CN102514301A - ABS/copper-nickel alloy electromagnetic shielding plastic - Google Patents
ABS/copper-nickel alloy electromagnetic shielding plastic Download PDFInfo
- Publication number
- CN102514301A CN102514301A CN2011104116874A CN201110411687A CN102514301A CN 102514301 A CN102514301 A CN 102514301A CN 2011104116874 A CN2011104116874 A CN 2011104116874A CN 201110411687 A CN201110411687 A CN 201110411687A CN 102514301 A CN102514301 A CN 102514301A
- Authority
- CN
- China
- Prior art keywords
- copper
- abs
- nickel
- nickel alloy
- electromagnetic shielding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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- 229920003023 plastic Polymers 0.000 title claims abstract description 19
- 239000004033 plastic Substances 0.000 title claims abstract description 19
- 229910000570 Cupronickel Inorganic materials 0.000 title claims abstract description 11
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 11
- 239000000956 alloy Substances 0.000 title claims abstract description 11
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 title claims abstract description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 34
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910052802 copper Inorganic materials 0.000 claims abstract description 13
- 239000010949 copper Substances 0.000 claims abstract description 13
- 239000006229 carbon black Substances 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims description 10
- 238000005987 sulfurization reaction Methods 0.000 claims description 3
- 238000000576 coating method Methods 0.000 abstract description 8
- 239000011248 coating agent Substances 0.000 abstract description 7
- 239000000758 substrate Substances 0.000 abstract 2
- 230000007797 corrosion Effects 0.000 abstract 1
- 238000005260 corrosion Methods 0.000 abstract 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 10
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 9
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 9
- 229920000049 Carbon (fiber) Polymers 0.000 description 4
- 239000004917 carbon fiber Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 206010070834 Sensitisation Diseases 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- KMUONIBRACKNSN-UHFFFAOYSA-N potassium dichromate Chemical compound [K+].[K+].[O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O KMUONIBRACKNSN-UHFFFAOYSA-N 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000008313 sensitization Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention provides an ABS/copper-nickel alloy electromagnetic shielding plastic. An ABS plate is used as a substrate of the plastic, a copper layer and a nickel layer are sequentially electroplated on the substrate from top to bottom, the nickel layer contains black stump chalk, and the mass ratio of copper to nickel to carbon black is 5: 7: 3. The ABS/copper-nickel alloy electromagnetic shielding plastic provided in the invention has the following characteristics: a film thickness is 0.05 to 0.08 mu m, resistance to corrosion and wear is obtained, resistivity of a copper coating is 4.5*10<-6> omega. cm, resistivity of a nickel coating is 9.8*10<-6> omega. cm, and binding between the coatings is firm.
Description
?
Technical field
The invention belongs to the conductive plastics technical field, relate in particular to a kind of ABS/ copper-nickel alloy shielding electromagnetic wave plastics.
Background technology
The metallic cover filled with carbon fibers type thermoplastic conductive plastics (PC/ acrylonitrile-butadiene-styrene terpolymer) of China's exploitation; The volume fraction of its filling is 10% one 15%; Shield effectiveness can reach 47 dB; But injection moulding machine-shaping has good electric conductivity and mechanical property simultaneously, and oneself has been applied in auto parts machinery, electricity on the housing shielding material of electric equipment products.In addition, the carbon fiber that adopts metallic cover to generate by acrylonitrile, with epoxy resin, ABS, the conductive plastics that makes after matrixes such as polyolefin are compound records its shield effectiveness average out to 50 dB under frequency 10～800 M Hz, be up to 60 dB; Moreover, as with volume fraction being 15% nickel-coated carbon fibers and PA, the shielding plastic that the PS resin compounded of PC and modification is processed, not only shield effectiveness is good, and order has good ageing-resistant performance, its electric conductivity is basicly stable in the time of 60 ℃.Carbon fiber has higher intensity and modulus, and electric conductivity is good, replaces carbon black or graphite to add the high comprehensive performance of the composite conductive plastic of processing in the thermoplastic resin (like PA and PP etc.) to it, and resistivity is low, and effectiveness is good.But because it costs an arm and a leg, carbon current fiber filled type conductive plastics only limits to the application in the high-tech product such as Aero-Space.
Summary of the invention
The technical problem that solves:The present invention aims to provide a kind of ABS/ copper-nickel alloy shielding electromagnetic wave plastics, and shielding electromagnetic wave plastics provided by the invention can be used for electronic product casing, the electromagnetic shielding of Medical Instruments.
