CN102412702B - load point assembly - Google Patents

Abstract

Combined circuit and electronic device. The invention discloses a load point component which comprises an inductor, at least one input capacitor and at least one switch element. The inductor is provided with a first surface and a second surface opposite to the first surface, a plurality of conductors are arranged on the first surface and the second surface, and the plurality of conductors on the first surface of the inductor are used as an output end of the load point component; the at least one switching element is stacked on the inductor and electrically connected with the inductor through a plurality of conductors on the second surface of the inductor. The at least one input capacitor and the at least one switch element are electrically connected to a carrier through a plurality of conductors, and the carrier is used for bearing the load point assembly.

Description

Point of Load Components

This application is a divisional application of the invention patent application with the application number "200810003217.2" and the invention title "combined circuit and electronic components" submitted by the applicant on January 7, 2008.

technical field

The present invention relates to a point-of-load component and a combined circuit using the point-of-load component. More specifically, it relates to a point-of-load component that can reduce the overall size to improve the power density of the overall power supply and a combination using the point-of-load component circuit.

Background technique

General electrical appliances use AC power. After the AC power is converted into an array of DC power by an AC to DC converter (AC to DC converter), it can supply various electronic components inside the appliance to meet their different power needs. However, due to the partial loss during power conversion, the conversion efficiency of converting to multiple sets of DC power output is not high. Therefore, if it is converted into a group of DC power first, and then converted into the DC power required by the array, the efficiency can be greatly improved. In addition, portable electronic products use a DC power source (ie, a battery) to supply power to internal circuits. Similarly, in order to meet the different DC voltage requirements of the internal circuit, it is necessary to use a DC converter (DC to DC converter) to convert the voltage provided by the battery into an array of DC voltages. The DC converter includes a step-down (Buck) converter, a step-up (Boost) converter, buck-boost (Buck-Boost) converter.

With the rapid development of power supply technology, voltage converters have higher and higher requirements on the power density of the power supply and the size of the converter. There are many ways to increase the power density of the power supply. The common method is to improve the power density of the power supply by changing the electrical characteristics of the power supply, such as increasing the operating frequency of the converter to greatly reduce the size of some passive components (such as inductors). power density. However, the factors that actually affect the power density and efficiency of the DC converter also include many structural factors, such as the size of each component itself and the structural design of the entire voltage converter. In the following, the point of load (Point Of Load, POL) DC converter in the DC converter of the voltage converter is taken as an example to illustrate this problem.

FIG. 1 is a circuit diagram of a point-of-load DC converter, which is a buck converter. The point-of-load DC converter 1 includes an inductor 11 , two switching elements 12 and 15 (such as Metal Oxide Semiconductor Field Effect Transistor (MOSFET)), an output capacitor 13 and a control chip 14 . The control chip 14 controls the operation of the point-of-load DC converter 1 by receiving an output feedback signal and a related voltage adjustment control signal Vadj.

2A and 2B are respectively a top view and a bottom view of a conventional point-of-load DC converter. The traditional point-of-load DC converter 2 is packaged in a combined circuit, and its input and output pins are traditional through hole pins. As shown in the figure, the point-of-load DC converter 2 includes a control chip 21, a circuit board 22, four input and output capacitors 23, several plug-in pins 24, a magnetic element (in this example, an inductor) 25 and two switches. Element 27. The control chip 21 and the output capacitor 23 are arranged on one side of the carrier 22 (usually a printed circuit board (PCB)), and the other side of the circuit board 22 is provided with a magnetic element 25 and two switching elements 27 .

The point-of-load DC converter 2 is plugged into a main circuit board (not shown) through several plug-in pins 24 . However, the insertion pin 24 will occupy a part of the surface area of the circuit board 22; in addition, the pin 24 has a supporting function, so the circuit board 22 needs to have a certain thickness, so that the volume of the point-of-load DC converter 2 is increased, and the load is further reduced. its overall power density.

The top and bottom views of another conventional point-of-load DC converter are shown in FIGS. 3A and 3B . This traditional point-of-load DC converter 3 is packaged in another combined circuit, and its input and output pins are wave pins, which are attached to the surface of the circuit board. As shown in the figure, the point-of-load DC converter 3 includes three capacitors 31 (including output capacitors and/or input capacitors), a switch element 32, a plurality of wave-shaped pins 33, a carrier 34, a magnetic element 35 and A control chip 36 . The capacitor 31 , the switching element 32 and the magnetic element 35 are disposed on one side of a carrier 34 (usually a printed circuit board), and a control chip 36 is disposed on the other side of the carrier 34 . The point-of-load DC converter 3 is connected to the main circuit board (not shown) through the wave-shaped pin 33 .

However, in addition to occupying a certain space on the circuit board 34 , the wavy pins 33 themselves have a certain height, which will increase the volume of the point-of-load DC converter 3 and reduce its power density.

To sum up, in the existing packaging methods, the point-of-load DC converters are all limited by pins, which makes the overall volume larger and the power density lower. Therefore, in order to solve these problems, it is urgently needed in this field to propose a new type of combined circuit to increase the power density of electronic devices (especially voltage converters) and reduce the overall size.

