CN102456835A - Glass substrate capable of efficiently extracting light and its manufacturing method - Google Patents
Glass substrate capable of efficiently extracting light and its manufacturing method Download PDFInfo
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- CN102456835A CN102456835A CN2011103140768A CN201110314076A CN102456835A CN 102456835 A CN102456835 A CN 102456835A CN 2011103140768 A CN2011103140768 A CN 2011103140768A CN 201110314076 A CN201110314076 A CN 201110314076A CN 102456835 A CN102456835 A CN 102456835A
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Abstract
The invention relates to a glass substrate capable of efficiently extracting light and its manufacturing method, which aims to improve the light extraction efficiency of a glass substrate applied to the LED lighting, a solar battery or a flat display panel. According to the invention, the glass substrate is immersed in an etching solution for a few seconds and then is cleaned. Therefore, the surface of the glass substrate is randomly provided with a plurality of pits with the dimensions thereof to be nanometers or micrometers. Therefore, the light extraction efficiency is increased by more than 25% to 30%.
Description
Technical field
The present invention relates to be applied to the glass substrate and the manufacturing approach thereof of OLED illumination, solar cell or display pannel, especially be particularly related to the technology that improves the light transmittance that is applied to the glass substrate on the said elements.
Background technology
Usually; The glass substrate that is applied to OLED illumination, solar cell, flat-panel display panel has the side that forms light-emitting area after side that various driving elements etc. are set and the light transmission; Wherein for the glass substrate that forms light-emitting area; The light that propagates into the glass substrate outside among the light that is sent is many more, then favourable more.
Especially; Throw light on for OLED; Owing to develop the phosphorescence organic material, the internal quantum efficiency of OLED (internal quantum efficiency) is 100%, but as shown in Figure 1; Between the light of about 50% among the light that luminescent layer produces is because of layer, form waveguide (waveguide) and propagate to the side, about 30% light disappears because of total reflection.
Therefore, in the inner light that produces only 20% light can propagate into the actual components outside, so the external quantum efficiency of OLED is on the low side.For head it off (that is, arriving outside in the light extraction of element internal) with confining, as shown in Figure 2, studying the technology of inserting special layer in the inside of element.The layer that will have low-refraction (Low refractive index) is inserted between transparent anode electrode and the substrate, can reduce the light loss that causes because of total reflection in view of the above.This effect can further increase through inserting microcavity (micro cavity) layer, and also can obtain similar effects through insertion to the layer that light carries out scattering (scattering).And, out coupling film) or microlens array film (micro lens array film) through in element-external, promptly on glass substrate, paste special film and (go out the optical coupling film:, can improve light extraction efficiency.
But above listed method all forms expensive technology, needs loaded down with trivial details effort, and light extraction efficiency, and promptly light transmission rate can not be increased to desired degree yet.
Summary of the invention
Therefore, the object of the present invention is to provide a kind of easylier, and can improve the glass substrate of light extraction efficiency with cheap technology.
The present invention can be provided on the glass substrate a plurality of indentures (dimple) that (randomly) randomly forms number nanometer (nm) to several microns (μ m), improves the glass substrate that can extract light expeditiously of light extraction efficiency thus.
And the present invention can provide a kind of manufacturing approach that can extract the glass substrate of light expeditiously, it is characterized in that, the said glass substrate that can extract light expeditiously soaks (dipping) glass substrate through liquid in etching solution and makes.
And; The present invention can provide a kind of manufacturing approach that can extract the glass substrate of light expeditiously; It is characterized in that when the etching solution that uses in the said etch process is selected when applying external pressure the etching glass substrate, having per minute and count the etching solution of μ m with interior etch capabilities.
And the present invention can provide a kind of manufacturing approach that can extract the glass substrate of light expeditiously, it is characterized in that, in the said liquid soaking technology, is comprising fluorine (F
+) in the etching solution of ion the dipping glass substrate several seconds to several minutes.
