CN102424973A - Metallographic corrosive agent for nickel-copper alloy - Google Patents
Metallographic corrosive agent for nickel-copper alloy Download PDFInfo
- Publication number
- CN102424973A CN102424973A CN2011104414252A CN201110441425A CN102424973A CN 102424973 A CN102424973 A CN 102424973A CN 2011104414252 A CN2011104414252 A CN 2011104414252A CN 201110441425 A CN201110441425 A CN 201110441425A CN 102424973 A CN102424973 A CN 102424973A
- Authority
- CN
- China
- Prior art keywords
- nickel
- copper alloy
- etchant
- corrosive agent
- nitric acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 40
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 title claims abstract description 40
- 239000003518 caustics Substances 0.000 title abstract 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910017604 nitric acid Inorganic materials 0.000 claims abstract description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910001020 Au alloy Inorganic materials 0.000 abstract 1
- 238000002425 crystallisation Methods 0.000 abstract 1
- 230000008025 crystallization Effects 0.000 abstract 1
- 230000002349 favourable effect Effects 0.000 abstract 1
- 239000003353 gold alloy Substances 0.000 abstract 1
- PQTCMBYFWMFIGM-UHFFFAOYSA-N gold silver Chemical compound [Ag].[Au] PQTCMBYFWMFIGM-UHFFFAOYSA-N 0.000 abstract 1
- 239000000203 mixture Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 235000009161 Espostoa lanata Nutrition 0.000 description 1
- 240000001624 Espostoa lanata Species 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 208000002193 Pain Diseases 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000036407 pain Effects 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Landscapes
- ing And Chemical Polishing (AREA)
Abstract
The invention discloses a metallographic corrosive agent for nickel-copper alloy, which comprises water and nitric acid, and the volume percentage of each component is as follows: nitric acid: 65-68% of water, and the balance of water. The metallographic corrosive agent for nickel-copper alloy can make the crystalline phase in nickel-copper alloy easily distinguished, is favorable for evaluating the quality of nickel-copper alloy products, and can prevent a pollution layer from being formed on the surface of a sample and prevent the crystallization phase in silver-gold alloy from being excessively corroded.
Description
Technical field
The present invention relates to a metallurgical corrosive, particularly to a suitable nickel-copper alloy (copper content 35%) of the metallurgical etchant.
Background technology
In the nickel-copper alloy of the study, differences in material composition, processing, heat treatment tends to get the difference between the different types of microstructure, thus also different alloys, to obtain the desired properties of the alloy nickel-copper alloy to gold phase structure were observed, and the binding properties of the test data, and adjust the alloy composition, processing, or heat treatment process.Typically, nickel-copper alloy by a nickel-copper alloy microstructure corrosive nitric acid, hydrochloric acid, water, etc., with the above nickel-copper alloy nickel-copper alloy microstructure etchant often in the metallographic specimen difficult to remove the surface layer of the film-form contaminated layer, the surface was observed blurred, resulting in precipitation of dwarf illegible on microstructure observation and discernment produce an adverse effect.
Thus, the conventional nickel-copper alloy etchant in use, there is obviously still inconvenience and defects, and urgent need to be further improved.To solve the nickel-copper alloy corrosive problems related companies compete pains to seek solutions, but has long been seen reagent formulations have been developed for the completion, and the general formula has not been able to solve the above problems, so obviously related industry anxious to solve the problem.
In view of the above-mentioned conventional nickel-copper alloy etch defects, the present inventors engaged in this field for many years based on a wealth of practical experience and expertise, and with the use of theoretical and actively to research and innovation, in order to create a new type of nickel-copper alloy microstructure etchant, to improve the general etchant existing nickel-copper alloy, it is more practical.Constantly research of process, design, and after studying test and improvement repeatedly, found finally and provide the present invention with practical value.
Summary of the invention
The main object of the present invention is to overcome the existing nickel-copper alloy etchant defects, and to provide a novel nickel-copper alloy corrosion inhibitors, the technical problem to be solved is to make the microstructure of grain boundary precipitates is easy to distinguish clearly, thus more suitable for practical, and has industrial value in use.
The object of the invention and solve its technical problem and adopt following technical scheme to realize.According to the present invention provides a nickel-copper alloy microstructure etchant, including water, but also nitric acid, the volume percentage of each component is:
Nitric acid: 65-68%
All the other are water.
By means of the above technical solution, the present invention relates to a nickel-copper alloy microstructure etchant at least the following advantages:
The invention of a nickel-copper alloy microstructure corrosive, can make nickel-copper alloy crystal phase structure is easy to identify, help evaluate the quality nickel-copper alloy products, and, with this nickel-copper alloy microstructure inhibitors, block the sample contaminated layer formed on the surface, not excessive corrosion nickel-copper alloy crystalline phase.
In summary, the present invention is a nickel-copper alloy microstructure etchant, microstructure of clear and easy to distinguish the grain boundary precipitates.It has many advantages and the practical value, regardless of its use Jieyou major improvements in technology have made significant progress, and produced a useful and practical effects, and more corrosive of existing nickel-copper alloy with improving a number of effects, and thus more suitable for practical, but with a wide range of industries use value, honesty is an innovative, progressive, practical new designs.
Embodiment
To further illustrate the present invention intended for the purpose of the invention to achieve the technical means adopted and efficacy, with the following preferred embodiments according to the present invention is made of nickel-copper alloy microstructure etchant to specific embodiments, characteristics and function, detailed description If after.
Embodiment 1:
A nickel-copper alloy microstructure etchant of 65% nitric acid placed in a glass beaker.
