CN102501615A - Rigid printed circuit board spray printing positioning method - Google Patents
Rigid printed circuit board spray printing positioning method Download PDFInfo
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- CN102501615A CN102501615A CN2011103089935A CN201110308993A CN102501615A CN 102501615 A CN102501615 A CN 102501615A CN 2011103089935 A CN2011103089935 A CN 2011103089935A CN 201110308993 A CN201110308993 A CN 201110308993A CN 102501615 A CN102501615 A CN 102501615A
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- spray printing
- printed circuit
- circuit board
- positioning
- rigid printed
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Abstract
The invention relates to a rigid printed circuit board spray printing positioning method. The method provided by the invention comprises the following two steps:1), coarse positioning: selecting one fixed angle of a spray printing table surface as a positioning angle, respectively installing a positioning side on the X-axis direction and Y-axis direction of the positioning angle, respectively aligning the X axis and Y axis of one angle on a spray printing circuit board with the X-axis and Y-axis positioning sides of the positioning angle, thereby realizing coarse positioning of the printed circuit board; and 2) exact positioning: starting a CCD (charge coupled device) to grab a preset fiducial point on the printed circuit board, and storing the co-ordinates of the fiducial point into a computer so as to provide an accurate position for subsequent spray printing operation, thereby realizing exact positioning of a figure. The rigid printed circuit board spray printing positioning method provided by the invention is simple and convenient in operation and suitable for printed circuit boards of different sizes, and can be used for realizing the rapid positioning of the printed circuit board; and meanwhile, the positioning method can be used for effectively overcoming the warpage problem of the printed circuit board to be subjected to spray printing, and solving the problem that the spray printing precision is influenced by the warpage deformation of the printed circuit board.
Description
Technical field
The invention belongs to rigid printed circuit boards spray printing localization method technical field.
Background technology
The method that take existing rigid printed circuit boards spray printing location is: 1. the borehole jack with some fixed position of wiring board nails at the pin of spray printing table top, to realize the coarse positioning of wiring board; Use mechanical clamping that wiring board is fixed on the spray printing table top then, prevent that wiring board produces displacement in the course of work.2. the accurate location that CCD (Charge-coupled Device, sensitization coupled apparatus) realized the spray printing figure through the datum mark that grasps some fixed position on the wiring board after coarse positioning was accomplished.
The problem that this method exists is: 1. need the position of corresponding each mechanical clamping of adjustment when changing the wiring board of different size, it is comparatively loaded down with trivial details to operate.2. this kind of the warpage issues mechanical positioning mode for plank is difficult to overcome.
Summary of the invention
The object of the invention solves the problems of the technologies described above exactly, and a kind of new rigid printed circuit boards spray printing localization method is provided, and makes rigid printed circuit boards locating fast and accurately on spray printing equipment, improves the locating speed and the positioning accuracy of wiring board.
For reaching above-mentioned purpose, the technical scheme that the present invention takes is following:
Rigid printed circuit boards spray printing localization method, this method comprise two steps:
1) coarse positioning: a fixed angles choosing the spray printing table top is an orientation angle; X and Y direction in orientation angle are provided with gulde edge respectively; X and the Y axle limit that makes an angle of spray printing wiring board respectively with the X and the snap of Y direction gulde edge of orientation angle, to realize the coarse positioning of wiring board;
2) accurately locate: launch CCD and grasp pre-set datum mark on the wiring board, and the coordinate of datum mark is saved in computer,, thereby realize the accurate location of figure for follow-up spray printing action provides the exact position.
Above-mentioned rigid printed circuit boards spray printing localization method; Start the vacuum suction function under the spray printing platform in the step 1) behind the coarse positioning, circuit board is adsorbed on the spray printing table top, prevent that circuit board is subjected to displacement in the spray printing process; Overcome the warpage issues of circuit board simultaneously, thereby improve image spray printing precision.In order to make the vacuum suction effect even, preferable scheme is, on the spray printing table top, capillary ceramic plate is set, and the below of capillary ceramic plate is a negative pressuren zone, and circuit board is positioned on the capillary ceramic plate.Said micropore ceramics panel aperture is at 20～100 μ m, and micropore evenly distributes, and whole plate micropore porosity is 20～50%.The aperture of capillary ceramic plate is set to suitable size; And when the equidistant even distribution of suitable distance; Then ceramic wafer is evenly strong to the adsorption effect of circuit board, not only can realize the vacuum suction function of rigid printed circuit boards spray printing table top, prevents that spray printing table top wiring board in motion process from producing displacement; Can also guarantee the vacuum suction effect on the spray printing table top, having overcome the thin type circuit board maybe be because the warpage issues that the absorption distortion produces.
Beneficial effect of the present invention:
Rigid printed circuit boards spray printing localization method of the present invention, compared with prior art easy and simple to handle, can adapt to the circuit board of different size, need not adjust the position of each mechanical clamping, the quick location of having realized circuit board; Simultaneously, the present invention has adopted the vacuum suction function, effectively overcomes the warpage issues of treating the spray printing circuit board, has solved circuit board owing to the influence problem of buckling deformation to the spray printing precision.This mechanical positioning mode in existing equipment is difficult to overcome.