And the present invention can provide a kind of manufacturing approach that can extract the glass substrate of light expeditiously, it is characterized in that, comprising:
On glass substrate, shelter and possess lateral length and vertical extension and be the steps of number μ m to the mask of the mesh (mesh) of tens of μ m;
To mix can be by fluorine ion (F
+) etched average grain diameter coats step said mask on silk screen printing for number μ m to the metal dust of tens of μ m sizes and the slurry of adhesive (binder);
Shine UV or under 50 ℃～200 ℃, said slurry is carried out dry step to the said slurry that is applied;
Can do not utilized sprayer to be ejected into to be coated with the step on the glass substrate of said slurry with not being pasted on said slurry by the etched resin material of fluorine particle yet;
Shine UV or under 50 ℃～200 ℃, said slurry is carried out dry step to said resin material;
To being coated with said slurry and resin material and carrying out dry glass substrate and carry out etching; Glass part with the position that particle was pressurizeed of being close to the metal dust that is pressurized to glass substrate and said metal dust to being contained in said slurry carries out etching, serves as the etching steps of number μ m to the micron indenture of tens of μ m sizes to form average diameter; And
Finish after the said etching step; Glass substrate is carried out etched second etching step; In being formed at the micron indenture of glass substrate, to form average diameter is the nanometer indenture of number nm to tens of nm sizes, is forming the micron indenture on the glass substrate and on said micron indenture face, is forming the nanometer indenture thus.
And the present invention can provide a kind of manufacturing approach that can extract the glass substrate of light expeditiously, it is characterized in that, the etching degree of said second etch compare said once etched etching degree more a little less than.
And; The present invention can provide a kind of manufacturing approach that can extract the glass substrate of light expeditiously; It is characterized in that said metal dust is formed by among Ag, Fe, Cu, the Al one of them, said resin material is by some formation the in epoxy resin or the polyester.
And; The present invention can provide a kind of glass substrate that can extract light expeditiously; It is characterized in that, on glass substrate, form average diameter and be the nanometer indenture of number nm to hundreds of nm sizes for number μ m forms average diameter to the micron indenture of tens of μ m sizes with on the surface of said micron indenture.
And the present invention can provide a kind of manufacturing approach that can extract the glass substrate of light expeditiously, it is characterized in that, from comprising fluorine ion (F
+) solution surface glass substrate is set at interval, and comprise fluorine ion (F from said solution surface evaporation to the jet surface of glass substrate
+) etching steam (fume), serve as the nanometer indentures of number nm to form average diameter to hundreds of nm sizes.
And the present invention can provide a kind of manufacturing approach that can extract the glass substrate of light expeditiously, it is characterized in that, will comprise the solution surface of said fluorine ion and the interval between the said glass baseplate surface and be decided to be several cm, comprises fluorine ion (F through mutually adjusting
+) the concentration, the time of spraying etching steam of solution, form said nanometer indenture.
And the present invention can provide a kind of manufacturing system that can extract the glass substrate of light expeditiously, it is characterized in that, comprising:
Solution tank is equipped with and comprises fluorine ion (F
+) solution;
The etching steam supply pipe, with the spatial communication of said solution tank, the etching steam that will evaporate from the solution of said solution tank is discharged on the glass substrate;
Etching steam suction pipe sucks etching steam, so that move horizontally at glass substrate from the etching steam of said etching steam supply pipe discharge,
The exhaust pressure of said etching steam supply pipe is maintained the suction pressure greater than said etching steam suction pipe,
Said etching steam is used to make the surface of said glass substrate to form average diameter for counting the nanometer indenture of nm to hundreds of nm sizes.
According to the present invention; Because of being formed at the indenture of the nanometer of glass substrate to micron-scale; Indenture surface at the light of the surface reflection of in the past the glass substrate sphere through being similar to concavees lens forms refraction and irregular reference, has reduced total reflection (total internal reflection) rate, thereby can extract from glass substrate expeditiously; Therefore on the whole than existing light extraction efficiency, light extraction efficiency can improve 25% to more than 50%.
And; According to the present invention; Form the micron indenture on the glass substrate and on the micron indenture, further forming the nanometer indenture, dispersing through the light that is similar to lens of a plurality of said indentures thus and the generation of irregular reference, preventing total reflection; Thereby can the light that send from luminescent layer be extracted into outside the glass substrate expeditiously, therefore can make light emitting element with high brightness.
