CN102464954B - Composite adhesive sheet, film comprising same and manufacturing method of film - Google Patents

Abstract

The present invention relates to a composite adhesive sheet having a first contact surface for contacting an object to be pasted. The composite adhesive sheet includes a resin matrix, a plurality of heat-conducting particles and a plurality of carbon fibers. The plurality of carbon fibers are all substantially perpendicular to the first contact surface, and the average length of the plurality of carbon fibers is 80% to 110% of the thickness of the composite adhesive sheet. The plurality of heat-conducting particles are located between the plurality of carbon fibers, and the average diameter of the plurality of heat-conducting particles is 70% to 90% of the thickness of the composite adhesive sheet. The resin matrix is distributed between multiple heat-conducting particles and multiple carbon fibers, and the viscosity of the resin matrix is 8000 centipoise to 18000 centipoise. The composite adhesive sheet of the technical solution has excellent thermal conductivity and thermal conductivity. The technical solution also provides a film comprising the composite adhesive sheet and a method for making the film.

Description

Composite adhesive sheet, film including the composite adhesive sheet, and method for producing the film

technical field

The invention relates to the adhesive technology, in particular to a composite adhesive sheet with better thermal conductivity, a film including the composite adhesive sheet and a method for making the film.

Background technique

With the advancement of science and technology, printed circuit boards have been widely used in the electronic field. For the application of the circuit board, please refer to the literature Takahashi, A.O oki, N.Nagai, A.Akahoshi, H.Mukoh, A.Wajima, M.Res.Lab, High densitymultilayer printed circuit board for HITAC M-880, IEEE Trans.onComponents , Packaging, and Manufacturing Technology, 1992, 15(4): 418-425.

As the integration of circuit boards increases, circuit board products often emit a lot of heat when they are actually working. If the heat cannot be exported in time, it will affect the signal transmission of the circuit board. One way to speed up the heat dissipation of circuit board products is to use a thermally conductive film with thermal conductivity when mounting or integrating electronic components on the circuit board. At present, the heat conduction speed of the commonly used heat conduction film is not fast enough, and the heat conduction performance is not uniform enough.

Therefore, it is necessary to provide a composite adhesive sheet with better thermal conductivity and heat conduction speed, a film including the composite adhesive sheet, and a method for making the film.

Contents of the invention

A composite adhesive sheet, a film comprising the composite adhesive sheet, and a method for making the film will be described below with examples.

A composite adhesive sheet has a first contact surface for contacting with an object to be pasted. The composite adhesive sheet includes a resin matrix, a plurality of heat-conducting particles and a plurality of carbon fibers. The plurality of carbon fibers are all substantially perpendicular to the first contact surface, and the average length of the plurality of carbon fibers is 80% to 110% of the thickness of the composite adhesive sheet. The plurality of heat-conducting particles are located between the plurality of carbon fibers, and the average diameter of the plurality of heat-conducting particles is 70% to 90% of the thickness of the composite adhesive sheet. The resin matrix is distributed between multiple heat-conducting particles and multiple carbon fibers, and the viscosity of the resin matrix is 8000 centipoise to 18000 centipoise.

A film, comprising a first release base material and a composite adhesive sheet. The first release substrate has a first release surface, and the composite adhesive sheet is formed on the first release surface. The composite adhesive sheet includes a resin matrix, a plurality of heat-conducting particles and a plurality of carbon fibers. The plurality of carbon fibers are all substantially perpendicular to the first release surface, and the average length of the plurality of carbon fibers is 80% to 110% of the thickness of the composite adhesive sheet. The plurality of heat-conducting particles are located between the plurality of carbon fibers, and the average diameter of the plurality of heat-conducting particles is 70% to 90% of the thickness of the composite adhesive sheet. The resin matrix is connected between a plurality of heat-conducting particles and a plurality of carbon fibers, and the viscosity of the resin matrix is 8000 centipoise to 18000 centipoise.

