CN102424995A - Tin-indium alloy electroplating solution - Google Patents
Tin-indium alloy electroplating solution Download PDFInfo
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- CN102424995A CN102424995A CN2011104245678A CN201110424567A CN102424995A CN 102424995 A CN102424995 A CN 102424995A CN 2011104245678 A CN2011104245678 A CN 2011104245678A CN 201110424567 A CN201110424567 A CN 201110424567A CN 102424995 A CN102424995 A CN 102424995A
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- Prior art keywords
- acid
- sulfonic acid
- alloy electroplating
- tin
- sequestrant
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- Pending
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- 238000009713 electroplating Methods 0.000 title claims abstract description 17
- 229910000846 In alloy Inorganic materials 0.000 title abstract description 4
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 title abstract 3
- 150000002471 indium Chemical class 0.000 claims abstract description 9
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 claims abstract description 7
- 239000002253 acid Substances 0.000 claims abstract description 7
- 239000007864 aqueous solution Substances 0.000 claims abstract description 6
- 239000003513 alkali Substances 0.000 claims abstract description 5
- 239000003518 caustics Substances 0.000 claims abstract description 5
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims abstract description 3
- 239000007788 liquid Substances 0.000 claims description 18
- 229910045601 alloy Inorganic materials 0.000 claims description 12
- 239000000956 alloy Substances 0.000 claims description 12
- 229910018956 Sn—In Inorganic materials 0.000 claims description 11
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 claims description 8
- CCIVGXIOQKPBKL-UHFFFAOYSA-M ethanesulfonate Chemical compound CCS([O-])(=O)=O CCIVGXIOQKPBKL-UHFFFAOYSA-M 0.000 claims description 8
- 239000003352 sequestering agent Substances 0.000 claims description 8
- PVNIIMVLHYAWGP-UHFFFAOYSA-N Niacin Chemical compound OC(=O)C1=CC=CN=C1 PVNIIMVLHYAWGP-UHFFFAOYSA-N 0.000 claims description 6
- WHOZNOZYMBRCBL-OUKQBFOZSA-N (2E)-2-Tetradecenal Chemical group CCCCCCCCCCC\C=C\C=O WHOZNOZYMBRCBL-OUKQBFOZSA-N 0.000 claims description 4
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 claims description 4
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 claims description 4
- ULUAUXLGCMPNKK-UHFFFAOYSA-N Sulfobutanedioic acid Chemical compound OC(=O)CC(C(O)=O)S(O)(=O)=O ULUAUXLGCMPNKK-UHFFFAOYSA-N 0.000 claims description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 4
- IFQUWYZCAGRUJN-UHFFFAOYSA-N ethylenediaminediacetic acid Chemical compound OC(=O)CNCCNCC(O)=O IFQUWYZCAGRUJN-UHFFFAOYSA-N 0.000 claims description 4
- MNWFXJYAOYHMED-UHFFFAOYSA-N heptanoic acid Chemical compound CCCCCCC(O)=O MNWFXJYAOYHMED-UHFFFAOYSA-N 0.000 claims description 4
- SUMDYPCJJOFFON-UHFFFAOYSA-N isethionic acid Chemical compound OCCS(O)(=O)=O SUMDYPCJJOFFON-UHFFFAOYSA-N 0.000 claims description 4
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims description 4
- 229940044654 phenolsulfonic acid Drugs 0.000 claims description 4
- KCXFHTAICRTXLI-UHFFFAOYSA-N propane-1-sulfonic acid Chemical compound CCCS(O)(=O)=O KCXFHTAICRTXLI-UHFFFAOYSA-N 0.000 claims description 4
- 235000019260 propionic acid Nutrition 0.000 claims description 4
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 claims description 4
