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CN102417794A - Circuit connecting material, connecting method, connecting structure, manufacturing method and use thereof - Google Patents

Circuit connecting material, connecting method, connecting structure, manufacturing method and use thereof Download PDF

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Publication number
CN102417794A
CN102417794A CN2011102511296A CN201110251129A CN102417794A CN 102417794 A CN102417794 A CN 102417794A CN 2011102511296 A CN2011102511296 A CN 2011102511296A CN 201110251129 A CN201110251129 A CN 201110251129A CN 102417794 A CN102417794 A CN 102417794A
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Prior art keywords
circuit
polymer
electrode
connection material
circuit electrode
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CN2011102511296A
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CN102417794B (en
Inventor
立泽贵
小林宏治
久米雅英
关耕太郎
相泽阳介
伊藤彰浩
藤绳贡
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Resonac Corp
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Hitachi Chemical Co Ltd
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    • H—ELECTRICITY
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    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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    • C09J9/02—Electrically-conducting adhesives
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Abstract

本发明涉及一种电路连接材料、连接方法、连接结构体及制造方法和用途，该电路连接材料用于介于在第一基板主面上形成了第一电路电极的第一电路部件和在第二基板主面上形成了第二电路电极的第二电路部件之间，在第一电路电极和第二电路电极对向配置的状态下通过加热和加压对所述第一电路电极和所述第二电路电极进行电连接，其中，加压是在1.5MPa以下进行，该电路连接材料含有赋予膜性能的聚合物、自由基聚合性物质、自由基聚合引发剂和导电粒子，所述赋予膜性能的聚合物包含玻璃化温度不到70℃的聚合物，并且其配合量以赋予膜性能的聚合物和自由基聚合性物质的总量为基准，为30～70质量％。

The present invention relates to a circuit connection material, a connection method, a connection structure, a manufacturing method and an application thereof. Between the second circuit components with the second circuit electrodes formed on the main surfaces of the two substrates, the first circuit electrodes and the second circuit electrodes are heated and pressed in a state where the first circuit electrodes and the second circuit electrodes are facing each other. The second circuit electrode is electrically connected, wherein the pressurization is performed below 1.5MPa, and the circuit connection material contains a polymer that imparts film properties, a radical polymerizable substance, a radical polymerization initiator, and conductive particles. The performance polymer includes a polymer having a glass transition temperature of less than 70° C., and its compounding amount is 30 to 70% by mass based on the total amount of the film performance-imparting polymer and the radically polymerizable substance.

Description

Circuit connection material, method of attachment, syndeton body and method of manufacture and purposes
Technical field
The present invention relates to a kind of circuit connection material, use the method for manufacture of circuit member connecting method, circuit connection structure and the circuit connection structure of this material, and the purposes that connects material.
Background technology
All the time, as to relatively to circuit heat, pressurize, and make the circuit connection material that is electrically connected between the electrode of compression aspect, known have a bonding film of anisotropic conductive.It is for example, known that to have at epoxy be the bonding film of anisotropic conductive that is dispersed with conducting particles in caking agent or the acrylic acid series caking agent.The bonding film of this anisotropic conductive be widely used in main lift-launch driving liquid crystal device (below, be called " LCD ".) being electrically connected of semi-conductive TCP (Tape Carrier Package) or COF (Chip On Flex) and LCD panel, or being electrically connected of TCP or COF and PC board.
In addition, recently, when directly semi-conductor being installed on LCD panel or the PC board, also adopt lead-in wire bonding method in the past, help the flip-chip installation that slimming is connected with narrow distance but adopt through facing down.In flip-chip is installed; Can use the bonding film of anisotropic conductive as circuit connection material (for example, with reference to japanese kokai publication sho 59-120436 communique, japanese kokai publication sho 60-191228 communique, japanese kokai publication hei 01-251787 communique and japanese kokai publication hei 07-090237 communique).
Summary of the invention
In the connection of the circuit block that uses the bonding film of anisotropic conductive, through heating and pressurization conducting particles is clamped between the electrode of subtend configuration, guaranteed interelectrode conducting.In the connection operation of circuit block, need be enough to make caking agent composition mobile heat and the pressure that is enough to make conducting particles and electrode driving fit.For the circuit connection material of heat reactive resin system,, therefore need higher connection temperature owing to be heated to the temperature that solidifying agent fully reacts.In addition, in the connection of circuit block, need the caking agent composition to solidify necessary thermal stresses, and the pressure stresses of the particle of between electrode, crushing.Therefore, the connection of circuit connection material is carried out under the pressure more than the 3MPa usually.These stress damage being produced by sticky object easily, and become the reason that shows bad and reliability decrease.Particularly, with the PET film as by in the touch panel purposes of sticky object etc., require to reduce pressure stresses.
Because the appearance of the circuit connection material of radically curing system, thus can be at low temperature, connect in the short period of time.Yet for the circuit connection material of in the past radically curing system, when connecting under the low pressure condition below 1.5MPa, the illiquidity of caking agent composition is easy to generate poor flow and impression is bad.
Therefore; The present invention In view of the foregoing; Even purpose is to provide under the low in the past situation of a kind of pressure ratio when circuit connects; Also can carry out the method for manufacture of circuit connection material, the circuit member connecting method of using this circuit connection material, circuit connection structure and the circuit connection structure of the formation of the impression connection all good with being connected resistance, and the purposes that connects material.
In the circuit that uses circuit connection material connects, with the circuit electrode clamping circuit connection material that connects, and from the crowded pyritous crimping rod that is heated to of bonded material one thruster.Circuit connection material through the heating of crimping rod demonstrate flowability, and unwanted caking agent composition is extruded to outside the connection section between junction circuit.Therefore, if the space between counter electrode is also littler than the diameter of conducting particles, then conducting particles is crushed by counter electrode, has guaranteed interelectrode conducting.Therefore, when carrying out the circuit connection with lower pressure condition, need to select to demonstrate the circuit connection material of enough high workabilities.
The inventor is conceived to the polymkeric substance of giving film properties as radical polymerization syzygy circuit connection material constituent; Carried out positive research repeatedly; Even the pressure the when result has found that circuit connects is low, also can carry out the circuit connection material of the formation of the impression connection all good with being connected resistance.
That is to say; The present invention provides a kind of circuit connection material; It is used between first circuit block that has formed first circuit electrode on the first substrate interarea and is forming on the second substrate interarea between the second circuit parts of second circuit electrode; Through heating and pressurization said first circuit electrode and said second circuit electrode are electrically connected under the state of configuration at first circuit electrode and second circuit electrode pair; Wherein, pressurization is below 1.5MPa, to carry out, and this circuit connection material contains the polymkeric substance of giving film properties, free-radical polymerised material, radical polymerization initiator and conducting particles; The said polymkeric substance of giving film properties comprises second-order transition temperature less than 70 ℃ polymkeric substance; And second-order transition temperature is less than the use level of 70 ℃ polymkeric substance, is benchmark with the polymkeric substance of giving film properties and the total amount of free-radical polymerised material, is 30～70 quality %.