A method for manufacturing a film, comprising the steps of:

A composite adhesive material is provided, the composite adhesive material includes a resin matrix, a plurality of thermally conductive particles and a plurality of carbon fibers, the plurality of thermally conductive particles are located between the plurality of carbon fibers, and the resin matrix is connected between the plurality of thermally conductive particles and between multiple carbon fibers;

providing a first release substrate having a first release surface;

Coating the composite adhesive material on the first release surface, so that the coating thickness of the composite adhesive material on the first release surface is 91% to 125% of the average length of the plurality of carbon fibers, and is more than 111% to 143% of the average particle diameter of each thermally conductive particle; and

Stretching the release base material, and heating the composite adhesive material coated on the first release surface, so that the carbon fibers in the composite adhesive material coated on the first release surface are substantially along the direction perpendicular to the first release surface. The direction of the surface is extended, and the resin matrix is cured to a viscosity of 8000 centipoise to 18000 centipoise, thereby forming a composite adhesive sheet.

A plurality of heat-conducting particles and a plurality of carbon fibers are dispersed in the composite adhesive sheet provided by the technical solution. Because carbon fiber has excellent thermal conductivity, its thermal conductivity is generally 300-500W/k, which can improve the thermal conductivity and thermal conductivity of the film. Moreover, the average length of multiple carbon fibers is 80% to 110% of the thickness of the composite adhesive sheet, and they are basically arranged vertically, so that when they are pasted on the surface of the circuit board or other heat source components, the heat emitted by the heat source can be conducted as soon as possible . Further, a plurality of heat-conducting particles are distributed among the plurality of carbon fibers, and the average particle size of the plurality of heat-conducting particles is 70% to 90% of the thickness of the composite adhesive sheet, so as to assist in conducting the heat emitted by the heat source. Moreover, the resin matrix also has good adhesiveness, so it can be better attached to the surface of the heat source. The film provided by the technical solution has good heat conduction performance and heat conduction efficiency. The film manufacturing method provided by the technical solution can prepare the above films with excellent thermal conductivity and thermal conductivity.

Description of drawings

Fig. 1 is a schematic cross-sectional view of a film including a composite adhesive sheet provided by an embodiment of the technical solution.

Fig. 2 is a flow chart of the film making method provided by the embodiment of the technical solution. Description of main component symbols

Film 10

The first release substrate 11

First release surface 110

Composite adhesive sheet 12

First contact surface 1201

Second contact surface 1202

carbon fiber 122

Thermally Conductive Particles 124

The first release substrate 13

Second release surface 130

Detailed ways

The composite adhesive sheet, film and production method thereof provided by the technical solution will be further described in detail below in conjunction with the accompanying drawings and embodiments.

Referring to FIG. 1 , the technical solution provides a film 10 , which includes a first release substrate 11 , a composite adhesive sheet 12 and a second release substrate 13 stacked in sequence.

The first release substrate 11 is used to carry the composite adhesive sheet 12 . The first release substrate 11 refers to a sheet material having at least one release surface. The release surface refers to a surface with low surface energy, which can adhere to other materials and is easy to separate the adhered materials. The first release substrate 11 can be a PET release film, that is, its substrate is PET, and at least one surface of the substrate is coated with materials such as silicone oil to form a sheet material on the release surface, so that it can stick The composite adhesive sheet 12 formed on it is easy to separate the first release substrate 11 from the composite adhesive sheet 12 . In this embodiment, the first release substrate 11 is a single-sided PET release film, which has a first release surface 110 in contact with the composite adhesive sheet 12 . The material of the first release substrate 11 is not limited to the PET release film provided in this embodiment, it may also be other materials with a release surface, such as release paper. The release paper can be silicone oil paper or coated paper.

The second release substrate 13 is used to protect the composite adhesive sheet 12 . When the produced film 10 does not need to be transported or stored for a long time, the film 10 may not include the second release substrate 13 . The material of the second release substrate 13 can be the same as that of the first release substrate 11, that is, it can be a PET release film, or it can be other materials with a release surface, such as various release papers, etc. . The second release substrate 13 has a second release surface 130 in contact with the composite adhesive sheet 12 . The second release surface 130 is substantially parallel to the first release surface 110 , and the distance between the second release surface 130 and the first release surface 110 is the thickness of the composite adhesive sheet 12 .

