CN102468398B - Light emitting diode packaging structure - Google Patents

Abstract

A light emitting diode packaging structure comprises a light emitting diode crystal grain, a conductive substrate, a first welding pad and a second welding pad, wherein the conductive substrate comprises a first conductive area and a second conductive area which are insulated with each other, the light emitting diode crystal grain is fixed on the conductive substrate, a first sliding groove is formed in the first conductive area, a second sliding groove is formed in the second conductive area, the first welding pad comprises a first buckling part, the second welding pad comprises a second buckling part, the first buckling part is contained in the first sliding groove in a sliding mode, the first welding pad is in contact with the first conductive area, the second welding pad comprises a second buckling part, the second buckling part is contained in the second sliding groove in a sliding mode, and the second welding pad is in contact with the second conductive area. The first welding pad and the second welding pad of the light-emitting diode packaging structure can respectively slide relative to the conductive substrate, so that when the light-emitting diode packaging structure is installed on a circuit board, the positions of the first welding pad and the second welding pad can be adjusted to match the welding position of the circuit board.

Description

Light-emitting diode packaging structure

technical field

The invention relates to a semiconductor light-emitting element, in particular to a light-emitting diode packaging structure.

Background technique

Usually, the welding pads of the light emitting diode packaging structure are electroplated on the substrate, and the welding pads cannot slide relative to the substrate. After the light emitting diode packaging structure is manufactured, the positions of the welding pads cannot be adjusted.

Contents of the invention

In view of this, it is necessary to provide a light emitting diode packaging structure that can adjust the position of the welding pad.

A light-emitting diode packaging structure, including a light-emitting diode crystal grain, a conductive substrate, a first welding pad, and a second welding pad, the conductive substrate includes a first conductive region and a second conductive region that are insulated from each other, and the light-emitting diode crystal grain is fixed on the conductive substrate Above, the first conductive area is provided with a first chute, the second conductive area is provided with a second chute, the first pad includes a first fastening portion, the second pad includes a second fastening portion, and the first fastening portion can be slidably accommodated in the first chute, the first welding pad is in contact with the first conductive area, the second fastening part is slidably accommodated in the second chute, the second welding pad is in contact with the second conductive area, the first The chute includes a first horizontal section and a first vertical section, the first conductive region forms a first shoulder at the intersection of the first horizontal section and the first vertical section of the first chute, and the second chute includes a second The horizontal section and the second vertical section, the second conductive area forms a second shoulder at the intersection of the second horizontal section and the second vertical section of the second chute, and the first fastening part includes the first horizontal section and the second a vertical portion, the first horizontal portion is accommodated in the first horizontal section of the first chute, the first vertical portion is accommodated in the first vertical section of the first chute, and the first horizontal portion abuts against the first shoulder , the second fastening portion includes a second horizontal portion and a second vertical portion, the second horizontal portion is accommodated in the second horizontal section of the second chute, and the second vertical portion is accommodated in the second vertical portion of the second chute section, the second horizontal portion abuts against the second shoulder.

The first welding pad and the second welding pad of the above light emitting diode packaging structure can slide relative to the conductive substrate respectively, and the first welding pad is in contact with the first conductive region of the conductive substrate to realize the electrical connection between the first welding pad and the first conductive region , the second pad is in contact with the second conductive region of the conductive substrate to realize the electrical connection between the second pad and the second conductive region, so that when the light emitting diode package structure is mounted on the circuit board, the first solder pad and the second conductive region can be adjusted The position of the second solder pad to match the soldering position of the circuit board.

The present invention will be further described below in conjunction with specific embodiments with reference to the accompanying drawings.

Description of drawings

FIG. 1 is a top view of an LED packaging structure according to an embodiment of the present invention.

FIG. 2 is a schematic cross-sectional view of the LED package structure in FIG. 1 .

FIG. 3 is a top view of the first pad and the second pad of the light emitting diode package structure in FIG. 1 after sliding.