Description of drawings
Fig. 1 is the light path of the existing OLED illumination of expression and the cutaway view of light extraction efficiency;
Fig. 2 is used to improve the cutaway view of the various trials of the prior art that the light extraction efficiency of OLED illumination carries out for expression;
Fig. 3 is the SEM photo on the surface of the general glass substrate of shooting;
Fig. 4 is for representing according to the present invention the SEM photo of the difference different multiplying on the surface of formation glass substrate indenture, that can extract light expeditiously on glass substrate;
Fig. 5 is the luminous photo of the OLED illumination of the glass substrate that can extract light expeditiously that adopts one embodiment of the invention and provide;
Fig. 6 is the luminous photo of the OLED illumination of the glass substrate that can extract light expeditiously that adopts another embodiment of the present invention and provide;
Fig. 7 and Fig. 8 are used for explaining in another embodiment of the present invention using the mesh mask to be coated with the pie graph of the step of the slurry that comprises metal dust;
Fig. 9 is illustrated in the another embodiment of the present invention to be coated with the cutaway view that slurry is pressed on the slurry that comprises metallic on the glass substrate with silk screen printing;
Figure 10 is filled in the cutaway view of the resin material between the metallic in another embodiment of the present invention with sprayer sprayed resin material for expression;
Figure 11 accomplishes etching step for expression according to another embodiment of the present invention and is formed at the micron indenture of glass substrate and the cutaway view of nanometer indenture afterwards;
Figure 12 is the skeleton diagram of explanation another embodiment of the present invention;
Figure 13 is the composition cutaway view of expression another embodiment of the present invention;
Figure 14 is the side composition diagram to Figure 13;
Figure 15 is illustrated in the side composition diagram that increases inscape on Figure 14.
Main symbol description: 100 is the mesh mask, and 200 is glass substrate, and 300 is metallic, and 400 is resin portion, and 500 is the micron indenture, and 550 is the nanometer indenture, and 1000 is solution tank, and 2000 are the etching steam supply pipe, and 3000 is air intake duct.
Embodiment
Below, specify the preferred embodiments of the present invention with reference to accompanying drawing.
Embodiment one
At first, prepare necessary etching solution when the dipping glass substrate.
At this moment; Not restriction of thickness for the glass substrate that uses; Used the glass substrate of 0.2mm to 2mm in the present embodiment, etching solution is made up of the acid solution that comprises the F ion, but need not its content ratio is limited to some number ranges; As long as make through adjustment rose and its expulsion pressure and can count μ m with interior speed etching glass substrate with the per minute etching, then can become satisfied etching solution to the etching test result that the glass substrate injection draws.This etch capabilities also is exemplary, is to consider productivity ratio etc. and the etching solution of having selected to have etch capabilities as above.
For the also not restriction of material of glass substrate, used the soda lime glass substrate between the 0.2mm to 2mm in the present embodiment, and the concentration of F ion has been set rank, (0.5 to 2kgf/cm through having fixing expulsion pressure simultaneously
2) the injection etching test of sprayer, formed etching solution with various mixing ratios.The manufacturing of this etching solution is exemplary, the time of the concentration of the manufacturing of etching solution through mutually adjusting the F ion, expulsion pressure and the liquid soaking technology stated after together with relevant therewith etch capabilities, can have the embodiment of multiple combination fully.
When the etching solution that will equally make as stated at room temperature fills in the tank; And dipping glass substrate and when making glass substrate keep liquid in several minutes and soak state in the several seconds, will on glass substrate, produce severals nm shown in the photo of Fig. 4 to the nanometer of number μ m size indenture extremely micron.Than the left photo of Fig. 4, right photograph is the high magnification photo.The surface of the general glass substrate before this can implement with the liquid soaking technology of Fig. 3 compares, and the size of nanometer to micron indenture forms as illustrated in fig. 4 randomly.This nanometer to micron indenture is the same as concavees lens; In divergent rays, cause irregular reference, prevent on the critical surface on plane to produce total reflection etc., thus make more light transmission outside glass substrate (promptly; More light propagates into outside the glass substrate, to present higher brightness).For etching solution with predetermined etch capabilities; If it is too short that liquid soaks the time; Then the formation degree of indenture does not reach requirement, and the extraction efficiency of light can not rise yet, but the liquid of exceedance minute soaks and then is unfavorable for productivity ratio; And also the albinism that glass substrate fogs may take place, therefore be necessary to select best liquid to soak the time.The liquid time of soaking can be adjusted to best selection according to the etch capabilities of etching solution and the thickness of glass substrate etc. as described above.