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 claims description 4
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims description 3
- 229960003512 nicotinic acid Drugs 0.000 claims description 3
- 235000001968 nicotinic acid Nutrition 0.000 claims description 3
- 239000011664 nicotinic acid Substances 0.000 claims description 3
- ZKIHLVYBGPFUAD-UHFFFAOYSA-N quinoline-2-sulfonic acid Chemical compound C1=CC=CC2=NC(S(=O)(=O)O)=CC=C21 ZKIHLVYBGPFUAD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052708 sodium Inorganic materials 0.000 claims description 3
- 239000011734 sodium Substances 0.000 claims description 3
- HSXUNHYXJWDLDK-UHFFFAOYSA-N 2-hydroxypropane-1-sulfonic acid Chemical compound CC(O)CS(O)(=O)=O HSXUNHYXJWDLDK-UHFFFAOYSA-N 0.000 claims description 2
- WBGKAOURNYRYBT-UHFFFAOYSA-N 2-sulfopropanoic acid Chemical compound OC(=O)C(C)S(O)(=O)=O WBGKAOURNYRYBT-UHFFFAOYSA-N 0.000 claims description 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 claims description 2
- FEPBITJSIHRMRT-UHFFFAOYSA-N 4-hydroxybenzenesulfonic acid Chemical compound OC1=CC=C(S(O)(=O)=O)C=C1 FEPBITJSIHRMRT-UHFFFAOYSA-N 0.000 claims description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims description 2
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 claims description 2
- COVZYZSDYWQREU-UHFFFAOYSA-N Busulfan Chemical compound CS(=O)(=O)OCCCCOS(C)(=O)=O COVZYZSDYWQREU-UHFFFAOYSA-N 0.000 claims description 2
- FEIHNNYIQBYGDK-UHFFFAOYSA-N C(C)(=O)O.[N+](=O)([O-])C(CO)(CO)CO Chemical compound C(C)(=O)O.[N+](=O)([O-])C(CO)(CO)CO FEIHNNYIQBYGDK-UHFFFAOYSA-N 0.000 claims description 2
- RGHNJXZEOKUKBD-SQOUGZDYSA-N D-gluconic acid Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)=O RGHNJXZEOKUKBD-SQOUGZDYSA-N 0.000 claims description 2
- RGHNJXZEOKUKBD-UHFFFAOYSA-N D-gluconic acid Natural products OCC(O)C(O)C(O)C(O)C(O)=O RGHNJXZEOKUKBD-UHFFFAOYSA-N 0.000 claims description 2
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 claims description 2
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 claims description 2
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 claims description 2
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 2
- PQVSTLUFSYVLTO-UHFFFAOYSA-N ethyl n-ethoxycarbonylcarbamate Chemical compound CCOC(=O)NC(=O)OCC PQVSTLUFSYVLTO-UHFFFAOYSA-N 0.000 claims description 2
- OUDSFQBUEBFSPS-UHFFFAOYSA-N ethylenediaminetriacetic acid Chemical compound OC(=O)CNCCN(CC(O)=O)CC(O)=O OUDSFQBUEBFSPS-UHFFFAOYSA-N 0.000 claims description 2
- 235000019253 formic acid Nutrition 0.000 claims description 2
- 229950006191 gluconic acid Drugs 0.000 claims description 2
- -1 hydroxyl methanesulfonic Chemical compound 0.000 claims description 2
- NBZBKCUXIYYUSX-UHFFFAOYSA-N iminodiacetic acid Chemical compound OC(=O)CNCC(O)=O NBZBKCUXIYYUSX-UHFFFAOYSA-N 0.000 claims description 2
- 229910052744 lithium Inorganic materials 0.000 claims description 2
- GLXDVVHUTZTUQK-UHFFFAOYSA-M lithium hydroxide monohydrate Substances [Li+].O.[OH-] GLXDVVHUTZTUQK-UHFFFAOYSA-M 0.000 claims description 2
- 229940040692 lithium hydroxide monohydrate Drugs 0.000 claims description 2
- 150000007524 organic acids Chemical class 0.000 claims description 2
- 239000001103 potassium chloride Substances 0.000 claims description 2
- 235000011164 potassium chloride Nutrition 0.000 claims description 2
- DVECLMOWYVDJRM-UHFFFAOYSA-N pyridine-3-sulfonic acid Chemical compound OS(=O)(=O)C1=CC=CN=C1 DVECLMOWYVDJRM-UHFFFAOYSA-N 0.000 claims description 2
