CN102547312B - LED stereoscopic display - Google Patents
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- 238000004806 packaging method and process Methods 0.000 claims abstract description 84
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000002041 carbon nanotube Substances 0.000 claims abstract description 15
- 229910021393 carbon nanotube Inorganic materials 0.000 claims abstract description 15
- 239000000084 colloidal system Substances 0.000 claims abstract description 11
- 230000010287 polarization Effects 0.000 claims abstract description 7
- 239000003086 colorant Substances 0.000 claims description 5
- 239000000843 powder Substances 0.000 claims description 4
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 claims description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 3
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims description 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 claims description 2
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 claims description 2
- AJXBBNUQVRZRCZ-UHFFFAOYSA-N azanylidyneyttrium Chemical compound [Y]#N AJXBBNUQVRZRCZ-UHFFFAOYSA-N 0.000 claims description 2
- -1 terbium yttrium aluminum Chemical compound 0.000 claims description 2
- 239000000463 material Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
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- 210000004556 brain Anatomy 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
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- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
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- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
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Abstract
本发明涉及一种LED立体显示器，其包括多个像素点，每个像素点包括至少两个发光二极管封装结构。每个发光二极管封装结构包括封装载体、贴设在该封装载体一个表面上的发光二极管芯片、以及覆盖在发光二极管芯片上的封装体。所述封装体包括透明胶体及在透明胶体内沿同一方向平行排列的碳纳米管。所述至少两个发光二极管封装结构包括至少一个第一方向发光二极管封装结构和至少一个第二方向发光二极管封装结构。所述第一方向与第二方向垂直，以使第一方向发光二极管封装结构和第二方向发光二极管封装结构的出射光的偏振方向相互垂直。
The invention relates to an LED stereoscopic display, which includes a plurality of pixel points, and each pixel point includes at least two light emitting diode packaging structures. Each LED packaging structure includes a packaging carrier, a LED chip mounted on one surface of the packaging carrier, and a packaging body covering the LED chip. The packaging body includes a transparent colloid and carbon nanotubes arranged in parallel along the same direction in the transparent colloid. The at least two LED packaging structures include at least one LED packaging structure in a first direction and at least one LED packaging structure in a second direction. The first direction is perpendicular to the second direction, so that the polarization directions of the outgoing light of the light emitting diode packaging structure in the first direction and the light emitting diode packaging structure in the second direction are perpendicular to each other.
Description
技术领域 technical field
本发明涉及一种显示器，尤其涉及一种LED立体显示器。The invention relates to a display, in particular to an LED stereoscopic display.
背景技术 Background technique
目前，常见的立体显示方式是在一个显示器上同时显示左眼图像和右眼图像，在左眼图像和右眼图像前分别贴设两种偏振方向垂直的偏振片，观看者通过佩戴偏振眼镜，使得左右眼能够分别看见左眼图像和右眼图像，最后通过人脑的融合来实现立体视觉效果。然而，为了得到清晰的图像，不管是左眼图像，还是右眼图像，他们的像素点之间的间距都要足够的小，而左眼图像和右眼图像的像素点又需要交错设置，这就要求偏振片尺寸也应很小，这导致偏振片的贴设难度非常大，且很难与各像素点对准，从而使得这种立体显示器具有较高的制造成本和较低的良率。At present, the common three-dimensional display method is to simultaneously display the left-eye image and the right-eye image on a display, and respectively attach two kinds of polarizers with vertical polarization directions in front of the left-eye image and the right-eye image. The viewer wears polarized glasses, The left and right eyes can see the left eye image and the right eye image respectively, and finally realize the stereoscopic vision effect through the fusion of the human brain. However, in order to obtain a clear image, whether it is a left-eye image or a right-eye image, the spacing between their pixels must be small enough, and the pixels of the left-eye image and the right-eye image need to be set alternately, which It is required that the size of the polarizing plate should be small, which makes it very difficult to attach the polarizing plate and align with each pixel point, so that the three-dimensional display has high manufacturing cost and low yield.
发明内容 Contents of the invention
有鉴于此，有必要提供一种新型的LED立体显示器。In view of this, it is necessary to provide a novel LED stereoscopic display.