Nanometer to micron indenture can be formed at the two sides of glass substrate, but also can utilize mask or film etc. only to be formed on the side.
Then, cleaning is formed with the glass substrate of nanometer to the micron indenture.Cleaning is following.
Said glass substrate is carried out 10 minutes with interior single-steeping in distilled water, in new distilled water, carry out 10 minutes then with interior double-steeping, with the diluted strong solution composition.
Then, the glass substrate utilization of accomplishing etch process such as the alkaline aqueous solution of NaOH (NaOH) are cleaned, remove the acid ingredient of the etching solution that residues in glass substrate and might the etching glass substrate through neutralization reaction.
Preferably, the pH value of the alkaline solution that in above-mentioned steps, uses is 12 ± 2, and treatment temperature is 45 ± 5 ℃, and the processing time is about 10 minutes, but is not limited thereto, and can mutually adjust each variable and changes.
Processing method for the glass substrate that will clean be loaded into the conveyer belt level and transfer, with spray pattern sodium hydroxide solution is ejected into the upper and lower sides of glass substrate through nozzle, thus glass cleaning substrate on the whole.The expulsion pressure of nozzle is decided to be 1.5 ± 0.5kgf/cm
2, the handover speed of glass substrate is decided to be 1.0 to 1.5m/min, to be fit to cleaning, is preferably set to 1.2m/min.
Then, utilize the mild acid wash glass substrate, residue in glass substrate with the strong basicity composition that prevents sodium hydrate aqueous solution.The weak acid that uses comprises citric acid, acetic acid, carbonic acid etc., and its pH value can be prepared as 3 or 4 and use.Utilize the clean temperature of weak acid can be set at normal temperature to 60 ℃; Be preferably 45 ± 5 ℃; Cleaning way adopts the glass substrate that institute will be cleaned to be loaded into conveyer belt and the level handover; And weak acid solution is ejected into the upper and lower sides of glass substrate with spray pattern, the mode of cleaning on the whole thus through nozzle.The expulsion pressure of nozzle is decided to be 1.0 ± 0.5kgf/cm
2, the handover speed of glass substrate is decided to be 1.0 to 1.5m/min, to be fit to cleaning, is preferably set to 1.2m/min.This cleaning condition only is exemplary, can mutually adjust variable and uses other selection also can reach optimization.
After finishing said mild acid wash step,, finish cleaning step thus with distilled water (pure water) glass cleaning substrate.
Utilize light source to carry out luminance test through above-mentioned technology to the glass substrate that is formed with nanometer to micron indenture, its photo such as Fig. 5 and shown in Figure 6 according to light extraction efficiency.Can know from Fig. 5 and Fig. 6, can with the naked eye confirm under identical etching solution according to liquid soak that temporal differences demonstrates, according to the luminance difference of the light extraction efficiency of the glass substrate that is formed with nanometer to micron indenture.Thus, can find out the composition of the etching solution that demonstrates best brightness and the combination that liquid soaks the time.
The light extraction efficiency of the glass substrate that is formed with nanometer to micron indenture that goes out constructed in accordance is compared existing light extraction efficiency and is improved 25% to 50%, and its result demonstrates 25% to the light extraction efficiency more than 30% for luminous quantity.
Embodiment two
Below, with reference to Fig. 7 to Figure 11 another embodiment of the present invention is described.
As shown in Figure 7, preparation laterally has the mesh mask 100 of several μ m to 300 above mesh of tens of μ m sizes with vertically all being formed with, and it is positioned on the glass substrate 200, and is as shown in Figure 8, is coated with the slurry that comprises metal dust with silk screen printing.The metal dust that is contained in said slurry constitutes by counting the metallic of μ m to tens of μ m sizes, for the not special restriction of the kind of metal, as long as can be by fluorine ion (F
+) etching just can, but preferably use one of them among Ag, Fe, Cu, the Al.Said slurry uses mixed metal powder and adhesive (binder) and manufactures the slurry of the state of easy coating.
