CN102532904A - Organic silicon heat radiation material and preparation method thereof - Google Patents
Organic silicon heat radiation material and preparation method thereof Download PDFInfo
- Publication number
- CN102532904A CN102532904A CN2011104472277A CN201110447227A CN102532904A CN 102532904 A CN102532904 A CN 102532904A CN 2011104472277 A CN2011104472277 A CN 2011104472277A CN 201110447227 A CN201110447227 A CN 201110447227A CN 102532904 A CN102532904 A CN 102532904A
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- Prior art keywords
- parts
- weight
- preparation
- heat sink
- heat radiation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000000463 material Substances 0.000 title claims abstract description 21
- 238000002360 preparation method Methods 0.000 title claims abstract description 8
- 230000005855 radiation Effects 0.000 title abstract description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title abstract 3
- 229910052710 silicon Inorganic materials 0.000 title abstract 3
- 239000010703 silicon Substances 0.000 title abstract 3
- 239000000080 wetting agent Substances 0.000 claims abstract description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 4
- 238000003756 stirring Methods 0.000 claims description 16
- 229910017083 AlN Inorganic materials 0.000 claims description 14
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 14
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 claims description 7
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 7
- 229920002545 silicone oil Polymers 0.000 claims description 7
- 150000001912 cyanamides Chemical class 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 4
- 229910002012 Aerosil® Inorganic materials 0.000 claims description 2
- XZMCDFZZKTWFGF-UHFFFAOYSA-N Cyanamide Chemical compound NC#N XZMCDFZZKTWFGF-UHFFFAOYSA-N 0.000 claims description 2
- 239000004593 Epoxy Substances 0.000 claims description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 2
- 239000002994 raw material Substances 0.000 claims description 2
- 229920000877 Melamine resin Polymers 0.000 abstract 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 abstract 1
- 229910021502 aluminium hydroxide Inorganic materials 0.000 abstract 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 abstract 1
- AMTWCFIAVKBGOD-UHFFFAOYSA-N dioxosilane;methoxy-dimethyl-trimethylsilyloxysilane Chemical compound O=[Si]=O.CO[Si](C)(C)O[Si](C)(C)C AMTWCFIAVKBGOD-UHFFFAOYSA-N 0.000 abstract 1
- 239000004615 ingredient Substances 0.000 abstract 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 229940083037 simethicone Drugs 0.000 abstract 1
- JZZIHCLFHIXETF-UHFFFAOYSA-N dimethylsilicon Chemical compound C[Si]C JZZIHCLFHIXETF-UHFFFAOYSA-N 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention relates to a paste organic silicon heat radiation material and a preparation method of the paste organic silicon heat radiation material. The heat radiation material comprises the following ingredients in parts by weight: 100 parts of simethicone, 2 to 10 parts of wetting agents, 5 to 15 parts of gas-phase silicon dioxide, 400 to 700 parts of alumina, 100 to 120 parts of aluminium hydroxide, 20 to 40 parts of melamine and 80 to 120 parts of aluminum nitride. The on-site operation is realized, the operability and the plasticity are good, and in addition, the hand sticking is avoided.
Description
Technical field
The present invention relates to a kind of hot material, especially relate to a kind of organosilicon in paste form heat sink material that is used to fill between electronic package and the scatterer.
Background technology
Along with the widespread usage of high-power electronic component, heat radiation more and more becomes the important factor that influences product life.These elements constantly gather heat in long-time use, if can not the heat that produce in time be derived, with the life-span that shortens these devices greatly, and then influence life-span of product.Paste heat sink material wettability is good, and thermal resistance is little, and good heat dissipation effect is easy to use, increasing being applied in heater members and the radiating element.
In some application scenarios, site operation requires good operability, and product is tack-free, the plasticity that also need get well.
Summary of the invention
Technical problem to be solved by this invention provides a kind of organosilicon in paste form heat sink material; The paste heat sink material can conveniently be filled the slit between electronic package and the scatterer, and on-site construction operations property, wettability, plasticity are good, and product is tack-free; Thermal resistance is little, good heat dissipation effect.
