CN102468445A - Glass packaging cover plate of OLED (Organic Light-Emitting Device) - Google Patents
Glass packaging cover plate of OLED (Organic Light-Emitting Device) Download PDFInfo
- Publication number
- CN102468445A CN102468445A CN2010105476389A CN201010547638A CN102468445A CN 102468445 A CN102468445 A CN 102468445A CN 2010105476389 A CN2010105476389 A CN 2010105476389A CN 201010547638 A CN201010547638 A CN 201010547638A CN 102468445 A CN102468445 A CN 102468445A
- Authority
- CN
- China
- Prior art keywords
- cover plate
- packaging cover
- glass packaging
- glass
- oled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Electroluminescent Light Sources (AREA)
Abstract
The invention relates to a glass packaging cover plate of an OLED (Organic Light-Emitting Device). The glass packaging cover plate comprises two or more rectangular grooves with different depths, wherein at least one of the deepest groove is used for arranging a getter. According to the glass packaging cover plate of the OLED, disclosed by the invention, a problem that a large-area packaging cover plate is easy to be broken during manufacturing due to low strength caused by overlarge area and depth of a rectangular groove in the large-area packaging cover plate is effectively solved.
Description
Technical field
The present invention relates to a kind of encapsulation technology, particularly a kind of glass packaging cover plate of organic electroluminescence device.
Background technology
Organic electroluminescence device is very responsive to water, oxygen content, and the existence of water, oxygen can make component failure.Failure procedure water, oxygen often reacts through pin hole and the metal that is present in the device metal negative electrode (being generally Al); Metallic cathode is peeled off; Pin hole develops into stain gradually, and stain is peeled off after along with metallic cathode and water, oxygen reaction and increased gradually until whole light-emitting zone.So, need encapsulate to device in order to intercept the influence of water, oxygen to organic electroluminescence device.The most general mode be exactly in inert gas atmosphere, adopt glass packaging cover plate and substrate carry out bonding mode with device sealing in a confined space, and in the glass packaging cover plate, post getter low amounts of water, oxygen absorbed.
The most common encapsulation cover plate is a glass material, and shape is like Fig. 1, shown in 2, and thickness is between 0.5～1.5mm, and for being used to place the rectangle pit 12 of getter, edge 11 is for being used to apply the zone of bonding glue in the middle of the encapsulation cover plate.Along with the increase of device area, the encapsulation cover plate area also needs corresponding increase, and rectangle pit area also can be along with increase.But because rectangle pit thickness of glass is thinned, its intensity tends to weaken.The cracked phenomenon of glass packaging cover plate in encapsulation process, can occur, after encapsulation is accomplished, also can in use produce cracked owing to rectangle pit strength of glass is low.
Summary of the invention
The present invention be directed to the cracked problem that is prone to of present glass capping existence; A kind of glass packaging cover plate of organic electroluminescence device has been proposed; Can effectively solve excessive because of rectangle pit area in the large-area glass encapsulation cover plate, cause intensity low excessively deeply, in manufacturing process, be prone to chipping problem.
Technical scheme of the present invention is: a kind of glass packaging cover plate of organic electroluminescence device, and said glass packaging cover plate has the rectangle pit of two or more different depth, and the darkest pit that is used to place getter has one at least.
The width of said cover plate edge is 1～3mm.
Said rectangle pit adopts the method for etching or sandblast to process.
The thickness that the said degree of depth of rectangle pit the most deeply is a getter adds 0.1mm again, and the most shallow rectangle pit depth is 0.1mm～0.2mm.
Beneficial effect of the present invention is: the glass packaging cover plate of organic electroluminescence device of the present invention, effective solution is crossed serious offense because of rectangle pit area and is caused intensity low deeply in the large tracts of land encapsulation cover plate, in manufacturing process, be prone to chipping problem.
Description of drawings
Fig. 1 is a traditional glass encapsulation cover plate structural representation;
Fig. 2 is a traditional glass encapsulation cover plate cutaway view;
Fig. 3 is glass packaging cover plate instance one structural representation of organic electroluminescence device of the present invention;
Fig. 4 is glass packaging cover plate instance one cutaway view of organic electroluminescence device of the present invention;
Fig. 5 is glass packaging cover plate instance two structural representations of organic electroluminescence device of the present invention;
Fig. 6 is glass packaging cover plate instance two cutaway views of organic electroluminescence device of the present invention.
Embodiment
Glass packaging cover sheet thickness among the embodiment one is 0.7～1.5mm, and shape is like Fig. 3, shown in 4, and glass cover-plate has the rectangle pit of two different depths, and the darker rectangle pit 22 of the degree of depth in the middle of being positioned at is used to place getter, and the degree of depth is 0.3～0.4mm.More shallow rectangle pit 23 degree of depth are 0.1～0.2mm.Do not have the side edge thereof 21 of rectangle pit to be used to apply ultra-violet curing glue, border width is 1～3mm.
