[go: up one dir, main page]

CN102378499B - Manufacturing method of PCB (printed circuit board) solder mask two-side windowing plug hole - Google Patents

Manufacturing method of PCB (printed circuit board) solder mask two-side windowing plug hole Download PDF

Info

Publication number
CN102378499B
CN102378499B CN 201110315991 CN201110315991A CN102378499B CN 102378499 B CN102378499 B CN 102378499B CN 201110315991 CN201110315991 CN 201110315991 CN 201110315991 A CN201110315991 A CN 201110315991A CN 102378499 B CN102378499 B CN 102378499B
Authority
CN
China
Prior art keywords
sides
hole
time
pcb board
plug hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN 201110315991
Other languages
Chinese (zh)
Other versions
CN102378499A (en
Inventor
邢玉伟
易雁
曾红
曾志军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shengyi Electronics Co Ltd
Original Assignee
Dongguan Shengyi Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongguan Shengyi Electronics Co Ltd filed Critical Dongguan Shengyi Electronics Co Ltd
Priority to CN 201110315991 priority Critical patent/CN102378499B/en
Publication of CN102378499A publication Critical patent/CN102378499A/en
Application granted granted Critical
Publication of CN102378499B publication Critical patent/CN102378499B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Manufacture Or Reproduction Of Printing Formes (AREA)

Abstract

The invention relates to a method for manufacturing a PCB solder mask two-side windowing hole plugging, which comprises the following steps: step 1: providing a PCB, wherein a first through hole for plugging a hole on two sides and a second through hole for plugging no hole on two sides are formed in the PCB; step 2: and (3) welding the PCB for the first time, wherein the manufacturing process comprises the following steps: two-side windowing hole plugging → first prebaking → first exposure → first development → first postbaking, after completing the two-side windowing hole plugging, directly performing first prebaking without performing silk-screen printing ink on the surface of the PCB; and step 3: and (3) welding the PCB for the second time, wherein the manufacturing process comprises the following steps: two-sided windowless plug hole → silk screen printing ink → second pre-baking → second exposure → second developing → second post-baking. The manufacturing method of the PCB solder-resisting two-side windowing hole plugging adopts an independent hole plugging process aiming at the two-side windowing hole plugging, and effectively overcomes the defects of hole plugging punch-through, oil vomit and the like.

Description

PCB板阻焊两面开窗塞孔的制作方法Method for making window plug holes on both sides of PCB board solder resist

技术领域 technical field

本发明涉及印刷电路板(Printed Circuit Board,PCB)制作领域,尤其涉及一种PCB板阻焊两面开窗塞孔的制作方法。The invention relates to the field of printed circuit board (Printed Circuit Board, PCB) production, in particular to a production method for opening windows and plugging holes on both sides of a PCB board for solder resistance.

背景技术 Background technique

目前,具有两面开窗的PCB板在进行阻焊加工时,通常采用如下阻焊流程:塞孔→丝印油墨→预烤→曝光→显影→检板→后烤。采用该阻焊加工流程生产时,容易出现塞孔位冲穿或呕油等品质缺陷,需要加以改进。At present, when the PCB board with windows on both sides is subjected to solder resist processing, the following solder resist process is usually adopted: plugging → silk screen printing ink → pre-baking → exposure → development → board inspection → post-baking. When this solder mask process is used for production, it is easy to have quality defects such as punching through the plug hole or vomiting oil, which needs to be improved.

发明内容 Contents of the invention

因此,本发明的目的在于提供一种PCB板阻焊两面开窗塞孔的制作方法,其针对两面开窗塞孔采用单独的塞孔流程,有效改善塞孔冲穿以及呕油等缺陷。Therefore, the object of the present invention is to provide a method for manufacturing plug holes with windows on both sides of the PCB board, which adopts a separate plug hole process for the plug holes with windows on both sides, and effectively improves defects such as plug hole punching and oil vomiting.

