CN102510661B - Anisotropic conductive film and circuit board using same - Google Patents

Abstract

The title of the present invention is an anisotropic conductive film and a circuit board using the film. The anisotropic conductive film of the present invention exists between opposing circuit electrodes, pressurizes the opposing circuit electrodes, and electrically connects the electrodes in the direction of pressure. A first adhesive film layer comprising a polymeric resin, a thermosetting resin, a curing agent for a thermosetting resin, and conductive particles, and a second adhesive film layer containing a thermosetting resin and a curing agent for a thermosetting resin are laminated.

Description

Anisotropic conductive film and circuit board using same

This application is a divisional application based on the application dated May 11, 2005, the application number 200910148964.X, and the title of the invention "Anisotropic Conductive Film and Circuit Board Using the Film".

technical field

The present invention relates to an anisotropic conductive film used for connecting circuit boards or electronic components such as integrated circuit (IC) chips and circuit boards, and a circuit board using the film.

Background technique

An anisotropic conductive film in which conductive particles are dispersed in an adhesive can be used to electrically connect circuit boards to each other or electronic components such as IC chips and the circuit board. In this case, an anisotropic conductive film is disposed between opposing electrodes, and the electrodes are connected to each other by heating and pressing, and electrical connection can be achieved by maintaining conductivity in the direction of pressing. The anisotropic conductive film plays an important role as a connection material for mounting a driver IC of a liquid crystal display (LCD: Liquid Crystal Display) in practical applications.

Currently, LCDs are used in a wide variety of applications, from large panels for notebook computers, monitors, and televisions to medium and small panels for portable devices such as mobile phones, personal digital assistants (PDA: Personal Digital Assistant), and game consoles. These LCDs use anisotropic conductive film (ACF: Anisotropic Conductive Film) to mount the driver IC. The driver IC in the LCD is installed by encapsulating the driver IC carrier tape (TCP: Tape Carrier Packag), and then using an anisotropic conductive film to electrically connect it to the LCD panel or printed circuit board (PWB: Printed Wiring Board). In addition, small and medium-sized LCDs such as mobile phones adopt the COG (Chip on Glass) method that directly mounts a bare driver IC (Beard Laiba IC) on an LCD panel with an anisotropic conductive film.

The high-definition of LCD is developing, and the connection between LCD panel and TCP or COG connection requires the connection pitch to be miniaturized. In particular, the COG connection uses the bumps of the IC chip as the connection electrodes, so the connection area is smaller than that of the TCP connection, so it is necessary to ensure conduction on the tiny connection electrodes, and how to capture a sufficient number of conductive particles is crucial to obtaining high connection reliability. very important.

Therefore, for example, Japanese Unexamined Patent Publication No. 8-279371 discloses a two-layer structure in which an adhesive layer (conductive particle layer) in which conductive particles are dispersed and a single adhesive layer (adhesive layer) are laminated. Compared with the structure, conductive particles can be efficiently captured on micro electrodes (bumps), and applicability to micro bumps can be provided, and an anisotropic conductive film with good connectivity at fine connection pitches can be provided.

Contents of the invention

However, this two-layer structure ACF has improved capture efficiency on tiny electrodes compared to the past, but since the conductive particles flow together with the adhesive at the time of connection, when using an IC with a finer connection pitch (for example, 15 μm or less spacing, electrode size below 2600μm ² ), although the insulation between adjacent electrodes is ensured, it cannot be said that a sufficient number of conductive particles (more than 5) can be ensured on electrodes below 2600μm ² , and the connection reliability is not enough. There is room for improvement.

The present invention was made in view of the above circumstances, and an object of the present invention is to provide an anisotropic conductive film and a circuit board using the film, which have high insulation properties at narrow intervals and can improve connection reliability at finer connection pitches.

The anisotropic conductive film of the present invention exists between opposing circuit electrodes, pressurizes the opposing circuit electrodes, and electrically connects the electrodes in the pressing direction. It is characterized in that the conductive The film is composed of a first adhesive film layer containing a polymerized photopolymerizable resin, a thermosetting resin, a curing agent for a thermosetting resin, and conductive particles, and a second adhesive film layer containing a thermosetting resin and a curing agent for a thermosetting resin. .

When such an anisotropic conductive film is used, the insulation performance at a narrow pitch is high, and the connection reliability at a fine connection pitch can be improved. In addition, the term "narrow interval" means that the interval between adjacent circuit electrodes is narrow.

The exothermic start temperature of the first adhesive film layer and the second adhesive film layer measured by DSC is preferably 60°C or higher and the temperature at which 80% of the curing reaction is completed is 260°C or lower. When the exothermic start temperature is less than 60°C, the preservability tends to decrease compared with the case where the exothermic start temperature is 60°C or higher. In addition, when the temperature at which 80% of the curing reaction is completed exceeds 260°C, compared with the case where the temperature is below 260°C, it cannot be connected at a low temperature for a short time, which may cause damage to the circuit.

As the aforementioned thermosetting resin, an epoxy resin is preferably used.

In addition, as the above-mentioned curing agent for thermosetting resin, it is preferable to use a latent curing agent from the viewpoint of storage stability improvement.

The first adhesive film layer and the second adhesive film layer preferably contain a film-forming polymer. At this time, it is easier to form a thin film.

In addition, the amount of conductive particles dispersed in the first adhesive film layer is preferably 0.2 to 30% by volume. When the amount of conductive particles is less than 0.2% by volume, the conductivity tends to be lower than when the amount of conductive particles is more than 0.2% by volume. The insulation between them tends to decrease.

