CN102392213A - Technological method for strengthening surface hardness of copper or copper alloy - Google Patents

Abstract

The invention discloses a technological method for strengthening the surface hardness of copper or copper alloy, belonging to the field of material surface treatment. The method comprises the steps of: cleaning the surface of the copper or copper alloy; tinplating on surfaces of the parts of the copper or copper alloy and ensuring that the thickness h of the tin layer is greater than or equal to 20 microns and less than or equal to 50 microns; carrying out heat-treatment diffusion on the tinplated parts of the copper or copper alloy in an air furnace for 100-150min at a temperature of 420+/-1DEG C so as to heat up along with the furnace; and carrying air cooling after the diffusion. The technological method has the beneficial effects that: as the heat-treatment diffusion is carried out after the tinplating, a tin permeation layer with a thickness greater than 10 microns is formed on the surface of the copper or copper alloy; and the hardness of the tin permeation layer is greater than or equal to 700HV0.05, so that the aim of strengthening the surface hardness of the copper or copper alloy is achieved.

Description

A kind of process method that is used to strengthen copper or copper alloy surface hardness

Affiliated field:

The invention belongs to the material surface process field, be specifically related to a kind of process method to copper or the reinforcement of copper alloy surface stannize.

Prior art:

Copper or copper alloy have high electroconductibility, thermal conductivity, good solidity to corrosion, and good formability is prone to performances such as connection, is widely used in aviation and other industrial sectors.Because its hardness is not high, limited in the application of certain field.

Retrieve journal both domestic and external, also do not have special to the data that improves copper or Cu alloy material hardness.

Summary of the invention:

The objective of the invention is: propose a kind of process method that is used to strengthen copper or copper alloy surface hardness.

A kind of process method that is used to strengthen copper or copper alloy surface hardness comprises the steps:

Step 1: clean copper or copper alloy surface;

Step 2: zinc-plated at copper or copper alloy piece surface, make tin thickness h satisfy: 20 μ m≤h≤50 μ m;

Step 3: copper after zinc-plated or copper alloy part are heat-treated diffusion, diffusion temperature in air furnace: 420 ± 10 ℃, diffusion time: 100～150 minutes, heat up with stove;

Step 4: after the diffusion, air cooling.

The invention has the beneficial effects as follows: the process method that is used to strengthen copper or copper alloy surface hardness that is proposed; Owing to after zinc-plated, heat-treat diffusion; Can make copper or copper alloy surface form the stannize layer of a layer thickness, this stannize layer hardness>=700HV greater than 10 μ m _0.05Thereby, reach the purpose of strengthening copper or copper alloy surface hardness.

Description of drawings:

Fig. 1 is among the embodiment 1, to QAl10-3-1.5 xantal pin carry out surperficial stannize strengthen back 500 * stannize layer pattern;

Fig. 2 is among the embodiment 1, to QAl10-3-1.5 xantal pin carry out surperficial stannize strengthen back 2000 * stannize layer pattern;

Fig. 3 is among the embodiment 1, QAl10-3-1.5 xantal pin is carried out surperficial stannize strengthen back stannize layer difference gamma spectrometry figure as a result;

Fig. 4 is among the embodiment 1, QAl10-3-1.5 xantal pin is carried out surperficial stannize strengthen back stannize layer tin concentration gradient line scanning result figure.

Embodiment:

Embodiment 1:

Process method among this embodiment is used to handle a QAl10-3-1.5 xantal pin, comprises the steps:

Step 1: gasoline cleans QAl10-3-1.5 xantal pin;

Step 2: adopt acidic solution, zinc-plated in QAl10-3-1.5 xantal pin surfaces, make that tin thickness h is 35 μ m;

Step 3: the QAl10-3-1.5 xantal pin after zinc-plated is heat-treated diffusion, diffusion temperature in air furnace: 410 ℃, diffusion time: 110 minutes, heat up with stove;

Step 4: after the diffusion, air cooling.

Among this embodiment, hardness was HB160 before QAl10-3-1.5 xantal pin was handled, and handling the back surface hardness is 754HV _0.05, obviously improved piece surface hardness.

Use the QAl10-3-1.5 xantal pin among this embodiment to carry out the frictional behaviour test.On wear-resistant trier, test, with before handling with handle after QAl10-3-1.5 xantal pin all make v type piece sample, friction velocity 0.1m/s.The result: 150kgf load focuses in the water to be tested, the QAl10-3-1.5 xantal pin before handling, and moment burns; QAl10-3-1.5 xantal pin after the processing, 12 hours burns.In oil, load continuously, the QAl10-3-1.5 xantal pin before handling is burnt during 270kgf, and the QAl10-3-1.5 xantal pin after the processing still moves normal when reaching trier limit 2500kgf.

Simultaneously, the QAl10-3-1.5 xantal pin after the processing in this instance is carried out metallographic detects, Fig. 1 and Fig. 2 be respectively 500 * and 2000 * stannize layer pattern, Fig. 3 is stannize layer difference gamma spectrometry figure as a result; Can find out that part top layer tin content increases greatly, Fig. 4 is a stannize layer tin concentration gradient line scanning result; Can find out that the top layer is a tin-riched layer, tin content 59%, internal layer are transition layer; Tin content 18%, the rich tin in the transition layer metallographic structure are particulate state mutually and distribute, and organize fine and closely woven.

According to technical scheme of the present invention, be process object with QAl10-3-1.5 xantal pin, carried out 9 batches of proof tests, test-results is seen table 1:

The zinc-plated diffusion test situation of table 1 copper and copper alloy surface is detailed

Claims (1)

1. a process method that is used to strengthen copper or copper alloy surface hardness comprises the steps:

Step 1: clean copper or copper alloy surface;

Step 2: zinc-plated at copper or copper alloy piece surface, make tin thickness h satisfy: 20 μ m≤h≤50 μ m;

Step 3: copper after zinc-plated or copper alloy part are heat-treated diffusion, diffusion temperature in air furnace: 420 ± 10 ℃, diffusion time: 100～150 minutes, heat up with stove;

Step 4: after the diffusion, air cooling.

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