CN102544339B - SMD Type LED Short Pitch Lead Frame - Google Patents
SMD Type LED Short Pitch Lead Frame Download PDFInfo
- Publication number
- CN102544339B CN102544339B CN201010594197.8A CN201010594197A CN102544339B CN 102544339 B CN102544339 B CN 102544339B CN 201010594197 A CN201010594197 A CN 201010594197A CN 102544339 B CN102544339 B CN 102544339B
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- lead frame
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- type led
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- 238000000034 method Methods 0.000 claims abstract description 16
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 239000000463 material Substances 0.000 description 5
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49565—Side rails of the lead frame, e.g. with perforations, sprocket holes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
一种SMD型LED短节距引线框架，包括多个引线框架单元构成的支架、支架两边的多个工艺边单元、以及工艺边单元上设有的定位孔，相邻两定位孔间距a小于12.0mm，引线框架单元的排距e小于8.0mm。本发明一种SMD型LED短节距引线框架，缩短了单只SMD型LED引线框架上相邻两个中心线之间的节距和排距，使用传统的每条支架为72粒的引线框架可以布置更多的SMD型LED引线。如：SMD型LED引线框架节距为9.00mm，排距为6.7mm，引线框架比传统引线框架节距为12.00mm，排距为8.00mm SMD型LED引线框架材料用量节约35.71%，降低物料消耗及生产成本，同时生产效率大大提高。
An SMD-type LED short-pitch lead frame, including a bracket composed of a plurality of lead frame units, a plurality of process side units on both sides of the bracket, and positioning holes provided on the process side units, the distance a between two adjacent positioning holes is less than 12.0 mm, the row spacing e of the lead frame unit is less than 8.0mm. An SMD-type LED short-pitch lead frame of the present invention shortens the pitch and row distance between two adjacent centerlines on a single SMD-type LED lead frame, and uses a traditional lead frame with 72 grains per bracket More SMD type LED leads can be arranged. For example: the pitch of the SMD LED lead frame is 9.00mm, the row pitch is 6.7mm, the pitch of the lead frame is 12.00mm, and the row pitch is 8.00mm compared with the traditional lead frame. And production costs, while production efficiency is greatly improved.
Description
技术领域 technical field
本发明涉及一种生产表面贴装式SMD型LED的部件，具体涉及一种SMD型LED短节距引线框架。 The invention relates to a component for producing surface-mounted SMD LEDs, in particular to an SMD LED short-pitch lead frame.
背景技术 Background technique
表面贴装式SMD型LED发光二极管属于绿色环保光源，是一种新型表面贴装式半导体发光器件，具有能耗低、发光效率高、体积小、散射角度大、发光均匀性好、可靠性高等优点。其发光颜色包括全彩、各种单色及白光，主要用于各种电子产品、大尺寸led背光、装饰、景观、照明、汽车灯等方面的运用，并将逐步取代传统照明。 Surface-mounted SMD type LED light-emitting diode is a green and environmentally friendly light source. It is a new type of surface-mounted semiconductor light-emitting device. advantage. Its luminous colors include full-color, various monochrome and white light, mainly used in various electronic products, large-size LED backlight, decoration, landscape, lighting, car lights, etc., and will gradually replace traditional lighting.
目前贴装式SMD型LED封装通用引线框架尺寸长度为144.00mm，节距为12.00mm，排距为7.80mm，工艺边宽为5.96mm，精密铜合金带为0.20mm。节距、排距、工艺边均较大，增加精密铜合金带或精密钢带消耗量，产品成本较高。 At present, the size and length of the general lead frame of the SMD type LED package is 144.00mm, the pitch is 12.00mm, the row spacing is 7.80mm, the process edge width is 5.96mm, and the precision copper alloy strip is 0.20mm. The pitch, row spacing, and process edge are all large, which increases the consumption of precision copper alloy strips or precision steel strips, and the product cost is high.
发明内容 Contents of the invention
本发明的目的是提供一种SMD型LED短节距引线框架，解决现有技术中SMD型LED引线框架成本高，物料消耗大的问题。在保障表面贴装表面贴装式SMD型LED质量及功能有效区的基础上，减少节距，降低SMD型LED引线框架的耗材，降低生产成本及物料消耗。 The purpose of the present invention is to provide an SMD type LED short-pitch lead frame to solve the problems of high cost and large material consumption of the SMD type LED lead frame in the prior art. On the basis of ensuring the quality and functional effective area of the surface mount SMD type LED, the pitch is reduced, the consumables of the SMD type LED lead frame are reduced, and the production cost and material consumption are reduced.