- MCJGNVYPOGVAJF-UHFFFAOYSA-N quinolin-8-ol Chemical compound C1=CN=C2C(O)=CC=CC2=C1 MCJGNVYPOGVAJF-UHFFFAOYSA-N 0.000 claims description 2
- ITXXHPLNLYEVQT-UHFFFAOYSA-N quinoline-3-sulfonic acid Chemical compound C1=CC=CC2=CC(S(=O)(=O)O)=CN=C21 ITXXHPLNLYEVQT-UHFFFAOYSA-N 0.000 claims description 2
- GJAWHXHKYYXBSV-UHFFFAOYSA-N quinolinic acid Chemical compound OC(=O)C1=CC=CN=C1C(O)=O GJAWHXHKYYXBSV-UHFFFAOYSA-N 0.000 claims description 2
- 229940095064 tartrate Drugs 0.000 claims description 2
- SYRHIZPPCHMRIT-UHFFFAOYSA-N tin(4+) Chemical compound [Sn+4] SYRHIZPPCHMRIT-UHFFFAOYSA-N 0.000 claims description 2
- 229940005605 valeric acid Drugs 0.000 claims description 2
- 238000007747 plating Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 3
- 150000003839 salts Chemical class 0.000 abstract description 3
- 239000000243 solution Substances 0.000 abstract 2
- 239000002738 chelating agent Substances 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 description 4
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910000337 indium(III) sulfate Inorganic materials 0.000 description 2
- XGCKLPDYTQRDTR-UHFFFAOYSA-H indium(iii) sulfate Chemical compound [In+3].[In+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O XGCKLPDYTQRDTR-UHFFFAOYSA-H 0.000 description 2
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 2
- 235000011006 sodium potassium tartrate Nutrition 0.000 description 2
- 229910001174 tin-lead alloy Inorganic materials 0.000 description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000003916 acid precipitation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- AUYOHNUMSAGWQZ-UHFFFAOYSA-L dihydroxy(oxo)tin Chemical compound O[Sn](O)=O AUYOHNUMSAGWQZ-UHFFFAOYSA-L 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Abstract
The invention discloses a tin-indium alloy electroplating solution which comprises an aqueous solution, wherein the aqueous solution comprises a meta-tin (IV) acid salt, a trivalent indium salt of organic carboxylic acid or sulfonic acid, a chelating agent and caustic alkali with the pH value of 8-10. The tin-indium alloy electroplating solution provided by the invention has stable performance in the processes of storage, transportation and use, and after electroplating, a spot plating film with excellent smoothness and brightness is formed, and the toughness of the plating layer is obviously improved.
Description
Technical field
The invention belongs to the electroplate liquid field, be specifically related to a kind of Sn-In alloy electroplating liquid.
Background technology
Soil and phreatic pollution have become the topic that people pay close attention in recent years, and this pollution is because of causing through acid rain wash-out lead from the tin-lead alloy that is used for useless household electrical appliance.This is because tin-lead alloy is widely used in assembling electronic element.Thereby people place hope on and develop lead-free field weld alloy or welding plating.As a kind of electro-plating method that can not cause the problems referred to above, Sn-In alloy is electroplated and is considered to likely.So far, tin/indium alloy is electroplated and is used to carry out the lower melting point plating, and in the Sn-In alloy electro-plating method of many routines, the content of indium is 40～60 Wt.%.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of Sn-In alloy electroplating liquid that is formed with the some plated film of excellent slipperiness and brightness.
