

The light source structure further includes a protective layer, which is arranged on the circuit board and covers the wires in an exposed manner. The circuit board further has an extension part, and the tail end of the extension part has pins, and the pins are electrically connected to the light source. The light source includes light emitting diodes. the

In order to achieve the above object, the present invention also provides a backlight module, which includes a metal backplane and a light source structure. The metal back plate has at least one metal protrusion structure. The light source structure includes a circuit board, multiple light sources, wires, and at least one through hole. Multiple light sources are arranged on the circuit board. The wires are arranged on the circuit board and blocked between the edge of the circuit board and the light source. The through hole is arranged on the path of the wire, for the metal protrusion structure to penetrate inside, so that the circuit board is assembled with the backlight module. Wherein, the wire has an outcrop at the through hole, and the outcrop is a conductive object disposed on the opposite sidewall of the through hole. When the metal protruding structure is penetrated in the through hole, the wire contacts the metal protruding structure through the outcrop to form a path. the

The effect of the present invention is that the light source structure provided by the present invention and the backlight module with the light source structure have a better electrostatic discharge protection effect, and the light source structure can be more conveniently assembled on the backplane of the backlight module. the

The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the present invention. the

Description of drawings

Fig. 1 is prior art schematic diagram;

Fig. 2 is a schematic diagram of an embodiment of the present invention;

3A to 3C are schematic diagrams of preferred embodiments of the present invention;

Figure 4A and Figure 4B are schematic diagrams of different embodiments of the present invention;

5A to 5C are schematic diagrams of different embodiments of the present invention;

6A and 6B are schematic diagrams of different embodiments of the present invention having a protective layer; and

Fig. 7 is a schematic diagram of different embodiments of the present invention with extensions. the

Among them, reference signs

71 alignment lines

100 layers of protection

200 light source structure

210 circuit board

218 extension

219 pins

230 light sources

250 wires

251 Outcrops

270 through holes

271 flange

272 slotted structure

620 light guide plate

660 reflector

700 metal backplane

710 metal raised structure

800 backlight module

Detailed ways

Below in conjunction with accompanying drawing, structural principle of the present invention and principle of work are specifically described:

As shown in FIG. 2 , the exploded view of the backlight module, in a preferred embodiment, the light source structure 200 of the present invention can be used by the backlight module 800 . Specifically, the backlight module 800 includes a light source structure 200 and a metal backplane 700 , the metal backplane 700 has at least one metal protrusion structure 710 , and the light source structure 200 can be assembled on the metal backplane 700 through the metal protrusion structure 710 . In other words, the metal protruding structure 710 can be used to assemble the light source structure 200 and the metal backplane 700 without using the alignment line 71 as shown in FIG. 1 for alignment before assembling, which can improve the convenience of assembly and reduce deviation. Wherein, the metal protruding structure 710 is disposed on the side of the metal back plate 700 opposite to the light source structure 200 , and corresponds to the position where the light source structure 200 is disposed. The metal protruding structure 710 can be formed directly from the metal back plate 700 by metal extrusion, or a bump can be bonded to the metal back plate 700 by welding, welding, locking or pasting to form the metal protruding structure 710 . However, the present invention is not limited thereto, and an appropriate method can be selected to form the metal protrusion structure according to actual requirements. the

FIG. 3A is a perspective view of a preferred embodiment of the light source structure 200 of the present invention. FIG. 3B is a perspective view of a preferred embodiment of the light source structure 200 of the present invention assembled with a metal backplane 700. FIG. 3C is a preferred embodiment of the light source structure 200 of the present invention. A schematic cross-sectional view of the assembly with the metal backplane 700 . As shown in FIG. 3A , the light source structure 200 of the present invention includes a circuit board 210 , a plurality of light sources 230 , wires 250 , and at least one through hole 270 . The light source 230 is disposed on the circuit board 210 . The wire 250 is disposed on the circuit board 210 , and the wire 250 is blocked between the edge of the circuit board 210 and the light source 230 , and preferably extends parallel to the edge as shown in FIG. 3A . The light source 230 may include a light emitting diode. Specifically, the wire 250 surrounds the light source 230 relative to the edge of the circuit board 210 . The through hole 270 is set on the path of the wire 250 for use in combination with the metal backplane 700 of the backlight module 800 as shown in FIG. The metal bump structure 710 is contacted to form a via. Preferably, one through hole 270 is provided at each two ends of the circuit board 210 , but the number and position thereof may vary depending on design requirements. Wherein, the conductive wire 250 has an outcrop 251 at the through hole 270 , and the outcrop 251 includes a conductive material disposed on the sidewalls facing the through hole 270 . The conductive substance includes a conductive substance of the same or different material as the wire, and can be installed by electroplating, spot coating or pasting, such as silver glue spot-coated or carbon tape pasted on the side wall facing the through hole 270 .