Contents of the invention

It is an object of the present invention to provide a point-of-load assembly. To achieve this purpose, the point-of-load component of the present invention includes an inductor, at least one input capacitor, and at least one switching element. The inductor has a first surface and a second surface opposite to the first surface. There are multiple conductors on the first surface and the second surface, and the multiple conductors located on the first surface of the inductor serve as an output end of the point-of-load component; At least one switch element is stacked on the inductor and electrically connected to the inductor through a plurality of conductors on the second surface of the inductor. Wherein, at least one input capacitor and at least one switch element are electrically connected to a carrier through a plurality of conductors, and the carrier is used to carry the point-of-load component.

After referring to the accompanying drawings and the implementation methods described later, those with ordinary knowledge in the technical field of the present invention can understand the purpose of the present invention, as well as the technical means and implementation aspects of the present invention.

Description of drawings

Figure 1 is a circuit diagram of a traditional point-of-load module power supply;

FIG. 2A is a top view of a traditional point-of-load DC converter using plug-in pins;

FIG. 2B is a bottom view of a traditional point-of-load DC converter using plug-in pins;

FIG. 3A is a top view of a conventional point-of-load DC converter using wavy pins;

FIG. 3B is a bottom view of a conventional point-of-load DC converter using wavy pins;

4A is a top view of a first electronic component covered with a first conductor layer in the DC converter according to the first embodiment of the present invention;

4B is a bottom view of the first electronic component covered with the first conductor layer in the DC converter according to the first embodiment of the present invention;

4C is another top view of the first electronic component covered with the first conductor layer in the DC converter according to the first embodiment of the present invention;

4D is another bottom view of the first electronic component covered with the first conductor layer in the DC converter according to the first embodiment of the present invention;

5A to FIG. 5E in the DC converter according to the first embodiment of the present invention, the production results of each step of covering the first electronic component with the first conductor layer;

Fig. 6A is a bottom view of the DC converter according to the first embodiment of the present invention;

6B is a top view of the DC converter according to the first embodiment of the present invention;

6C is a top view of a combined circuit including a DC converter according to the first embodiment of the present invention;

7A is a top view of the second electronic component connected to the first conductor layer in the DC converter according to the second embodiment of the present invention;

FIG. 7B is a top view of a DC converter according to a second embodiment of the present invention;

8A is a top view of a second electronic component covered with a first conductor layer in a DC converter according to a sixth embodiment of the present invention;

8B is a top view of a DC converter according to a sixth embodiment of the present invention;

9A is a top view of a fourth electronic component covered with a first conductor layer in a DC converter according to a seventh embodiment of the present invention;

9B is a top view of a DC converter according to a seventh embodiment of the present invention;

10 is a top view of a DC converter according to an eighth embodiment of the present invention;

11A is a top view of a point-of-load DC converter according to a third embodiment of the present invention;

Fig. 11B is a top view and a bottom view of a point-of-load DC converter according to a third embodiment of the present invention;

11C is a schematic diagram of a co-fired magnetic material substrate, a first conductor layer and a conductor according to a third embodiment of the present invention;

11D is a schematic diagram of the co-fired magnetic material substrate after removing the first layer of magnetic material substrate according to the third embodiment of the present invention;

Figure 11E is a perspective view of the internal structure of Figure 11C;

11F is a schematic diagram of other inner layer circuits except the first layer, the second layer and the last layer of the co-fired magnetic material substrate according to the third embodiment of the present invention;

11G is a schematic diagram of the last layer of the co-fired magnetic material substrate according to the third embodiment of the present invention;

12A is a top view of a point-of-load DC converter according to a fourth embodiment of the present invention;

12B is a top view and a bottom view of a point-of-load DC converter according to a fourth embodiment of the present invention;

12C is a schematic diagram of a magnetic material substrate, a first conductor layer and a conductor according to a fourth embodiment of the present invention;

Figure 12D is a perspective view of the internal structure of Figure 12C;

13A is a top view of a point-of-load DC converter according to a fifth embodiment of the present invention;

13B is a top view and a bottom view of a point-of-load DC converter according to a fifth embodiment of the present invention;

13C is a schematic diagram of a magnetic material substrate, a first conductor layer, an insulating layer and a conductor according to a fifth embodiment of the present invention;

Figure 13D is a side view of Figure 13C;

13E is a schematic diagram of a magnetic material substrate not covered with an insulating layer according to a fifth embodiment of the present invention;

Figure 13F is a perspective view of the internal structure of Figure 13E;

Fig. 14A is a top view of an inductor made by pressing an iron powder core;

Fig. 14B is a bottom view of an inductor made by pressing an iron powder core;

14C is a schematic diagram of the inductor coil pin; and

FIG. 14D is a schematic structural diagram of the inner coil of the inductor.

Detailed ways

In order to effectively increase the power density of electronic devices (especially voltage converters) and reduce the overall size, the present invention proposes a new type of pin design, which is widely used in various common electronic devices. Please refer to FIGS. 4A and 4C and FIGS. 4B and 4D , which respectively show a bottom view and a top view of an inductive element 62 in the first embodiment of the present invention. In more detail, the inductive element 62 can be an inductor. In actual application, the inductive element 62 can be a co-fired magnetic material inductor or a wire-wound pressure-fit inductor. It should be noted that the inductive element 62 in this embodiment is only for illustration, in fact, the technology disclosed in the present invention can be applied to the main body of general electronic elements, such as field effect transistors.

