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CN102555082B - 脆性材料基板的分断方法 - Google Patents

脆性材料基板的分断方法 Download PDF

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Publication number
CN102555082B
CN102555082B CN201110391123.9A CN201110391123A CN102555082B CN 102555082 B CN102555082 B CN 102555082B CN 201110391123 A CN201110391123 A CN 201110391123A CN 102555082 B CN102555082 B CN 102555082B
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CN
China
Prior art keywords
brittle substrate
disjunction
article
material substrate
fragile material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201110391123.9A
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English (en)
Chinese (zh)
Other versions
CN102555082A (zh
Inventor
村上健二
武田真和
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Publication of CN102555082A publication Critical patent/CN102555082A/zh
Application granted granted Critical
Publication of CN102555082B publication Critical patent/CN102555082B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
CN201110391123.9A 2010-11-30 2011-11-25 脆性材料基板的分断方法 Expired - Fee Related CN102555082B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2010-265881 2010-11-30
JP2010265881 2010-11-30
JP2011185656A JP5187421B2 (ja) 2010-11-30 2011-08-29 脆性材料基板のブレイク方法
JP2011-185656 2011-08-29

Publications (2)

Publication Number Publication Date
CN102555082A CN102555082A (zh) 2012-07-11
CN102555082B true CN102555082B (zh) 2014-10-15

Family

ID=46647377

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201110391123.9A Expired - Fee Related CN102555082B (zh) 2010-11-30 2011-11-25 脆性材料基板的分断方法

Country Status (4)

Country Link
JP (1) JP5187421B2 (ja)
KR (1) KR101299793B1 (ja)
CN (1) CN102555082B (ja)
TW (1) TWI436871B (ja)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102789780B (zh) * 2012-07-14 2014-10-01 福州大学 基于谱时幅度分级向量辨识环境声音事件的方法
JP6039363B2 (ja) * 2012-10-26 2016-12-07 三星ダイヤモンド工業株式会社 脆性材料基板の分断方法並びに分断装置
JP6262960B2 (ja) * 2013-08-23 2018-01-17 三星ダイヤモンド工業株式会社 基板分断装置
JP6185812B2 (ja) * 2013-09-30 2017-08-23 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク方法並びにブレイク装置
JP6154713B2 (ja) 2013-09-30 2017-06-28 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク方法並びにブレイク装置
JP6243699B2 (ja) 2013-10-25 2017-12-06 三星ダイヤモンド工業株式会社 脆性材料基板の分断装置
JP2016030364A (ja) * 2014-07-28 2016-03-07 三星ダイヤモンド工業株式会社 貼り合わせ基板の分断方法及び分断装置
JP2016040079A (ja) * 2014-08-12 2016-03-24 三星ダイヤモンド工業株式会社 脆性材料基板の分断方法及び分断装置
JP2016043505A (ja) * 2014-08-20 2016-04-04 三星ダイヤモンド工業株式会社 脆性材料基板の分断方法及び分断装置
JP6481465B2 (ja) * 2014-08-21 2019-03-13 三星ダイヤモンド工業株式会社 複合基板のブレイク方法
JP6446912B2 (ja) * 2014-08-26 2019-01-09 三星ダイヤモンド工業株式会社 ブレーク装置
JP6547556B2 (ja) * 2015-09-29 2019-07-24 三星ダイヤモンド工業株式会社 脆性基板の分断方法
TW202041343A (zh) * 2018-12-18 2020-11-16 日商三星鑽石工業股份有限公司 陶瓷片的製造方法及陶瓷片製造用之煅燒前片的製造方法
JP7098173B2 (ja) * 2020-02-12 2022-07-11 三星ダイヤモンド工業株式会社 脆性材料基板の分断機構
WO2023176068A1 (ja) * 2022-03-16 2023-09-21 ナルックス株式会社 マイクロレンズ及びマイクロレンズアレイの製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1868943A (zh) * 2005-05-27 2006-11-29 肖特股份有限公司 对脆裂材料制成的有划痕的平坦工件进行机械破断的方法
CN101099228A (zh) * 2005-01-05 2008-01-02 Thk株式会社 工件的截断方法和装置、划线和截断方法、以及带截断功能的划线装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6368397A (ja) * 1986-09-05 1988-03-28 三菱電機株式会社 基板のブレ−ク装置
JP2003267742A (ja) * 2002-03-13 2003-09-25 Nakamura Tome Precision Ind Co Ltd 硬質脆性板のスクライブ方法
JP4742649B2 (ja) * 2005-04-05 2011-08-10 ソニー株式会社 貼り合わせ基板の基板ブレイク装置及びその基板ブレイク方法
JP2007067365A (ja) * 2005-08-05 2007-03-15 Alps Electric Co Ltd 電子機器の製造方法
JP5330845B2 (ja) * 2009-01-30 2013-10-30 三星ダイヤモンド工業株式会社 基板ブレーク装置
JP5216040B2 (ja) * 2010-03-31 2013-06-19 三星ダイヤモンド工業株式会社 脆性材料基板の分断方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101099228A (zh) * 2005-01-05 2008-01-02 Thk株式会社 工件的截断方法和装置、划线和截断方法、以及带截断功能的划线装置
CN1868943A (zh) * 2005-05-27 2006-11-29 肖特股份有限公司 对脆裂材料制成的有划痕的平坦工件进行机械破断的方法

Also Published As

Publication number Publication date
TW201244902A (en) 2012-11-16
JP5187421B2 (ja) 2013-04-24
TWI436871B (zh) 2014-05-11
CN102555082A (zh) 2012-07-11
JP2012131216A (ja) 2012-07-12
KR101299793B1 (ko) 2013-08-23
KR20120059355A (ko) 2012-06-08

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Granted publication date: 20141015

Termination date: 20161125