Embodiment 2:
A nickel-copper alloy microstructure etchant, the 68% nitric acid placed in a glass beaker.
Embodiment 3:
A nickel-copper alloy microstructure etchant of 67% nitric acid was placed in a glass beaker.
In ventilated environment, carry out following steps:
A, the nickel-copper alloy polished samples obtained after nickel-copper alloy polished surface of the sample immersed in nickel-copper alloy microstructure etchant for etching for about 10 seconds;
B, after step A, remove the nickel-copper alloy repeatedly washed with water, then wipe with a cotton ball moistened with alcohol sample of the nickel-copper alloy polished surface, natural dry or dry.
This formulation of the present invention constructed as a nickel-copper alloy microstructure etchant technological innovation, for today the industry's technical staff who all have many merits, but does have a technological advance.
The above only is preferred embodiment of the present invention, is not the present invention is done any pro forma restriction; Though the present invention discloses as above with preferred embodiment; Yet be not in order to limiting the present invention, anyly be familiar with the professional and technical personnel, in not breaking away from technical scheme scope of the present invention; When the technology contents of above-mentioned announcement capable of using is made a little change or is modified to the equivalent embodiment of equivalent variations; In every case be the content that does not break away from technical scheme of the present invention, to any simple modification, equivalent variations and modification that above embodiment did, all still belong in the scope of technical scheme of the present invention according to technical spirit of the present invention.
Claims (1)
1 A nickel-copper alloy microstructure etchant, including water, characterized in that it further comprises nitric acid, the volume percentage of each component is:
Nitric acid: 65-68%
All the other are water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104414252A CN102424973A (en) | 2011-12-26 | 2011-12-26 | Metallographic corrosive agent for nickel-copper alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104414252A CN102424973A (en) | 2011-12-26 | 2011-12-26 | Metallographic corrosive agent for nickel-copper alloy |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102424973A true CN102424973A (en) | 2012-04-25 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011104414252A Pending CN102424973A (en) | 2011-12-26 | 2011-12-26 | Metallographic corrosive agent for nickel-copper alloy |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102424973A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103196733A (en) * | 2013-04-01 | 2013-07-10 | 东方电气集团东方汽轮机有限公司 | Etchant for displaying metallographic structure of nickel-based high temperature alloy and method |
| CN111793797A (en) * | 2020-06-30 | 2020-10-20 | 首钢智新迁安电磁材料有限公司 | High-silicon steel metallographic corrosive liquid and application thereof |
| CN112857932A (en) * | 2021-01-12 | 2021-05-28 | 昆明理工大学 | Preparation method of metallographic sample of silver-gallium diffusion alloy |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1058383A (en) * | 1991-04-26 | 1992-02-05 | 黄永忠 | Utilize the pharmaceutical industry waste manganese slag to produce the method for activated manganese dioxide |
| CN101597760A (en) * | 2009-06-26 | 2009-12-09 | 上海工程技术大学 | A kind of corrosive agent for brazing material with nickel base as brazing filler metal |
| WO2010000424A2 (en) * | 2008-07-03 | 2010-01-07 | Bayer Materialscience Ag | A highly efficient gas phase method for modification and functionalization of carbon nanofibres with nitric acid vapour |
| CN102121106A (en) * | 2010-11-26 | 2011-07-13 | 亚洲硅业（青海）有限公司 | Polycrystalline silicon carbon head material separation corrosion solution and separation method |
| CN102168230A (en) * | 2011-04-14 | 2011-08-31 | 北京科技大学 | 304 substituting nickel-saving austenitic stainless steel and preparation method thereof |
-
2011
- 2011-12-26 CN CN2011104414252A patent/CN102424973A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1058383A (en) * | 1991-04-26 | 1992-02-05 | 黄永忠 | Utilize the pharmaceutical industry waste manganese slag to produce the method for activated manganese dioxide |
| WO2010000424A2 (en) * | 2008-07-03 | 2010-01-07 | Bayer Materialscience Ag | A highly efficient gas phase method for modification and functionalization of carbon nanofibres with nitric acid vapour |
| CN101597760A (en) * | 2009-06-26 | 2009-12-09 | 上海工程技术大学 | A kind of corrosive agent for brazing material with nickel base as brazing filler metal |
| CN102121106A (en) * | 2010-11-26 | 2011-07-13 | 亚洲硅业（青海）有限公司 | Polycrystalline silicon carbon head material separation corrosion solution and separation method |
| CN102168230A (en) * | 2011-04-14 | 2011-08-31 | 北京科技大学 | 304 substituting nickel-saving austenitic stainless steel and preparation method thereof |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103196733A (en) * | 2013-04-01 | 2013-07-10 | 东方电气集团东方汽轮机有限公司 | Etchant for displaying metallographic structure of nickel-based high temperature alloy and method |
| CN103196733B (en) * | 2013-04-01 | 2015-03-11 | 东方电气集团东方汽轮机有限公司 | Etchant for displaying metallographic structure of nickel-based high temperature alloy and method |
| CN111793797A (en) * | 2020-06-30 | 2020-10-20 | 首钢智新迁安电磁材料有限公司 | High-silicon steel metallographic corrosive liquid and application thereof |
| CN111793797B (en) * | 2020-06-30 | 2022-11-22 | 首钢智新迁安电磁材料有限公司 | High-silicon steel metallographic corrosive liquid and application thereof |
| CN112857932A (en) * | 2021-01-12 | 2021-05-28 | 昆明理工大学 | Preparation method of metallographic sample of silver-gallium diffusion alloy |
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Application publication date: 20120425 |