One of the features of the present invention is that the outer surface of the inductive element 62 is coated with a first conductor layer 61, the first conductor layer 61 has a connecting conductor 40 and a pin conductor 40', wherein the connecting conductor 40 wraps the inductive element 62 is a first surface of the outer surface, and the lead conductor 40 ′ wraps a second surface of the outer surface of the inductive element 62 , and the lead conductor 40 ′ is a lead of the inductive element 62 , such as a lead of an inductor. When the present invention is applied to the main body of other electronic components, such as field effect transistors, the pins can be the gate, source and drain of the field effect transistors. The inductive element 62 itself is connected to the external circuit through the pin conductor 40'. In this embodiment, the first surface includes several areas such as a part of the outer surface of the inductive element 62, a part of the top surface, and a part of the bottom surface; the second surface includes other parts of the outer surface of the inductive element 62. Several areas such as the top surface, wherein the upward surface in FIG. 4B is defined as the top surface of the inductive element 62 , and the upward surface in FIG. 4A is defined as the bottom surface of the inductive element 62 .

The above-mentioned first surface and second surface cover the scope of the outer surface of the inductive element 62 and the aspects shown in the related drawings are only for illustration and are not intended to limit the present invention. In fact, the areas covered by the first surface and the second surface It can be adjusted according to actual needs. In addition, it should be emphasized that at least a part of the connecting conductor 40 on the outer surface of the inductive element 62 of this embodiment is isolated from the lead conductor 40 ′, that is, at least a part of the connecting conductor 40 is separated from the lead conductor 40 ′. There is no direct physical and electrical connection between them on the outer surface. More specifically, only when the inductive element 62 is connected to other electronic components or circuit boards, the connection conductor 40 is partially electrically connected to the pin conductor 40' indirectly through other electronic components or circuit boards. In other implementations, the connecting conductors 40 on the outer surface of the inductive element 62 may also be completely isolated from the pin conductors 40 ′, that is, all the connecting conductors 40 are between the pin conductors 40 ′. There are no direct physical and electrical connections on the outer surface. More specifically, the inductive element 62 is only electrically connected to the pin conductor 40' through other electronic elements or circuit boards when the inductive element 62 is connected to other electronic elements or circuit boards.

Please refer to FIG. 4A , FIG. 4B , FIG. 4C and FIG. 4D together. In this embodiment, the pin conductor 40' has two pins 41, 45, which are arranged on both ends of the outer surface of the inductive element 62, as the pins of the inductive element 62, to electrically connect the inductive element 62 with other Any component or carrier (such as a circuit board). In addition, the connection conductor 40 can have different designs according to actual needs. In this embodiment, the connection conductor 40 has several different conductor areas 42, 43, 44, 47, 48, covering and attaching to the inductance A first surface on the body of element 62 . For example, the conductive areas 42 , 43 , 44 are used as power pins for connecting to field effect transistors; the conductive areas 47 , 48 are used as signal pins for connecting to a control chip. Wherein the conductor region 43 as the power pin has a relatively large area, and the distance between other conductor regions 42, 44, 47, 48 of the connecting conductor 40 is relatively small, so the top surface of the inductive element 62 (i.e. the first 4B) is almost completely covered by the conductor regions 42 , 43 , 44 , 47 and 48 of the connecting conductor 40 . As mentioned above, since at least a part of the connecting conductor 40 on the outer surface of the inductive element 62 is isolated from the pin conductor 40 ′, that is, at least a part of the connecting conductor 40 and the pin conductor 40 ′ are separated from the inductive element 62 . There are no direct physical and electrical connections on the outer surface. In more detail, only when the inductive element 62 is connected to other electronic components or circuit boards, its pin conductor 40' is electrically connected to at least part of the surface of the connecting conductor 40 indirectly through other electronic components or circuit boards. Therefore, the partial conductor areas 42, 43, 44, 47, 48 of the connecting conductor 40 on the outer surface of the inductive element 62 are not directly electrically connected to the pins 41, 45 of the pin conductor 40'. This large-area pin design not only helps to substantially increase the heat dissipation area of the first electronic component (ie, the inductor) 62, but also effectively improves the overall heat dissipation performance of the electronic device (such as a voltage converter) using the inductive component 62. .

Generally speaking, the lead conductor 40' of the first conductor layer 61 in FIGS. 4A and 4B is fabricated before the connection conductor 40 is formed. Taking the aforementioned inductive element 62 as an example of a wire-wound pressure-fit inductor 140, the schematic flow diagrams of the inductor 140 and the lead conductor 40' for manufacturing the inductor 140 are shown in FIGS. 14A to 14D. Among them, Fig. 14A and Fig. 14B are respectively the top view and bottom view of the inductor made of ordinary iron powder core, Fig. 14C shows the shape of the coil pin before bending, and Fig. 14D shows the coil in the magnetic material part Structure. In detail, the inductor 140 includes a magnetic material part 141 and an inner metal coil 142 , and the two ends of the inner metal coil 142 are respectively connected to the pin conductors 143 . The iron powder core is wrapped around the inner metal coil 142 and pressed together to obtain the outer magnetic material part 141 , and the pin conductors 143 at both ends of the inner metal coil 142 are bent and attached to a second surface of the inductor 140 .

On the other hand, in this embodiment, the connection conductor 40 of the first conductor layer 61 can be mainly formed on the outer surface of the inductive element 62 through two methods. One method is to directly form the connecting conductor 40 on the surface of the inductive element 62 body, and another method is to independently complete the connecting conductor 40 and then fix it to the first surface of the inductive element 62 body, as detailed below stated.