为实现上述目的,本发明提供一种PCB板阻焊两面开窗塞孔的制作方法,包括如下步骤:In order to achieve the above object, the present invention provides a method for making window plug holes on both sides of PCB board solder resistance, comprising the following steps:

步骤1:提供PCB板,所述PCB板上设有待两面开窗塞孔的第一通孔及待两面无窗塞孔的第二通孔;Step 1: Provide a PCB board, the PCB board is provided with a first through hole to be opened on both sides of the plug hole and a second through hole to be no window plug hole on both sides;

步骤2:对所述PCB板制作第一次阻焊,制作流程为:两面开窗塞孔→第一次预烤→第一次曝光→第一次显影→第一次后烤,进行两面开窗塞处理时,采用阻焊剂对所述第一通孔进行塞孔处理,而对于所述第二通孔则不进行塞孔处理,完成两面开窗塞孔后,不对PCB板的板面进行丝印油墨而直接进行第一次预烤,经后续处理后在所述第一通孔位置形成两面开窗塞孔;Step 2: Make the first solder resist on the PCB board. The production process is: open the window plug hole on both sides → the first pre-baking → the first exposure → the first development → the first post-baking, and perform double-sided opening During the window plug treatment, the first through-hole is plugged with solder resist, but the second through-hole is not plugged. After the window plugging is completed on both sides, the PCB surface is not plugged. Screen printing ink and directly carry out the first pre-baking, and after subsequent processing, a double-sided window plug hole is formed at the position of the first through hole;

步骤3:对所述PCB板制作第二次阻焊,制作流程为:两面无窗塞孔→丝印油墨→第二次预烤→第二次曝光→第二次显影→第二次后烤,丝印油墨时,对PCB板的板面进行丝印,所采用的网版在两面开窗塞孔位置设有挡油点以防止油墨进入两面开窗塞孔内。Step 3: Make a second solder mask on the PCB board. The production process is: no window plug holes on both sides → silk screen printing ink → second pre-baking → second exposure → second development → second post-baking, When screen printing ink, screen printing is performed on the surface of the PCB board, and the screen used is provided with an oil stop at the position of the plug hole with windows on both sides to prevent ink from entering the plug hole with windows on both sides.

所述步骤2中,两面开窗塞孔时使用铝片塞孔,第一次预烤时,在70℃烤60分钟,第一次显影时,显影时间为75-90秒,显影压力控制在1.2-1.4Kg/cm2,第一次后烤时采用分段式,在75℃烤30分钟,在90℃烤30分钟,在120℃烤120分钟。In the step 2, use aluminum sheet plug holes when opening windows on both sides, bake at 70°C for 60 minutes during the first pre-baking, and develop for the first time. The developing time is 75-90 seconds, and the developing pressure is controlled at 1.2-1.4Kg/cm 2 , the first post-baking adopts segmented type, bake at 75°C for 30 minutes, bake at 90°C for 30 minutes, and bake at 120°C for 120 minutes.

所述步骤3中,丝印油墨时,所采用网版的T数为43T或48T,其中T数与目数之间的转换关系为1T=2.542目。In the step 3, when screen printing ink, the T number of the screen used is 43T or 48T, and the conversion relationship between the T number and the mesh number is 1T=2.54 2 mesh.

所述挡油点的直径比第一通孔的孔径大10mil。The diameter of the oil blocking point is 10 mil larger than the diameter of the first through hole.

本发明的有益效果:本发明的PCB板阻焊两面开窗塞孔的制作方法,通过采用分两次阻焊,以针对两面开窗塞孔采用单独的塞孔流程,有效改善塞孔冲穿以及呕油等缺陷。Beneficial effects of the present invention: the manufacturing method of the plug hole with windows on both sides of the PCB board solder mask of the present invention adopts a separate plug hole process for the plug hole with windows on both sides by using the solder mask twice, which effectively improves the punching through of the plug hole And defects such as vomiting oil.