For solving the problems of the technologies described above; The technical scheme that the present invention adopted is: a kind of Sn-In alloy electroplating liquid, and it comprises a kind of aqueous solution, and the said aqueous solution comprises inclined to one side tin (IV) hydrochlorate; The trivalent indium salt of the trivalent indium salt of organic carboxyl acid or sulfonic acid, sequestrant and pH value are 8～10 caustic alkali.
Said organic acid have carboxylic acid or sulfonic acid be selected from following at least a: methanesulfonic, ethane sulfonic acid, propane sulfonic acid, hydroxyl methanesulfonic, 2-hydroxyethanesulfonic acid, 2-hydroxypropanesulfonic acid, α-carboxyl ethane sulfonic acid, 1; 2-dihydroxyl ethane sulfonic acid, 1; 2-dicarboxyl ethane sulfonic acid, sulfo-succinic acid, Phenylsulfonic acid, adjacent phenol sulfonic acid, a phenol sulfonic acid, sulfocarbolic acid, formic acid, acetate, propionic acid, butyric acid, valeric acid, concentration 1 2～3 0g/L of the trivalent indium salt of the trivalent indium salt of organic carboxyl acid or sulfonic acid.
Sequestrant be selected from following at least a: lithium, sodium and the sylvite of nicotinic acid, pyridine-3-sulphonic acid, quinoline, quinolinic acid, quinoline-3-sulfonic acid, quinoline-2-sulfonic acid, hydroxyquinoline, YD 30, ethylenediamine triacetic acid, ethylenediamine-N,N'-diacetic acid(EDDA), nitrotrimethylolmethane acetate, iminodiethanoic acid Hydrocerol A, tartrate, glyconic acid, enanthic acid, oxysuccinic acid and xitix, the total concn of sequestrant is 50～350g/L.
Caustic alkali is to be selected from least a in following: Lithium Hydroxide MonoHydrate, sodium hydroxide and Pottasium Hydroxide, its total concn are 10～200g/L.
Beneficial effect of the present invention: a kind of Sn-In alloy electroplating liquid provided by the present invention, stable performance in storing transportation and use is formed with the some plated film of excellent slipperiness and brightness after the plating, and the toughness of coating improves significantly.
Embodiment
Embodiment 1
Prepare a kind of electroplate liquid (pH=9.5), it comprises the metastannic acid potassium (Sn of 27g/L
4+), the ethane sulfonic acid (In of 13g/L
3+), the nicotinic acid of 150g/L and 100g/L be as the Pottasium Hydroxide of pH regulator agent.Adopt this electroplate liquid, under the electric current of 2A, electroplated 5 minutes.Estimate the outward appearance of the electroplating film of formation with mode relatively.As relatively, prepare and a kind ofly replace ethane sulfonic acid (In with indium sulfate
3+) electroplate liquid, adopt seignette salt as sequestrant, without methylsulfonic acid as the conduction salt forming agent.Then, adopt this electroplate liquid of relatively using, with as above identical condition under carry out the Hull cell experiment, test-results shows that effect of the present invention is more even, smooth, bright.
Embodiment 2
Prepare a kind of electroplate liquid (pH=10), it comprises the sodium metastannate (Sn of 16g/L
4+), propane sulfonic acid and propionic acid and the sulfo-succinic acid (In of 30g/L
3+), the YD 30 of 340g/L and quinoline-2-sulfonic acid and 180g/L be as the sodium hydroxide of pH regulator agent.Adopt this electroplate liquid, under the electric current of 4A, electroplated 10 minutes.Estimate the outward appearance of the electroplating film of formation with mode relatively.As relatively, prepare a kind of with indium sulfate replacement propane sulfonic acid and propionic acid and sulfo-succinic acid (In
3+) electroplate liquid, adopt seignette salt as sequestrant, without methylsulfonic acid as the conduction salt forming agent.Then, adopt this electroplate liquid of relatively using, with as above identical condition under carry out the Hull cell experiment, test-results shows that effect of the present invention is more even, smooth, bright.