Wherein, the specific implementation method of forming the connecting conductor 40 on the surface of the inductive element 62 body includes the following steps: first, a layer of conductive material, such as copper, is formed on the surface of the inductive element 62 body, wherein the method of forming the conductive material includes using chemical Vapor deposition or physical vapor deposition, such as evaporation, sputtering, or spraying of conductive material, is a surface metallization process that forms a layer of conductive material on the surface of the inductive element 62 . Secondly, the conductive material layer is patterned by exposure and development processes to form the connecting conductor 40 on the first surface of the body surface of the inductive element 62 .

Secondly, as shown in FIGS. 5A to 5E , another method for forming the first conductor layer 61 on the surface of the body of the inductive element 62 can be achieved in the following two ways. First, a frame 51 including the first conductor layer 61 is independently completed externally, as shown in FIG. 5A; secondly, as shown in FIG. There is a frame 51 of the first conductor layer 61, and this frame 51 is combined and pressed into the outer surface of the inductive element 62 during the lamination process of the inductive element 62; after the lamination is completed, as shown in Figure 5C, the redundant The frame 51 is cut off, and then the remaining first conductive layer 61 is bent, so that the first conductive layer 61 covers the first surface of the inductive element 62 , so that an integrated structure 53 can be formed.

In the second way, as shown in FIG. 5B, a layer of adhesive glue is brushed on the side of the frame 51 with the first conductor layer 61 adjacent to the first surface of the inductive element 62 (in this embodiment, the adhesive glue can be cured by heat); secondly, the frame 51 is bonded to the outer surface of the inductive element 62, and then the frame 51 is bent to make the first conductor layer 61 cover the first surface of the inductive element 62; finally with a heat After the adhesive is heat-cured during the manufacturing process, the first conductive layer 61 can be fixed and covered on the first surface of the inductive element 62 to obtain the integrated structure 53 .

As mentioned above, in the integrated structure 53 obtained by the aforementioned method of this embodiment, the maximum gap between the first conductor layer 61 and the inductive element 62 is less than 0.3 mm. The frame 51 is bent to cover the integrated structure 53 of the inductive element 62 , and its bottom view and top view are respectively shown in FIG. 5D and FIG. 5E .

Please refer to FIG. 6A, FIG. 6B and FIG. 6C, which show the specific application of the first embodiment of the present invention, wherein FIG. 6A and FIG. 6B respectively show a top view and a bottom view of a DC converter, and those shown in FIG. 6C include the DC converter Top view of the combined circuit. The DC converter 60 shown in FIG. 6A and FIG. 6B uses the aforementioned inductive element 62 with a large-area pin. The DC converter 60 can be applied to a step-down converter at the load end, that is, a point-of-load DC converter. The combined circuit 4 shown in FIG. 6C uses a circuit structure of a DC converter 60, which will be described in detail later.

As shown in the figure, in this embodiment, the combined circuit 4 includes two first carriers and second carriers for carrying electronic components, such as a first circuit board 69 and a second circuit board 63 respectively. The formula circuit 4 further includes a first conductor layer 61 , an inductive element 62 , a first electronic element 66 , two second electronic elements 64 , 65 and two third electronic elements 67 , 68 . Wherein, except for the first circuit board 69 , other components can jointly form the aforementioned DC converter 60 . In this embodiment, the inductive element 62, the first electronic element 66, the second electronic element 64, 65 and the third electronic element 67, 68 are respectively an inductor, a control chip, a capacitor and a field effect transistor; and in other implementation states In the sample, each electronic component can be one of an inductor, a resistor, a capacitor, a field effect transistor, a control chip and an integrated circuit, and the integrated circuit uses an inductor, a resistor, a capacitor, a field effect transistor The transistor is integrated with at least two of a control chip. Wherein, the field effect transistor as the third electronic element 67 and 68 can also be called a switch element or a power element, and the field effect transistor is a metal oxide semiconductor field effect transistor (MOSFET).

Referring to FIG. 6A , FIG. 6B and FIG. 6C , the first circuit board 69 is electrically connected to the connecting conductor 40 covering the first surface of the inductive element 62 . The first electronic component 66 is also electrically connected to the connecting conductor 40 covering the first surface of the inductive component 62 . More specifically, the first electronic component 66 is electrically connected to the connecting conductor 40 through the second circuit board 63 .

As shown in FIG. 6A and FIG. 6B, the inductive element 62, the first electronic element 66, the second electronic element 64, 65, and the third electronic element 67, 68 are installed on the second circuit board 63 to form a DC converter 60. . In more detail, the second circuit board 63 is usually a printed circuit board (Printed Circuit Board, PCB), which has two opposite sides, one of which is mounted with the inductive element 62 covering the first conductor layer 61 and the second electronic circuit board. Components 64, 65; on the other hand, the other side of the second circuit board 63 is mounted with a first electronic component 66 and a third electronic component 67, 68, as shown in FIG. 6B. FIG. 6C is a structural perspective view of installing the DC converter 60 with the aforementioned integrated structure 53 on the first circuit board 69 to form the combined circuit 4 . As shown in the figure, the DC converter 60 is mounted on the first circuit board 69 through the conductor areas 42 , 43 , 44 , 47 , 48 that are connected to the conductors 40 wrapped around the inductive element 62 as pins.