In addition, the present invention is characterized in that a first circuit component having a first connection terminal and a second circuit component having a second connection terminal are disposed, and the first connection terminal and the second connection terminal are opposed to each other. There is an anisotropic conductive film between the aforementioned first connecting terminal and the aforementioned second connecting terminal arranged oppositely, and after heating and pressing, a circuit that electrically connects the aforementioned first connecting terminal and the aforementioned second connecting terminal arranged oppositely plate, the aforementioned anisotropic conductive film is the aforementioned anisotropic conductive film.

According to the circuit board of the present invention, the insulation performance at narrow intervals is good, and the connection reliability at fine wiring pitches is improved.

If the anisotropic conductive film of the present invention is used, the first adhesive film layer containing the polymerized photopolymerizable resin, thermosetting resin, curing agent for thermosetting resin and conductive particles is formed, and the layer containing the thermosetting resin and curing agent for thermosetting resin is formed. The ACF is composed of a two-layer structure of the second adhesive film layer of the agent, and the first adhesive film layer containing conductive particles is polymerized with light, so the fluidity of the layer connection can be suppressed. Therefore, in addition to efficiently trapping conductive particles on the bumps of the semiconductors to be connected, since conductive particles can also be suppressed from flowing into narrow spaces, the insulation at narrow spaces is good, and the connection reliability at fine connection pitches is improved.

Therefore, the anisotropic conductive film of the present invention is suitable for use in applications where the LCD panel and the TAB are connected, and the LCD panel and the IC chip are electrically connected only in the pressurizing direction.

In addition, according to the circuit board of the present invention, the insulation performance is good at narrow intervals, and the connection reliability is improved at fine connection pitches.

Detailed ways

The anisotropic conductive film of the present invention exists between opposing circuit electrodes, pressurizes the opposing circuit electrodes, and electrically connects the electrodes in the pressing direction, and is characterized in that the conductive film is composed of polymerized A photopolymerizable resin, a thermosetting resin, a thermosetting resin curing agent, and a first adhesive film layer of conductive particles are laminated with a second adhesive film layer containing a thermosetting resin and a thermosetting resin curing agent. Here, the anisotropic conductive film is a thin film pressurized by opposing circuit electrodes, that is, circuit electrodes located on both sides of the anisotropic conductive film, and is arranged between the electrodes in the pressing direction, that is, along the pressing direction. A film in which the circuit electrodes are electrically connected to each other.

The use of such an anisotropic conductive film provides high insulation at narrow pitches and improves connection reliability at finer pitches.

It is preferable that the 2nd adhesive film layer contains electroconductive particle further.

As the first adhesive film layer and the second adhesive film layer, it is preferable to use a film layer whose exothermic start temperature measured by DSC is 60° C. or higher and the temperature at which 80% of the curing reaction is completed is 260° C. or lower. Wherein, the temperature at which 80% of the curing reaction between the first adhesive film layer and the second adhesive film layer completes can be measured by DSC (heating rate: 10° C./min).

The above-mentioned photopolymerizable resin is a substance having a functional group that polymerizes using a radical such as an acryloyl group or a methacryloyl group, and examples of such a photopolymerizable resin include acrylate, methacrylate, malein Amine compounds, etc. As the radically polymerizable substance, either a monomer or an oligomer may be used, or a monomer and an oligomer may be used together. Specific examples of acrylate (methacrylate) include urethane acrylate, methyl acrylate, epoxy acrylate, polybutadiene acrylate, silicone acrylate, polyester acrylate, ethyl acrylate, isoacrylate Propyl, Isobutyl Acrylate, Ethylene Glycol Diacrylate, Diethylene Glycol Diacrylate, Trimethylolpropane Triacrylate, Tetrahydroxymethane Tetraacrylate, 2-Hydroxy-1,3-Diacryloyl Oxypropane, 2,2-bis[4-(acryloyloxymethoxy)phenyl]propane, 2,2-bis[4-(acryloyloxypolyethoxy)phenyl]propane, acrylic acid Dicyclopentenyl ester, tricyclodecenyl acrylate, bis(acryloyloxyethyl)isocyanurate, ε-caprolactone modified tris(acryloyloxyethyl)isocyanurate, isocyanurate Tris(acryloyloxyethyl)urate, tris(acryloyloxyethyl)isocyanurate, etc. A polymerization inhibitor such as hydroquinone or methyl ether hydroquinone can also be used appropriately as needed. In addition, when the photopolymerizable resin has a dicyclopentenyl group and/or a tricyclodecenyl group and/or a triazine ring, it is preferable because the heat resistance of the anisotropic conductive film improves. As long as the maleimide compound is a compound containing at least two or more maleimide groups in the molecule, as the maleimide compound, for example, 1-methyl-2,4-bismaleimide can be cited. Leimide benzene, N,N'-m-phenylene bismaleimide, N,N'-p-phenylene bismaleimide, N,N'-m-tolylene bismaleimide Imide, N,N'-4,4-biphenylene bismaleimide, N,N'-4,4-(3,3'-dimethyl-biphenylene)bismaleimide Toimide, N,N'-4,4-(3,3'-dimethyldiphenylmethane)bismaleimide, N,N'-4,4-(3,3'- Diethyldiphenylmethane) bismaleimide, N,N'-4,4-diphenylmethane bismaleimide, N,N'-4,4-diphenylpropane bismaleimide Toimide, N,N'-4,4-diphenyl ether bismaleimide, N,N'-3,3'-diphenylsulfone bismaleimide, 2,2- Bis(4-(4-maleimidephenoxy)phenyl)propane, 2,2-bis(3-sec-butyl-4-8(4-maleimidephenoxy)phenyl ) propane, 1,1-bis(4-(4-maleimidephenoxy)phenyl)decane, 4,4'-cyclohexylene-bis(1-(4-maleimide phenoxy)-2-cyclohexylbenzene, 2,2-bis(4-(4-maleimidephenoxy)phenyl)hexafluoropropane, etc. These can be used alone or in combination, and can also be used with alkenyl Allyl compounds such as propylphenol, allyl phenyl ether, and allyl benzoate are used together.