Claims (4)
1. Sn-In alloy electroplating liquid, it comprises a kind of aqueous solution, and the said aqueous solution comprises inclined to one side tin (IV) hydrochlorate, the trivalent indium salt of the trivalent indium salt of organic carboxyl acid or sulfonic acid, sequestrant and pH value are 8～10 caustic alkali.
2. Sn-In alloy electroplating liquid according to claim 1; It is characterized in that; Said organic acid have carboxylic acid or sulfonic acid be selected from following at least a: methanesulfonic, ethane sulfonic acid, propane sulfonic acid, hydroxyl methanesulfonic, 2-hydroxyethanesulfonic acid, 2-hydroxypropanesulfonic acid, α-carboxyl ethane sulfonic acid, 1; 2-dihydroxyl ethane sulfonic acid, 1; 2-dicarboxyl ethane sulfonic acid, sulfo-succinic acid, Phenylsulfonic acid, adjacent phenol sulfonic acid, a phenol sulfonic acid, sulfocarbolic acid, formic acid, acetate, propionic acid, butyric acid, valeric acid, the concentration 12～30g/L of the trivalent indium salt of the trivalent indium salt of organic carboxyl acid or sulfonic acid.
3. Sn-In alloy electroplating liquid according to claim 1; It is characterized in that; Sequestrant be selected from following at least a: lithium, sodium and the sylvite of nicotinic acid, pyridine-3-sulphonic acid, quinoline, quinolinic acid, quinoline-3-sulfonic acid, quinoline-2-sulfonic acid, hydroxyquinoline, YD 30, ethylenediamine triacetic acid, ethylenediamine-N,N'-diacetic acid(EDDA), nitrotrimethylolmethane acetate, iminodiethanoic acid Hydrocerol A, tartrate, glyconic acid, enanthic acid, oxysuccinic acid and xitix, the total concn of sequestrant is 50～350g/L.
4. Sn-In alloy electroplating liquid according to claim 1 is characterized in that, caustic alkali is to be selected from least a in following: Lithium Hydroxide MonoHydrate, sodium hydroxide and Pottasium Hydroxide, its total concn are 10～200g/L.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104245678A CN102424995A (en) | 2011-12-17 | 2011-12-17 | Tin-indium alloy electroplating solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104245678A CN102424995A (en) | 2011-12-17 | 2011-12-17 | Tin-indium alloy electroplating solution |
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| Publication Number | Publication Date |
|---|---|
| CN102424995A true CN102424995A (en) | 2012-04-25 |
Family
ID=45959021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011104245678A Pending CN102424995A (en) | 2011-12-17 | 2011-12-17 | Tin-indium alloy electroplating solution |
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| Country | Link |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106544665A (en) * | 2016-11-27 | 2017-03-29 | 湖南金裕化工有限公司 | Nigrescence minute surface adds lustre to anticorrodent and preparation method thereof |
| CN106676594A (en) * | 2016-06-10 | 2017-05-17 | 太原工业学院 | Low-cost cyanide-free copper-zinc-tin alloy electroplating solution and copper-zinc-tin alloy electroplating technology thereof |
| CN106756957A (en) * | 2016-11-27 | 2017-05-31 | 湖南金裕化工有限公司 | A kind of environmentally friendly nigrescence minute surface adds lustre to anticorrodent and preparation method thereof |
| CN106756958A (en) * | 2016-11-27 | 2017-05-31 | 湖南金裕化工有限公司 | A kind of environmentally friendly hair blackening liquid and preparation method thereof |
| JP2020503383A (en) * | 2016-12-23 | 2020-01-30 | エスセエ フランス | Compounds based on elements from the boron group and their use in electrolyte compositions |
| US11686007B2 (en) | 2017-12-18 | 2023-06-27 | New Mexico Tech University Research Park Corporation | Tin-indium alloy electroplating solution |
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