为更进一步阐述本发明为实现预定目的所采取的技术手段及功效,请参阅以下有关本发明的详细说明与附图,相信本发明的目的、特征与特点,应当可由此得到深入且具体的了解,然而附图仅提供参考与说明用,并非用来对本发明加以限制。In order to further elaborate the technical means and effects adopted by the present invention to achieve the predetermined purpose, please refer to the following detailed description and accompanying drawings of the present invention. It is believed that the purpose, characteristics and characteristics of the present invention should be able to gain a deep and specific understanding from this , however, the accompanying drawings are provided for reference and illustration only, and are not intended to limit the present invention.

附图说明 Description of drawings

下面结合附图,通过对本发明的具体实施方式详细描述,将使本发明的技术方案及其他有益效果显而易见。The technical solutions and other beneficial effects of the present invention will be apparent through the detailed description of specific embodiments of the present invention below in conjunction with the accompanying drawings.

附图中,In the attached picture,

图1为本发明PCB板阻焊两面开窗塞孔的制作方法的流程示意图;Fig. 1 is the schematic flow sheet of the manufacturing method of opening window plug hole on both sides of PCB board solder resistance of the present invention;

图2为本发明PCB板阻焊两面开窗塞孔的制作方法各制作阶段所对应PCB板的剖面结构示意图。Fig. 2 is a schematic cross-sectional structure schematic diagram of a PCB board corresponding to each manufacturing stage of the manufacturing method of the present invention with solder-resisting holes on both sides of the PCB board.

具体实施方式 Detailed ways

如图1与图2所示,本发明PCB板阻焊两面开窗塞孔的制作方法,包括如下步骤:As shown in Fig. 1 and Fig. 2, the manufacturing method of opening a window plug hole on both sides of the PCB board solder resistance of the present invention comprises the following steps:

步骤1:提供PCB板,所述PCB板上设有待两面开窗塞孔的第一通孔11及待两面无窗塞孔的第二通孔12;Step 1: Provide a PCB board, and the PCB board is provided with a first through hole 11 to be opened with windows on both sides and a second through hole 12 to have no window plug holes on both sides;

步骤2:对所述PCB板制作第一次阻焊,制作流程为:两面开窗塞孔→第一次预烤→第一次曝光→第一次显影→第一次后烤,进行两面开窗塞处理时,采用阻焊剂对所述第一通孔11进行塞孔处理,而对于所述第二通孔12则不进行塞孔处理,完成两面开窗塞孔后,不对PCB板的板面进行丝印油墨而直接进行第一次预烤,经后续处理后在所述第一通孔11位置形成两面开窗塞孔;Step 2: Make the first solder resist on the PCB board. The production process is: open the window plug hole on both sides → the first pre-baking → the first exposure → the first development → the first post-baking, and perform double-sided opening During the window plug treatment, the first through hole 11 is plugged with solder resist, but the second through hole 12 is not plugged. After the window plug holes are opened on both sides, the PCB board The first pre-baking is directly carried out with screen printing ink on the surface, and after subsequent processing, a double-sided window plug hole is formed at the position of the first through hole 11;

步骤3:对所述PCB板制作第二次阻焊,制作流程为:两面无窗塞孔→丝印油墨→第二次预烤→第二次曝光→第二次显影→第二次后烤,丝印油墨时,对PCB板的板面进行丝印,所采用的网版在两面开窗塞孔位置设有挡油点13以防止油墨进入两面开窗塞孔内。Step 3: Make a second solder mask on the PCB board. The production process is: no window plug holes on both sides → silk screen printing ink → second pre-baking → second exposure → second development → second post-baking, During silk screen printing ink, the board surface of PCB board is carried out silk screen printing, and the screen plate that adopts is provided with oil retaining point 13 to prevent ink from entering in the two-sided window plug hole position.