In a preferred embodiment, the circuit board 210 includes a flexible circuit board. In the embodiment shown in FIG. 3A to FIG. 3C , the circuit board 210 is provided with two flanges 271 on opposite sides of the through hole 270 , respectively protruding from the circuit board 210 to the inside of the through hole 270 along the path of the wire 250 . The wire 250 is extended to the edge of the through hole 270 , and the outcrop 251 is disposed on the sidewall of the two flanges 271 facing the through hole 270 . When the through hole 270 is assembled with the metal back plate 700, the metal protrusion structure 710 is penetrated in the through hole 270 so that the two flanges 271 are respectively bent, and are arranged on the side walls of the two flanges 271 facing the through hole 270 The outcrops 251 contact the sidewalls of the metal protruding structure 710 , so that the conductive wire 250 forms a path through the metal protruding structure 710 . When the circuit board 210 is sleeved on the metal protrusion structure 710 , the circuit board 210 will be bent as shown in FIG. 3B and FIG. 3C , and the side edge of the through hole 270 of the circuit board 210 can form a path with the metal protrusion structure 710 . the

Specifically, in the embodiment shown in FIG. 3A to FIG. 3C , since the circuit board 210 can be a flexible circuit board, and the relative distance between the two flanges 271 is substantially smaller than the diameter of the metal protrusion structure 710, when running through When the hole 270 is assembled with the metal back plate 700 , the two flanges 271 are respectively bent upward due to the abutment of the metal protrusion structure 710 penetrating through the through hole 270 . At this time, the outcrops 251 disposed on the side walls of the two flanges 271 facing the through hole 270 contact the side wall of the metal protrusion structure 710, so that the wire 250 forms a path through the metal protrusion structure 710, and the light source 230 Surrounding inside to block the edge of the circuit board 210 and the light source 230 . Since electrostatic discharge mostly occurs at the edge of the circuit board 210, when the electrostatic discharge occurs, the electrical connection between the wire 250 and the metal protruding structure 710 can lead the static electricity to the ground, reducing the damage of the light source 230 from the electrostatic discharge attack, making the The light source structure 200 as a whole has a better electrostatic discharge protection effect. the

FIG. 4A is a perspective view of a preferred embodiment of the light source structure 200 of the present invention, and FIG. 4B is a perspective view of a preferred embodiment of the combination of the light source structure 200 and the metal back plate 700 of the present invention. In various embodiments, the circuit board 210 is not limited to using the flange 271 against the metal protrusion structure 710 . As shown in FIG. 4A and FIG. 4B, the circuit board 210 can be a flexible circuit board, and the diameter of the through hole 270 of the circuit board 210 is substantially smaller than the diameter of the metal protrusion structure 710, and the metal protrusion structure 710 is penetrated in the through hole 270. The portion of the circuit board surrounding the through hole 270 is bent so that the wire 250 forms a path through the metal protrusion structure 710 . In other words, the metal protruding structure 710 is inserted into the through hole 270. Since the diameter of the through hole 270 of the circuit board 210 is substantially smaller than the diameter of the metal protruding structure 710, the part of the circuit board surrounding the through hole 270 will be bent, and The outcrops 251 disposed on the opposite sidewalls of the through holes 270 will contact the sidewalls of the metal protruding structure 710, so that the conductive wire 250 forms a path through the metal protruding structure 710. On the other hand, at least one slit structure 272 can be further provided on the side of the through hole 270 to facilitate the sheathing. Specifically, the slit structure 272 can endow the through hole 270 with greater deformability, so as to accommodate the metal protruding structure 710 . the

FIG. 5A is a perspective view of a preferred embodiment of the light source structure 200 of the present invention. FIG. 5B is a perspective view of a preferred embodiment of the combination of the light source structure 200 and the metal back plate 700 of the present invention. FIG. 5C is a perspective view of the light source structure 200 of the present invention and the metal back plate. A schematic cross-sectional view of a preferred embodiment of the plate 700 assembly. As shown in FIGS. 5A to 5C , in different embodiments, the circuit board 210 is not limited to using a flexible circuit board, as long as the aperture diameter of the through hole 270 of the circuit board 210 is accurately controlled, and the holes disposed on the through hole 270 facing each other The distance between the outcrops 251 of the sidewall is equal to or slightly smaller than the diameter of the metal protruding structure 710, or the metal protruding structure 710 adopts a tapered design with a narrow top and a wide bottom. The circuit board 210 can also use a rigid circuit board. When the through hole 270 is assembled with the metal back plate 700, the metal protrusion structure 710 is penetrated in the through hole 270, and the exposed head 251 is in contact with the side wall of the metal protrusion structure 710, so that the wire 250 is formed through the metal protrusion structure 710. path. Wherein, at least one slit structure 272 may be further provided on the side of the through hole 270 for the convenience of sheathing. Specifically, the slit structure 272 can endow the through hole 270 with greater deformability, so as to accommodate the metal protruding structure 710 . the

FIG. 6A is a schematic perspective view of a light source structure 200 with a protective layer 100 according to the present invention, and FIG. 6B is a schematic cross-sectional view of a light source structure 200 with a protective layer 100 according to the present invention. In different embodiments as shown in FIG. 6A and FIG. 6B, the light source structure 200 further includes a protective layer 100, which is disposed on the circuit board 210, and covers the wire 250 in a manner of exposing the outcrop 251, so as to protect the wire 250 from being oxidized. . In other words, the wire 250 is covered by the protection layer 100 to avoid oxidation, and the outcrop 251 is not covered by the protection layer 100 , so that when the through hole 270 is assembled with the metal backplane 700 , the metal protrusion structure 710 penetrates through the through hole 270 Inside, the outcrop 251 can be in contact with the sidewall of the metal protruding structure 710 . Wherein, the protective layer 100 can be selected from polymer materials, metal oxides or other suitable materials. the