一种LED立体显示器，其包括多个像素点，每个像素点包括至少两个发光二极管封装结构。每个发光二极管封装结构包括封装载体、贴设在该封装载体一个表面上的发光二极管芯片、以及覆盖在发光二极管芯片上的封装体。所述封装体包括透明胶体及在透明胶体内沿同一方向平行排列的碳纳米管。所述至少两个发光二极管封装结构包括至少一个第一方向发光二极管封装结构和至少一个第二方向发光二极管封装结构。所述第一方向与第二方向垂直，以使第一方向发光二极管封装结构和第二方向发光二极管封装结构的出射光的偏振方向相互垂直。An LED stereoscopic display includes a plurality of pixel points, and each pixel point includes at least two light emitting diode packaging structures. Each LED packaging structure includes a packaging carrier, a LED chip mounted on one surface of the packaging carrier, and a packaging body covering the LED chip. The packaging body includes a transparent colloid and carbon nanotubes arranged in parallel along the same direction in the transparent colloid. The at least two LED packaging structures include at least one LED packaging structure in a first direction and at least one LED packaging structure in a second direction. The first direction is perpendicular to the second direction, so that the polarization directions of the outgoing light of the light emitting diode packaging structure in the first direction and the light emitting diode packaging structure in the second direction are perpendicular to each other.
所述LED立体显示器中，由于每个像素点中均包括第一方向发光二极管封装结构和第二方向发光二极管封装结构，而第一方向发光二极管封装结构和第二方向发光二极管封装结构的出射光的偏振方向相互垂直，这样使得每个像素点中的第一方向发光二极管封装结构和第二方向发光二极管封装结构可以分别用来形成左眼图像和右眼图像，从而达到立体显示的效果。另外，由于所述立体显示器中无需贴设偏振片，可以降低制造成本并提高良率。In the LED stereoscopic display, since each pixel includes a first-direction light-emitting diode packaging structure and a second-direction light-emitting diode packaging structure, the emitted light from the first-direction light-emitting diode packaging structure and the second-direction light-emitting diode packaging structure The polarization directions are perpendicular to each other, so that the first direction light emitting diode packaging structure and the second direction light emitting diode packaging structure in each pixel can be used to form left-eye images and right-eye images respectively, so as to achieve the effect of stereoscopic display. In addition, since the stereoscopic display does not need to attach polarizers, the manufacturing cost can be reduced and the yield rate can be improved.
附图说明 Description of drawings
图1是本发明实施方式提供的一种LED立体显示器的示意图。FIG. 1 is a schematic diagram of an LED stereoscopic display provided by an embodiment of the present invention.
图2是图1中的LED立体显示器的一个像素点的示意图。FIG. 2 is a schematic diagram of a pixel of the LED stereoscopic display in FIG. 1 .
图3是图2的LED立体显示器中的发光二极管封装结构剖视图。FIG. 3 is a cross-sectional view of the LED package structure in the LED stereoscopic display of FIG. 2 .
主要元件符号说明Description of main component symbols
LED立体显示器 1LED Stereo Display 1
像素点 2Pixels 2
发光二极管封装结构 100Light-emitting diode packaging structure 100
封装载体 10Packaging carrier 10
绝缘本体 11Insulation Body 11
导线架 12Lead frame 12
发光二极管芯片 20Light-emitting diode chip 20
封装体 30Package Body 30
反射杯 40Reflector Cup 40
第一表面 101First Surface 101
第二表面 102Second Surface 102
具体实施方式 Detailed ways
以下将结合附图对本发明作进一步的详细说明。The present invention will be further described in detail below in conjunction with the accompanying drawings.
请参阅图1和图2，本发明实施方式提供的一种LED立体显示器1，其包括多个像素点2。每个像素点2包括至少两个发光二极管封装结构100。Referring to FIG. 1 and FIG. 2 , an LED stereoscopic display 1 provided by an embodiment of the present invention includes a plurality of pixels 2 . Each pixel 2 includes at least two LED packaging structures 100 .
请参阅图3，所述发光二极管封装结构100包括封装载体10、发光二极管芯片20、封装体30及反射杯40。Please refer to FIG. 3 , the LED package structure 100 includes a package carrier 10 , a LED chip 20 , a package body 30 and a reflective cup 40 .