, giving the polymkeric substance of film properties here, is benchmark with its total amount, preferably comprises the above second-order transition temperature of 50 quality % and be more than 50 ℃ and less than 70 ℃ polymkeric substance.Thus, can carry out above-mentioned connection more well.
Further, free-radical polymerised material comprise 2 officials can below free-radical polymerised material, and this 2 official can below the use level of free-radical polymerised material, be benchmark with the total amount of free-radical polymerised material, be preferably more than the 50 quality %.Thus, can further improve the flowability that foregoing circuit connects material.
In addition; The present invention provides a kind of circuit member connecting method; This method is for first circuit block that on the first substrate interarea, has formed first circuit electrode, on the second substrate interarea, has formed the second circuit parts of second circuit electrode, and the foregoing circuit that is configured between first circuit block and the second circuit parts connects material; Under the state of configuration, heat and pressurize at first circuit electrode and second circuit electrode pair; Thereby first circuit electrode is connected with the second circuit electrode electricity, and wherein, pressurization is below 1.5MPa, to carry out.Connection structure connecting by this method, its impression is with to be connected resistance all good.
In addition; The present invention provides a kind of method of manufacture of circuit connection structure; It comprises foregoing circuit is connected material configuration in first circuit block that has formed first circuit electrode on the first substrate interarea and the operation between the second circuit parts that formed the second circuit electrode on the second substrate interarea; And under the state of configuration, heat and pressurize at first circuit electrode and second circuit electrode pair; Thereby the operation that first circuit electrode is connected with the second circuit electrode electricity, wherein, pressurization is below 1.5MPa, to carry out.According to this method of manufacture, can obtain the formation circuit connection structure all good of impression with being connected resistance.
In addition, the present invention provides a kind of circuit connection structure of making through above-mentioned method of manufacture.Sort circuit syndeton body, the formation of its impression is with to be connected resistance all good.
In addition; The present invention provides a kind of material that connects to be used for the purposes that circuit connects; This connection material contains the polymkeric substance of giving film properties, free-radical polymerised material, radical polymerization initiator and conducting particles; The said polymkeric substance of giving film properties comprises second-order transition temperature less than 70 ℃ polymkeric substance; And this second-order transition temperature is less than the use level of 70 ℃ polymkeric substance; With the polymkeric substance of giving film properties and the total amount of free-radical polymerised material is benchmark; Be 30～70 quality %, and this connection material is used between first circuit block that has formed first circuit electrode on the first substrate interarea and forming on the second substrate interarea between the second circuit parts of second circuit electrode, under the state of configuration, said first circuit electrode and said second circuit electrode are electrically connected through heating and the pressurization below 1.5MPa, carried out at first circuit electrode and second circuit electrode pair.Connect if above-mentioned connection material is used for sort circuit,, also can carry out the formation connection all good of impression with being connected resistance even the pressure when then circuit connects is low.
, giving the polymkeric substance of film properties here, is benchmark with its total amount, preferably comprises the above second-order transition temperature of 50 quality % and be more than 50 ℃ and less than 70 ℃ polymkeric substance.Thus, can use above-mentioned connection material more well.
Further; In the time will connecting material and be used for circuit and connect, free-radical polymerised material comprise 2 officials can below free-radical polymerised material, and this 2 official can below the use level of free-radical polymerised material; Total amount with free-radical polymerised material is a benchmark, is preferably more than the 50 quality %.Thus, state in the use when connecting material, can improve the flowability that connects material.
According to the present invention; Even can provide under the low in the past situation of a kind of pressure ratio when circuit connects; Also can carry out the method for manufacture of circuit connection material, the circuit member connecting method of using this circuit connection material, circuit connection structure and the circuit connection structure of the formation of the impression connection all good with being connected resistance, and the purposes that connects material.
Description of drawings
[Fig. 1] is the sectional view of an embodiment of the membranaceous circuit connection material of expression.
[Fig. 2] is a preferred implementation of connection structure connecting is carried out in expression with circuit connection material of the present invention pattern sectional view.
[Fig. 3] is the process chart of representing an embodiment of circuit member connecting method of the present invention through general profile chart.
[Fig. 4] is the impression photo of observed circuit connection structure in an embodiment.
[Fig. 5] is the plat that the preceding state of membranaceous circuit connection material junction circuit parts is used in expression.
Nomenclature
1... the syndeton of circuit block, 5,11... caking agent composition, the 7... conducting particles, 8... supports base material; 10... circuit connection material, 20... first circuit block, 21... first substrate, the 21a... first substrate interarea; 22... first splicing ear, 30... second circuit parts, 31... second substrate, the 31a... second substrate interarea; 32... second splicing ear, the membranaceous circuit connection material of 40..., 100... adhesive sheet.
Embodiment
Below, as required, Yi Bian with reference to accompanying drawing, Yi Bian preferred implementation of the present invention is elaborated.But the present invention is not limited to following embodiment.In addition, in the accompanying drawings, give same-sign, and omit the multiple explanation for identical element.In addition, wait the position relation up and down, short of special instruction just is based on position shown in the drawings relation.Further, the dimension scale of accompanying drawing is not limited to illustrated ratio.In addition, " (methyl) propenoate " expression " propenoate " and " methacrylic ester " corresponding in this specification sheets with it.Equally, " (methyl) acryloxy " expression " acryloxy " and " methacryloxy " corresponding with it.
(circuit connection material)
Circuit connection material of the present invention contains caking agent composition and conducting particles.In the present invention, the caking agent composition is meant in the constituent material of circuit connection material, comprises all material except that conducting particles.For circuit connection material of the present invention,, comprise the polymkeric substance of giving film properties, free-radical polymerised material and radical polymerization initiator as the caking agent composition.In addition, the caking agent composition can comprise stoppers such as quinhydrones, MEHQ hydroquinone monomethyl ether class as required.
The polymkeric substance of giving film properties comprise second-order transition temperature (below, abbreviate " Tg " as.) less than 70 ℃ polymkeric substance.As this polymer, can enumerate for example polyimide resin, polyamide, (methyl) acrylic resin, polyester polyurethane resin (Port リ worker ス テ Le ゥ レ タ Application resin), polyurethane resin, phenoxy resin, polyvinyl butyral resin.Wherein, as preference, can enumerate polyester polyurethane resin, urethane resin, phenoxy resin.They can use a kind separately, also can use mixing more than 2 kinds.
For the Tg of polymkeric substance, can synthesize the material of purpose scope through the mol ratio of adjustment monomeric structure of formation or comonomer.In order to improve Tg, can the monomer with upright and outspoken skeletons such as phenyl ring or naphthalene nucleus be imported as monomer component.In order to reduce Tg, can the monomer of fatty family be imported as monomer component.
Polyester polyurethane resin for example, can obtain through the reaction of the pure and mild vulcabond of polyester polyols.As vulcabond; Can suitably use 2; 4-tolylene diisocyanate (TDI), 4,4 '-diphenylmethanediisocyanate (MDI), 1,6-hexamethylene diisocyanate (HDI), isophorone diisocyanate aromatic series, alicyclic or aliphatic vulcabond such as (IPDI).