The anisotropic conductive film of the present invention may also contain a photoinitiator. As the photoinitiator, known ones that generate radicals by light irradiation can be used. As a cracking type photoinitiator, benzoin isobutyl ether, diethoxyacetophenone, hydroxycyclohexyl phenyl ketone, benzyl dimethyl ketal, 2-hydroxy-2-methyl -1-phenylpropan-1-one, 4-methylthio-2,2-dimethyl-2-morpholinoacetophenone, 4-morpholino-2-ethyl-2-dimethyl Amino-2-benzylacetophenone, methylphenylglyoxylate, acylphosphine oxide, and the like. As a dehydrogenation photoinitiator, benzophenone, 2-ethylanthraquinone, 2-chlorothioxanthone, 2-isopropylthioxanthone, 1,7,7-trimethyl- 2,3-dioxobicyclo (2,2,1-heptane), 4,4'-bis(dimethylamino)benzophenone, 4-benzyl-4'-methyl diphenyl sulfide, etc. .

Before the photopolymerizable resin is polymerized, the amount of these photoinitiators used with respect to the photopolymerizable resin is not particularly limited as long as the photopolymerizable resin can be polymerized, but it is preferably 100 parts by weight of the radical polymerizable substance. Use 0.3-5 parts by weight of photoinitiator. When the amount of the photoinitiator used is less than 0.3 parts by weight, compared with the case of 0.3 parts by weight or more, the reactivity tends to deteriorate. than, the preservability may decrease.

In addition, in order to facilitate film formation of the first adhesive film layer and the second adhesive film layer, it is preferable to mix a film-forming polymer composed of a thermoplastic resin such as phenoxy resin, polyester resin, or polyamide resin. These film-forming polymers have a stress-relaxing effect when a reactive resin, that is, a photopolymerizable resin or a thermosetting resin is cured. In particular, when the film-forming polymer has a functional group such as a hydroxyl group, it is more preferable because of improved adhesiveness.

The amount of the film-forming polymer used in the first adhesive film layer is preferably 10 to 150 parts by weight, particularly preferably 20 to 100 parts by weight, based on 100 parts by weight of the photopolymerizable resin. When the amount of the film-forming polymer used is less than 10 parts by weight, the self-supporting property tends to deteriorate compared with the case of more than 10 parts by weight. Compatibility tends to be deteriorated compared to the case of less than one part.

As the thermosetting resin used in the present invention, epoxy resin is preferable. As the epoxy resin, bisphenol type epoxy resin derived from epichlorohydrin and bisphenol A or bisphenol F, bisphenol AD, etc., epichlorohydrin and phenol novolak resin or cresol novolac resin can be used Derived epoxy phenolic resin or naphthalene-based epoxy resin with naphthalene ring skeleton, glycidyl amine, glycidyl ether, biphenyl, alicyclic and other epoxy resins with more than 2 glycidyl groups in one molecule Compounds and the like are used alone or in combination of two or more. In order to prevent electron migration, these epoxy resins are preferably high-purity products in which impurity ions (Na ⁺ , Cl ^-, etc.) and hydrolyzable chlorine are reduced to 300 ppm or less.

The curing agent for thermosetting resins used in the present invention is preferably a curing agent for epoxy resins, and imidazole-based, hydrazide-based, boron trifluoride-amine complexes, sulfonium salts, amine imides, and polyamines can be used. Potential curing agents such as salt and dicyandiamide.

The amount of the film-forming polymer used in the second adhesive film layer is preferably 30 to 100 parts by weight, particularly preferably 30 to 60 parts by weight, based on 100 parts by weight of the total amount of the thermosetting resin and curing agent used. When the amount of the film-forming polymer used is less than 30 parts by weight, the self-supporting property tends to deteriorate compared with the case of more than 30 parts by weight. Compatibility tends to be deteriorated compared to the case of less than one part.

In the present invention, the total amount of the thermosetting resin and the curing agent used relative to the photopolymerizable resin in the first adhesive film layer is preferably 60 to 400 parts by weight relative to 100 parts by weight of the photopolymerizable resin, especially Preferably it is 100 to 250 parts by weight. When the total amount of the thermosetting resin and the curing agent is less than 60 parts by weight relative to 100 parts by weight of the photopolymerizable resin, the flowability during connection is reduced compared with the case of more than 60 parts by weight, and it is difficult to connect the electrodes and the conductor. The tendency to remove resin at the particle interface. In addition, when the total amount of the thermosetting resin and curing agent is more than 400 parts by weight relative to 100 parts by weight of the photopolymerizable resin, the fluidity at the time of connection is too high compared to the case of 400 parts by weight or less, and conductive particles are present. Flow together with the resin tends to lower the capture efficiency on the counter electrode, or increase the inflow of conductive particles to the electrode spacer, and tend to increase the probability of occurrence of short circuits.

The conductive particles used in the present invention are, for example, metal particles such as Au, Ag, Cu, or solder, more preferably particles having a conductive layer such as Ni, Cu, Au, or solder provided on a polymer spherical core material such as polystyrene. Surface layers of Su, Au, solder, etc. may also be formed on the surface of electroconductive particle. The particle diameter needs to be smaller than the minimum interval between the substrate electrodes, and when the electrodes have height variations, the particle diameter is preferably larger than the height variation, preferably 1 to 10 μm. In addition, the amount of conductive particles dispersed in the adhesive is 0.1 to 30% by volume, preferably 0.2 to 15% by volume.