所述封装载体10包括绝缘本体11及两个导线架12。所述封装载体10包括相对的第一表面101及第二表面102。所述每个导线架12一端裸露在封装载体10的第一表面101上，另一端裸露在封装载体10的第二表面102上。所述绝缘本体11可采用高导热且电绝缘材料制成，该高导热且电绝缘材料可选自石墨、硅、陶瓷、类钻、环氧树脂或硅烷氧树脂等。所述导线架12可采用金属或金属合金制成。The packaging carrier 10 includes an insulating body 11 and two lead frames 12 . The package carrier 10 includes a first surface 101 and a second surface 102 opposite to each other. One end of each lead frame 12 is exposed on the first surface 101 of the package carrier 10 , and the other end is exposed on the second surface 102 of the package carrier 10 . The insulating body 11 can be made of high thermal conductivity and electrical insulation material, and the high thermal conductivity and electrical insulation material can be selected from graphite, silicon, ceramics, diamond-like resin, epoxy resin or siloxane resin and the like. The lead frame 12 can be made of metal or metal alloy.
所述发光二极管芯片20贴设于所述封装载体10上，具体的，所述发光二极管芯片20可贴设于所述绝缘本体11上，或贴设于所述导线架12裸露在第一表面101上的一端上。本实施方式中，所述发光二极管芯片20贴设于一个导线架12裸露在第一表面101上的一端上。所述发光二极管芯片20可通过覆晶(flip-chip)、共晶(eutectic)或打线等方式与所述两个导线架12电连接。本实施方式中，所述发光二极管芯片20与所述两个导线架12打线连接。The light emitting diode chip 20 is attached on the packaging carrier 10, specifically, the light emitting diode chip 20 can be attached on the insulating body 11, or attached to the lead frame 12 exposed on the first surface 101 on one end. In this embodiment, the LED chip 20 is mounted on one end of a lead frame 12 exposed on the first surface 101 . The LED chip 20 can be electrically connected to the two lead frames 12 through flip-chip, eutectic or wire bonding. In this embodiment, the LED chip 20 is connected to the two lead frames 12 by wire bonding.
所述封装体30覆盖在发光二极管芯片20上，用于保护发光二极管芯片20免受灰尘、水气等影响。所述封装体30包括透明胶体31及在透明胶体31内沿同一方向大致平行排列的碳纳米管32。透明胶体31的材质可以为硅胶(silicone)、环氧树脂(epoxy)或其组合物。所述透明胶体31指能够透射发光二极管芯片20发出的光线的胶体。由于平行排列的碳纳米管32具有偏振片的功能，因此，发光二极管芯片20发出的光线经过所述封装体30后即可成为偏振光，该偏振光的偏振方向与碳纳米管32排列的方向相同。另外，由于碳纳米管32具有极好的导热性，从而能够提高整个封装体30的导热性能，有利于提高发光二极管芯片20的散热效率。由于碳纳米管32还具有很好的力学性能，从而能够提高整个封装体30的材料强度。优选地，所述封装体30内可掺杂有荧光粉，所述荧光粉可选自钇铝石榴石、铽钇铝石榴石、氮化物、硫化物及硅酸盐中的一种或几种的组合。The package body 30 covers the LED chip 20 and is used to protect the LED chip 20 from dust, moisture and the like. The encapsulation body 30 includes a transparent colloid 31 and carbon nanotubes 32 arranged substantially parallel in the same direction in the transparent colloid 31 . The material of the transparent colloid 31 can be silicone, epoxy or a combination thereof. The transparent colloid 31 refers to the colloid that can transmit the light emitted by the LED chip 20 . Since the carbon nanotubes 32 arranged in parallel have the function of a polarizer, the light emitted by the light emitting diode chip 20 can become polarized light after passing through the package body 30, and the polarization direction of the polarized light is the same as the direction in which the carbon nanotubes 32 are arranged. same. In addition, since the carbon nanotubes 32 have excellent thermal conductivity, the thermal conductivity of the entire package body 30 can be improved, which is beneficial to improve the heat dissipation efficiency of the LED chip 20 . Since the carbon nanotubes 32 also have good mechanical properties, the material strength of the entire package 30 can be improved. Preferably, phosphor powder can be doped in the package body 30, and the phosphor powder can be selected from one or more of yttrium aluminum garnet, terbium yttrium aluminum garnet, nitride, sulfide and silicate The combination.