Polyester polyol for example, can obtain through the reaction of dicarboxylicacid and divalent alcohol.As dicarboxylicacid, be preferably aromatic series or aliphatic dicarboxylic acids such as terephthalic acid, m-phthalic acid, hexanodioic acid, sebacic acid.As divalent alcohol, be preferably terepthaloyl moietie, Ucar 35,1, glycolss such as 4-butyleneglycol, pinakon, NSC 6366, Diethylene Glycol, triethylene glycol.
In order to improve bonding strength, polyester polyurethane resin can have anionic property.Polyester polyurethane resin with anionic property can be through when the pure and mild di-isocyanate reaction of polyester polyols, and the divalent alcohol that has sulfonic group or carboxyl on the side chain or two amines are carried out copolymerization and obtain.
Polyester polyurethane resin preferably has the aromatic group that contains phenyl ring etc. or contains the cyclic aliphatic group of cyclohexane ring etc.
Polyester polyurethane resin can contain and has free-radical polymerised unsaturated double-bond and/or epoxy group(ing).Thus, when circuit connection material is solidified and the epoxy resin in the adhesive composite or free-radical polymerised compound produce reaction, improve the Young's modulus and the thermotolerance of circuit connection material cured article.
Polyester polyurethane resin can use mixing more than 2 kinds.For example, can the material of aromatic polyester polyol and aliphatic diisocyanate reaction gained and the combinations of substances of aliphatic polyester polyols and aromatic diisocyanate reaction gained be used.
The weight-average molecular weight of giving the polymkeric substance of film properties is preferably 5000～100000.If weight-average molecular weight is less than 5000; Then have the tendency that the film-forming properties that is shaped to when membranaceous descends; If weight-average molecular weight surpasses 100000, the solvability or the consistency that then have solvent descend, and are difficult to modulate the tendency that is used to be shaped to membranaceous coating fluid.
In this embodiment, weight-average molecular weight is according to the condition shown in the below table 1, the value of using the polystyrene standard calibration curve to be measured by gel permeation chromatography (GPC).
[table 1]
Figure BSA00000564278800061
Tg is less than the use level of 70 ℃ polymkeric substance, is benchmark with the polymkeric substance of giving film properties and the total amount of free-radical polymerised material, is 30～70 quality %, is preferably 50～70 quality %, and more preferably 40～70 quality % further are preferably 55～65 quality %.
It is more than 50 ℃ and less than 70 ℃ polymkeric substance that the above-mentioned polymkeric substance of giving film properties preferably comprises Tg.This Tg is more than 50 ℃ and less than 70 ℃ polymkeric substance, is benchmark with the total amount of the polymkeric substance of giving film properties, preferably comprises more than the 50 quality %, more preferably more than the 60 quality %, further preferably comprises more than the 75 quality %.In addition, give the polymkeric substance of film properties, mixed with polymers more than 2 kinds that can Tg is different is used.For example, can be to use more than 10 ℃ and less than 30 ℃ mixed with polymers more than 50 ℃ and less than 70 ℃ polymkeric substance and Tg with Tg.
The circuit connection material of this embodiment, in the scope of the effect that does not break away from the present invention and obtained, can and using Tg is that polymkeric substance more than 70 ℃ is as the polymkeric substance of giving film properties.At this moment, its use level is a benchmark with the polymkeric substance of giving film properties and the total amount of free-radical polymerised material, is preferably below the 15 quality %.
Free-radical polymerised material is the material with polymeric functional group through radical, for example can enumerate (methyl) propenoate, maleimide compound etc.
As free-radical polymerised material, preferably comprise the free-radical polymerised material that (that is to say simple function or 2 officials ability) below the 2 officials ability.As its concrete example; As (methyl) propenoate; Can enumerate for example carbamate (methyl) propenoate, (methyl) methyl acrylate, (methyl) ethyl propenoate, (methyl) isopropyl acrylate, (methyl) NSC 20949, ethylene glycol bisthioglycolate (methyl) propenoate, Diethylene Glycol two (methyl) propenoate, triethylene glycol two (methyl) propenoate, 2-hydroxyl-1; 3-two (methyl) acryloxy propane, 2; 2-two [4-((methyl) acryloyl-oxy ylmethoxy) phenyl] propane, 2,2-two [4-((methyl) acryloxy polyethoxye) phenyl] propane, dicyclopentenyl (methyl) propenoate, three ring decyl (methyl) propenoate, two ((methyl) acryloxy ethyl) isocyanuric acid ester.
As maleimide compound, be preferably the material that in molecule, contains at least 2 above dimaleoyl iminos, for example can enumerate 1-methyl-2; 4-bismaleimides benzene, N, N '-meta-phenylene bismaleimide, N, N '-TOPOT 2,2 maleimide, N, a N '-methylene benzene bismaleimides, N; N '-4,4-biphenylene bismaleimides, N, N '-4,4-(3; 3 '-dimethyl--biphenylene) bismaleimides, N, N '-4,4-(3,3 '-dimethyl diphenylmethane) bismaleimides, N; N '-4,4-(3,3 '-diethylammonium ditan) bismaleimides, N, N '-4; 4-ditan bismaleimides, N, N '-4,4-diphenyl propane bismaleimides, N, N '-4; 4-diphenyl ether bismaleimides, N, N '-3,3 '-sulfobenzide bismaleimides, 2; 2-two [4-(4-maleimide phenoxy) phenyl] propane, 2,2-two [3-s-butyl-4,8-(4-maleimide phenoxy) phenyl] propane, 1; 1-two [4-(4-maleimide phenoxy) phenyl] decane, 4,4 '-cyclohexylene-two [1-(4-maleimide phenoxy)-2-cyclohexyl] benzene, 2,2-two [4-(4-maleimide phenoxy) phenyl] HFC-236fa.They also can use with allylic cpd combinations such as chavicol, allyl phenyl ether, phenylformic acid allyl esters.
In the free-radical polymerised material below 2 officials ability, consider preferred carbamate (methyl) propenoate from the viewpoint of cementability.In addition, in order to improve thermotolerance, preferred and be used in and after the second-order transition temperature (Tg) of the organo-peroxide (in the radical polymerization initiator a kind) the stated polymkeric substance after crosslinked be separately the free-radical polymerised material more than 100 ℃.As this free-radical polymerised material, can suitably use have dicyclopentenyl, the free-radical polymerised material of three ring decyls (ト リ シ Network ロ デ power ニ Le) and/or triazine rings.Particularly can use free-radical polymerised material suitably with three ring decyls, triazine ring.
As free-radical polymerised material, in the scope of not damaging effect of the present invention, can also contain 3 officials can above free-radical polymerised material.As this free-radical polymerised material, can enumerate for example trimethylolpropane tris (methyl) propenoate, tetramethylol methane four (methyl) propenoate, 6-caprolactone modification three ((methyl) acryloxy ethyl) isocyanuric acid ester, three ((methyl) acryloxy ethyl) isocyanuric acid ester.
In addition, free-radical polymerised material also can have phosphate ester structure.Specifically, can enumerate 2-methacryloxyethyl acid phosphoric acid ester, 2-acryloxy ethyl acid phosphoric acid ester etc.In addition, have the free-radical polymerised material of phosphate ester structure, can be used as the reactant of phosphoric anhydride and 2-hydroxyl (methyl) propenoate and obtain.