The technical scheme that the present invention solves the problems of the technologies described above is following: a kind of organosilicon heat sink material comprises each raw material of following weight part: 100 parts of dimethyl silicone oils; 2～10 parts of wetting agents, 5～15 parts of aerosils, 400～700 parts in aluminum oxide, 100～120 parts of white lake parts, 20～40 parts of trimeric cyanamides, 80～120 parts of aluminium nitride AlN.
Said wetting agent is γ-(2,3-epoxy third oxygen) propyl trimethoxy silicane, adds wetting agent and can effectively reduce the product thermal resistance.
The invention has the beneficial effects as follows: the organosilicon in paste form heat sink material can be used to fill the slit between electronic package and the scatterer, plays adhesive effect, itself has certain rigidity, flowability, tension type and tack-free, good operability.
The present invention also provides a kind of preparation method of organosilicon heat sink material; May further comprise the steps: (1) joins dimethyl silicone oil 100 parts of (parts by weight), aluminum oxide 400～700 parts of (parts by weight), white lake 100～120 parts of (parts by weight), trimeric cyanamide 20～40 parts of (parts by weight), aluminium nitride AlN 80～120 parts (parts by weight) in the stirring tank and stirs; Stir and vacuumize after 2 hours, vacuum tightness is less than-0.9Kg/cm
2, wherein whipping temp is 100～120 ℃, churning time 4 hours, and mixing speed is 300r～500rpm; (2) be cooled to room temperature, add aerosil and wetting agent after stirring, stir, obtain the paste material, wherein whipping temp is 30 minutes, and mixing speed is 600r～1000rpm.
Embodiment
Following institute gives an actual example and only is used to explain the present invention, is not to be used to limit scope of the present invention.
Embodiment 1
Pressing dimethyl-silicon weight of oil 100 calculates for unit
With 100 parts of dimethyl silicone oils, 400 parts in aluminum oxide, 80 parts of aluminium nitride AlN, 100 parts in white lake, 20 parts of trimeric cyanamides, join in the stirring tank at 100～120 ℃ and stirred 4 hours down, vacuumize, rotating speed is 300rpm.Cool to room temperature adds 2 parts of 5 parts of aerosils and wetting agents after stirring, stirred 30 minutes, and rotating speed is 600rpm; Obtain paste material.
Embodiment 2
Pressing dimethyl-silicon weight of oil 100 calculates for unit
With 100 parts of dimethyl silicone oils, 525 parts in aluminum oxide, 100 parts of aluminium nitride AlN, 100 parts in white lake, 25 parts of trimeric cyanamides, join in the stirring tank at 100～120 ℃ and stirred 4 hours down, stir and vacuumize after 2 hours, rotating speed is 500rpm.Cool to room temperature adds 7 parts of 10 parts of aerosils and wetting agents after stirring, stirred 30 minutes, and rotating speed is 1000rpm; Obtain paste material.
Embodiment 3
Pressing dimethyl-silicon weight of oil 100 calculates for unit
With 100 parts of dimethyl silicone oils, 650 parts in aluminum oxide, 122 parts of aluminium nitride AlN, 108 parts in white lake, 40 parts of trimeric cyanamides, join in the stirring tank at 100～120 ℃ and stirred 4 hours down, vacuumize, rotating speed is 400rpm.Cool to room temperature adds 10 parts of 15 parts of aerosils and wetting agents after stirring, stirred 30 minutes, and rotating speed is 700rpm; Obtain paste material.
The above is merely preferred embodiment of the present invention, and is in order to restriction the present invention, not all within spirit of the present invention and principle, any modification of being done, is equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (6)
1. organosilicon heat sink material; It is characterized in that, comprise each raw material of following parts by weight: 100 parts of dimethyl silicone oils, 2～10 parts of wetting agents, 5～15 parts of aerosils, 400～700 parts in aluminum oxide, 100～120 parts in white lake, 20～40 parts of trimeric cyanamides, 80～120 parts of aluminium nitride AlN.
2. organosilicon heat sink material according to claim 1 is characterized in that, said wetting agent is γ-(2,3-epoxy third oxygen) propyl trimethoxy silicane.