所述反射杯40环绕所述发光二极管芯片20及封装体30设置在封装载体10的第一表面101上。所述反射杯40用于提高整个发光二极管封装结构100的出光效率，所述反射杯40可完全采用反射材料制成，或仅其内表面采用反射材料制成。优选地，所述反射杯40采用高导热性材料制成，以提高发光二极管芯片20的散热效率。本实施方式中，所述碳纳米管32大致平行于封装载体10的第一表面101，由于碳纳米管32轴向具有极佳的导热性能，因此，封装体30内的热量可快速传导到反射杯40上，从而能够进一步提高发光二极管芯片20的散热效率。The reflective cup 40 is disposed on the first surface 101 of the package carrier 10 around the LED chip 20 and the package body 30 . The reflective cup 40 is used to improve the light extraction efficiency of the entire LED packaging structure 100 , and the reflective cup 40 may be entirely made of reflective materials, or only its inner surface may be made of reflective materials. Preferably, the reflective cup 40 is made of a material with high thermal conductivity, so as to improve the heat dissipation efficiency of the LED chip 20 . In this embodiment, the carbon nanotubes 32 are roughly parallel to the first surface 101 of the package carrier 10. Since the carbon nanotubes 32 have excellent thermal conductivity in the axial direction, the heat in the package 30 can be quickly transferred to the reflector. The cup 40 can further improve the heat dissipation efficiency of the light emitting diode chip 20 .
请再参阅图2，所述像素点2中的至少两个发光二极管封装结构100中，至少有一个发光二极管封装结构100中的碳纳米管32沿第一方向排列，另外，至少有一个发光二极管封装结构100中的碳纳米管32沿第二方向排列。所述第一方向与所述第二方向垂直。以下，将碳纳米管32沿第一方向排列的发光二极管封装结构100称为第一方向发光二极管封装结构100，将碳纳米管32沿第二方向排列的发光二极管封装结构100称为第二方向发光二极管封装结构100。Please refer to FIG. 2 again, among the at least two light emitting diode packaging structures 100 in the pixel point 2, the carbon nanotubes 32 in at least one light emitting diode packaging structure 100 are arranged along the first direction, and at least one light emitting diode The carbon nanotubes 32 in the packaging structure 100 are arranged along the second direction. The first direction is perpendicular to the second direction. Hereinafter, the light emitting diode packaging structure 100 in which the carbon nanotubes 32 are arranged along the first direction is called the first direction light emitting diode packaging structure 100, and the light emitting diode packaging structure 100 in which the carbon nanotubes 32 are arranged in the second direction is called the second direction. Light emitting diode package structure 100 .
本实施方式中，所述像素点2包括6个发光二极管封装结构100，其中，3个第一方向发光二极管封装结构100和3个第二方向发光二极管封装结构100。可以理解，所述像素点2中的发光二极管封装结构100总的数量并不限于本实施方式，且所述像素点2中，第一方向和第二方向发光二极管封装结构100的数量也不限于本实施方式。所述第一方向和第二方向发光二极管封装结构100的设置关系也不限于本实施方式，例如，所述相邻的两个第一方向发光二极管封装结构100可以设置在一行或一列上，相邻的两个第一方向发光二极管封装结构100也可既不同行也不同列。In this embodiment, the pixel point 2 includes six LED packaging structures 100 , among which, there are three LED packaging structures 100 in the first direction and three LED packaging structures 100 in the second direction. It can be understood that the total number of light emitting diode packaging structures 100 in the pixel point 2 is not limited to this embodiment, and in the pixel point 2, the number of light emitting diode packaging structures 100 in the first direction and the second direction is not limited to This embodiment. The arrangement relationship between the light emitting diode packaging structures 100 in the first direction and the second direction is not limited to this embodiment, for example, the two adjacent light emitting diode packaging structures 100 in the first direction can be arranged in a row or a column, and The adjacent two light-emitting diode packaging structures 100 in the first direction may also have different rows and different columns.
为了使所述LED立体显示器1能够显示彩色，每个像素点2应包括至少两个不同颜色的第一方向发光二极管封装结构100，及至少两个不同颜色的第二方向发光二极管封装结构100。本实施方式中，所述3个第一方向发光二极管封装结构100包括一个蓝色、一个红色及一个绿色发光二极管封装结构100，所述3个第二方向发光二极管封装结构100也包括一个蓝色、一个红色及一个绿色发光二极管封装结构100。In order to enable the LED stereoscopic display 1 to display colors, each pixel 2 should include at least two first-directional LED packaging structures 100 of different colors, and at least two second-directional LED packaging structures 100 of different colors. In this embodiment, the three first-direction light-emitting diode packaging structures 100 include one blue, one red and one green light-emitting diode packaging structure 100, and the three second-direction light-emitting diode packaging structures 100 also include one blue , a package structure 100 for a red light emitting diode and a green light emitting diode.