Glass packaging cover sheet thickness among the embodiment two is 0.7～1.5mm, and shape is like Fig. 5, shown in 6, and glass cover-plate has the rectangle pit of two kinds of different depths, and darker rectangle pit 32 has four, is positioned at more shallow rectangle pit 33 and is evenly distributed.The darker rectangle pit of the degree of depth is used to place getter, and the degree of depth is 0.3～0.4mm, and more shallow rectangle pit depth is 0.1～0.2mm.Do not have the side edge thereof 31 of rectangle pit to be used to apply ultra-violet curing glue, border width is 1～3mm.
In the different depth of said rectangle pit, the area of the darkest rectangle pit adds the fabrication error decision when sticking getter by the area of getter, and the thickness that the degree of depth is generally getter adds 0.1mm again; The most shallow rectangle pit depth is 0.1mm～0.2mm.The rectangle pit adopts the method for etching or sandblast to process.
Claims (4)
1. the glass packaging cover plate of an organic electroluminescence device is characterized in that, said glass packaging cover plate has the rectangle pit of two or more different depth, and the darkest pit that is used to place getter has one at least.
2. according to the glass packaging cover plate of the said organic electroluminescence device of claim 1, it is characterized in that the width of said cover plate edge is 1～3mm.
3. according to the glass packaging cover plate of the said organic electroluminescence device of claim 1, it is characterized in that said rectangle pit adopts the method for etching or sandblast to process.
4. according to the glass packaging cover plate of the said organic electroluminescence device of claim 1, it is characterized in that the thickness that the said degree of depth of rectangle pit the most deeply is a getter adds 0.1mm again, the most shallow rectangle pit depth is 0.1mm～0.2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105476389A CN102468445A (en) | 2010-11-17 | 2010-11-17 | Glass packaging cover plate of OLED (Organic Light-Emitting Device) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105476389A CN102468445A (en) | 2010-11-17 | 2010-11-17 | Glass packaging cover plate of OLED (Organic Light-Emitting Device) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102468445A true CN102468445A (en) | 2012-05-23 |
Family
ID=46071798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105476389A Pending CN102468445A (en) | 2010-11-17 | 2010-11-17 | Glass packaging cover plate of OLED (Organic Light-Emitting Device) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102468445A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104576967A (en) * | 2015-01-26 | 2015-04-29 | 深圳市华星光电技术有限公司 | OLED packaging structure and method |
| CN112993740A (en) * | 2019-12-02 | 2021-06-18 | 夏普福山激光株式会社 | Laser device |
-
2010
- 2010-11-17 CN CN2010105476389A patent/CN102468445A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104576967A (en) * | 2015-01-26 | 2015-04-29 | 深圳市华星光电技术有限公司 | OLED packaging structure and method |
| US9634282B2 (en) | 2015-01-26 | 2017-04-25 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | OLED package structure and OLED packaging method |
| CN112993740A (en) * | 2019-12-02 | 2021-06-18 | 夏普福山激光株式会社 | Laser device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103325958A (en) | Organic light-emitting device packaging cover plate, organic light-emitting device and displayer | |
| CN101866943B (en) | Organic light-emitting diode display and packaging method thereof | |
| CN101866944B (en) | Organic light-emitting diode display | |
| WO2016086538A1 (en) | Oled encapsulation structure and oled encapsulation method | |
| WO2009114832A3 (en) | Translucent solar cells | |
| CN102270742B (en) | Organic optoelectronic device wrapper and device packaging method | |
| EP2727164A1 (en) | Encapsulation structure for an opto-electronic component, and method for encapsulating an optoelectronic component | |
| US20140360651A1 (en) | Flat display panel cutting method | |
| CN103022374A (en) | Displaying device packaging structure and method | |
| EP1939953A2 (en) | Light emitting device | |
| CN104993063A (en) | A package member and a manufacture method therefor, and an OLED device | |
| CN102468445A (en) | Glass packaging cover plate of OLED (Organic Light-Emitting Device) | |
| CN203300706U (en) | Packaging cover plate of organic electroluminescent device, organic electroluminescent device and display | |
| TWI470597B (en) | Sealed glass substrate for organic electroluminescence and manufacturing method of organic electroluminescence display | |
| CN201796893U (en) | Encapsulation structure of active matrix organic electroluminescent display | |
| CN103078064B (en) | OLED panel packaging structure and packaging method | |
| CN205281089U (en) | Display panel | |
| CN204167324U (en) | A kind of OLED display | |
| CN201749877U (en) | Packaging cover board with organic lighting element | |
| CN206022312U (en) | Base plate for packaging drying-plate tool | |
| CN203910867U (en) | Melt sealing device | |
| DE102011079160A1 (en) | Packaging structure for optoelectronic component e.g. organic optoelectronic component, has an adhesive layer formed on surface of thin-layer such that the adhesive layer is partially surrounded by the particulate impurities | |
| KR20050011009A (en) | Sealing plate for electroluminescent device, method for manufacturing same, and mother glass substrate for multi-production of sealing plate | |
| KR101032441B1 (en) | Press stage of encapsulation device used in organic light emitting diode backplane manufacturing equipment | |
| CN107658391B (en) | Packaging method of narrow-frame PMOLED device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120523 |