During transportation and storage, the first release substrate 11 and the second release substrate 13 can isolate the composite adhesive sheet 12 from the outside world, preventing the composite adhesive sheet 12 from being polluted or absorbing moisture. During transportation or storage, when the multi-layer films 10 are stacked, the first release substrate 11 and the second release substrate 13 can also isolate adjacent films 10 to prevent the films 10 from sticking to each other.

The composite adhesive sheet 12 is used for bonding to the surface of the heat source element, and plays the role of bonding other elements and conducting the heat emitted by the heat source element. The thickness of the composite adhesive sheet 12 can be set according to actual needs. In this embodiment, the thickness of the composite adhesive sheet 12 is about 50 microns. The composite adhesive sheet 12 is disposed between the first release surface 110 of the first release substrate 11 and the second release surface 130 of the second release substrate 13 . The composite adhesive sheet 12 has a first contact surface 1201 and a second contact surface 1202 opposite to each other. The second contact surface 1202 is in contact with the first release substrate 11 , and is used for sticking to the component to be bonded and contacting the component to be bonded after being separated from the first release substrate 11 . The first contact surface 1201 is in contact with the second release substrate 13 , and is used for being attached to the component to be bonded and in contact with the component to be bonded after being separated from the second release substrate 13 . The distance between the first contact surface 1201 and the second contact surface 1202 is the thickness of the composite adhesive sheet 12 , which is about 50 microns. The composite adhesive sheet 12 is composed of composite adhesive materials. The composite adhesive material includes at least a resin matrix, a plurality of carbon fibers 122 and a plurality of thermally conductive particles 124 , and may also include other materials, such as hardeners, catalysts, solvents, tougheners, additives and defoamers. The plurality of carbon fibers 122 are substantially uniformly distributed in the composite adhesive material, and the plurality of heat-conducting particles 124 are also substantially uniformly distributed in the composite adhesive material. Moreover, the plurality of carbon fibers 122 and the plurality of heat-conducting particles 124 are doped with each other, that is, the plurality of carbon fibers 122 are located between the plurality of heat-conducting particles 124 , and the plurality of heat-conducting particles 124 are located between the plurality of carbon fibers 122 . The resin matrix and other materials are used to connect and bond a plurality of carbon fibers 122 and a plurality of heat conducting particles 124 .

The resin matrix can be in a cured state or a semi-cured state, and its viscosity is from 8000 mPa·s (milliPa·s) to 18000 mPa·s, that is, from 8000 centipoise to 18000 centipoise, preferably 11000 mPa·s (milliPa·s) ) to 14000mPa·s. Resin matrix can be epoxy resin, also can be other resins, such as polyimide (Polyimide, PI), polyethylene terephthalate (Polyethylene Terephthalate, PET), polyethylene naphthalate (Polyethylene naphthalate, PEN) and so on. In this embodiment, the resin matrix is commercially available Dow 331 liquid epoxy resin, which is a liquid product formed by the reaction of epichlorohydrin and bisphenol A, and its epoxy equivalent is 182 to 192. Preferably around 188. Of course, the resin matrix can also be other modified epoxy resins, such as the product after the copolymerization reaction of epoxy resin and carboxyl-terminated polymer, that is, the epoxy group at the end of the epoxy resin and the terminal of the carboxyl-terminated polymer The carboxyl group reacts to form an ester group, resulting in a polymer comprising alternating repeat units of epoxy resin and repeat units of carboxyl-terminated polymer. The mass percentage content of epoxy resin in the composite adhesive material is about 10% to 18%, preferably about 14.03%.

The plurality of carbon fibers 122 are substantially perpendicular to the first contact surface 1201 , and basically extend from the first contact surface 1201 or near the first contact surface 1201 to the second contact surface 1202 or near the second contact surface 1202 . The average length of the plurality of carbon fibers 122 is 80% to 110% of the thickness of the composite adhesive sheet 12 . In this embodiment, the average length of the plurality of carbon fibers 122 is substantially equal to the thickness of the composite adhesive sheet 12 , which is about 50 microns. Among the plurality of carbon fibers 122 , at least some of the carbon fibers 122 are exposed to the first contact surface 1201 , and at least some of the carbon fibers 122 are exposed to the second contact surface 1202 . Or it can be said that among the plurality of carbon fibers 122, some carbon fibers 122 are exposed to both the first contact surface 1201 and the second contact surface 1202; some carbon fibers 122 are neither exposed to the first contact surface 1201 nor exposed to the The second contact surface 1202; some carbon fibers are only exposed to the first contact surface 1201, but not to the second contact surface 1202; and some carbon fibers are only exposed to the second contact surface 1202, but not to the first contact surface 1201 . The carbon fiber 122 may be a microcrystalline graphite material obtained by carbonizing and graphitizing organic fibers, or may be one-dimensional carbon materials such as carbon nanotubes, carbon nanowires, carbon nanoclusters, and graphene. In this embodiment, the mass percentage of carbon fiber 122 in the composite adhesive material is about 8% to 12%, preferably about 9.82%.