Further; In the solids component total amount with the caking agent composition is benchmark (100 quality %), when using 0.1～10 quality % to have the free-radical polymerised material of phosphate ester structure, has improved in the lip-deep bonding strength of inorganicss such as metal; Therefore preferred, more preferably use 0.5～5 quality %.
Above free-radical polymerised material can use a kind separately, also can combination more than 2 kinds be used.
As free-radical polymerised material; Before connecting material at curing circuit; The viewpoint that is easy to carry out the working fastening of circuit block is considered; Preferably contain the free-radical polymerised material that at least a kind of viscosity under 25 ℃ is 100000～1000000mPas, more preferably contain the have 100000～500000mPas viscosity free-radical polymerised material of (25 ℃).The viscosity of free-radical polymerised material can use commercially available E type viscometer to measure.
When the circuit connection material of this embodiment comprises the free-radical polymerised material below the 2 officials ability; Total amount with free-radical polymerised material is a benchmark; Preferably contain 50～100 quality %, more preferably contain 65～100 quality %, further preferably contain 80～100 quality %.Thus, in the crimping when circuit connects, the raising of resin flow property.
As radical polymerization initiator (free free-radical generating agent), can enumerate peroxide compound, azo based compound etc. decompose and produce free radical through heating or light material.Radical polymerization initiator connects according to purpose suitably to be selected temperature, tie-time, working life etc.; But consider from the viewpoint of hyperergy and working life; The temperature of preferred 10 hours transformation period is more than 40 ℃, and the temperature of 1 minute transformation period is the organo-peroxide below 180 ℃.
The use level of radical polymerization initiator is a benchmark with the solids component total amount of caking agent composition, is preferably about 0.05～10 quality %, more preferably 0.1～5 quality %.
As radical polymerization initiator, specifically, can enumerate diacyl peroxide class, peroxy dicarbonates, peroxyesters, ketal peroxide class, dialkyl peroxide class, hydroperoxide type etc.Wherein, consider preferred peroxyesters, dialkyl peroxide class, hydroperoxide type from the circuit electrode corrosive viewpoint that suppresses circuit block.In addition, consider from improving reactive viewpoint, more preferably peroxyesters.
As the diacyl peroxide class; Can enumerate for example isobutyl peroxide, 2; 4-dichloro-benzoyl peroxide, 3; 5,5-trimethyl acetyl base superoxide, sim peroxides, lauroyl superoxide, stearyl-superoxide, succinyl-superoxide (ス Network シ ニ ッ Network パ one ォ キ サ ィ De), benzoyl-peroxo-toluene, Lucidol.
As peroxy dicarbonates, can enumerate for example di peroxy dicarbonate, diisopropyl peroxydicarbonate, two (4-tert-butylcyclohexyl) peroxy dicarbonate, two-2-oxyethyl group methoxy base peroxy dicarbonate, two (peroxo-of 2-ethylhexyl), two carbonic ethers, dimethoxy butyl peroxyization two carbonic ethers, two (3-methyl-3-methoxyl group butyl peroxyization) two carbonic ethers.
As peroxyesters; Can enumerate for example cumyl new decanoate ester peroxide, 1; 1,3,3-tetramethyl butyl new decanoate ester peroxide, 1-cyclohexyl-1-methylethyl new decanoate ester peroxide, uncle's hexyl new decanoate ester peroxide, t-butylperoxy pivarate, 1; 1; 3,3-tetramethyl butyl peroxo--2-ethylhexanoate, 2,5-dimethyl--2; 5-two (peroxo-of 2-ethyl hexanoyl base) hexane, 1-cyclohexyl-1-methylethyl peroxo--2-ethylhexanoate, uncle's hexyl peroxo--2-ethylhexanoate, tert-butyl hydroperoxide-2-ethylhexanoate, tert-butyl hydroperoxide isobutyrate, 1; 1-two (tert-butyl hydroperoxide) hexanaphthene, uncle's hexyl peroxo-sec.-propyl monocarbonate, tert-butyl hydroperoxide-3,5,5 Trimethylhexanoic acid ester, tert-butyl hydroperoxide laurate, 2; 5-dimethyl--2,5-two (peroxo-of toluoyl base) hexane, tert-butyl hydroperoxide sec.-propyl monocarbonate, tert-butyl hydroperoxide-2-ethylhexyl monocarbonate, uncle's hexyl peroxide benzoate, tert-butyl hydroperoxide acetic ester.
As the ketal peroxide class, for example can enumerate 1,1-two (peroxo-of uncle's hexyl)-3; 3,5-trimethyl-cyclohexane, 1,1-two (peroxo-of uncle's hexyl) hexanaphthene, 1; 1-two (tert-butyl hydroperoxide)-3,3,5-trimethyl-cyclohexane, 1; 1-(tert-butyl hydroperoxide) cyclododecane, 2,2-two (tert-butyl hydroperoxide) decane.
As the dialkyl peroxide class, can enumerate for example α, α '-two (tert-butyl hydroperoxide) diisopropyl benzene, dicumyl peroxide, 2,5-dimethyl--2,5-two (tert-butyl hydroperoxide) hexane, tertiary butyl cumyl peroxide.
As hydroperoxide, can enumerate for example diisopropyl benzene hydroperoxide, cumene hydroperoxide.
Above radical polymerization initiator can use a kind separately, perhaps can use mixing more than 2 kinds.In addition, radical polymerization initiator can also mix use with decomposition accelerating agent, suppressor factor etc.
The circuit connection material of this embodiment contains conducting particles.As conducting particles, can enumerate metallicss such as Au, Ag, Ni, Cu, scolding tin or carbon etc.In addition, can also be to be nuclear with dielectric glass, pottery, plastics etc., and on this nuclear the material of lining above-mentioned metal, metallics or carbon.When conducting particles is to be nuclear with plastics; And on this nuclear during the material of lining above-mentioned metal, metallics or carbon, perhaps when it is hot molten metal particle such as scolding tin, owing to it has deformability through heating and pressurizing; Therefore can, circuit absorb the thickness deviation of electrode when connecting; Or the contact area of increase and electrode, thereby improved safety, therefore preferred.
In addition; The surface of these conducting particless is further by fine particles coated such as macromolecule resins; In the time of can being suppressed at the use level that increases conducting particles, the short circuit because of particle contacts with each other and causes improves the insulativity between telegraph circuit; Therefore can suitably use separately, or mix use with conducting particles.
For the median size of this conducting particles, consider from viewpoint dispersed, electroconductibility, be preferably 1～18 μ m.When containing this conducting particles, be more suitable for the circuit connection material of this embodiment is used for being connected to each other of circuit block.
Use the circuit connection material shown in above, can be with being electrically connected at first circuit block that has formed first circuit electrode on the first substrate interarea and the second circuit parts that on the second substrate interarea, formed the second circuit electrode.More particularly, under the state of configuration, the circuit connection material that makes this embodiment is between between them at above-mentioned two electrode pairs, and heats and pressurize, and above-mentioned two circuit electrodes are electrically connected to each other.Being pressurised into below the 1.5MPa at this moment.According to the circuit connection material of this embodiment, even be below the 1.5MPa when low in this wise at the pressure in when pressurization, the impression in the syndeton and to connect resistance also all good.