Since the conductor areas 42, 43, 44, 47, 48 of the inductive element 62 connected to the conductor 40 are distributed on the outer surface of the inductive element 62, the DC converter 60 is suitable for passing through the conductor area of the connected conductor 40 in the inductive element 62 42 , 43 , 44 , 47 , 48 are electrically connected to the first circuit board 69 , so when the DC converter 60 is installed on the first circuit board 69 , the occupied space of the first circuit board 69 is extremely small. On the other hand, since the DC converter 60 is installed on the first circuit board 69, the inductive element 62 body is used as the mechanical support of the entire DC converter 60, so the second circuit board 63 can be thinned in actual application to greatly reduce the The required thickness of the second circuit board 63 saves a certain space of the DC converter 60 and even the combined circuit 4 , so as to effectively increase the power density of the DC converter 60 .

In addition, because the first electronic component 66 and the third electronic component 67, 68 are the main heating elements, the pin 66a of the first electronic component 66 and the pin 67a, 68a of the third electronic component 67, 68 can pass through the first The conductive layer 61 enhances the overall heat dissipation capability of the DC converter 60 . Since the thickness of the second circuit board 63 has been substantially thinned and has excellent thermal conductivity, the heat of the first electronic component 66 and the third electronic components 67, 68 can be easily dissipated in the second circuit board 63, And the heat of the DC converter 60 is transferred to the first circuit board 69 with the assistance of the first electronic component 66 connected to the first conductor layer 61 and the third electronic component 67 , 68 .

A practical application of the present invention described above can be changed according to actual needs. For example, the second embodiment of the present invention described below also applies the above-mentioned same features to a combined circuit of a DC converter 70 , as shown in FIGS. 7A and 7B . The difference between the second embodiment and the first embodiment is that the second electronic components 64, 65 of the first embodiment are electrically connected to the second circuit board 63 first, and are connected to the first conductor layer 61 through the second circuit board 63. The connecting conductor 40 is electrically connected; and the second electronic components 72, 73 of the second embodiment are directly physically and electrically connected to the connecting conductor 71 on the outer surface of the inductive component 74. More specifically, the second electronic component 72 and 73 are directly installed on the connecting conductor 71, as shown in FIG. 7A, and the three-dimensional structure diagram of the DC converter 70 adopting the aforementioned connection method is shown in FIG. 7B.

It should be noted that this embodiment adopts a structure in which the first conductive layer 71 is covered on the surface of the first electronic component (ie inductor) 74. In other implementations of this embodiment, the first conductive layer 71 can also be changed to be coated on the surface of the first electronic component (not shown) or the third electronic component (not shown), and then the second electronic component (ie capacitor) 72, 73 is directly attached to the surface of the first electronic component (not shown in the figure) On the first conductor layer 71 on the surface of an electronic component or a third electronic component, so as to achieve the same effect of increasing power density and reducing volume as mentioned above.

The third embodiment of the present invention is also a combined circuit applied to a DC converter, especially a point-of-load DC converter, and its related diagrams are shown in FIGS. 11A to 11G . 11A and 11B are respectively a top view and a bottom view of a point-of-load DC converter 110, wherein the point-of-load DC converter 110 uses a co-fired ferrite material inductor as a substrate. The point-of-load DC converter 110 includes an inductive element, a first conductor layer 112 , two second electronic elements, a fourth electronic element, and an inductive coil 116 . In this embodiment, the inductive element is formed by stacking several layers of co-fired magnetic material substrates 111, the second electronic element is a capacitor 114, and the fourth electronic element is an integrated field effect transistor (especially a metal oxide semiconductor field effect transistor) (Metal Oxide Semiconductor Field Effect Transistor, MOSFET)) and an integrated circuit 115 of a control chip. As mentioned above, the first conductor layer 112 includes a connecting conductor and a pin conductor, in this embodiment the connecting conductor has four pins 118 and the conductor 113 connected with it, and the pin conductor has two pins 117 And the conductor 113 connected with it.

The first conductor layer 112 covers a first surface of the outer surface of the stacked co-fired magnetic material substrate 111. The first surface includes an upper surface, a lower surface and a side surface. More specifically, the side surface is covered by a conductor 113. cover. The first conductor layer 112 on the upper surface provides the electrical connection of the capacitor 114 and the integrated circuit 115, etc.; The first conductive layer 112 on the surface is electrically connected to the carrier; the conductor 113 wrapped in the first conductive layer 112 on the side is electrically connected to the first conductive layer 112 on the upper surface and the lower surface.

Specifically, the co-fired magnetic material inductor 111 is formed by sintering a multi-layer magnetic material base material, and its manufacturing method is similar to that of Low Temperature Co-fired Ceramic (LTCC). As shown in Figure 11E, the inductance coil 116 includes a plurality of connected conductive elements 119, which are made by making a plurality of through holes on the magnetic material substrates of the middle layers, and stacking the magnetic material substrates of each layer in parallel Afterwards, the projections of the corresponding through holes on the substrate on each layer on a plane parallel to the magnetic material layers are substantially overlapped. Also make a plurality of semicircular through holes on both sides of the magnetic material of each layer, and then fill each layer of through holes with metal, such as silver (Ag), palladium (Pd), gold (Au) or copper (Cu), to make The conductive element 119 and the pins 117 and 118 are connected to the inductance coil 116 . A plurality of conductors are fabricated on the upper surface of the uppermost layer of magnetic material and the lower surface of the lowermost layer of magnetic material, and each conductor connects two through holes on the layer of magnetic material. Finally, the multilayer magnetic material substrates are laminated to form the inductor coil 116 and part of the first conductor layer 113 , wherein the inductor coil 116 is electrically connected to the pin 117 of the pin conductor.