The plurality of heat-conducting particles 124 may be spherical, ellipsoidal, approximately spherical, approximately ellipsoidal or in other shapes. The average particle diameter of the plurality of thermally conductive particles 124 is 70% to 90% of the thickness of the composite adhesive sheet 12 . Alternatively, it may be 70% to 90% of the average length of the plurality of carbon fibers 122 . Preferably, the average particle size of the plurality of heat-conducting particles 124 is about 80% of the thickness of the composite adhesive sheet 12 . The average particle diameter refers to the equivalent diameter of the largest particle when the cumulative distribution is 50% in the particle size distribution curve. In this embodiment, the average particle size of the heat-conducting particles 124 is about 40 microns, about 50% of the heat-conducting particles 124 have a particle size less than or equal to 40 microns, and 5% of the heat-conducting particles 124 have a particle size of about 50 microns. In this embodiment, the heat conducting particles 124 are boron nitride (BN) particles. Certainly, the heat conduction particles 124 may also be made of aluminum oxide, silver or other materials with higher heat conduction coefficient. The mass percentage of the thermally conductive particles 124 in the composite adhesive material is 35% to 55%, preferably about 44.91%.

The hardener is used to harden the composite adhesive material. In this embodiment, the hardener used is Dicyandiamine, and the weight percentage of the hardener in the composite adhesive material is 1.0% to 2.0%, preferably about 1.57%. In composite adhesives, the total amount of active hydrogen in the hardener can be compared to the total amount of epoxy in the epoxy resin.

The catalyst is 2-phenylimidazole (2-Phenylimidazole), and the content of the catalyst corresponds to the content of the epoxy resin. The mass percentage of the catalyst in the composite adhesive material is about 0.16%.

The solvent is diethylene glycol monoethyl ether acetate, and the content of the solvent in the composite adhesive material is 10% to 30%, preferably about 21.05%. The solvent is used to dissolve the other components mentioned above to form a uniform liquid dispersion.

The toughening agent is bisphenol A polyhydroxy ether (Poly-hydroxylether of Bisphenol A, PKHH), and the content of the toughening agent in the composite adhesive material is 2.0% to 6.5%, preferably about 4.21%. The content of the toughening agent corresponds to the content of the solvent. The mass ratio of toughening agent to solvent is about 0.1 to 0.3 to 1, preferably 0.2 to 1.

The additive is used to alleviate the stringing phenomenon that occurs when the toughening agent is dissolved in a solvent. The additive is γ-glycidoxypropyl trimethoxysilane (γ-Glycidoxypropyl tri-methoxy silane), and the content of the additive in the composite adhesive material is about 0.74%.

The defoamer is used to eliminate foam in the composite adhesive material, and the mass percentage content of the defoamer in the composite adhesive material is about 2% to 5%. Preferably it is 3.51%. The defoamer can be commercially available 1211 defoamer produced by Taiwan Chunzheng Company, which can also play a leveling role in the composite adhesive material.

In the film of a preferred embodiment provided by this technical solution, in the composite adhesive material used to form the composite adhesive sheet 12, the mass percentage of epoxy resin is about 14.03%, and the mass percentage of multiple carbon fibers 122 It is about 9.82%, the mass percentage of multiple heat-conducting particles 124 is about 44.91%, the mass percentage of dicyandiamide is about 1.57%, and the mass percentage of 2-phenylimidazole is about 0.16%. The mass percentage of glycol monoethyl ether acetate is about 21.05%, the mass percentage of bisphenol A polyhydroxy ether is about 4.21%, and the mass percentage of γ-glycidyl ether oxypropyltrimethoxysilane It is about 0.74%, and the mass percentage of the defoamer is about 3.51%.