所述步骤2中,两面开窗塞孔时使用铝片塞孔,第一次预烤时,在70℃烤60分钟,第一次显影时,显影时间为75-90秒,显影压力控制在1.2-1.4Kg/cm2,第一次后烤时采用分段式,在75℃烤30分钟,在90℃烤30分钟,在120℃烤120分钟。In the step 2, use aluminum sheet plug holes when opening windows on both sides, bake at 70°C for 60 minutes during the first pre-baking, and develop for the first time. The developing time is 75-90 seconds, and the developing pressure is controlled at 1.2-1.4Kg/cm2, the first post-baking adopts segmented type, bake at 75°C for 30 minutes, bake at 90°C for 30 minutes, and bake at 120°C for 120 minutes.

所述步骤3中,丝印油墨时,所采用网版的T数为43T或48T。In the step 3, when screen printing ink, the T number of the screen used is 43T or 48T.

所述挡油点13的直径比第一通孔11的孔径大10mil。The diameter of the oil blocking point 13 is 10 mil larger than the diameter of the first through hole 11 .

上述PCB板阻焊两面开窗塞孔的制作方法,通过采用分两次阻焊,以针对两面开窗塞孔采用单独的塞孔流程,有效改善塞孔冲穿以及呕油等缺陷。The above-mentioned method for manufacturing plug holes with windows on both sides of the solder mask on the PCB adopts a separate plug hole process for the plug holes with windows on both sides by dividing the solder mask into two times, so as to effectively improve defects such as plug hole punching and oil vomiting.

以上所述,对于本领域的普通技术人员来说,可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形,而所有这些改变和变形都应属于本发明后附的权利要求的保护范围。As mentioned above, for those of ordinary skill in the art, other various corresponding changes and modifications can be made according to the technical scheme and technical concept of the present invention, and all these changes and modifications should belong to the appended claims of the present invention scope of protection.

Claims (4)

1. the manufacture method of a pcb board welding resistance two sides windowed plug hole is characterized in that, comprises the steps:
Step 1: pcb board is provided, and described pcb board is provided with the first through hole for the treatment of the two sides windowed plug hole and the second through hole for the treatment of the windowless consent in two sides;
Step 2: described pcb board is made for the first time welding resistance, the making flow process is: two sides windowed plug hole → first time is pre-baked → for the first time exposure → develop for the first time → and roasting after for the first time, carrying out the two sides windows when filling in processing, adopting solder resist that described the first through hole is carried out consent processes, then not carrying out consent for described the second through hole processes, after finishing the two sides windowed plug hole, the plate face of pcb board is not carried out ink for screen printing and directly to carry out the first time pre-baked, after subsequent treatment, form the two sides windowed plug hole at described the first lead to the hole site;
Step 3: described pcb board is made for the second time welding resistance, the making flow process is: the windowless consent → ink for screen printing in two sides → second time is pre-baked → and bakes afterwards exposure → second development → second time for the second time, during ink for screen printing, plate face to pcb board carries out silk-screen, and the half tone that adopts is provided with the gear oil drop and enters in the windowed plug hole of two sides to prevent printing ink in windowed plug hole position, two sides.
2. the manufacture method of pcb board welding resistance as claimed in claim 1 two sides windowed plug hole is characterized in that, in the described step 2, use the aluminium flake consent during two sides windowed plug hole, when for the first time pre-baked, baked 60 minutes at 70 ℃, when developing for the first time, developing time is 75-90 second, development pressure is controlled at 1.2-1.4Kg/cm2, adopts segmented when roasting after the first time, bakes 30 minutes at 75 ℃, baked 30 minutes at 90 ℃, baked 120 minutes at 120 ℃.
3. the manufacture method of pcb board welding resistance as claimed in claim 1 or 2 two sides windowed plug hole is characterized in that in the described step 3, during ink for screen printing, the T number of the half tone that adopts is 43T or 48T.
4. the manufacture method of pcb board welding resistance as claimed in claim 1 two sides windowed plug hole, the diameter of described gear oil drop is than the large 10mil in the aperture of the first through hole.
CN 201110315991 2011-10-18 2011-10-18 Manufacturing method of PCB (printed circuit board) solder mask two-side windowing plug hole Active CN102378499B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201110315991 CN102378499B (en) 2011-10-18 2011-10-18 Manufacturing method of PCB (printed circuit board) solder mask two-side windowing plug hole