As shown in Figure 8, through utilize the squash type scraper with said slurry silk screen printing to glass substrate 200, metallic 300 is pressed on the glass substrate 200 through the mesh of said mesh mask 100 as illustrated in fig. 9.Under this state, be fixing metal particle 300, in 50 ℃ to 200 ℃ drying machine, implement dry to the glass substrate 200 that is coated with slurry.Drying can adopt air dry or use the drying of ultraviolet ray (UV) irradiation, for having no particular limits drying time, can suitably adjust according to the state of slurry.
After drying finishes, remove said mesh mask 100 from glass substrate 200, and, fill the blank between the metallic 300 by resin material as illustrated in fig. 10 thus to said glass substrate 200 usefulness sprayer sprayed resin materials.Employed resin material should use and can not stick on the slurry and can be by the etched heat-curing resin of fluorine ion this moment, was preferably to use some in epoxy resin or the mylar.
In order to make said heat-curing resin between metallic 300, form resin portion 400 securely, under 50 ℃ to 200 ℃, carry out drying.Be the metallic 300 of micron order (number μ m is to tens of μ m) and utilize resin portion 400 to fill between the metallic 300 in coating average grain diameter on the glass substrate 200, and this glass substrate 200 is put into etching solution carry out an etching.Once etched purpose is to melt said metallic 300, and then the glass substrate 200 of the part that metallic 300 is covered carries out etching, to form the micron indenture 500 of micron-scale.Therefore, preferably use fluorine ion (F
+) etching solution 600 that concentration is high slightly, be preferably and comprise 55% F at least
+Etching solution 600.But, need not F
+Concentration is carried out special restriction, and this is because can under high concentration, implement the etching of short time, perhaps under low concentration, implements long etching.
Take out glass substrate 200 after accomplishing an etching, and in the alkaline solution resin portion 400 is peeled off out or peel off, and then put into new etching solution and implement second etch through physics mode through being immersed in.The purpose of second etch is in the micron indenture 500 that has formed, to form average diameter and is the nanometer indenture 550 of number nm to hundreds of nm nano-scales, and should implement the more weak etching of a relative etching.
That is, compare an etching, reduce the concentration of etching solution,, perhaps suitably reduce the concentration and the etching period of etching solution, form nanometer indenture 550 (with reference to Figure 11) if the perhaps etching solution of same concentrations then reduces etching period.
When accomplishing second etch, from etching solution, take out glass substrate 200, clean with the cleaning way described in the previous embodiment one.
Embodiment three
Followingly specify another embodiment of the present invention with reference to Figure 12 to Figure 15.
The big or small prep solution groove of corresponding glass substrate, and filling improves fluorine ion (F a little in this solution tank
+) etching solution 600 of concentration.Be preferably to use and comprise at least 55% F
+Etching solution 600, but need not to limit especially F
+Concentration, this is because can under high concentration, implement the etching of short time, perhaps under low concentration, implements long etching.Filling is during etching solution 600 in solution tank, should be vacant in the height of solution tank goes out about several cm, is preferably the vacant 5cm to 10cm of going out, with the space of guaranteeing that etching steam that solution evaporation back produces can exist.Glass substrate is directly placed in upper end at said solution tank, so that comprise the etching steam (fume) of fluorine ion etching is implemented on the surface of said glass substrate.In view of the above, will form a plurality of indentures randomly on the surface of glass substrate with average diameter of nano-scale.
That is, form the molecule of etching steam and do the Brownian movement of moving at random, therefore impact the surface of glass substrate out of orderly, thereby, form the indenture of nano-scale thus randomly with fine big or small etching glass substrate surface in the clearance spaces of said solution tank.
Consider productivity ratio, when the concentration of etching solution 600 was decided to be high concentration (about 70%), etching period reached 1 minute to 5 minutes then relatively fully, along with the concentration of etching solution is high, but in cleaning the high slightly alkaline cleaning fluid of working concentration.
And, as one of scheme of boosting productivity, also can select the high etching solution of volatility for use, to form the nanometer indenture at short notice.
In the present embodiment, under normal temperature (18～25 ℃), make F
+Concentration is about 55% etching solution evaporation, has sprayed the etching steam about 15 seconds to 1 minute and 30 seconds to glass substrate thus.
Below, with reference to Figure 13 another embodiment of the present invention is described.