本发明实施方式提供的LED立体显示器1中，由于每个像素点2中均包括第一方向发光二极管封装结构100和第二方向发光二极管封装结构100，而第一方向发光二极管封装结构100和第二方向发光二极管封装结构100的出射光的偏振方向相互垂直，这样使得每个像素点2中的第一方向发光二极管封装结构100和第二方向发光二极管封装结构100可以分别用来形成左眼图像和右眼图像，从而达到立体显示的效果。另外，由于所述LED立体显示器1中无需贴设偏振片，可以降低制造成本并提高良率。In the LED stereoscopic display 1 provided in the embodiment of the present invention, since each pixel point 2 includes a first-direction light-emitting diode packaging structure 100 and a second-direction light-emitting diode packaging structure 100, and the first-direction light-emitting diode packaging structure 100 and the second-direction light-emitting diode packaging structure 100 The polarization directions of the outgoing light of the two-direction LED packaging structure 100 are perpendicular to each other, so that the first-direction LED packaging structure 100 and the second-direction LED packaging structure 100 in each pixel 2 can be used to form left-eye images respectively and the image for the right eye, so as to achieve the effect of stereoscopic display. In addition, since the LED stereoscopic display 1 does not need to attach polarizers, the manufacturing cost can be reduced and the yield rate can be improved.
可以理解的是，对于本领域的普通技术人员来说，可以根据本发明的技术构思做出其它各种相应的改变与变形，而所有这些改变与变形都应属于本发明权利要求的保护范围。It can be understood that those skilled in the art can make various other corresponding changes and modifications according to the technical concept of the present invention, and all these changes and modifications should belong to the protection scope of the claims of the present invention.
Claims (10)
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| CN201010595679.5A CN102547312B (en) | 2010-12-20 | 2010-12-20 | LED stereoscopic display |
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| CN108110124A (en) * | 2016-11-25 | 2018-06-01 | 佛山市国星光电股份有限公司 | A kind of TOP-LED devices and its manufacturing method |
| CN106990544B (en) * | 2017-04-17 | 2019-08-06 | 宁波万维显示科技有限公司 | Display panel and 3 d display device |
| CN108878619B (en) * | 2017-05-15 | 2021-04-09 | 巨贸精密工业股份有限公司 | Light source sensor lead frame base material structure |
| US11543676B2 (en) * | 2019-08-30 | 2023-01-03 | 3D Live, Inc. | Encapsulation of polarized light emitters |
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| CN1913648A (en) * | 2005-08-10 | 2007-02-14 | 胜华科技股份有限公司 | Image display device and stereoscopic image generating structure used in the image display device |
| CN101276012A (en) * | 2007-03-30 | 2008-10-01 | 清华大学 | Polarizing element and its preparation method |
| CN201440192U (en) * | 2009-06-17 | 2010-04-21 | 华映光电股份有限公司 | Three-dimensional monitor |
| CN201556640U (en) * | 2009-10-27 | 2010-08-18 | 先进开发光电股份有限公司 | Light emitting diode packaging structure |
| CN201622392U (en) * | 2009-11-20 | 2010-11-03 | 中国科学技术大学 | Light-emitting diode polarized film display for stereoscopic display |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1913648A (en) * | 2005-08-10 | 2007-02-14 | 胜华科技股份有限公司 | Image display device and stereoscopic image generating structure used in the image display device |
| CN101276012A (en) * | 2007-03-30 | 2008-10-01 | 清华大学 | Polarizing element and its preparation method |
| CN201440192U (en) * | 2009-06-17 | 2010-04-21 | 华映光电股份有限公司 | Three-dimensional monitor |
| CN201556640U (en) * | 2009-10-27 | 2010-08-18 | 先进开发光电股份有限公司 | Light emitting diode packaging structure |
| CN201622392U (en) * | 2009-11-20 | 2010-11-03 | 中国科学技术大学 | Light-emitting diode polarized film display for stereoscopic display |
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Effective date of registration: 20170405 Address after: 255000 Shandong City, Linzi Province, the town of the Central District of the village shop No. 4 Group No. 44, No. Patentee after: Cui Liangmei Address before: 225300 Jiangsu City, Taizhou Province Economic Development Zone, medicine city road, No. 1, building, science and technology, building, layer 2, layer Patentee before: LI WEILIANG |
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