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201110315991 CN102378499B (en) 2011-10-18 2011-10-18 Manufacturing method of PCB (printed circuit board) solder mask two-side windowing plug hole

Publications (2)

Publication Number Publication Date
CN102378499A CN102378499A (en) 2012-03-14
CN102378499B true CN102378499B (en) 2013-03-20

Family

ID=45796192

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201110315991 Active CN102378499B (en) 2011-10-18 2011-10-18 Manufacturing method of PCB (printed circuit board) solder mask two-side windowing plug hole

Country Status (1)

Country Link
CN (1) CN102378499B (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102686031B (en) * 2012-05-25 2015-06-24 湖南鸿瑞新材料股份有限公司 Pre-windowing process of high-density interconnected PCB (printed circuit board) with buried blind hole
CN102795006B (en) * 2012-08-09 2015-07-08 皆利士多层线路版(中山)有限公司 Green oil silk-printing method for printed circuit board
CN103079362B (en) * 2012-12-25 2015-02-18 深圳市星河电路有限公司 Method for preventing oil from bleeding from solder resist ink plug hole
CN103220888B (en) * 2013-04-18 2016-03-02 梅州市志浩电子科技有限公司 Printed circuit board (PCB) mesh screen plughole method
CN104640376A (en) * 2013-11-13 2015-05-20 宏启胜精密电子(秦皇岛)有限公司 Circuit board plug hole forming method
CN103794516B (en) * 2014-01-24 2016-06-08 广州兴森快捷电路科技有限公司 A kind of encapsulating products manufacture method of ladder welding resistance
CN104411119A (en) * 2014-10-30 2015-03-11 胜宏科技(惠州)股份有限公司 Method for processing reddening of circuit board solder mask conducting holes
CN105338744B (en) * 2015-10-22 2018-11-06 江门崇达电路技术有限公司 The production method of PCB with two-sided lid oil via and spray tin surfaces processing
CN106132111A (en) * 2016-07-26 2016-11-16 江门崇达电路技术有限公司 A kind of manufacture method of the wiring board with different solder mask colors
CN108513451A (en) * 2017-02-28 2018-09-07 胜宏科技(惠州)股份有限公司 A kind of production method of the wiring board through-hole solder mask consent depth more than 80%
CN107333397A (en) * 2017-08-07 2017-11-07 胜宏科技(惠州)股份有限公司 A kind of wiring board control deeply etching method
CN110662364B (en) * 2019-11-06 2021-08-10 深南电路股份有限公司 Manufacturing method of circuit board solder mask and circuit board
CN110831336B (en) * 2019-11-11 2020-10-27 珠海崇达电路技术有限公司 Resin hole plugging method for large-aperture back drilling hole
CN111182743B (en) * 2020-01-06 2021-06-04 江门崇达电路技术有限公司 Manufacturing method of ceramic-based circuit board
CN112672544A (en) * 2020-12-31 2021-04-16 昆山苏杭电路板有限公司 Solder mask developing method for metallized hole of PCB (printed circuit board)
CN112492764B (en) * 2021-01-27 2021-04-20 四川英创力电子科技股份有限公司 Method for eliminating solder resist ink in through hole of printed circuit board
CN112930043A (en) * 2021-01-29 2021-06-08 生益电子股份有限公司 PCB ink hole plugging method and PCB
CN113747674A (en) * 2021-08-31 2021-12-03 智恩电子(大亚湾)有限公司 Thick copper plate printing method and ink
CN113966101B (en) * 2021-12-21 2022-03-18 广东科翔电子科技股份有限公司 Small pad windowing manufacturing method of high-precision Mini-LED PCB