Filling etching solution in solution tank 1000; And, forming nanometer indenture 550 randomly on the surface of glass substrate thus to the etching steam that the glass substrate injection is evaporated thus, the embodiment with Figure 12 is identical in this; But in the present embodiment; For reaching higher productivity ratio and also all forming the nanometer indenture fully at the marginal position of glass baseplate surface, shown in figure 13, etching steam supply pipe 2000 and suction pipe 3000 are set.Promptly; Following etching steam supply pipe 2000 can be provided; Glass substrate is equipped on the transmission mechanism of roller etc., the solution tank 1000 that etching solution is housed is arranged in the downside of said glass substrate, and the pipeline with the spatial communication of solution tank is set; Discharge etching steam through this pipeline to the surface of said glass substrate thus, to form nanometer indenture 550.And, consider to discharge constantly might cause being distributed in the part on the glass substrate in the etching vapor collection because of etching steam, the etching steam suction pipe 3000 that moves horizontally that can promote etching steam can be set.In the present embodiment, left and right symmetrically is provided with two said suction pipes 3000, but can a plurality of suction pipes be arranged to triangle or radiation symmetry shape.At this moment; With respect to the pressure that etching steam is discharged to the glass substrate upside; The pressure that sucks etching steam should be littler; The numerical value of the suction pressure of the exhaust pressure of etching steam supply pipe 2000 and suction pipe 3000 can be through making up etching solution on the whole concentration and etching steam is ejected into the variablees such as time of glass substrate, reach optimization in every way.The surface of the relative etching solution in upper end of said solution tank 1000 is necessary to keep the clearance spaces that is used to be provided with etching steam suction pipe 3000 and etching steam supply pipe 2000; The height in this space is preferably more than about 40cm; And liquid level sensor preferably is set, to be used to adjust the liquid level of etching solution.
And because of etching solution evaporation, when being necessary that new etching solution is filled in solution tank 1000, the flexible pipe that valve is set and is connected to this valve is opened the valve that is in closed condition at ordinary times thus, fills etching solution through flexible pipe.The filling of this etching solution, pressure etc. can be controlled through control board is set easily.
In the present embodiment, under normal temperature (18～25 ℃), make F
+Concentration is about 55% etching solution evaporation, has sprayed the etching steam about 30 seconds to 1 minute and 30 seconds to glass substrate thus.Etching steam supply pipe 2000 comprises forced draft fan and ventilating fan with suction pipe 3000; This forced draft fan and ventilating fan all can use 3 to 5 horsepowers forced draft fan and ventilating fan, and its pressure uses variable resistance (manually) and inverter (automatically) to be adjusted to 1000mpa to 4000mpa.The pressure differential of etching steam supply pipe 2000 and suction pipe 3000 is about 500mpa to 1000mpa.
Figure 14 is the side sectional view of Figure 13, and expression forms the processing of nanometer indenture simultaneously to plural glass substrate.And Figure 15 is the side view identical with Figure 14, but further expresses the inscape of increase.
Promptly; Diagram has the loading part 700 in the interval of glass substrate-conveying in being exposed to etching steam and sprays etching steam and form after the nanometer indenture glass substrate-conveying to the unloading portion 800 between cleaning area; And expression is necessary to be provided with and cuts off between the air-tight section that sucks gas 701, so that etching steam only is ejected into glass substrate and can be leaked to the outside.And, preferably, paste the diaphragm of series of polymers at the back side of glass substrate, to avoid receiving the influence of etching steam.So, can boost productivity, produce in a large number.
The glass substrate of accomplishing nanometer indenture formation step is done as follows cleaning.
Implement 5 minutes to 10 minutes single-steeping in the distilled water about 45 ± 5 ℃,, in new distilled water, implement 5 minutes 10 minutes double-steeping then, with the diluted strong composition to peel off diaphragm.Then, clean with the above embodiments one identically.
The glass substrate 200 that is formed with micron indenture 500 to nanometer indenture 550 constructed in accordance; Total reflection on the critical surface of elimination glass substrate 200; And cause to distribute arbituarily and penetrate; The shape of the depression of indenture plays the effect of concavees lens, can the light that luminous element sends be extracted into outside the glass substrate 200 expeditiously.Interest field of the present invention is not limited to above illustrated example, and defines according to the record of claims, and obviously, this area has within the scope that the technical staff of common knowledge can be put down in writing in claims carries out various changes and improvement.