In addition, the circuit connection material of this embodiment as connecting material, is suitable for circuit and connects.That is to say; This connection material is suitable for the purposes that circuit connects; This connection material contains the polymkeric substance of giving film properties, free-radical polymerised material, radical polymerization initiator and conducting particles; The said polymkeric substance of giving film properties comprises second-order transition temperature less than 70 ℃ polymkeric substance; And this second-order transition temperature is less than the use level of 70 ℃ polymkeric substance; With the polymkeric substance of giving film properties and the total amount of free-radical polymerised material is benchmark; Be 30～70 quality %, and this connection material is used between first circuit block that has formed first circuit electrode on the first substrate interarea and forming on the second substrate interarea between the second circuit parts of second circuit electrode, under the state of configuration, said first circuit electrode and said second circuit electrode are electrically connected through heating and the pressurization below 1.5MPa, carried out at first circuit electrode and second circuit electrode pair.
In addition, circuit connection material of the present invention can form membranaceous.Fig. 1 is the sectional view that expression has a circuit connection material and an embodiment of the adhesive sheet of supporting base material.Adhesive sheet 100 shown in Figure 1 has to be supported base material 8 and strippingly is stacked in the membranaceous circuit connection material of supporting on the base material 8 10.Circuit connection material 10 comprises the caking agent composition 5 of insulativity and is dispersed in the conducting particles 7 in the caking agent composition 5.
As long as it is membranaceous to support that base material 8 can remain circuit connection material 10, then its shape or material all are arbitrarily.Specifically, can use fluororesin film, polyethylene terephthalate (PET), biaxial-stretched polypropylene films (OPP) or non-woven fabrics etc. as supporting base material.
(syndeton of circuit block)
Fig. 2 is the general profile chart of an embodiment of the syndeton (circuit connection structure) of expression circuit block of the present invention.The syndeton of circuit block shown in Figure 2 (circuit connection structure) 1 has first circuit block 20 and second circuit parts 30 of mutual subtend, and between first circuit block 20 and second circuit parts 30, is provided with the circuit connection material 10 that connects them.
First circuit block 20 has first substrate 21 and formed first splicing ear 22 on the interarea 21a of first substrate 21.Second circuit parts 30 have second substrate 31 and formed second splicing ear 32 on the interarea 31a of second substrate 31.On the interarea 21a of first substrate 21 and/or on the interarea 31a of second substrate 31, can according to circumstances form insulation layer (not shown).In other words, formed as required insulation layer forms between at least one in first circuit block 20 and second circuit parts 30 and the circuit connection material 10.
As first and second substrates 21,31; Can enumerate by inorganicss such as semi-conductor, glass, potteries; Flexible PC board such as TCP, COF is organism such as polyterephthalate, polyethersulfone, epoxy resin, vinyl resin such as the polyimide resin, polycarbonate, polyethylene terephthalate of representative, and these inorganicss and the formed substrate of organic matrix material.Consider that from the viewpoint of the bonding strength of further raising and circuit connection material 10 at least one in first and second substrates is preferably by the formed substrate of the material that comprises at least a resin that is selected from polyterephthalate, polyethersulfone, epoxy resin, vinyl resin, polyimide resin and glass.
In addition, coating or when being stained with insulation layer, insulation layer is preferably the layer that comprises at least a resin that is selected from polyorganosiloxane resin, vinyl resin and polyimide resin on circuit block and face that circuit connection material 10 contacts.Thus, compare with the situation that does not form above-mentioned insulation layer, first substrate 21 and/or second substrate 31 further improve with the bonding strength of circuit connection material 10.
In first splicing ear 22 and second splicing ear 32 at least one preferably comprises the metal that is selected from gold and silver, tin, platinum family by its surface and at least a material in the tin indium oxide (ITO) forms.Thus, can on same circuit block 20 or 30, keep insulativity each other by adjacent splicing ear 22 or 32, and further reduce the splicing ear 22 of subtend and 32 resistance value.
As the concrete example of first and second circuit blocks 20,30, can enumerate glass substrate, plastic base, PC board, ceramic wiring board, flexibility printed circuit board, semiconductor silicon chips of having formed splicing ear with ITO etc. of can be used for by liquid-crystal display etc.Plastic base among these is representative with for example polyethylene terephthalate (PET), polycarbonate (PC), PEN (PEN), can be used for touch panel, Electronic Paper etc., be effective therefore particularly for the connection under the low pressure condition because such plastic base is the lower material of physical strength.They can make up use as required.
As the combination of the effective circuit parts in this embodiment, for example can enumerate:
Being connected of flexible PC board such as TCP, COF and glass substrate,
Being connected of flexible PC board such as TCP, COF and plastic base,
Being connected of flexible PC board such as TCP, COF and PC board,
Being connected of flexible PC board such as TCP, COF and ceramic wiring board,
Circuit connection material 10 is formed by the cured article of the circuit connection material of above-mentioned the embodiment that contains conducting particles 7.Circuit connection material 10 is made up of caking agent composition 11 and the conducting particles 7 that is dispersed in this caking agent composition 11.Conducting particles 7 in the circuit connection material 10 not only is configured between first splicing ear 22 and second splicing ear 32 of subtend, also is configured in interarea 21a, 31a each other.In the syndeton 1 of circuit block, both directly contact the conducting particles 7 and first and second splicing ears 22,32, simultaneously at first and second splicing ears 22, be compressed to flats between 32.Thus, first and second splicing ears 22,32 are electrically connected through conducting particles 7.Therefore, first splicing ear 22 fully reduces with the resistance that is connected of 32 of second splicing ears.Therefore, the electric current of 22,32 of first and second splicing ears is flowed smoothly, and can give full play to the function that circuit has.
The syndeton of sort circuit parts (circuit connection structure) 1 can be through following operation manufacturing.That is to say; Can make through following method of manufacture; This method comprises that foregoing circuit is connected material 10 to be disposed at first circuit block 20 that has formed first splicing ear (first circuit electrode) 22 on the interarea 21a of first substrate 21 and to have formed the operation between the second circuit parts 30 of second splicing ear (second circuit electrode) 32 on the interarea 31a of second substrate 31; And under the state of first splicing ear 22 and second splicing ear, 32 subtends configuration, heat and pressurize; Thereby with the operation of first splicing ear 22 and 32 electrical connections of second splicing ear, wherein, pressurization is below 1.5MPa, to carry out.
(circuit member connecting method)
Fig. 3 (a)～(c) is a process chart of being represented an embodiment of circuit member connecting method of the present invention by general profile chart.
In this embodiment, at first, prepare the first above-mentioned circuit block 20 and membranaceous circuit connection material 40.
The thickness of membranaceous circuit connection material 40 is preferably 5～50 μ m.When the thickness of circuit connection material 40 during, have the tendency of circuit connection material 40 at the lack of fill of 22,32 of first and second splicing ears less than 5 μ m.On the other hand, if surpass 50 μ m, then have the tendency that is difficult to guarantee 22,32 conductings of first and second splicing ears.