Of course, those skilled in the art can understand that in the composite adhesive material used to form the composite adhesive sheet 12, in addition to the resin matrix, a plurality of carbon fibers 122 and a plurality of heat-conducting particles 124, other hardeners, catalysts, solvents, Tougheners, additives and defoamers are not essential technical features, and may contain only one or several of them, or may include other materials. For example, the composite adhesive material may include a resin matrix, a plurality of carbon fibers 122 , a plurality of thermally conductive particles 124 and a solvent.

When the film 10 provided by this technical solution is applied to the surface of a circuit board or other heat source surfaces, the second release substrate 13 can be torn off first, thereby exposing the first contact surface 1201 of the composite adhesive sheet 12, and the first The contact surface 1201 is in contact with the surface of the circuit board or other heat source surfaces so that the composite adhesive sheet 12 is attached and bonded to the surface of the circuit board or other heat source surfaces, and then the first release substrate 11 can be separated from the composite adhesive sheet 12 The second contact surface 1202 is torn off. In this way, the composite adhesive sheet 12 can be pasted and bonded to the surface of the circuit board or other heat source surfaces to achieve the effects of bonding and heat conduction.

After being pasted on the surface of the circuit board or other heat sources, the composite adhesive sheet 12 is basically gray and has good adhesion, solvent resistance and acid and alkali resistance. Specifically, after the composite adhesive sheet 12 is pasted on the surface of the circuit board or other heat sources, it is soaked in acetone solution for 17 hours without peeling off, and soaked in 10% sodium hydroxide or hydrochloric acid solution for half an hour There was no peeling phenomenon.

Please refer to Fig. 1 and Fig. 2 together, this technical scheme also provides the manufacturing method of described film 10, and this manufacturing method comprises the following steps:

In the first step, a composite adhesive material is provided. The composite adhesive material at least includes a resin matrix, a plurality of carbon fibers 122 and a plurality of heat conducting particles 124 . The plurality of carbon fibers 122 are located between the plurality of heat-conducting particles 124, and the plurality of heat-conducting particles 124 are located between the plurality of carbon fibers 122. The resin matrix can be epoxy resin, connected between the plurality of heat-conducting particles 124 and between multiple carbon fibers 122 . The average particle size of the plurality of thermally conductive particles 124 may be between 70% and 90% of the average length of the plurality of carbon fibers 122 . In this embodiment, the average length of the plurality of carbon fibers 122 is about 50 microns, and the average particle diameter of the plurality of heat-conducting particles 124 is about 40 microns.

The composite adhesive material may also include other materials. In this embodiment, the composite adhesive material also includes a hardener, a catalyst, a solvent, a toughening agent, an additive and a defoamer. These materials can all be the materials as described above. For example, the solvent may be diethylene glycol monoethyl ether acetate as mentioned above, and the content of the solvent in the composite adhesive material may be 10% to 30%.

In the second step, the first release substrate 11 is provided, and the first release substrate 11 has a first release surface 110 . The first release substrate 11 may be a PET release film.

In the third step, the composite adhesive material is coated on the first release surface 110, and the coating thickness of the composite adhesive material on the first release surface 110 is 91% to 91% of the average length of the plurality of carbon fibers 122. 125%, and is 111% to 143% of the average particle diameter of the plurality of heat-conducting particles 124 . Therefore, the average length of the plurality of carbon fibers 122 is 80% to 110% of the coating thickness, and the average particle diameter of the plurality of thermal conductive particles is 70% to 90% of the coating thickness. In this embodiment, the coating thickness of the composite adhesive material on the first release surface 110 is about 50 microns.

In this embodiment, the liquid composite adhesive material is coated on the first surface 111 of the insulating substrate layer 110 by using a slit coater, while controlling the coating thickness and coating evenly.