Layer a layer of magnetic material or coat a layer of insulating material on the upper and lower surfaces of the finished inductor, and make corresponding semicircular through holes on the layer of magnetic material or insulating material and add metal to form a co-fired magnetic material Substrate 111. The first conductive layer 112 is formed on the surface of the co-fired magnetic material substrate 111 to install electronic components, such as capacitors 114 and integrated circuits 115 integrating field effect transistors and control chips, and electrically connect the first conductive layer to the substrate 111. Conductor layer 112 to form the entire point-of-load DC converter 110 as shown in FIG. 11A and FIG. 11B . FIG. 11C is a schematic diagram of the co-fired magnetic material substrate 111 and the first conductor layer 112 . FIG. 11D is a schematic diagram of the co-fired magnetic material substrate 111 after removing the first layer of magnetic material substrate to show the electrical connection between the inductor coil 116 inside the co-fired magnetic material substrate 111 and the pins. FIG. 11E is a perspective view of the internal structure of FIG. 11D , from which the winding direction of the inductance coil 116 can be seen, and it can be clearly shown that the pin 117 is connected to the inductance coil 116 . FIG. 11F is a schematic diagram of other inner layers of the co-fired magnetic material substrate 111 except the first layer, the second layer and the last layer. FIG. 11G is a schematic diagram of the last layer of wiring of the co-fired magnetic material substrate 111 . It can be seen from the figure that at least a part or all of the connection conductors on the outer surface of the co-fired magnetic material substrate 111 are isolated from the pin conductors, that is, at least a part or all of the connection conductors are separated from the pin conductors on the outside. There is no direct physical and electrical connection on the surface. In more detail, at least a part or all of the connecting conductors are indirectly connected to the pin conductors, that is, when other electronic components such as capacitors 114 and integrated circuits 115 are stacked on the co-fired magnetic material substrate 111, The pin 118 of the connecting conductor is electrically connected to the pin 117 of the pin conductor indirectly through other electronic components.

The fourth embodiment of the present invention is also a combined circuit applied to a DC converter, especially a point-of-load DC converter 120 , and its related diagrams are shown in FIGS. 12A to 12D . 12A and 12B are respectively a top view and a bottom view of the point-of-load DC converter 120 in which the inductance coil 127 is pressed into the magnetic material substrate 125 . The point-of-load DC converter 120 includes a fourth electronic component, two second electronic components, a first conductor layer 123 and an inductive component. The fourth electronic component is an integrated circuit 121 integrating a field effect transistor (especially a MOSFET) and a control chip, the two second electronic components are capacitors 122, and the inductive component includes the aforementioned magnetic material substrate 125 and inductance coil 127 . As previously mentioned, the first conductor layer 123 includes a connecting conductor with four pins 124 and a pin conductor with two pins 126, and each pin 124 of the connecting conductor is connected to each pin 126 of the pin conductor. A conductor 129 is included.

The first conductor layer 123 covers a first surface of the outer surface of the magnetic material substrate 125. This first surface includes an upper surface, a lower surface and a side surface. In more detail, the side surface is covered by the conductor 129 in the first conductor layer 123. clad. The integrated circuit 121 and the capacitor 122 are directly mounted on the first conductor layer 123 on the magnetic material substrate 125 , and are in direct contact with the first conductive layer 123 to form an electrical connection. More specifically, the conductor 129 passes through the upper and lower surfaces of the magnetic material substrate 125 in the form of a through hole, so as to form an electrical connection with the upper and lower surfaces of the magnetic material substrate 125 . And when the combined circuit is mounted on a carrier (here it is a main circuit board and not shown in the figure)), it can be electrically connected to the carrier through the first conductor layer 123 . At the same time, the conductor 129 in the two pins 126 of the pin conductor is connected to the flat coil pins 128 at the two ends of the inductance coil 127 inside the magnetic material substrate 125 to form an electrical connection. 12C is a schematic diagram of a magnetic material substrate 125, a first conductor layer 123, and a conductor 129. FIG. 12D is a perspective view of the internal structure of FIG. The conductors 129 of the pins 126 of the pin conductors are connected.

As described in the third embodiment, the inductance coil 127 is pressed into the magnetic material substrate 125 when it is manufactured. And as previously mentioned, it can be seen from the figure that at least a part or all of the pins 124 of the connecting conductors are isolated from the pins 126 of the lead conductors, that is, at least a part or all of the pins 124 of the connecting conductors are isolated from each other. There is no direct physical and electrical connection between the pins 126 of the pin conductor on the outer surface.

The fifth embodiment of the present invention is still a combined circuit applied to a DC converter, especially a point-of-load DC converter, and its related diagrams are shown in FIGS. 13A to 13F . 13A and 13B are respectively a top view and a bottom view of the point-of-load DC converter 13 in which the inductance coil 138 is fabricated inside the magnetic material substrate 136 through through holes. The point-of-load DC converter 13 includes a fourth electronic component, two second electronic components, an insulating layer 133 , a first conductive layer 134 and an inductive component. The fourth electronic component is an integrated circuit 131 integrating a field effect transistor (especially a MOSFET) and a control chip, the two second electronic components are capacitors 132, and the inductive component includes a magnetic material substrate 136 and an inductance coil as described above 138. The first conductor layer 134 includes a connecting conductor with four pins 135 and a pin conductor with two pins 137 , and each pin 135 of the connecting conductor and each pin 137 of the pin conductor include a conductor 139 .