The anisotropic conductive film can be produced by the process described below. Dissolving or dispersing an adhesive composition composed of photoinitiator, photopolymerizable resin, thermosetting resin, curing agent for thermosetting resin, and film-forming polymer in an organic solvent, and then dispersing conductive particles to prepare a film for the first adhesive film Coating solution. The organic solvent used at this time is preferably a mixed solvent of an aromatic hydrocarbon system and an oxygen-containing system in order to increase the solubility of the material.

Then, use a coating device to coat the solution on a surface-treated transparent PET film with a thickness of 50 μm, and dry it with hot air at 70° C. for 10 minutes to obtain an adhesive film with a thickness of 10 μm. .

Then, using a coating device, in the preparation of the above-mentioned film coating solution, except that the photoinitiator and photopolymerizable resin were not dissolved, the film coating solution prepared by the same method was coated on a thickness of 50 μm. The surface-treated white PET film on one side was dried with hot air at 70° C. for 10 minutes to prepare a second adhesive film having a thickness of 15 μm. Further, the obtained first adhesive film and second adhesive film were laminated using a roll laminator while heating at 40°C.

Next, use a high-pressure ultraviolet lamp to make ultraviolet rays with an ultraviolet amount of 2T/ ^cm2 pass through the transparent PET on the first adhesive film layer and irradiate on the first adhesive film layer to reduce the photopolymerization in the first adhesive film layer. The resin is polymerized to produce an anisotropic conductive film with a two-layer structure.

When the photopolymerizable resin of the first adhesive film layer is polymerized by light, before laminating with the second adhesive film layer, it may be polymerized by ultraviolet irradiation in advance, but at this time, due to oxygen barrier, it cannot be fully polymerized. Polymerization, or a condition that does not laminate smoothly. On the other hand, as mentioned above, in the method of light irradiation after lamination, in addition to the good adhesion between the first adhesive film layer and the second adhesive film layer, since both sides are coated with PET film, there is no oxygen. Since the photopolymerization of the photopolymerizable resin can be sufficiently carried out using light, it is particularly preferable to use this method.

The circuit board of the present invention uses the two-layer structure anisotropic conductive film prepared as above, and can be manufactured by the following process. That is, on the surface of the first circuit component with the first connection terminal, the transparent PET film on the first adhesive film layer side of the two-layer structure anisotropic conductive film is peeled off, and the first adhesive film layer is transferred, Peel off the white PET film on the second adhesive layer, configure the first circuit component with the first connection terminal and the second circuit component with the second connection terminal, make the first connection terminal and the second connection terminal face each other. The anisotropic conductive film is heated and pressed to manufacture a circuit board in which the above-mentioned oppositely arranged first terminal and second terminal are electrically connected.

In addition, when heating an anisotropic conductive film, heating can be performed at the temperature more than the temperature at which the thermosetting resin in a 1st adhesive film and a 2nd adhesive film hardens.

As the first circuit part with the first connection terminal of the present invention, it is preferable to use a semiconductor with bump electrodes, and as the second circuit part with the second connection terminal, it is preferable to use a glass substrate formed with ITO or a metal circuit or a glass substrate formed with a metal circuit. A flexible wiring board or a printed wiring board of a Ni/Au-plated Cu circuit is particularly preferably a glass substrate on which an ITO or metal circuit is formed.

Example

Hereinafter, the contents of the present invention will be more specifically described by way of examples, but the present invention is not limited to these examples.

(Example 1)

30 g of phenoxy acrylate, 0.3 g of hydroxycyclohexyl phenyl ketone, and 20 g of phenoxy resin with a weight average molecular weight of 40,000 were dissolved in 50 g of ethyl acetate to prepare an adhesive composition solution.

Then, 50 g of liquid epoxy resin (epoxy equivalent 185, manufactured by Asahi Kasei Co., Ltd., Novakyua HX-3941) containing 10 g of bisphenol A type epoxy (epoxy equivalent 180) and a microcapsule type latent curing agent were mixed in this solution. , 10% by volume of conductive particles forming an Au layer were dispersed on the surface of polystyrene-based nuclei (diameter: 4 μm) (the number of projected particles at a thickness of 10 μm: 30,000/mm ² ) to prepare a thin film coating solution. Next, using a coating device, apply this solution on a transparent PET film with a thickness of 50 μm that has been surface-treated on one side, and dry it with hot air at 70° C. for 10 minutes to prepare a first adhesive film with an adhesive layer of 10 μm in thickness. . The reaction start temperature of the first adhesive film measured by DSC was 80°C, and the reaction end temperature at which 80% of the curing reaction was completed was 200°C.

Then, using a coating device, in the preparation of the above-mentioned film coating solution, except that the phenoxy acrylate and hydroxycyclohexyl phenyl ketone are not dissolved, the film coating solution prepared by the same method is coated on one side. The surface-treated white PET film with a thickness of 50 μm was dried with hot air at 70° C. for 10 minutes to obtain a second adhesive film with a thickness of 15 μm. The reaction start temperature of the second adhesive film measured by DSC was 80°C, and the reaction end temperature at which 80% of the curing reaction was completed was 210°C.

Furthermore, the obtained first adhesive film and second adhesive film were laminated with a roll laminator while heating at 40° C. together with a PET film as a base material.

Then use a high-pressure ultraviolet lamp to make the ultraviolet rays with an ultraviolet amount of 2J/ ^cm2 pass through the transparent PET on the first adhesive film layer, and irradiate on the first adhesive film layer, and the photopolymerizable resin in the first adhesive film layer Polymerization to prepare an anisotropic conductive film with a two-layer structure.