FIG. 7 is a schematic top view of the light source structure 200 of the present invention having the extension portion 218 . In a different embodiment as shown in FIG. 7 , the circuit board 210 further has an extension 218 , and a tail end of the extension 218 has a pin 219 . Specifically, the pin 219 is a metal contact disposed at the tail end of the extension portion 218 . Wherein, the pin 219 is electrically connected to the light source 230, and the pin 219 can be further connected to a power source (not shown). In other words, the light source 230 can be connected to a power source through the pin 219 . It should be noted that the wire 250 is not electrically connected to the pin 219 . In this embodiment, the wire 250 extends parallelly along the edge of the extension portion 218 as shown in FIG. 7 . When the pin 219 is connected to a power source, the wire 250 surrounding the circuit board 210 can achieve the effect of electrostatic discharge protection. the

Certainly, the present invention also can have other multiple embodiments, without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and deformations according to the present invention, but these corresponding Changes and deformations should belong to the scope of protection of the appended claims of the present invention. the

Claims (14)

1. A light source structure for use by a backlight module, characterized in that the light source structure comprises: a circuit board; A plurality of light sources are arranged on the circuit board; a wire disposed on the circuit board, the wire is blocked between the edge of the circuit board and the plurality of light sources, and the wire surrounds the plurality of light sources; and At least one through hole is arranged on the path of the wire for use in combination with a metal backplane of the backlight module, wherein the wire has an outcrop at the through hole, and the outcrop includes an outcrop arranged on the opposite side wall of the through hole As for the conductive object, at least one slit structure is provided on the side of the through hole, so as to facilitate sheathing. 2. The light source structure according to claim 1, wherein the metal back plate has a metal protrusion structure, the circuit board includes a flexible circuit board, and the through hole of the circuit board has a smaller diameter than the metal protrusion The diameter of the structure, the metal protruding structure penetrates in the through hole to bend the circuit board part surrounding the through hole, so that the wire forms a path through the metal protruding structure. 3. The light source structure according to claim 1, wherein the metal back plate has a metal protrusion structure, the circuit board includes a rigid circuit board, and when the through hole is assembled with the metal back plate, the metal The metal protruding structure of the back plate is penetrated in the through hole, and the outcrop is in contact with the sidewall of the metal protruding structure, so that the wire forms a path through the metal protruding structure. 4. The light source structure according to claim 1, wherein the outcrop is disposed on the opposite sidewall of the through hole by electroplating. 5 . The light source structure according to claim 1 , further comprising a protective layer disposed on the circuit board and covering the wire in a manner of exposing the exposed head. 6 . 6 . The light source structure according to claim 1 , wherein the circuit board further has an extension, and a tail end of the extension has a pin, and the pin is electrically connected to the plurality of light sources. 7. The light source structure according to claim 1, wherein the plurality of light sources comprise light emitting diodes. 8. A backlight module, characterized in that it comprises: a metal backplane having at least one metal raised structure; and A light source structure, including: a circuit board; A plurality of light sources are arranged on the circuit board; a wire disposed on the circuit board, the wire is blocked between the edge of the circuit board and the plurality of light sources, and the wire surrounds the plurality of light sources; and At least one through hole is arranged on the path of the wire, through which the metal protrusion structure is penetrated, so that the circuit board is assembled on the backlight module, wherein the wire has an outcrop at the through hole, and the outcrop includes setting Conductors on the opposite side walls of the through-hole, when the metal protruding structure penetrates the through-hole, the wire contacts the metal protruding structure through the outcrop to form a path, and the side of the through-hole is provided with at least One-slit construction for easy slip-on. 9. The backlight module according to claim 8, wherein the circuit board comprises a flexible circuit board, the diameter of the through hole of the circuit board is smaller than the diameter of the metal protruding structure, and the metal protruding structure passes through The part of the circuit board surrounding the through hole is bent in the through hole, so that the wire forms a path through the metal protrusion structure. 10. The backlight module according to claim 8, wherein the circuit board comprises a rigid circuit board, and when the through hole is assembled with the metal backplane, the metal protrusion structure penetrates the through hole, The outcrop is in contact with the sidewall of the metal protruding structure, so that the wire forms a path through the metal protruding structure. 11. The backlight module according to claim 8, wherein the outcrop is disposed on the opposite sidewall of the through hole by electroplating. 12 . The backlight module according to claim 8 , further comprising a protection layer disposed on the circuit board and covering the wires in a manner of exposing the exposed heads. 13 . 13 . The backlight module according to claim 8 , wherein the circuit board further has an extension, and a tail end of the extension has a pin, and the pin is electrically connected to the plurality of light sources. 14. The backlight module according to claim 8, wherein the light source comprises a light emitting diode.

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