The first conductor layer 134 covers a first surface of the outer surface of the magnetic material substrate 136, and the first surface includes a lower surface and a side surface. In more detail, the side surface is covered by the conductor 139 in the first conductor layer 134; In addition, the first conductive layer 134 further covers the insulating layer 133 on the upper surface of the outer surface of the magnetic material substrate 136 . The integrated circuit 131 and the capacitor 132 are directly mounted on the upper surface of the first conductor layer 134 of the magnetic material substrate 136 , and are in direct contact with it to form an electrical connection. More specifically, the conductor 139 passes through the upper and lower surfaces of the magnetic material substrate 136 in the form of a through hole, so as to form an electrical connection with the upper and lower surfaces of the magnetic material substrate 136 . As mentioned above, the insulating layer 133 is interposed between the first conductive layer 134 and the magnetic material substrate 136 to insulate the two.

And when the combined circuit is mounted on a carrier (here it is a main circuit board and not shown in the figure)))))), it can be electrically connected to the carrier through the first conductor layer 134 . FIG. 13C is a schematic diagram of the magnetic material substrate 136 , the first conductive layer 134 , the insulating layer 133 and the conductor 139 , and FIG. 13D is a side view of FIG. 13C , and these figures respectively show the structure of each layer. In FIG. 13E , it shows a schematic view of the magnetic material substrate 136 not covered with the insulating layer 133. In this figure, the two connecting conductive elements 139' of the two pins 137 are used to connect the inductor coil 138 and the conductor 139. FIG. 13F is a perspective view of the internal structure of FIG. 13E , from which the winding direction of the inductor coil 138 can be seen.

The specific implementation method of this embodiment can be as follows. The inductance coil 138 is manufactured on the magnetic material substrate 136 by means of drilling through holes and through hole electroplating. Then apply a viscous insulating layer 133 on the upper surface of the magnetic material substrate 136, then press the first conductor layer 134 on the surface of the magnetic material substrate 136, and then obtain the conductor 139 by drilling through holes and electroplating through holes, This move is similar to the production process of PCB.

And, as previously mentioned, it can be seen from the figure that at least a part or all of the pin 135 of the connecting conductor is isolated from the pin 137 of the pin conductor, that is, at least a part or all of the pin 135 of the connecting conductor There is no direct physical and electrical connection with the pin 137 of the pin conductor on the outer surface, and the connection is through a circuit board or other electronic components, such as the integrated circuit 131 , capacitor 132 and other indirect connections.

In a word, the third embodiment to the fifth embodiment all use the magnetic material of the inductor as the substrate of the entire point-of-load DC converter. The upper surface of the inductive magnetic material substrate as the body of the inductive element is coated with a first conductor layer, which is used to connect the electrical signals of each electronic component. The electronic component includes an inductor, a resistor, a capacitor, a field effect transistor, and a control One of the chip and an integrated circuit, and the integrated circuit is obtained by integrating at least two of an inductor, a resistor, a capacitor, a field effect transistor, and a control chip, and the electronic component and the first conductive layer The connection can be realized by surface mount or wire bond. The lower surface of the inductance is the output and input ends of the electrical signals of the point-of-load DC converter, that is, the pins of the point-of-load DC converter, which are used for soldering to a circuit board (ie, the first carrier of the foregoing embodiments). superior. The upper and lower surfaces of the inductor are connected by conductors in the first conductor layer. It should be emphasized that if electronic components such as capacitors and resistors are integrated in the point-of-load DC converter, it will be more conducive to reducing the influence of parasitic parameters inside the point-of-load DC converter, so better electrical performance can be obtained , especially for small high-frequency point-of-load DC converters.

The sixth embodiment of the present invention also applies the features described in the first embodiment to a DC converter, and its related diagrams are shown in FIG. 8A and FIG. 8B . In this embodiment, a DC converter 80 may also be connected to the first carrier (here, a circuit board, not shown). The DC converter 80 of this embodiment includes a second carrier, an inductive element 89a, a first electronic element 85, two second electronic elements 89b and two third electronic elements 89c. The second carrier can be, for example, a The second circuit board 88 . Similar to that described in the first embodiment, the surface of the first electronic component 85 is also coated with a first conductor layer to provide the electrical connection between the DC converter and the first carrier, wherein the first conductor layer includes a connecting conductor and a Pinned conductor 84 , wherein the connecting conductor has several pins 81 , 82 , 83 , 86 , 87 . In this embodiment, the inductive element 89a, the first electronic element 85, the second electronic element 89b and the third electronic element 89c are respectively an inductor, a control chip, a capacitor and a field effect transistor.