Then, using the obtained two-layer structure anisotropic conductive film, a chip (1×10mm , Thickness: 500μm) and glass substrate (thickness: 1.1mm) with ITO circuit. That is, peel off the transparent PET film on the surface of the first adhesive film layer of the two-layer structure anisotropic conductive film (1.5×12mm), and paste the ^first adhesive film layer on the surface at 80°C under a pressure of 10kgf/cm After the glass substrate with ITO circuit is attached, the white PET film on the surface of the second adhesive film layer is peeled off, and the bumps of the chip are aligned with the glass substrate with ITO circuit.

Then, this connection was performed by heating and pressing from above the chip under the conditions of 210° C., 40 g/bump, and 10 seconds. The average number of conductive particles on the connected bumps (500) was 24, and the minimum was 11. In addition, the connection resistance was 120mΩ at the highest and 58mΩ on average per bump. In addition, the insulation resistance is 108Ω or more, and the practically necessary 108Ω insulation can be ensured. These values did not change even after 1000 cycles of thermal shock test at -40 to 100°C, high temperature, high humidity (85°C/85%RH, 1000h) test, showing good connection reliability.

(comparative example 1)

Dissolve 30 g of phenoxy acrylate, 0.3 g of hydroxycyclohexyl phenyl ketone, and 20 g of phenoxy resin with a weight average molecular weight of 40,000 in 50 g of ethyl acetate to prepare an adhesive composition solution.

Then, 50 g of a liquid epoxy resin (epoxy equivalent 185, manufactured by Asahi Kasei Co., Ltd., Novakyua HX-3941) containing 10 g of bisphenol A type epoxy (epoxy equivalent 180) and a microcapsule type latent curing agent was mixed with this solution. , dispersed on the surface of polystyrene-based nuclei (diameter: 4 μm) Au layer-forming conductive particles 4% by volume (the number of projected particles at a thickness of 25 μm: 30,000/mm ² ) to prepare a thin film coating solution. Next, using a coating device, the solution was coated on a 50 μm thick PET film surface-treated on one side, and dried with hot air at 70° C. for 10 minutes to obtain an adhesive film with an adhesive layer thickness of 25 μm.

Next, the adhesive film was irradiated with ultraviolet rays having an ultraviolet amount of 2 J/cm ² using a high-pressure ultraviolet lamp to prepare an anisotropic conductive adhesive film in which the photopolymerizable resin in the film was polymerized. The reaction start temperature of the anisotropic conductive granular film measured by DSC is 80°C, and the reaction end temperature at which 80% of the curing reaction is completed is 200°C.

Then, using the obtained monolayer structure anisotropic conductive film, a chip (1×10mm, Thickness: 500μm) and glass substrate with ITO circuit (thickness: 1.1mm) connection. At 80°C and 10kg f/cm ² , an anisotropic conductive adhesive film with a single-layer structure anisotropic conductive film (1.5×12mm) is pasted on a glass substrate with an ITO circuit, and then the PET film is peeled off for chip placement. The bumps are aligned with the position of the glass substrate with ITO circuit.

Next, under the conditions of 210° C., 40 g/bump, and 10 seconds, heating and pressure were applied from above the chip to perform the connection. The average number of conductive particles on the connected bumps (500 pieces) was 14, and the minimum was 1. In addition, the maximum connection resistance per bump is 5300mΩ, and the average is 3200mΩ. These values increase after 1000 cycles of thermal shock test at -40 to 100°C, high temperature, high humidity (85°C/85%RH, 1000h) test Large, poor conduction occurs in some connections. In addition, the insulation resistance showed 106Ω, and the practically necessary insulation of 108Ω or more could not be ensured.

(comparative example 2)

Except that phenoxy acrylate and hydroxycyclohexyl phenyl ketone were not dissolved, and the phenoxy resin with a molecular weight of 40,000 was made into 50 g, the film coating solution for the first adhesive film prepared by the same method as in Example 1 was The adhesive film A having a thickness of 10 μm was obtained by coating on a 50 μm thick PET film surface-treated on one side using a coating device and drying with hot air at 70° C. for 10 minutes. The reaction start temperature of the adhesive film measured by DSC was 80°C, and the reaction end temperature at which 80% of the curing reaction was completed was 200°C.

Then, another adhesive film B was produced by the same method as that of the second adhesive film layer in Example 1. The reaction start temperature of the adhesive film measured by DSC was 80°C, and the reaction end temperature at which 80% of the curing reaction was completed was 210°C.

Then, the obtained adhesive film A and adhesive film B were heated at 40° C. and laminated with a roll laminator to obtain an anisotropic conductive film with a two-layer structure.

Then, using the obtained two-layer structure anisotropic conductive film, chips (1×10mm, Thickness: 500μm) and glass substrate with ITO circuit (thickness: 1.1mm) connection. Paste the film surface of the adhesive film A of the two-layer structure anisotropic conductive film (1.5×12mm) on the glass substrate with ITO circuit under the pressure of 80°C and 10kgf/cm ² , then peel off the PET film and perform chip The protrusions are aligned with the position of the glass substrate with ITO circuit.

Next, under the conditions of 210° C., 40 g/bump, and 10 seconds, heating and pressurizing are performed from above the chip, and this sequence is performed. The average number of conductive particles on the connected bumps (500 pieces) was 18, and the minimum was 2. In addition, the connection resistance is up to 2500mΩ per bump, and the average is 1200mΩ. These values are after 1000 cycles of thermal shock test at -40 to 100°C, high temperature, high humidity (85°C/85%RH, 1000h) test Increased, poor electrical conduction occurred in part of the connection. In addition, the insulation resistance showed 106Ω, and the practically necessary insulation of 108Ω or more could not be ensured.