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6735865B2 (en) * 2001-04-25 2004-05-18 Benq Corporation Flexible circuit board and method of fabricating the same
CN101378629A (en) * 2008-09-28 2009-03-04 深圳崇达多层线路板有限公司 Method for processing resistance welding milling point
CN101668390A (en) * 2009-09-22 2010-03-10 深圳崇达多层线路板有限公司 Production technology of PCB (Printed Circuit Board) solder mask
CN101868122A (en) * 2010-06-24 2010-10-20 深南电路有限公司 PCB manufacturing process and hole plugging process thereof
CN102170758A (en) * 2011-04-13 2011-08-31 深南电路有限公司 Circuit board double window resistance welding hole filling processing method and resistance welding exposure film

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6735865B2 (en) * 2001-04-25 2004-05-18 Benq Corporation Flexible circuit board and method of fabricating the same
CN101378629A (en) * 2008-09-28 2009-03-04 深圳崇达多层线路板有限公司 Method for processing resistance welding milling point
CN101668390A (en) * 2009-09-22 2010-03-10 深圳崇达多层线路板有限公司 Production technology of PCB (Printed Circuit Board) solder mask
CN101868122A (en) * 2010-06-24 2010-10-20 深南电路有限公司 PCB manufacturing process and hole plugging process thereof
CN102170758A (en) * 2011-04-13 2011-08-31 深南电路有限公司 Circuit board double window resistance welding hole filling processing method and resistance welding exposure film

Also Published As

Publication number Publication date
CN102378499A (en) 2012-03-14

Similar Documents

Publication Publication Date Title
CN102378499B (en) Manufacturing method of PCB (printed circuit board) solder mask two-side windowing plug hole
CN102387671A (en) Manufacturing method of window plug hole on one side of HASL
CN105228353B (en) A kind of printed circuit board solder mask jack process
CN103079362B (en) Method for preventing oil from bleeding from solder resist ink plug hole
CN102510664A (en) The method to solve the oil thin PCB board circuit
CN110881247B (en) Simple and reliable LED lamp panel ink color control method
WO2017071393A1 (en) Printed circuit board and fabrication method therefor
WO2015110003A1 (en) Manufacturing method for ladder solder mask package product
CN102751241B (en) Method for manufacturing array substrate via hole and array substrate manufacturing process
CN101772278A (en) PCB (Printed Circuit Board) screen printing taphole process, screen printing taphole screen plate and manufacture method thereof
CN104684260B (en) A kind of method for improving asymmetric pressing structure circuit slab warping
CN108934128A (en) Prevent the method, printed wiring board and computer installation of anti-solder ink plug-hole
CN108055776A (en) A kind of improvement welding resistance consent oil spilling production method
CN108513451A (en) A kind of production method of the wiring board through-hole solder mask consent depth more than 80%
CN103085451B (en) A kind of screen printing screens, make PCB method and be printed with the PCB of peelable glue
CN104640380A (en) Non-plating through hole with hole ring making method and printed circuit board manufacturing method
CN105376941B (en) The processing method of printed circuit board
CN104902695A (en) Solder resist manufacturing method of windowing taphole design
CN105338744A (en) Manufacturing method for PCB with double-sided oil-coating via hole and tin spraying surface treatment
CN102548232B (en) Method for preventing circuit board solder mask ink from blocking hole
CN104582300A (en) A circuit board solder resist film and circuit board manufacturing method
CN104427785B (en) The preparation method and printed circuit board (PCB) of different pore size blind hole
WO2018000875A1 (en) Package substrate and manufacturing method therefor
TW201906515A (en) Fabrication method of circuit board
CN104883818B (en) The alignment method of printed wiring board

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee
CP03 Change of name, title or address

Address after: 523127 Dongcheng District City, Guangdong province (with sand) science and Technology Industrial Park Road, No. 33 vibration with the number of

Patentee after: Shengyi electronic Limited by Share Ltd

Address before: 523000 Dongcheng District (Dongguan) science and Technology Industrial Park, Guangdong, China

Patentee before: Dongguan Shengyi Electronics Ltd.