Description of main component symbols

Light-emitting diode packaging structure 10

LED Die 11

First electrode 111

Second electrode 112

Conductive substrate 12

The first pad 13

First Arm 131

Second Arm 132

The first connecting part 133

The first fastening part 135

Level 1 Section 136

First Vertical Section 137

First Containment Space 138

The second welding pad 14

Third arm 141

Fourth arm 142

The second connection part 143

The second fastening part 145

Second Level Section 146

Second vertical part 147

Second Containment Space 148

Package Body 15

The first conductive region 16

The first chute 161

First Vertical Section 162

The first horizontal section 163

First shoulder 164

The second conductive region 17

The second chute 171

Second vertical section 172

The second horizontal section 173

Second shoulder 174

Insulation material 18

Detailed ways

Referring to FIG. 1 and FIG. 2 , a light emitting diode package structure 10 provided by an embodiment of the present invention includes a light emitting diode die 11 , a conductive substrate 12 , a first pad 13 , a second pad 14 and a package body 15 .

The conductive substrate 12 includes a first conductive region 16 and a second conductive region 17 which are insulated from each other, and the first conductive region 16 and the second conductive region 17 are connected by an insulating material 18 . The first conductive area 16 defines a first sliding slot 161 , the second conductive area 17 defines a second sliding slot 171 , and the first sliding slot 161 and the second sliding slot 171 are parallel to each other. The first chute 161 is narrow on the outside and wide on the inside. The first chute 161 includes a first horizontal section 163 and a first vertical section 162 . The intersection of straight segments 162 forms a first shoulder 164 . The second chute 171 is narrow on the outside and wide on the inside. The second chute 171 includes a second horizontal section 173 and a second vertical section 172 . The junction of the straight segments 172 forms a second shoulder 174 .

The first welding pad 13 includes a first arm portion 131, a second arm portion 132, a first connecting portion 133 and a first buckling portion 135, and the first arm portion 131 and the second arm portion 132 are respectively located at the ends of the first connecting portion 133. At both ends, the first arm portion 131 , the second arm portion 132 and the first connecting portion 133 form a U shape, and the first receiving space 138 is formed by enclosing the first arm portion 131 , the second arm portion 132 and the first connecting portion 133 . The first fastening portion 135 is in an inverted T shape as a whole, and the first fastening portion 135 is formed by protruding from the first arm portion 131 to the first receiving space 138 . The first fastening portion 135 includes a first vertical portion 137 and a first horizontal portion 136. The first vertical portion 137 is formed by extending vertically downward from the first arm portion 131. The first horizontal portion 136 is located at the first vertical portion. 137 bottom end.

The first conductive region 16 of the conductive substrate 12 protrudes into the first receiving space 138 of the first welding pad 13, and the first buckling portion 135 is slidably accommodated in the first slide groove 161. The first welding pad 13 and the first The conductive areas 16 make contact. Specifically, the first horizontal portion 136 of the first fastening portion 135 is accommodated in the first horizontal section 163 of the first chute 161 , and the first vertical portion 137 is accommodated in the first vertical section 162 of the first chute 161 , the first horizontal portion 136 abuts against the first shoulder 164 .

The second welding pad 14 also includes a third arm portion 141, a fourth arm portion 142, a second connecting portion 143 and a second buckling portion 145, and the third arm portion 141 and the fourth arm portion 142 are located at the second connecting portion 143 respectively. The third arm portion 141 , the fourth arm portion 142 and the second connecting portion 143 form a U-shape at both ends, and the third arm portion 141 , the fourth arm portion 142 and the second connecting portion 143 enclose to form the second receiving space 148 . The second fastening portion 145 is in an inverted T shape as a whole, and the second fastening portion 145 is formed by protruding from the third arm portion 141 to the second receiving space 148 . The second fastening portion 145 includes a second vertical portion 147 and a second horizontal portion 146. The second vertical portion 147 is formed by extending vertically downward from the third arm portion 141. The second horizontal portion 146 is located at the second vertical portion. 147 bottom end.

The second conductive region 17 of the conductive substrate 12 protrudes into the second receiving space 148 of the second welding pad 14, and the second buckling portion 145 is slidably accommodated in the second slide groove 171. The second welding pad 14 and the second Conductive area 17 contacts. Specifically, the second horizontal portion 146 of the second fastening portion 145 is accommodated in the second horizontal segment 173 of the second sliding groove 171 , and the second vertical portion 147 is accommodated in the second vertical segment 172 of the second sliding groove 171 , the second horizontal portion 146 abuts against the second shoulder 174 .