From the above results of Example 1 and Comparative Examples 1 and 2, it can be seen that if the anisotropic conductive film of the present invention is used, the insulation of narrow spaces is good, and the connection reliability of fine connection pitches can be improved.

Claims (79)

1. Anisotropic conductive film, which exists between the opposing circuit electrodes, pressurizes the opposing circuit electrodes, and electrically connects the electrodes in the direction of pressure, It is characterized in that light irradiates a composition containing a photopolymerizable resin having a functional group polymerized by radicals, a photoinitiator that generates radicals by light irradiation, an epoxy resin, a curing agent for epoxy resins, and conductive particles , and the first adhesive film layer formed by polymerizing the photopolymerizable resin, and the second adhesive film layer containing epoxy resin and epoxy resin curing agent are laminated. 2. The anisotropic conductive film according to claim 1, wherein the exothermic start temperature measured by DSC for the first adhesive film layer and the second adhesive film layer is above 60°C, and 80% of the curing reaction is completed. The temperature is below 260°C. 3. The anisotropic conductive film according to claim 1 or 2, wherein the curing agent for epoxy resin is composed of a latent curing agent. 4. The anisotropic conductive film according to claim 1 or 2, wherein the filling amount of the conductive particles dispersed in the first adhesive film layer is 0.1 to 30% by volume. 5. The anisotropic conductive film according to claim 4, wherein the filling amount of the conductive particles dispersed in the first adhesive film layer is 0.2 to 15% by volume. 6. The anisotropic conductive film according to claim 1 or 2, wherein the composition further contains a film-forming polymer. 7. The anisotropic conductive film according to claim 6, wherein the amount of the film-forming polymer used in the first adhesive film layer is 10 to 150 parts by weight relative to 100 parts by weight of the photopolymerizable resin . 8. The anisotropic conductive film according to claim 6, wherein the amount of the film-forming polymer used in the first adhesive film layer is 20 to 100 parts by weight relative to 100 parts by weight of the photopolymerizable resin . 9. The anisotropic conductive film according to claim 1 or 2, wherein the second adhesive film layer further contains a film-forming polymer. 10. The anisotropic conductive film according to claim 9, wherein the second adhesive film layer contains 100 wt. The part is 30 to 100 parts by weight of the aforementioned film-forming polymer. 11. The anisotropic conductive film according to claim 9, wherein the second adhesive film layer contains 100 wt. The part is 30 to 60 parts by weight of the aforementioned film-forming polymer. 12. The anisotropic conductive film according to claim 1 or 2, wherein the second adhesive film layer further contains conductive particles. 13. The anisotropic conductive film according to claim 1 or 2, wherein the photopolymerizable resin has an acryloyl group or a methacryloyl group. 14. The anisotropic conductive film according to claim 1 or 2, wherein the photopolymerizable resin is selected from acrylate, methacrylate, and maleimide compounds. 15. The anisotropic conductive film according to claim 1 or 2, wherein the composition contains 0.3 to 5 parts by weight of the photoinitiator relative to 100 parts by weight of the photopolymerizable resin. 16. The anisotropic conductive film according to claim 1 or 2, wherein the epoxy resin is selected from the group consisting of bisphenol-type epoxy resins, epoxy novolac resins, naphthalene-based epoxy resins, and two or more shrinkage resins in one molecule. Glyceryl epoxy compounds. 17. The anisotropic conductive film according to claim 1 or 2, wherein the total of the epoxy resin and the curing agent for the epoxy resin is equal to the amount of the photopolymerizable resin used in the first adhesive film layer. The quantity is 60-400 weight part with respect to 100 weight part of said photopolymerizable resins. 18. The anisotropic conductive film according to claim 17, wherein the total amount of the epoxy resin and the curing agent for the epoxy resin relative to the amount of the photopolymerizable resin used in the first adhesive film layer is, It is 100-250 weight part with respect to 100 weight part of said photopolymerizable resins. 19. The anisotropic conductive film according to claim 1 or 2, which is used for COG connection. 20. Use of the following film as an anisotropic conductive film that exists between opposing circuit electrodes, pressurizes opposing circuit electrodes, and electrically connects electrodes in the direction of pressure, Wherein, the film is characterized in that it contains a photopolymerizable resin having a functional group polymerized by free radicals, a photoinitiator that generates free radicals by light irradiation, an epoxy resin, a curing agent for epoxy resin, and conductive particles. The composition is irradiated with light to laminate a first adhesive film layer obtained by polymerizing the photopolymerizable resin and a second adhesive film layer containing an epoxy resin and a curing agent for epoxy resin. 21. Use of the following film for the manufacture of an anisotropic conductive film that exists between opposing circuit electrodes, pressurizes opposing circuit electrodes, and electrically connects electrodes in the direction of pressure, Wherein, the film is characterized in that it contains a photopolymerizable resin having a functional group polymerized by free radicals, a photoinitiator that generates free radicals by light irradiation, an epoxy resin, a curing agent for epoxy resin, and conductive particles. The composition is irradiated with light to laminate a first adhesive film layer obtained by polymerizing the photopolymerizable resin and a second adhesive film layer containing an epoxy resin and a curing agent for epoxy resin. 22. The use according to claim 20 or 21, wherein the exothermic start temperature measured by DSC for the first adhesive film layer and the second adhesive film layer is above 60°C, and the temperature at which 80% of the curing reaction is completed is Below 260°C. 23. The use according to claim 20 or 21, wherein the curing agent for epoxy resin is composed of a latent curing agent. 