为解决上述技术问题，本发明的目的是这样实现的：一种SMD型LED短节距引线框架，包括多个引线框架单元构成的支架、支架两边的多个工艺边单元、以及工艺边单元上设有的定位孔，相邻两定位孔间距a小于12.0mm，引线框架单元的排距e小于8.0mm。 In order to solve the above-mentioned technical problems, the purpose of the present invention is achieved in this way: a kind of SMD type LED short-pitch lead frame, comprises the support that a plurality of lead frame units constitute, a plurality of process edge units on both sides of the support, and process edge unit The positioning holes are provided, the distance a between two adjacent positioning holes is less than 12.0 mm, and the row distance e of the lead frame unit is less than 8.0 mm.
工艺边单元的边宽度b小于5.96mm，相邻两引线框架单元功能区卡筋宽度c小于1.96mm、连接筋宽度d小于3.0mm。 The side width b of the process side unit is less than 5.96mm, the rib width c of the functional area of two adjacent lead frame units is less than 1.96mm, and the width d of the connecting rib is less than 3.0mm.
本发明一种SMD型LED短节距引线框架，缩短了单只SMD型LED引线框架上相邻两个中心线之间的节距和排距，使用传统的每条支架为72粒的引线框架可以布置更多的SMD型LED引线。如：SMD型LED引线框架节距为9.00mm，排距为6.7mm，引线框架比传统引线框架节距为12.00mm，排距为8.00mm SMD型LED引线框架材料用量节约35.71%，降低物料消耗及生产成本，同时生产效率大大提高。 An SMD-type LED short-pitch lead frame of the present invention shortens the pitch and row distance between two adjacent centerlines on a single SMD-type LED lead frame, and uses a traditional lead frame with 72 grains per bracket More SMD type LED leads can be arranged. For example: the pitch of the SMD type LED lead frame is 9.00mm, the row pitch is 6.7mm, the pitch of the lead frame is 12.00mm, and the row pitch is 8.00mm compared with the traditional lead frame. The material consumption of the SMD type LED lead frame saves 35.71%, reducing material consumption And production costs, while production efficiency is greatly improved.
附图说明 Description of drawings
下面结合附图和实施例对本发明作进一步说明： Below in conjunction with accompanying drawing and embodiment the present invention will be further described:
图1是本发明的结构示意图； Fig. 1 is a structural representation of the present invention;
图2是本发明的引线框架单元结构示意图。 Fig. 2 is a structural schematic diagram of the lead frame unit of the present invention.
具体实施方式 detailed description
一种SMD型LED短节距引线框架，包括多个引线框架单元1构成的支架、支架两边的多个工艺边单元2、以及工艺边单元2上设有的定位孔3，相邻两定位孔3间距a小于12.0mm，引线框架单元1的排距e小于8.0mm。工艺边单元2的边宽度b小于5.96mm，相邻两引线框架单元1功能区卡筋宽度c小于1.96mm、连接筋宽度d小于3.0mm。 An SMD-type LED short-pitch lead frame, including a bracket composed of a plurality of lead frame units 1, a plurality of process side units 2 on both sides of the bracket, and a positioning hole 3 provided on the process side unit 2, two adjacent positioning holes 3 The spacing a is less than 12.0 mm, and the row spacing e of the lead frame unit 1 is less than 8.0 mm. The side width b of the process side unit 2 is less than 5.96mm, the rib width c of two adjacent lead frame units 1 in the functional area is less than 1.96mm, and the width d of the connecting rib is less than 3.0mm.
如图1所示：本发明中引线框架总长度L为144.00mm，与传统引线框架长度相同，其宽度工艺作相应调整。相邻两定位孔3间距a，即为引线框架单元1节距a。 As shown in Figure 1: the total length L of the lead frame in the present invention is 144.00 mm, which is the same as the length of the traditional lead frame, and its width process is adjusted accordingly. The pitch a between two adjacent positioning holes 3 is the pitch a of the lead frame unit 1 .