3. the preparation method of an organosilicon heat sink material is characterized in that, may further comprise the steps:
(1) dimethyl silicone oil 100 parts of (parts by weight), aluminum oxide 400～700 parts of (parts by weight), white lake 100～120 parts of (parts by weight), trimeric cyanamide 20～40 parts of (parts by weight), aluminium nitride AlN 80～120 parts (parts by weight) are joined in the stirring tank and stir; Vacuumize
(2)Be cooled to room temperature, add aerosil 5～15 parts of (parts by weight) and 2～10 parts of wetting agents (parts by weight) after stirring, stir, obtain paste material.
4. preparation method according to claim 3 is characterized in that, the said whipping temp of step (1) is 100～120 ℃, churning time 4 hours, and mixing speed is 300r～500rpm.
5. preparation method according to claim 3 is characterized in that, the said whipping temp of step (2) is 30 minutes, and mixing speed is 600r～1000rpm.
6. according to each described preparation method of claim 3 to 5, it is characterized in that the described vacuum tightness that vacuumizes of step (1) is for less than-0.9Kg/cm
2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110447227 CN102532904B (en) | 2011-12-28 | 2011-12-28 | Organic silicon heat radiation material and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110447227 CN102532904B (en) | 2011-12-28 | 2011-12-28 | Organic silicon heat radiation material and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102532904A true CN102532904A (en) | 2012-07-04 |
| CN102532904B CN102532904B (en) | 2013-04-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110447227 Expired - Fee Related CN102532904B (en) | 2011-12-28 | 2011-12-28 | Organic silicon heat radiation material and preparation method thereof |
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| Country | Link |
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| CN (1) | CN102532904B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107442658A (en) * | 2017-06-20 | 2017-12-08 | 太仓市兴港金属材料有限公司 | A kind of preparation technology of high-efficiency radiator |
| CN115058232A (en) * | 2022-06-09 | 2022-09-16 | 昆山纳诺新材料科技有限公司 | Preparation method of low-cost heat-conducting paste |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1610725A (en) * | 2001-12-27 | 2005-04-27 | 英特尔公司 | Chain extension for thermal materials |
| WO2006043334A1 (en) * | 2004-10-18 | 2006-04-27 | Nippon Koyu Ltd. | Silicone composition for heat dissipation |
| CN1986643A (en) * | 2005-12-23 | 2007-06-27 | 富准精密工业(深圳)有限公司 | Silicone grease composition |
| CN101928461A (en) * | 2010-08-10 | 2010-12-29 | 席俊峰 | Heat-conducting material |
| CN102181271A (en) * | 2011-01-24 | 2011-09-14 | 重庆大学 | Binary mixed nano heat-conducting silicone grease for heat dissipation of high-power LED (light-emitting diode) lamp and preparation method thereof |
-
2011
- 2011-12-28 CN CN 201110447227 patent/CN102532904B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1610725A (en) * | 2001-12-27 | 2005-04-27 | 英特尔公司 | Chain extension for thermal materials |
| WO2006043334A1 (en) * | 2004-10-18 | 2006-04-27 | Nippon Koyu Ltd. | Silicone composition for heat dissipation |
| CN1986643A (en) * | 2005-12-23 | 2007-06-27 | 富准精密工业(深圳)有限公司 | Silicone grease composition |
| CN101928461A (en) * | 2010-08-10 | 2010-12-29 | 席俊峰 | Heat-conducting material |
| CN102181271A (en) * | 2011-01-24 | 2011-09-14 | 重庆大学 | Binary mixed nano heat-conducting silicone grease for heat dissipation of high-power LED (light-emitting diode) lamp and preparation method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107442658A (en) * | 2017-06-20 | 2017-12-08 | 太仓市兴港金属材料有限公司 | A kind of preparation technology of high-efficiency radiator |
| CN115058232A (en) * | 2022-06-09 | 2022-09-16 | 昆山纳诺新材料科技有限公司 | Preparation method of low-cost heat-conducting paste |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102532904B (en) | 2013-04-24 |
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Application publication date: 20120704 Assignee: Yantai Debang Advanced Silicon Materials Co.,Ltd. Assignor: Yantai Darbond Technology Co., Ltd. Contract record no.: 2013370000195 Denomination of invention: Organic silicon heat radiation material and preparation method thereof Granted publication date: 20130424 License type: Exclusive License Record date: 20130822 |
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