24. The use according to claim 20 or 21, wherein the filling amount of the conductive particles dispersed in the first adhesive film layer is 0.1 to 30% by volume. 25. The use according to claim 24, wherein the filling amount of the conductive particles dispersed in the first adhesive film layer is 0.2 to 15% by volume. 26. The use according to claim 20 or 21, wherein the composition further contains a film-forming polymer. 27. The use according to claim 26, wherein the amount of the film-forming polymer used in the first adhesive film layer is 10 to 150 parts by weight relative to 100 parts by weight of the photopolymerizable resin. 28. The use according to claim 26, wherein the amount of the film-forming polymer used in the first adhesive film layer is 20 to 100 parts by weight relative to 100 parts by weight of the photopolymerizable resin. 29. The use according to claim 20 or 21, wherein the second adhesive film layer further contains a film-forming polymer. 30. The use according to claim 29, wherein the second adhesive film layer contains 30 parts by weight relative to 100 parts by weight of the epoxy resin and the curing agent for epoxy resin in the second adhesive film layer. ~100 parts by weight of the aforementioned film-forming polymer. 31. The use according to claim 29, wherein the second adhesive film layer contains 30 parts by weight relative to 100 parts by weight of the epoxy resin and the curing agent for epoxy resin in the second adhesive film layer. ~60 parts by weight of the aforementioned film-forming polymer. 32. The use according to claim 20 or 21, wherein the second adhesive film layer further contains conductive particles. 33. The use according to claim 20 or 21, wherein the photopolymerizable resin has an acryloyl group or a methacryloyl group. 34. The use according to claim 20 or 21, wherein the photopolymerizable resin is selected from acrylate, methacrylate and maleimide compounds. 35. The use according to claim 20 or 21, wherein the composition contains 0.3 to 5 parts by weight of the photoinitiator relative to 100 parts by weight of the photopolymerizable resin. 36. The use according to claim 20 or 21, wherein the aforementioned epoxy resin is selected from the group consisting of bisphenol-type epoxy resins, epoxy novolac resins, naphthalene-based epoxy resins, and rings having two or more glycidyl groups in one molecule. in oxygen compounds. 37. The use according to claim 20 or 21, wherein the total of the epoxy resin and the curing agent for the epoxy resin is relative to the amount of the photopolymerizable resin used in the first adhesive film layer. It is 60-400 weight part with respect to 100 weight part of said photopolymerizable resins. 38. The use according to claim 37, wherein the total amount of the aforementioned epoxy resin and the aforementioned curing agent for epoxy resin relative to the amount of the aforementioned photopolymerizable resin in the aforementioned first adhesive film layer is relative to the amount of the aforementioned photopolymerizable resin. 100 parts by weight of the polymerizable resin is 100 to 250 parts by weight. 39. The use according to claim 20 or 21, wherein the aforementioned anisotropic conductive film is used for COG connection. 40. An anisotropic conductive film, which is an anisotropic conductive film that exists between opposing circuit electrodes, pressurizes the opposing circuit electrodes, and electrically connects the electrodes in the direction of pressure, characterized in that, It is formed by laminating a first adhesive film layer containing a polymerized photopolymerizable resin, a thermosetting resin, a curing agent for a thermosetting resin, and conductive particles, and a second adhesive film layer containing a thermosetting resin and a curing agent for a thermosetting resin, The aforementioned polymerized photopolymerizable resin is obtained by polymerizing a photopolymerizable resin selected from acrylate, methacrylate, and maleimide compounds. 41. The anisotropic conductive film according to claim 40, wherein the exothermic start temperature of the first adhesive film layer and the second adhesive film layer measured by DSC is above 60°C, and 80% of the curing reaction is completed. The temperature is below 260°C. 42. The anisotropic conductive film according to claim 40 or 41, wherein the curing agent for thermosetting resin is a latent curing agent. 43. The anisotropic conductive film according to claim 40 or 41, wherein the filling amount of the conductive particles dispersed in the first adhesive film layer is 0.1 to 30% by volume. 44. The anisotropic conductive film according to claim 43, wherein the filling amount of the conductive particles dispersed in the first adhesive film layer is 0.2 to 15% by volume. 45. The anisotropic conductive film according to claim 40 or 41, wherein the first adhesive film layer further contains a film-forming polymer. 46. The anisotropic conductive film according to claim 45, wherein the amount of the film-forming polymer used in the first adhesive film layer is 10 to 150 parts by weight relative to 100 parts by weight of the photopolymerizable resin. 47. The anisotropic conductive film according to claim 45, wherein the amount of the film-forming polymer used in the first adhesive film layer is 20 to 100 parts by weight relative to 100 parts by weight of the photopolymerizable resin. 48. The anisotropic conductive film according to claim 40 or 41, wherein the second adhesive film layer further contains a film-forming polymer. 49. The anisotropic conductive film according to claim 48, wherein the second adhesive film layer contains 100 parts by weight of the total amount of the thermosetting resin and the curing agent for the thermosetting resin in the second adhesive film layer It is 30 to 100 parts by weight of the aforementioned film-forming polymer. 50. The anisotropic conductive film according to claim 48, wherein the second adhesive film layer contains 100 parts by weight of the total amount of the thermosetting resin and the curing agent for the thermosetting resin in the second adhesive film layer It is 30 to 60 parts by weight of the aforementioned film-forming polymer. 51. The anisotropic conductive film according to claim 40 or 41, wherein the second adhesive film layer further contains conductive particles. 52. The anisotropic conductive film according to claim 40 or 41, wherein the first adhesive film layer is a layer formed by photopolymerization. 