The seventh embodiment of the present invention is also applied to a DC converter 90 with the same features as described above. As shown in Figures 9A and 9B, in this embodiment, the DC converter 90 can also be connected to a first carrier (here it is a circuit board and not shown in the figure), and the DC converter 90 includes a The second carrier, an inductive component 98a, a first electronic component 98b, two second electronic components 98c and two third electronic components 93, the second carrier is a second circuit board 97, and in the sixth embodiment Similar to the above, the surface of the third electronic component 93 is coated with a first conductor layer to provide the electrical connection between the DC converter and the first carrier, wherein the first conductor layer includes a connecting conductor and a pin conductor 94, The connecting conductor has several pins 91 , 92 , 95 , 96 . In this embodiment, the inductive element 98a, the first electronic element 98b, the second electronic element 98c and the third electronic element 93 are respectively an inductor, a control chip, a capacitor and a field effect transistor.

The eighth embodiment of the present invention is shown in FIG. 10 . In this embodiment, the DC converter 100 also includes a second carrier, an inductive element 106 , a first electronic element 101 , two second electronic elements 107 and two third electronic elements 103 , 104 . In this embodiment, the second carrier is a second circuit board 102; similar to the previous embodiment, two first conductor layers 105a, 105b are coated on the surface of the electronic components 101, 103, 104 to provide the DC converter 100 and Electrical connection of a first carrier (here, a circuit board and not shown in the figure); wherein the inductive element 106, the first electronic element 101, the second electronic element 107 and the third electronic element 103, 104 are respectively Inductors, control chips, capacitors and field effect transistors.

The above-mentioned DC converters are all composed of several independent electronic components, but with the development of packaging technology, more and more electronic components can be packaged together into a single component, and then form an integrated circuit, further reducing the size of the electronic components. The volume of the element. Therefore, the aforementioned electronic component coated with the connecting conductor may also be an integrated circuit. Although the aforementioned embodiments all apply the combined circuit to the DC converter, it should be noted that the combined circuit of the present invention can be applied to other types of converters to provide a connection between the converter and the circuit board.

The present invention uses a large-area conductor layer as the pin structure, which not only helps to strengthen the heat dissipation performance of each electronic component, but also brings great help to the improvement of the overall heat dissipation performance of the DC converter. Therefore, using the connection of the present invention The structure can improve the integration degree of components of the DC converter, reduce the overall size of the DC converter, and increase its power density.

The above-mentioned embodiments are only used to illustrate the implementation of the present invention and explain the technical features of the present invention, and are not intended to limit the scope of the present invention. Any changes or equivalence arrangements that can be easily accomplished by those skilled in the art belong to the scope of the present invention, and the scope of rights of the present invention should be determined by the claims.

Claims (13)

1. a POL assembly, comprises:

One inductance, there is a upper surface, a lower surface relative with this upper surface and connect multiple sides of this upper surface and this lower surface, on this upper surface, have multiple conductors, wherein each conductor of at least a portion in the plurality of conductor is extended on this lower surface via a side of the plurality of side by this upper surface;

At least one input capacitance, is electrically connected to the plurality of conductor; And

At least one switch element, is arranged at the top of this upper surface of this inductance, and is electrically connected by the plurality of conductor on this upper surface of this inductance and this inductance;

Wherein, on this lower surface of this inductance, there are the multiple pins that are connected to the plurality of conductor to be electrically connected to a carrier.

2. POL assembly as claimed in claim 1, it is characterized in that, also comprise an intermediary circuit plate, this intermediary circuit plate is arranged between this inductance and this at least one switch element, and being electrically connected to this inductance and this at least one switch element, this intermediary circuit plate has a first surface and a second surface.

3. POL assembly as claimed in claim 2, is characterized in that, this at least one switch element is arranged on this intermediary circuit plate and by this intermediary circuit plate and is electrically connected to this inductance.

4. POL assembly as claimed in claim 2, is characterized in that, this at least one input capacitance is arranged on the second surface adjacent with this inductance of this intermediary circuit plate, and is electrically connected to this inductance by this intermediary circuit plate.

5. POL assembly as claimed in claim 2, is characterized in that, this at least one input capacitance is arranged on this first surface relative with this inductance of this intermediary circuit plate, and is electrically connected on this inductance by this intermediary circuit plate.

6. POL assembly as claimed in claim 1, is characterized in that, this at least one input capacitance is arranged at a side of this inductance, and is electrically connected to this inductance by the plurality of conductor on this side.

7. POL assembly as claimed in claim 1, is characterized in that, also comprises an integrated circuit (IC) controller, in order to control this at least one switch element, and is arranged on this upper surface of this inductance.

8. POL assembly as claimed in claim 7, is characterized in that, this integrated circuit controller and this at least one switch element are integrated in an integrated circuit package body.

9. POL assembly as claimed in claim 2, is characterized in that, also comprises an integrated circuit controller, in order to control this at least one switch element, and is arranged on this intermediary circuit plate.

10. POL assembly as claimed in claim 2, is characterized in that, also comprises an output capacitance, is arranged on this second surface adjacent with this inductance of this intermediary circuit plate, and is electrically connected to this inductance by this intermediary circuit plate.

11. POL assemblies as claimed in claim 2, is characterized in that, also comprise an output capacitance, are arranged on this second surface relative with this inductance of this intermediary circuit plate, and are electrically connected to this inductance by this intermediary circuit plate.

12. POL assemblies as claimed in claim 1, is characterized in that, have also comprised an output capacitance, are arranged at a side of this inductance, and are electrically connected to this inductance by the plurality of conductor on this side.

13. POL assemblies as claimed in claim 1, is characterized in that, also comprise a connection conducting element and run through this inductance, and be electrically connected the plurality of conductor on this upper surface and this lower surface.