The LED crystal grain 11 is fixed on the conductive substrate 12, the LED crystal grain 11 includes a first electrode and a second electrode, the first electrode is electrically connected to the first conductive region 16 of the conductive substrate 12 through the first gold wire, and the second electrode The second gold wire is electrically connected to the second conductive region 17 of the conductive substrate 12 . The package body 15 is made of transparent material, and the package body 15 wraps the LED chip 11 .

As shown in FIG. 3 , the first welding pad 13 slides backward along the extension direction of the first chute 161 to the rear end of the first chute 161 , and the second welding pad 14 slides forward along the extension direction of the second chute 171 to the front end of the second chute 171 .

The first welding pad 13 and the second welding pad 14 of the light emitting diode packaging structure 10 of the present invention can slide relative to the conductive substrate 12 respectively, and the first welding pad 13 is in contact with the first conductive region 16 of the conductive substrate 12 to realize the first The pad 13 is electrically connected to the first conductive region 16, and the second pad 14 is in contact with the second conductive region 17 of the conductive substrate 12 to realize the electrical connection between the second pad 14 and the second conductive region 17, so that when the LED is packaged When the structure 10 is installed on the circuit board, the positions of the first welding pad 13 and the second welding pad 14 can be adjusted to match the welding position of the circuit board.

Claims (9)

1. a package structure for LED, comprise LED crystal particle, electrically-conductive backing plate, the first weld pad and the second weld pad, electrically-conductive backing plate comprises the first conductive region and second conductive region of mutually insulated, LED crystal particle is fixed on electrically-conductive backing plate, it is characterized in that: the first conductive region is offered the first chute, the second conductive region is offered the second chute, the first weld pad comprises the first buckling parts, the second weld pad comprises the second buckling parts, the first buckling parts is slidably contained in the first chute, the first weld pad contacts with the first conductive region, the second buckling parts is slidably contained in the second chute, the second weld pad contacts with the second conductive region, the first chute comprises vertically section of the first horizontal segment and first, the first conductive region forms the first shoulder in the first horizontal segment of the first chute and the intersection of the first vertical section, the second chute comprises vertically section of the second horizontal segment and second, the second conductive region forms the second shoulder in the second horizontal segment of the second chute and the intersection of the second vertical section, the first buckling parts comprises the first horizontal part and the first vertical portion, the first horizontal part is contained in the first horizontal segment of the first chute, the first vertical portion is contained in the first vertical section of the first chute, the first horizontal part is resisted against the first shoulder, the second buckling parts comprises the second horizontal part and the second vertical portion, the second horizontal part is contained in the second horizontal segment of the second chute, the second vertical portion is contained in the second vertical section of the second chute, the second horizontal part is resisted against the second shoulder.

2. package structure for LED as claimed in claim 1, is characterized in that: the outer narrow inner width of this first chute and the second chute.

3. package structure for LED as claimed in claim 1, it is characterized in that: the first weld pad also comprises the first arm, the second arm and the first connecting portion, the first arm and the second arm lay respectively at the two ends of the first connecting portion, the first arm, the second arm and the first connecting portion are U-shaped, the first arm, the second arm and the first connecting portion surround and form the first receiving space, and the first conductive region stretches in the first receiving space.

4. package structure for LED as claimed in claim 3, is characterized in that: the first buckling parts is protruded out and forms to the first receiving space by the first arm.

5. package structure for LED as claimed in claim 1, it is characterized in that: the second weld pad also comprises the 3rd arm, the 4th arm and the second connecting portion, the 3rd arm and the 4th arm lay respectively at the two ends of the second connecting portion, the 3rd arm, the 4th arm and the second connecting portion are U-shaped, the 3rd arm, the 4th arm and the second connecting portion surround and form the second receiving space, and the second conductive region stretches in the second receiving space.

6. package structure for LED as claimed in claim 5, is characterized in that: the second buckling parts is protruded out and forms to the second receiving space by the 3rd arm.

7. package structure for LED as claimed in claim 1, is characterized in that: the first conductive region is connected by insulating material with the second conductive region.

8. package structure for LED as claimed in claim 1, is characterized in that: LED crystal particle comprises the first electrode and the second electrode, and the first electrode is electrically connected to the first conductive region, and the second electrode is electrically connected to the second conductive region.

9. package structure for LED as claimed in claim 1, is characterized in that: also comprise packaging body, this packaging body coats LED crystal particle.