The fourth step is to stretch the first release substrate 11, and heat the composite adhesive material coated on the first release surface 110, so that more than one part of the composite adhesive material coated on the first release surface 110 The carbon fibers 122 extend substantially along a direction perpendicular to the first release surface 110 , and the resin matrix is cured to a viscosity of 8000 centipoise to 18000 centipoise, thereby forming the composite adhesive sheet 12 . The composite adhesive sheet 12 has a first contact surface 1201 and a second contact surface 1202 opposite to each other, and the second contact surface 1202 is in contact with the first release surface 110 of the first release substrate 11 .

In this embodiment, stretching the first release substrate 11 and heating the composite adhesive material coated on the first release surface 110 to form the composite adhesive sheet 12 may include the following steps:

First, the first release substrate 11 is stretched, and the composite adhesive material coated on the first release surface 110 is baked at a temperature of about 80-120 degrees Celsius for about 2-4 minutes. In this embodiment, while stretching, the composite adhesive material coated on the first release surface 110 is baked at a temperature of about 100 degrees Celsius for about 3 minutes. Due to the tensile force of the first release substrate 11 and the polarity of the solvent, the plurality of carbon fibers 122 in the composite adhesive material basically stand on the first release surface 110 . That is, the plurality of carbon fibers 122 will be substantially perpendicular to the first release surface 110 .

Next, stop stretching the first release substrate 11, and bake the composite adhesive material coated on the first release surface 110 at a temperature of about 60-80 degrees Celsius for about 4-8 minutes. In this embodiment, the composite adhesive material coated on the first release surface 110 is baked at a temperature of about 70 degrees Celsius for about 5 minutes. At this time, the resin matrix, solvent and other materials may be further cured, so that the resin matrix is cured to a viscosity of 8000 cps to 18000 cps.

Those skilled in the art can understand that stretching conditions and heating conditions may depend on the components and thickness of the composite adhesive material. In actual operation, stretching and heating parameters can be formulated according to specific conditions.

In the fifth step, attach the second release substrate 13 on the surface of the composite adhesive sheet 12 away from the first release substrate 11 , that is, on the first contact surface 1201 . The second release substrate 13 has a second release surface 130, and the composite adhesive sheet 12 is attached to the first release surface 110 of the first release substrate 11 and the second release substrate 13. between the second release surfaces 130 . The second release substrate 13 can be a release PET film, which can be various release papers.

When the formed film 10 is directly used for circuit board production, the second release substrate 13 may not be attached to the composite adhesive film.

After the fourth step or the fifth step, the film 10 can be further cut to make the film 10 into a desired shape for convenient use. When the fabricated film 10 is not used directly, the film 10 can be stored in a low-temperature environment, and the storage temperature can be about 5 degrees Celsius.

In the film 10 provided by this technical solution, the composite adhesive sheet 12 is uniformly dispersed with a plurality of heat-conducting particles 124 and a plurality of carbon fibers 122 . Since carbon fiber has excellent thermal conductivity, its thermal conductivity is generally 300-500 W/k, so that the thermal conductivity and thermal conductivity of the film 10 can be improved. Moreover, the average length of the plurality of carbon fibers 122 is 80% to 110% of the thickness of the composite adhesive sheet 12, and they are basically arranged vertically, so that when they are pasted on the surface of the circuit board or other heat source components, the heat source can be dissipated as soon as possible. of heat. Further, a plurality of heat-conducting particles 124 are distributed between the plurality of carbon fibers 122, and the average particle size of the plurality of heat-conducting particles 124 is 70% to 90% of the thickness of the composite adhesive sheet 12, so as to assist conduction of the heat source to dissipate of heat. Moreover, the resin matrix also has good adhesiveness, so it can be better attached to the surface of the heat source. That is to say, the composite adhesive sheet 12 can be stably attached to the surface of the heat source and has faster heat dissipation efficiency. The film manufacturing method provided by the technical solution can prepare the above film 10 with excellent thermal conductivity and thermal conductivity.

It can be understood that those skilled in the art can make various other corresponding changes and modifications according to the technical concept of the present invention, and all these changes and modifications should belong to the protection scope of the claims of the present invention.