Claims (11)
1. the glass substrate that can extract light expeditiously is characterized in that, on glass substrate, forms a plurality of indentures of several nanometers to the number micron-scale that improves light extraction efficiency randomly.
2. the manufacturing approach that can extract the glass substrate of light expeditiously is characterized in that, the described glass substrate that can extract light expeditiously of claim 1 soaks glass substrate manufacturing through liquid in etching solution.
3. the manufacturing approach that can extract the glass substrate of light expeditiously according to claim 2; It is characterized in that; When the etching solution that uses in the said etch process is selected when applying external pressure the etching glass substrate, have per minute and count the etching solution of μ m with interior etch capabilities.
4. according to claim 2 or the 3 described a kind of manufacturing approaches that can extract the glass substrate of light expeditiously, it is characterized in that in the said liquid soaking technology, the dipping glass substrate several seconds was to several minutes in the etching solution of the normal temperature that comprises fluorine ion.
5. the manufacturing approach that can extract the glass substrate of light expeditiously is characterized in that, comprising:
On glass substrate, shelter and possess lateral length and vertical extension and be the steps of number μ m to the mask of the mesh of tens of μ m;
Can be coated step said mask on silk screen printing for number μ m to the metal dust of tens of μ m sizes and the slurry of adhesive by the etched average grain diameter of fluorine ion with mixing;
Under 50 ℃～200 ℃, the said slurry that is applied is carried out dry step;
Remove after the said mask, also can be ejected into the step on the glass substrate that is coated with said slurry by the etched heat-curing resin of fluorine particle with not being pasted on said slurry;
Under 50 ℃～200 ℃, said heat-curing resin is carried out dry step;
To being coated with said slurry and heat-curing resin and carrying out dry glass substrate and carry out etching; Glass part to be close to the position that the metal dust that is pressurized to glass substrate and said metal powder particles pressurizeed to being contained in said slurry carries out etching, serves as the etching steps of number μ m to the micron indenture of tens of μ m sizes to form average diameter; And
Finish after the said etching step; Glass substrate is carried out etched second etching step; In being formed at the micron indenture of glass substrate, to form average diameter is the nanometer indenture of number nm to tens of nm sizes, is forming the micron indenture on the glass substrate and on said micron indenture face, is forming the nanometer indenture thus.
6. the manufacturing approach that can extract the glass substrate of light expeditiously according to claim 5 is characterized in that, the etching degree of said second etch compare said once etched etching degree more a little less than.
7. the manufacturing approach that can extract the glass substrate of light expeditiously according to claim 6; It is characterized in that; Said metal dust is formed by among Ag, Fe, Cu, the Al one of them, and said heat-curing resin is by some formation the in epoxy resin or the polyester.
8. glass substrate that can extract light expeditiously; It is characterized in that, on glass substrate, form average diameter and be the nanometer indenture of number nm to hundreds of nm sizes for number μ m forms average diameter to the micron indenture of tens of μ m sizes with on the surface of said micron indenture.
9. the manufacturing approach that can extract the glass substrate of light expeditiously; It is characterized in that; From the solution surface that comprises fluorine ion glass substrate is set at interval; And, serve as the nanometer indentures of number nm to hundreds of nm sizes to form average diameter to the jet surface of glass substrate the etching steam that comprises fluorine ion from said solution surface evaporation.
10. the manufacturing approach that can extract the glass substrate of light expeditiously according to claim 9; It is characterized in that; To comprise the solution surface of said fluorine ion and the interval between the said glass baseplate surface and be decided to be several cm; Through the concentration of mutually adjusting the solution that comprises fluorine ion, the time of uperize, form said nanometer indenture.
11. the manufacturing system that can extract the glass substrate of light expeditiously is characterized in that, comprising:
Solution tank is equipped with the solution that comprises fluorine ion;
The etching steam supply pipe, with the spatial communication of said solution tank, the etching steam that will evaporate from the solution of said solution tank is discharged on the glass substrate;
Etching steam suction pipe sucks etching steam, so that move horizontally at glass substrate from the etching steam of said etching steam supply pipe discharge,
The exhaust pressure of said etching steam supply pipe is maintained the suction pressure greater than said etching steam suction pipe,
Said etching steam is used to make the surface of said glass substrate to form average diameter for counting the nanometer indenture of nm to hundreds of nm sizes.