方案1： plan 1:
引线框架单元1节距a小于12.00mm，引线框架单元1的排距小于8.0mm，分别为9.0mm和6.7mm。 The pitch a of the lead frame unit 1 is less than 12.00 mm, and the row pitch of the lead frame unit 1 is less than 8.0 mm, which are 9.0 mm and 6.7 mm respectively.
方案2： Scenario 2:
引线框架单元1节距a小于12.00mm，引线框架单元1的排距小于8.0mm，分别为9.6mm和7.0mm。 The lead frame unit 1 pitch a is less than 12.00mm, and the row pitch of the lead frame unit 1 is less than 8.0mm, which are 9.6mm and 7.0mm respectively.
在满足工艺条件前提下尽量缩短节距a和排距e，以节省材料用量及提高产能效率。 Under the premise of meeting the process conditions, the pitch a and the row distance e are shortened as much as possible to save material consumption and improve production efficiency.
Claims (1)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010594197.8A CN102544339B (en) | 2010-12-18 | 2010-12-18 | SMD Type LED Short Pitch Lead Frame |
| PCT/CN2011/081843 WO2012079434A1 (en) | 2010-12-18 | 2011-11-06 | Short-pitch lead frame for smd-type led |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010594197.8A CN102544339B (en) | 2010-12-18 | 2010-12-18 | SMD Type LED Short Pitch Lead Frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102544339A CN102544339A (en) | 2012-07-04 |
| CN102544339B true CN102544339B (en) | 2015-08-19 |
Family
ID=46244069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010594197.8A Expired - Fee Related CN102544339B (en) | 2010-12-18 | 2010-12-18 | SMD Type LED Short Pitch Lead Frame |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102544339B (en) |
| WO (1) | WO2012079434A1 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7350942B2 (en) * | 2004-01-19 | 2008-04-01 | Shanghai Sansi Technology Co., Ltd. | LED matrix display module with high luminance area ratio |
| EP2128689A1 (en) * | 2008-05-27 | 2009-12-02 | Barco NV | A display panel with improved reflectivity |
| CN101344236B (en) * | 2008-09-03 | 2010-06-02 | 湖北匡通电子有限公司 | Short-pitch thin LED lead frame |
| CN201877464U (en) * | 2010-12-18 | 2011-06-22 | 湖北匡通电子有限公司 | SMD (surface-mounted) type LED (light-emitting diode) short pitch lead frame |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201265825Y (en) * | 2008-09-03 | 2009-07-01 | 湖北匡通电子有限公司 | Short-pitch thin LED lead frame |
| CN201608182U (en) * | 2010-02-05 | 2010-10-13 | 东莞市胤腾光电科技有限公司 | LED light bracket |
-
2010
- 2010-12-18 CN CN201010594197.8A patent/CN102544339B/en not_active Expired - Fee Related
-
2011
- 2011-11-06 WO PCT/CN2011/081843 patent/WO2012079434A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7350942B2 (en) * | 2004-01-19 | 2008-04-01 | Shanghai Sansi Technology Co., Ltd. | LED matrix display module with high luminance area ratio |
| EP2128689A1 (en) * | 2008-05-27 | 2009-12-02 | Barco NV | A display panel with improved reflectivity |
| CN101344236B (en) * | 2008-09-03 | 2010-06-02 | 湖北匡通电子有限公司 | Short-pitch thin LED lead frame |
| CN201877464U (en) * | 2010-12-18 | 2011-06-22 | 湖北匡通电子有限公司 | SMD (surface-mounted) type LED (light-emitting diode) short pitch lead frame |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2012079434A1 (en) | 2012-06-21 |
| CN102544339A (en) | 2012-07-04 |
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| C53 | Correction of patent of invention or patent application | ||
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Address after: 443600 Zigui City, Yichang province Mao Ping Town, East Road, building Applicant after: HUBEI KUANGTONG LIMITED BY SHARE LTD. Address before: 443600 Zigui City, Yichang province Mao Ping Town, East Road, building Applicant before: HUBEI KUANGTONG ELECTRONIC Co.,Ltd. |
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Free format text: CORRECT: APPLICANT; FROM: HUBEI KUANGTONG ELECTRONIC CO., LTD. TO: HUBEI KENTO ELECTRONIC STOCK CORPORATION |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150819 Termination date: 20211218 |
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| CF01 | Termination of patent right due to non-payment of annual fee |