Further specify the specific embodiment of utility model below in conjunction with accompanying drawing 1:
Description of drawings
Fig. 1 is a rigid printed circuit boards spray printing navigation system structural representation of the present invention
The specific embodiment
As shown in Figure 1, rigid printed circuit boards spray printing localization method of the present invention comprises two steps:
1) coarse positioning: a fixed angles choosing spray printing table top 1 is an orientation angle; At the X of orientation angle axle and Y direction gulde edge (3,2) is set respectively; X and the Y axle limit that makes an angle of spray printing wiring board respectively with the X and the snap of Y direction gulde edge of orientation angle, to realize the coarse positioning of wiring board; Start the vacuum suction function under the spray printing platform behind the coarse positioning, circuit board is adsorbed on the spray printing table top, prevent that circuit board is subjected to displacement in the spray printing process, overcome the warpage issues of circuit board simultaneously, thereby improve image spray printing precision.Concrete grammar can be provided with capillary ceramic plate on the spray printing platform, the below of capillary ceramic plate is a negative pressuren zone, and circuit board is positioned on the capillary ceramic plate.Selected micropore ceramics panel aperture is 30 μ m, and micropore evenly distributes, and whole plate micropore porosity is 48%.
2) accurately locate: launch CCD4 and grasp pre-set datum mark on the wiring board, and the coordinate of datum mark is saved in computer,, thereby realize the accurate location of figure for follow-up spray printing action provides the exact position.
As shown in Figure 1, rigid printed circuit boards spray printing localization method comprises two steps like embodiment 1: 1) coarse positioning and 2) accurately locate, adopt different capillary ceramic plates, the micropore ceramics panel aperture is 84 μ m, and micropore evenly distributes, and whole plate micropore porosity is 25%.
The present invention adopts two step localization methods, and is easy and simple to handle, can adapt to the circuit board of different size, need not adjust the position of each mechanical clamping, the quick location of having realized circuit board; Simultaneously, the present invention has adopted the efficient vacuum adsorption function, overcomes the warpage issues of treating the spray printing circuit board, has solved circuit board owing to the influence problem of buckling deformation to the spray printing precision.
Claims (5)
1. rigid printed circuit boards spray printing localization method, this method comprises two steps:
1) coarse positioning: a fixed angles choosing the spray printing table top is an orientation angle; X and Y direction in orientation angle are provided with gulde edge respectively; X and the Y axle limit that makes an angle of spray printing wiring board respectively with the X and the snap of Y direction gulde edge of orientation angle, to realize the coarse positioning of wiring board;
2) accurately locate: launch CCD and grasp pre-set datum mark on the wiring board, and the coordinate of datum mark is saved in computer,, thereby realize the accurate location of figure for follow-up spray printing action provides the exact position.
2. rigid printed circuit boards spray printing localization method as claimed in claim 1 is characterized in that: behind the step 1) coarse positioning, spray printing platform below is formed negative pressure, circuit board is adsorbed on the spray printing table top is not subjected to displacement.
3. rigid printed circuit boards spray printing localization method as claimed in claim 2, it is characterized in that: the spray printing deck plate is a capillary ceramic plate, and circuit board is positioned on the capillary ceramic plate.
4. rigid printed circuit boards spray printing localization method as claimed in claim 3 is characterized in that: the micropore ceramics panel aperture is 20～100 μ m.
5. rigid printed circuit boards spray printing localization method as claimed in claim 3, it is characterized in that: the micropore on the capillary ceramic plate evenly distributes, and capillary ceramic plate micropore porosity is 20～50%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103089935A CN102501615A (en) | 2011-10-12 | 2011-10-12 | Rigid printed circuit board spray printing positioning method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103089935A CN102501615A (en) | 2011-10-12 | 2011-10-12 | Rigid printed circuit board spray printing positioning method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102501615A true CN102501615A (en) | 2012-06-20 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103089935A Pending CN102501615A (en) | 2011-10-12 | 2011-10-12 | Rigid printed circuit board spray printing positioning method |
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| CN (1) | CN102501615A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109263301A (en) * | 2018-08-09 | 2019-01-25 | 深圳弘锐精密数码喷印设备有限公司 | Method, apparatus, computer installation and the readable storage medium storing program for executing of the calibration of pcb board |
| CN109733077A (en) * | 2019-01-30 | 2019-05-10 | 江苏长电科技股份有限公司 | A Substrate Positioning Method for Improving Printing Position Accuracy |
| CN114987049A (en) * | 2021-07-15 | 2022-09-02 | 山东履信思源防伪技术有限公司 | Anti-counterfeit label continuous pouring production method and device |
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| CN109733077A (en) * | 2019-01-30 | 2019-05-10 | 江苏长电科技股份有限公司 | A Substrate Positioning Method for Improving Printing Position Accuracy |
| CN114987049A (en) * | 2021-07-15 | 2022-09-02 | 山东履信思源防伪技术有限公司 | Anti-counterfeit label continuous pouring production method and device |
| CN114987049B (en) * | 2021-07-15 | 2023-03-03 | 山东履信思源防伪技术有限公司 | Anti-counterfeit label continuous pouring production method and device |
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| ASS | Succession or assignment of patent right |
Owner name: JIANGSU HI-PRINT TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: JIANGSU RUIBILI INDUSTRIAL CO., LTD. Effective date: 20121207 |
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| C41 | Transfer of patent application or patent right or utility model | ||
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Effective date of registration: 20121207 Address after: 224056 Yancheng City province high tech Industrial Zone, Phoenix South Road, No. 18, No. Applicant after: Jiangsu Hi-Print Technology Co., Ltd. Address before: 224056 Yancheng City province high tech Industrial Zone, Phoenix South Road, No. 18, No. Applicant before: Jiangsu Rabily Industry Co., Ltd. |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120620 |