Claims (11)

1. a composite gum bonding die, have for the first surface in contact with object contact to be pasted, described composite gum bonding die comprises resin matrix, a plurality of heat conduction particles and many carbon fibers, described many carbon fibers are all perpendicular to the first surface in contact, the mean length of many carbon fibers is 80% to 110% of described composite gum bonding die thickness, the quality percentage composition of described many carbon fibers in the composite gum bonding die is 8% to 12%, described a plurality of heat conduction particle is between many carbon fibers, the median size of a plurality of heat conduction particles is 70% to 90% of described composite gum bonding die thickness, the quality percentage composition of described a plurality of heat conduction particle in the composite gum bonding die is 35% to 55%, described resin matrix be distributed between a plurality of heat conduction particles and many carbon fibers between, the viscosity of resin matrix is 8000 centipoise to 18000 centipoises, the quality percentage composition of described resin matrix in the composite gum bonding die is 10% to 18%.

2. composite gum bonding die as claimed in claim 1, is characterized in that, in described many carbon fibers, carbon fiber is exposed to the first surface in contact at least partly.

3. composite gum bonding die as claimed in claim 1, is characterized in that, described resin matrix is the epoxy resin that epoxy equivalent (weight) is 182 to 192, and the viscosity of described epoxy resin is 11000 centipoise to 14000 centipoises.

4. composite gum bonding die as claimed in claim 1, is characterized in that, the material of described a plurality of heat conduction particles is boron nitride.

5. composite gum bonding die as claimed in claim 1, is characterized in that, described composite gum bonding die also comprises stiffening agent, catalyzer, solvent, toughner, additive and defoamer.

6. composite gum bonding die as claimed in claim 5, it is characterized in that, described stiffening agent is Dyhard RU 100, described stiffening agent shared quality percentage composition in the composite gum bonding die is 1.0% to 2.0%, described catalyzer is the 2-phenylimidazole, described solvent is diethylene glycol ether acetate alone, the quality percentage composition of described solvent in the composite gum bonding die is 10% to 30%, described toughner is the bisphenol A-type polyhydroxy ether, the quality percentage composition of described toughner in the composite gum bonding die is 2.0% to 6.5%, described additive is γ-glycidyl ether oxygen propyl trimethoxy silicane, the quality percentage composition of described defoamer in the composite gum bonding die is 2% to 5%.

7. a film, comprise the first release base material and composite gum bonding die as described as claim 1 to 6 any one, the described first release base material has the first release surface, described composite gum bonding die also has second surface in contact relative with the first surface in contact, and described the second surface in contact contacts with described the first release surface.

8. film as claimed in claim 7, is characterized in that, described film also comprises the second release base material, and the described second release base material has the second release surface, and described the first surface in contact contacts with described the second release surface.

9. film as claimed in claim 7, is characterized in that, in described many carbon fibers, an end of part carbon fiber is exposed to the first surface in contact, and the other end is exposed to the second surface in contact.

10. the manufacture method of a film comprises step:

Composite cementation material is provided, described composite cementation material comprises epoxy resin-base, a plurality of heat conduction particle and many carbon fibers, described a plurality of heat conduction particle is between many carbon fibers, described epoxy resin-base be connected between a plurality of heat conduction particles and many carbon fibers between, the quality percentage composition of described many carbon fibers in composite cementation material is 8% to 12%, the quality percentage composition of described a plurality of heat conduction particle in composite cementation material is 35% to 55%, and the quality percentage composition of described resin matrix in composite cementation material is 10% to 18%;

The first release base material is provided, and the described first release base material has the first release surface;

Described composite cementation material is coated to the first release surface, makes 91% to 125% of mean length that described composite cementation material is many carbon fibers at the coating thickness of the first release surface, and be a plurality of heat conduction particles median size 111% to 143%; And

The first release base material stretches, and the composite cementation material of the first release surface is coated in heating, so that the carbon fiber of coating in the composite cementation material of the first release surface all extends along the direction perpendicular to the first release surface, and to make resin matrix be cured to viscosity be 8000 centipoise to 18000 centipoises, thereby form the composite gum bonding die.

11. the manufacture method of film as claimed in claim 10, is characterized in that, forms the composite gum bonding die and comprise step:

The first release base material that stretches, and continue the very first time with the composite cementation material that the first release surface is coated in the first temperature baking; And

The first release base material that stops stretching, and continued for the second time with the composite cementation material that the first release surface is coated in the second temperature baking, described the first temperature is higher than the second temperature, and described the second time is longer than the very first time.

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