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2010-0105670 | 2010-10-28 | ||
| KR1020100105670A KR101277439B1 (en) | 2010-10-28 | 2010-10-28 | High Efficiently Light Extractable Glass Substrate and Manufacturing Method thereof |
| KR10-2010-0119378 | 2010-11-29 | ||
| KR1020100119378A KR101238093B1 (en) | 2010-11-29 | 2010-11-29 | High Efficiently Light Extractable Glass Substrate And Manufacturing Method Thereof |
| KR10-2011-0006653 | 2011-01-24 | ||
| KR1020110006653A KR101254428B1 (en) | 2011-01-24 | 2011-01-24 | High Efficiently Light Extractable Glass Substrate Manufacturing Method and Manufacturing System |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102456835A true CN102456835A (en) | 2012-05-16 |
| CN102456835B CN102456835B (en) | 2016-04-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110314076.8A Expired - Fee Related CN102456835B (en) | 2010-10-28 | 2011-10-17 | Glass substrate and the manufacture method thereof of light can be extracted expeditiously |
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| Country | Link |
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| CN (1) | CN102456835B (en) |
| TW (1) | TWI452024B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104183768A (en) * | 2013-05-22 | 2014-12-03 | 海洋王照明科技股份有限公司 | Organic light emitting diode and preparation method thereof |
| CN107994135A (en) * | 2017-12-07 | 2018-05-04 | 武汉华美晨曦光电有限责任公司 | A kind of processing method that film is extracted outside OLED luminescent devices |
| CN109052977A (en) * | 2018-08-13 | 2018-12-21 | 中国人民解放军陆军防化学院 | A kind of construction method of micro-nano defect glass surface |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8497155B1 (en) * | 2012-06-05 | 2013-07-30 | Guardian Industries Corp. | Planarized TCO-based anode for OLED devices, and/or methods of making the same |
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| CN1519588A (en) * | 2003-01-28 | 2004-08-11 | ������������ʽ���� | Substrate and manufacturing method thereof, microlens substrate, transmissive screen and rear projector |
| CN1600723A (en) * | 2003-09-26 | 2005-03-30 | 日本板硝子株式会社 | Etched article, mold structure for producing the same and method for production thereof |
| US20080029399A1 (en) * | 2006-02-28 | 2008-02-07 | Fujifilm Corporation | Method of manufacturing nanostructures |
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| JPH07101753A (en) * | 1993-10-01 | 1995-04-18 | Nippon Sheet Glass Co Ltd | Production of silicate glass article |
| WO2009066624A1 (en) * | 2007-11-19 | 2009-05-28 | Asahi Glass Co., Ltd. | Method for etching glass substrate |
| US20100215862A1 (en) * | 2009-02-26 | 2010-08-26 | Sinue Gomez | Method for forming an opal glass |
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| CN1519588A (en) * | 2003-01-28 | 2004-08-11 | ������������ʽ���� | Substrate and manufacturing method thereof, microlens substrate, transmissive screen and rear projector |
| CN1600723A (en) * | 2003-09-26 | 2005-03-30 | 日本板硝子株式会社 | Etched article, mold structure for producing the same and method for production thereof |
| US20080029399A1 (en) * | 2006-02-28 | 2008-02-07 | Fujifilm Corporation | Method of manufacturing nanostructures |
| US20080081154A1 (en) * | 2006-10-03 | 2008-04-03 | Seiko Epson Corporation | Element substrate and method of manufacturing the same |
| CN101746957A (en) * | 2008-12-19 | 2010-06-23 | 旭硝子株式会社 | Method of glass surface fine processing |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104183768A (en) * | 2013-05-22 | 2014-12-03 | 海洋王照明科技股份有限公司 | Organic light emitting diode and preparation method thereof |
| CN107994135A (en) * | 2017-12-07 | 2018-05-04 | 武汉华美晨曦光电有限责任公司 | A kind of processing method that film is extracted outside OLED luminescent devices |
| CN109052977A (en) * | 2018-08-13 | 2018-12-21 | 中国人民解放军陆军防化学院 | A kind of construction method of micro-nano defect glass surface |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201217289A (en) | 2012-05-01 |
| TWI452024B (en) | 2014-09-11 |
| CN102456835B (en) | 2016-04-27 |
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