Then, with membranaceous circuit connection material 40 be placed on first circuit block 20 formation on the face of splicing ear 22.Then, on the arrow A of Fig. 3 (a) and B direction, membranaceous circuit connection material 40 is pressurizeed, make the membranaceous circuit connection material 40 and first circuit block 20 bonding temporarily (Fig. 3 (b)).
At this moment pressure more preferably is made as 0.5～1.5MPa as long as not producing in the scope of damage circuit block, just do not have special restriction, but preferably be made as 0.1～30MPa usually.In addition, pressurize while can heat, Heating temperature is that circuit connection material 40 in fact can the solidified temperature.Heating temperature preferably is made as 50～190 ℃ usually.These heating and pressurization are preferably carried out in the scope in 0.5～120 second.
Then, shown in Fig. 3 (c), so that second splicing ear 32 towards the mode of first circuit block, 20 sides, is placed on second circuit parts 30 on the membranaceous circuit connection material 40.In addition, when membranaceous circuit connection material 40 driving fits be arranged on and support after peeling off the support base material, second circuit parts 30 to be placed on the membranaceous circuit connection material 40 in base material (not shown) when lasting.Then, on one side heating circuit connect material 40, on the arrow A of Fig. 3 (c) and B direction, integral body is pressurizeed on one side.
Heating temperature for example is made as 90～200 ℃, and the tie-time for example is made as 1 second～10 minute.Pressure is made as below the 1.5MPa.Heating temperature and tie-time are suitably selected according to the purposes of using, circuit connection material, circuit block, and as required, also can carry out after fixing.For example, the Heating temperature when circuit connection material contains free-radical polymerised material is made as the temperature that radical polymerization initiator can produce radical.Thus, in radical polymerization initiator, produce radical, and cause the polymerization of free-radical polymerised material.
Through using the circuit connection material of this embodiment, can realize the connection under the low pressure condition such below the above-mentioned 1.5MPa.The following of this pressure is limited to about 0.5MPa, about preferred 0.8MPa, more preferably about 0.9MPa, considers that from the viewpoint of production be preferably the pressure of 0.8～1.5MPa, more preferably 0.9～1.3MPa is preferably 0.9～1.2MPa especially.
Fig. 5 uses the plat of the preceding state of membranaceous circuit connection material junction circuit parts (flexible substrate PC boards such as FPC, TCP, COF) for expression.Moulding pressure during above-mentioned connection is meant the pressure with respect to the total area of connection section." total area of connection section " is meant the total of area in the zone that comprises the gap of 22 of through circuit connection material connection terminals 22 and splicing ear; Like Fig. 5 (a) with (b), obtain by the amassing of length y of the splicing ear of the width x of the splicing ear that arrange to be provided with and vertical this width.These method of calculation are identical in the situation (Fig. 5 (b)) that the size of connection section and membranaceous circuit connection material 40 situation (Fig. 5 (a)) and membranaceous circuit connection material 40 about equally covers the zone wideer than connection section.
Moulding pressure specifically can be obtained as follows.For example; The width of connection section be 30mm, with the length of the splicing ear of the vertical direction of this width be the situation of 2mm, can obtain through calculating as follows in order the pressure in the connection section to be made as the moulding pressure of setting in
Figure BSA00000564278800151
pressurizing device.Applying following moulding pressure in the corresponding bonding head gets final product.
Goal pressure=1.0MPa (10kgf/cm 2)
The total area=the 0.2cm of connection section * 3.0cm=0.6cm 2
Moulding pressure=(total area of connection section) * (goal pressure)=0.6cm 2* 10kgf/cm 2=6kgf
In addition, in above-mentioned example, have a plurality of connection sections (for example 10), when each several part pressurizeed simultaneously, moulding pressure was as follows.
Goal pressure=1.0MPa (10kgf/cm 2)
The total area=the 0.2cm of connection section * 3.0cm * 10=6cm 2
Moulding pressure=(total area of connection section) * (goal pressure)=6cm 2* 10kgf/cm 2=60kgf
Through heating membranaceous circuit connection material 40 under the state that the distance that makes 32 of first splicing ear 22 and second splicing ears fully diminishes; Membranaceous circuit connection material 40 produces and solidifies, and first circuit block 20 is connected through circuit connection material 10 with second circuit parts 30 securely.
Through the curing of membranaceous circuit connection material 40, form circuit connection material 10, obtain the syndeton 1 of circuit block shown in Figure 2.
According to this embodiment; In the syndeton 1 of the circuit block of gained; Can make conducting particles 7 and subtend first and second splicing ears 22,32 both contact; Thereby can fully reduce the connection resistance of 22,32 of first and second splicing ears, can fully guarantee simultaneously the insulativity of 22,32 of first or second splicing ears of adjacency.In addition, owing to circuit connection material 10 is made up of the cured article that foregoing circuit connects material, so circuit connection material 10 is fully high with respect to the bonding force of first and second circuit blocks 20 or 30.
[embodiment]
Below, enumerate embodiment and comparative example, content of the present invention is more specifically explained.In addition, the present invention is not limited to following embodiment.
(synthesizing of urethane acrylate)
While to be 800 polycaprolactone divalent alcohol, 131 mass parts vinylformic acid-2-hydroxypropyl acrylate, 0.5 mass parts as the dibutyltin dilaurate of catalyzer and 1.0 mass parts stir as the hydroquinone monomethyl ether of stopper is heated to 50 ℃ with 400 mass parts molecular-weight average, mixes.Then, drip 222 mass parts isophorone diisocyanates, and further stir, be warming up to 80 ℃ simultaneously, carry out the urethane reaction.The reactivity of confirming NCO be 99% or more after, the reduction temperature of reaction obtains urethane acrylate.
(polyester polyurethane resin A's is synthetic)
Use terephthalic acid as dicarboxylicacid; Ucar 35 is as divalent alcohol, and 4,4 '-diphenylmethanediisocyanate is as isocyanic ester; Synthetic terephthalic acid/Ucar 35/4, the mol ratio of 4 '-diphenylmethanediisocyanate is the polyester polyurethane resin A of 1.0/2.0/0.25.With above-mentioned polyester polyurethane resin A be dissolved in methylethylketone (below, abbreviate " MEK " as.) in, be 20 quality %.Using apparatus for coating, is to have carried out on the surface-treated PET film on the one side of 80 μ m at thickness with the 20 quality %MEK solution coat of this polyester polyurethane resin A, and the warm air drying through 70 ℃, 10 minutes, and making thickness is the film of 35 μ m.Use wide area Measurement of Dynamic Viscoelasticity device (condition determination: the stretching loading is 5g, and frequency is 10Hz), measure the temperature dependency of the Young's modulus of this film.The second-order transition temperature of the polyester polyurethane resin A that is calculated by the temperature dependency of Young's modulus is 65 ℃.In addition, the weight-average molecular weight of polyester polyurethane resin A is 24000.