53. The anisotropic conductive film according to claim 40 or 41, wherein the polymerized photopolymerizable resin is polymerized using 0.3 to 5 parts by mass of a photoinitiator relative to 100 parts by mass of the photopolymerizable resin. get. 54. The anisotropic conductive film according to claim 40 or 41, wherein the thermosetting resin is epoxy resin. 55. The anisotropic conductive film according to claim 54, wherein the epoxy resin is selected from bisphenol-type epoxy resins, epoxy novolac resins, naphthalene-based epoxy resins, and one molecule having two or more glycidyl groups. in epoxy compounds. 56. The anisotropic conductive film according to claim 40 or 41, wherein the total amount of the thermosetting resin and the curing agent for the thermosetting resin relative to the amount of the photopolymerizable resin used in the first adhesive film layer is, It is 60-400 weight part with respect to 100 weight part of said photopolymerizable resins. 57. The anisotropic conductive film according to claim 56, wherein the total of the thermosetting resin and the curing agent for the thermosetting resin is relative to the amount of the photopolymerizable resin used in the first adhesive film layer. It is 100-250 weight part with respect to 100 weight part of said photopolymerizable resins. 58. The anisotropic conductive film according to claim 40 or 41, which is used for COG connection. 59. Use of the following film as an anisotropic conductive film that exists between opposing circuit electrodes, pressurizes opposing circuit electrodes, and electrically connects electrodes in the direction of pressure, Among them, the film is characterized in that it combines a first adhesive film layer obtained by photopolymerization containing a polymerized photopolymerizable resin, a thermosetting resin, a curing agent for a thermosetting resin, and conductive particles, and a layer containing a thermosetting resin. Laminated with a second adhesive film layer of curing agent for thermosetting resin. 60. The following film is used to manufacture an anisotropic conductive film that exists between opposing circuit electrodes, pressurizes opposing circuit electrodes, and electrically connects electrodes in the direction of pressure, Among them, the film is characterized in that a first adhesive film layer obtained by photopolymerization containing a polymerized photopolymerizable resin, a thermosetting resin, a curing agent for a thermosetting resin, and conductive particles, and a layer containing a thermosetting resin and a The thermosetting resin is laminated with a second adhesive film layer of curing agent. 61. The use according to claim 59 or 60, wherein the exothermic starting temperature measured by DSC for the first adhesive film layer and the second adhesive film layer is above 60°C, and the temperature at which 80% of the curing reaction is completed It is below 260°C. 62. The use according to claim 59 or 60, wherein the curing agent for thermosetting resin is composed of a latent curing agent. 63. The use according to claim 59 or 60, wherein the filling amount of the conductive particles dispersed in the first adhesive film layer is 0.1 to 30% by volume. 64. The use according to claim 63, wherein the filling amount of the conductive particles dispersed in the first adhesive film layer is 0.2 to 15% by volume. 65. The use according to claim 59 or 60, wherein the first adhesive film layer further contains a film-forming polymer. 66. The use according to claim 65, wherein the amount of the film-forming polymer used in the first adhesive film layer is 10 to 150 parts by weight relative to 100 parts by weight of the photopolymerizable resin. 67. The use according to claim 65, wherein the amount of the film-forming polymer used in the first adhesive film layer is 20 to 100 parts by weight relative to 100 parts by weight of the photopolymerizable resin. 68. The use according to claim 59 or 60, wherein the second adhesive film layer further contains a film-forming polymer. 69. The use according to claim 68, wherein the second adhesive film layer contains 30 to 100 parts by weight of the total amount of the thermosetting resin and the curing agent for thermosetting resin in the second adhesive film layer. The aforementioned film-forming polymer in parts by weight. 70. The use according to claim 68, wherein the second adhesive film layer contains 30-60 parts by weight relative to 100 parts by weight of the total amount of the thermosetting resin and the curing agent for thermosetting resin in the second adhesive film layer The aforementioned film-forming polymer in parts by weight. 71. The use according to claim 59 or 60, wherein the second adhesive film layer further contains conductive particles. 72. The use according to claim 59 or 60, wherein the polymerized photopolymerizable resin is obtained by polymerizing a photopolymerizable resin having an acryloyl group or a methacryloyl group. 73. The use according to claim 59 or 60, wherein the polymerized photopolymerizable resin is formed by polymerizing a photopolymerizable resin selected from acrylate, methacrylate and maleimide compounds. 74. The use according to claim 59 or 60, wherein the polymerized photopolymerizable resin is obtained by polymerization using 0.3 to 5 parts by weight of a photoinitiator relative to 100 parts by weight of the photopolymerizable resin. 75. The use according to claim 59 or 60, wherein the thermosetting resin is an epoxy resin. 76. The use according to claim 75, wherein the aforementioned epoxy resin is selected from bisphenol-type epoxy resins, epoxy novolac resins, naphthalene-based epoxy resins, and epoxy compounds having more than two glycidyl groups in one molecule middle. 77. The use according to claim 59 or 60, wherein the total amount of the thermosetting resin and the curing agent for the thermosetting resin relative to the amount of the photopolymerizable resin in the first adhesive film layer is relative to the amount of the aforementioned 100 weight part of photopolymerizable resins are 60-400 weight part. 78. The use according to claim 77, wherein the total of the thermosetting resin and the curing agent for the thermosetting resin is relative to the amount of the photopolymerizable resin used in the first adhesive film layer relative to the amount of the photopolymerization 100 parts by weight of the resin is 100 to 250 parts by weight. 79. The use according to claim 59 or 60, wherein the aforementioned anisotropic conductive film is used for COG connection.