Technical scheme:ABS/ copper-nickel alloy shielding electromagnetic wave plastics are base material with ABS sheet material, are electroplate with copper layer and nickel dam on the base material from bottom to top successively, and said nickel dam contains black stump chalk, copper: nickel: the mass ratio of carbon black is 5:7:3.
Said carbon black is the sulfuration carbon black.
Beneficial effect:ABS/ copper-nickel alloy shielding electromagnetic wave plastics provided by the invention, thickness 0.05～0.08 μ m, anticorrosive anti-wear, copper plate resistivity are 4.5 * 10
-6Ω cm, nickel coating resistivity is 9.8 * 10
-6Ω cm, coating combines firmly.
The specific embodiment
Embodiment 1
ABS/ copper-nickel alloy shielding electromagnetic wave plastics are base material with ABS sheet material, are electroplate with copper layer and nickel dam on the base material from bottom to top successively, and said nickel dam contains black stump chalk, copper: nickel: the mass ratio of carbon black is 5:7:3.Said carbon black is the sulfuration carbon black.
At first plated item is placed to heat in the baking oven and remove destressing; Deoil through alkaline solution then, carry out alligatoring, carry out activation and sensitization with colloid palladium solution then with potassium bichromate solution; Adopting aqueous hydrochloric acid solution to carry out dispergation; Afterwards plated item is carried out electroless copper, with sulfate electroplate liquid thickening copper coating, carry out nickel plating after washing again then.
Compare with the commercially available prod, this product thickness 0.05～0.08 μ m, anticorrosive anti-wear, copper plate resistivity are 4.5 * 10
-6Ω cm, nickel coating resistivity is 9.8 * 10
-6Ω cm, coating combines firmly.
Not relating to all identical with the prior art prior art that maybe can adopt of part in the literary composition realizes.The above is the preferred embodiments of the present invention, but the present invention also is not limited to above only embodiment, on embodiment, does improvement slightly and also will be regarded as protection scope of the present invention.
Claims (2)
1.ABS/ copper-nickel alloy shielding electromagnetic wave plastics are base material with ABS sheet material, it is characterized in that being electroplate with copper layer and nickel dam on the base material from bottom to top successively, said nickel dam contains black stump chalk, copper: nickel: the mass ratio of carbon black is 5:7:3.
2. ABS/ copper-nickel alloy shielding electromagnetic wave plastics according to claim 1 is characterized in that said carbon black is the sulfuration carbon black.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104116874A CN102514301A (en) | 2011-12-12 | 2011-12-12 | ABS/copper-nickel alloy electromagnetic shielding plastic |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104116874A CN102514301A (en) | 2011-12-12 | 2011-12-12 | ABS/copper-nickel alloy electromagnetic shielding plastic |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102514301A true CN102514301A (en) | 2012-06-27 |
Family
ID=46285499
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011104116874A Withdrawn CN102514301A (en) | 2011-12-12 | 2011-12-12 | ABS/copper-nickel alloy electromagnetic shielding plastic |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102514301A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003112389A (en) * | 2001-10-04 | 2003-04-15 | Sumitomo Metal Mining Co Ltd | Electromagnetic wave shield film |
| US20040170857A1 (en) * | 2003-02-27 | 2004-09-02 | Yasuhisa Yoshihara | Electromagnetic shielding copper foil, method of production thereof and electromagnetic shield |
| US20060240274A1 (en) * | 2002-08-20 | 2006-10-26 | Toyo Kohan Co. Ltd. | Surface treated steel plate for battery cases, its manufacturing method, battery case formed using the steel plate, battery using the battery case |
| CN201160362Y (en) * | 2008-02-03 | 2008-12-03 | 赖仁寿 | Foil for electromagnetic shielding |
-
2011
- 2011-12-12 CN CN2011104116874A patent/CN102514301A/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003112389A (en) * | 2001-10-04 | 2003-04-15 | Sumitomo Metal Mining Co Ltd | Electromagnetic wave shield film |
| US20060240274A1 (en) * | 2002-08-20 | 2006-10-26 | Toyo Kohan Co. Ltd. | Surface treated steel plate for battery cases, its manufacturing method, battery case formed using the steel plate, battery using the battery case |
| US20040170857A1 (en) * | 2003-02-27 | 2004-09-02 | Yasuhisa Yoshihara | Electromagnetic shielding copper foil, method of production thereof and electromagnetic shield |
| CN201160362Y (en) * | 2008-02-03 | 2008-12-03 | 赖仁寿 | Foil for electromagnetic shielding |
Non-Patent Citations (1)
| Title |
|---|
| 张丽芳等: "ABS/Cu-Ni电磁屏蔽复合材料的研制", 《材料导报》 * |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C04 | Withdrawal of patent application after publication (patent law 2001) | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20120627 |