(polyester polyurethane resin B's is synthetic)
Except with terephthalic acid/Ucar 35/4, the mol ratio of 4 '-diphenylmethanediisocyanate becomes beyond the 1.0/1.3/0.25 and the synthetic operation likewise of polyester polyurethane resin A, the 20 quality %MEK solution of modulation polyester polyurethane resin B.Use apparatus for coating, 20 quality %MEK solution with this polyester polyurethane resin B are coated on the one side that thickness is 80 μ m and have carried out on the surface-treated PET film, and pass through 70 ℃, 10 minutes warm air drying, and making thickness is the film of 35 μ m.Use wide area Measurement of Dynamic Viscoelasticity device (condition determination: the stretching loading is 5g, and frequency is 10Hz), measure the temperature dependency of the Young's modulus of this film.The second-order transition temperature of the polyester polyurethane resin B that is calculated by the temperature dependency of Young's modulus is 105 ℃.In addition, the weight-average molecular weight of polyester polyurethane resin B is 26000.
[embodiment 1]
Will be as the above-mentioned urethane acrylate of 25 mass parts, 20 mass parts isocyanuric acid ester type propenoate (the goods names: M-325 of free-radical polymerised material; East Asia Synesis Company makes) and 1 mass parts 2-methacryloxyethyl acid phosphoric acid ester (goods name: P-2M; Chemical company of common prosperity society makes); With 4 mass parts Lucidols (goods name: Nyper BMT-K40 as radical polymerization initiator; Japan's grease manufacturing) with mix as 20 quality %MEK solution (polyester polyurethane resin A:55 mass parts), 275 mass parts of the polyester polyurethane resin A of the polymkeric substance of giving film properties and stir, modulate binding resin.Then, with respect to above-mentioned binding resin, disperse 2.0 volume % as conducting particles be nuclear with the PS, and outermost layer is with the conducting particles of Au lining, modulation caking agent varnish.Use apparatus for coating, this varnish is coated on has carried out on the one side that thickness is 50 μ m on the surface-treated PET film (support base material), and pass through 70 ℃, 10 minutes warm air drying, obtain adhesive sheet (width is 15cm, and length is 70m).Thickness at the membranaceous circuit connection material of supporting to form on the base material is 16 μ m.
(making of circuit connection structure)
Above-mentioned adhesive sheet is cut into the size that width is 1.5mm, and under 70 ℃, 1MPa, the condition in 2 seconds, membranaceous circuit connection material face is bonding temporarily with the glass substrate that has formed ITO electrode and Al electrode.Then, peel off support base material after, lamination COF (interelectrode distance 50 μ m, electrode width are 25 μ m, and space (ス ペ one ス) is 25 μ m) under 170 ℃, 1MPa, the condition in 5 seconds, carries out formally bondingly, obtains circuit connection structure.In addition, in order to compare, except will formal bonding condition, to change into 170 ℃, 2MPa, beyond 5 seconds, likewise operate, obtain circuit connection structure.
[embodiment 2]
Except cooperating 35 mass parts urethane acrylates, 25 mass parts M-325 and 1 mass parts P-2M as free-radical polymerised material; And cooperate as the 30 mass parts polyester polyurethane resin A and 10 mass parts polyester polyurethane resin C (the goods names: UR8300 of giving the polymkeric substance of film properties; Japan's textile company is made, and second-order transition temperature is 20 ℃, and weight-average molecular weight is 30000) in addition; Likewise operate with embodiment 1, obtain circuit connection structure.
[embodiment 3]
Except cooperating 45 mass parts urethane acrylates and 1 mass parts P-2M as free-radical polymerised material; And cooperate beyond the 55 mass parts polyester polyurethane resin A as the polymkeric substance of giving film properties; Likewise operate with embodiment 1, obtain circuit connection structure.
[embodiment 4]
Except cooperating 20 mass parts urethane acrylates, 15 mass parts M-325 and 1 mass parts P-2M as free-radical polymerised material; And cooperate beyond the 65 mass parts polyester polyurethane resin A as the polymkeric substance of giving film properties; Likewise operate with embodiment 1, obtain circuit connection structure.
[comparative example 1]
Except changing into polyester polyurethane resin A the polyester polyurethane resin B and embodiment 1 likewise operates, obtain circuit connection structure.
[comparative example 2]
Except polyester polyurethane resin A is changed into polyester polyurethane resin D (goods name: UR1400, Japan textile company is made, second-order transition temperature is 83 ℃, weight-average molecular weight is 50000) in addition and embodiment 1 likewise operate, obtain circuit connection structure.
[comparative example 3]
Except cooperating 25 mass parts urethane acrylates, 25 mass parts M-325 and 1 mass parts P-2M as free-radical polymerised material; And cooperate as the 10 mass parts polyester polyurethane resin A that give the polymkeric substance of film properties, 30 mass parts polyester polyurethane resin B and beyond the 10 mass parts polyester polyurethane resin C; Likewise operate with embodiment 1, obtain circuit connection structure.
[comparative example 4]
Except cooperating 10 mass parts urethane acrylates, 15 mass parts M-325 and 1 mass parts P-2M as free-radical polymerised material; And cooperate beyond the 75 mass parts polyester polyurethane resin A as the polymkeric substance of giving film properties; Likewise operate with embodiment 1, obtain circuit connection structure.
(mensuration that connects resistance)
To gained circuit connection structure, use digital multimeter (the Advantest manufactured, trade(brand)name: TR-6845) measure 37 at the resistance between adjacent electrode under the constant current of measuring electric current 1mA.When the MV of measuring be " A " during less than 3 Ω, when it is that 3 Ω are " B " when above.
(evaluation of impression)
Microscope is used in the BH3-MJL liquid crystal panel inspection of using Olympus to make, from glass substrate one side, observes through the Nomarski differential interference, estimates the impression shape of circuit connecting section.An example of the observed impression photo of expression among Fig. 4.Fig. 4 (a) is that expression impression intensity is enough strong, and does not produce the photo of uneven state.Fig. 4 (b) is the photo of representing the impression weak strength, having uneven state.Impression intensity shown in Fig. 4 (a) is enough strong, and does not produce uneven situation for " A ", the impression weak strength shown in Fig. 4 (b), exists uneven situation to be " B ".
Constitute the polymkeric substance of giving film properties of the circuit connection material of gained in the foregoing description and the comparative example and the cooperation ratio of free-radical polymerised material, and the evaluation result of circuit connection structure is shown in table 2.
[table 2]
Figure BSA00000564278800191
When under 1MPa, carrying out crimping, the circuit connection material of making among the embodiment 1～4 has demonstrated the formation result all good with being connected resistance of impression.Relative therewith; Only containing Tg is the comparative example 1 and 2 of the polymkeric substance of giving film properties more than 70 ℃; And Tg is less than the poor comparative example 3 of 70 ℃ the polymkeric substance of giving film properties; The illiquidity of the circuit connection material in them, the formation of impression is insufficient, and it is also high to connect resistance.In addition, in the Tg comparative example 4 many less than the content of 70 ℃ the polymkeric substance of giving film properties, because cementability is not enough, the formation of impression is insufficient, and it is also high to connect resistance.In addition, even when under 3MPa, carrying out crimping, in the comparative example 1,2 and 4 to be connected resistance also high, and in comparative example 4, the formation of impression is also insufficient.
The circuit under the low pressure condition below the 1.5MPa that circuit connection material of the present invention, realization that can be good were difficult to realize in the past connects, and can be reduced in crimping the time to by the load of sticky object.

Claims (9)

1.一种电路连接材料，其用于介于在第一基板主面上形成了第一电路电极的第一电路部件和在第二基板主面上形成了第二电路电极的第二电路部件之间，在所述第一电路电极和所述第二电路电极对向配置的状态下通过加热和加压对所述第一电路电极和所述第二电路电极进行电连接，1. A circuit connection material for interposing a first circuit component having first circuit electrodes formed on a main surface of a first substrate and a second circuit component having second circuit electrodes formed on a main surface of a second substrate between, electrically connecting the first circuit electrode and the second circuit electrode by heating and pressing in a state where the first circuit electrode and the second circuit electrode are facing each other, 其中，所述加压是在1.5MPa以下进行，Wherein, the pressurization is carried out below 1.5MPa, 该电路连接材料含有赋予膜性能的聚合物、自由基聚合性物质、自由基聚合引发剂和导电粒子，The circuit connection material contains a polymer for imparting film properties, a radical polymerizable substance, a radical polymerization initiator and conductive particles, 所述赋予膜性能的聚合物包含玻璃化温度不到70℃的聚合物，并且该玻璃化温度不到70℃的聚合物的配合量，以所述赋予膜性能的聚合物和所述自由基聚合性物质的总量为基准，为30～70质量％。The polymer that imparts film properties includes a polymer with a glass transition temperature of less than 70°C, and the blending amount of the polymer with a glass transition temperature of less than 70°C is based on the polymer that imparts film properties and the free radical The total amount of polymerizable substances is based on 30 to 70% by mass. 2.如权利要求1所述的电路连接材料，所述赋予膜性能的聚合物，以其总量为基准，包含50质量％以上的玻璃化温度为50℃以上且不到70℃的聚合物。2. The circuit connection material according to claim 1, wherein the polymer that imparts film properties contains 50% by mass or more of a polymer having a glass transition temperature of 50° C. or more and less than 70° C. based on the total amount. . 3.如权利要求1或2所述的电路连接材料，所述自由基聚合性物质包含2官能以下的自由基聚合性物质，并且该2官能以下的自由基聚合性物质的配合量，以所述自由基聚合性物质的总量为基准，为50质量％以上。3. The circuit connecting material as claimed in claim 1 or 2, wherein the radical polymerizable substance contains a radical polymerizable substance with a bifunctional or lower radical polymerizable substance, and the compounding amount of the radical polymerizable substance with a functional or lower bifunctional Based on the total amount of the above-mentioned radically polymerizable substance, it is 50% by mass or more. 4.一种电路部件的连接方法，该方法是对于在第一基板主面上形成了第一电路电极的第一电路部件，在第二基板主面上形成了第二电路电极的第二电路部件，和配置在所述第一电路部件和所述第二电路部件之间的权利要求1～3任一项所述的电路连接材料，在所述第一电路电极和所述第二电路电极对向配置的状态下进行加热和加压，从而使所述第一电路电极和所述第二电路电极电连接的电路部件的连接方法，4. A method for connecting circuit components, the method is to form a first circuit component with first circuit electrodes on the main surface of the first substrate, and a second circuit with second circuit electrodes formed on the main surface of the second substrate component, and the circuit connecting material according to any one of claims 1 to 3 arranged between the first circuit component and the second circuit component, between the first circuit electrode and the second circuit electrode A method of connecting circuit components in which the first circuit electrode and the second circuit electrode are electrically connected by heating and pressurizing in a facing state, 其中，所述加压是在1.5MPa以下进行。Wherein, the pressurization is carried out below 1.5MPa. 5.一种电路连接结构体的制造方法，其包括将权利要求1～3任一项所述的电路连接材料配置于在第一基板主面上形成了第一电路电极的第一电路部件和在第二基板主面上形成了第二电路电极的第二电路部件之间的工序，以及5. A method of manufacturing a circuit-connected structure, comprising disposing the circuit-connecting material according to any one of claims 1 to 3 on a first circuit member and a first circuit electrode formed on a first substrate main surface. a process between second circuit components having second circuit electrodes formed on the main surface of the second substrate, and 在所述第一电路电极和所述第二电路电极对向配置的状态下进行加热和加压，从而使所述第一电路电极和所述第二电路电极电连接的工序，a step of electrically connecting the first circuit electrode and the second circuit electrode by applying heat and pressure in a state where the first circuit electrode and the second circuit electrode are opposed to each other, 其中，所述加压是在1.5MPa以下进行。Wherein, the pressurization is carried out below 1.5MPa. 6.一种通过权利要求5所述的制造方法制造的电路连接结构体。6. A circuit connection structure manufactured by the manufacturing method according to claim 5. 7.一种连接材料用于电路连接的用途，该连接材料含有赋予膜性能的聚合物、自由基聚合性物质、自由基聚合引发剂和导电粒子，7. An application of a connection material for circuit connection, the connection material contains a polymer that imparts film properties, a free radical polymerizable substance, a free radical polymerization initiator and conductive particles, 所述赋予膜性能的聚合物包含玻璃化温度不到70℃的聚合物，并且该玻璃化温度不到70℃的聚合物的配合量，以所述赋予膜性能的聚合物和所述自由基聚合性物质的总量为基准，为30～70质量％，The polymer that imparts film properties includes a polymer with a glass transition temperature of less than 70°C, and the blending amount of the polymer with a glass transition temperature of less than 70°C is based on the polymer that imparts film properties and the free radical The total amount of polymerizable substances is based on 30 to 70% by mass, 并且该连接材料用于介于在第一基板主面上形成了第一电路电极的第一电路部件和在第二基板主面上形成了第二电路电极的第二电路部件之间，在所述第一电路电极和所述第二电路电极对向配置的状态下通过加热和在1.5MPa以下进行的加压而对所述第一电路电极和所述第二电路电极进行电连接。And the connection material is used to be interposed between the first circuit part having the first circuit electrode formed on the main surface of the first substrate and the second circuit part having the second circuit electrode formed on the main surface of the second substrate, in which The first circuit electrode and the second circuit electrode are electrically connected by heating and pressing at 1.5 MPa or less in a state where the first circuit electrode and the second circuit electrode are opposed to each other. 8.如权利要求7所述的用途，所述赋予膜性能的聚合物，以其总量为基准，包含50质量％以上的玻璃化温度为50℃以上且不到70℃的聚合物。8 . The use according to claim 7 , wherein the film performance-imparting polymer contains 50% by mass or more of a polymer having a glass transition temperature of 50° C. or more and less than 70° C. based on the total amount. 9.如权利要求7或8所述的用途，所述自由基聚合性物质包含2官能以下的自由基聚合性物质，并且该2官能以下的自由基聚合性物质的配合量，以所述自由基聚合性物质的总量为基准，为50质量％以上。9. The use according to claim 7 or 8, wherein the radical polymerizable substance contains a radical polymerizable substance with a function below 2, and the compounding amount of the radically polymerizable substance with a functionality below 2 is based on the free radical polymerizable substance. Based on the total amount of polymerizable substances, it is 50% by mass or more.
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TWI436709B (en) 2014-05-01
KR101227358B1 (en) 2013-01-28

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