CN102378499B - Manufacturing method of PCB (printed circuit board) solder mask two-side windowing plug hole - Google Patents
Manufacturing method of PCB (printed circuit board) solder mask two-side windowing plug hole Download PDFInfo
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- CN102378499B CN102378499B CN 201110315991 CN201110315991A CN102378499B CN 102378499 B CN102378499 B CN 102378499B CN 201110315991 CN201110315991 CN 201110315991 CN 201110315991 A CN201110315991 A CN 201110315991A CN 102378499 B CN102378499 B CN 102378499B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 20
- 238000000034 method Methods 0.000 claims abstract description 19
- 238000007650 screen-printing Methods 0.000 claims abstract description 17
- 238000003466 welding Methods 0.000 claims abstract 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000012208 gear oil Substances 0.000 claims 2
- 238000007639 printing Methods 0.000 claims 1
- 230000007547 defect Effects 0.000 abstract description 5
- 230000008673 vomiting Effects 0.000 abstract description 5
- 210000004916 vomit Anatomy 0.000 abstract 1
- 206010047700 Vomiting Diseases 0.000 description 4
- 238000004080 punching Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
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Abstract
Description
技术领域 technical field
本发明涉及印刷电路板(Printed Circuit Board,PCB)制作领域,尤其涉及一种PCB板阻焊两面开窗塞孔的制作方法。The invention relates to the field of printed circuit board (Printed Circuit Board, PCB) production, in particular to a production method for opening windows and plugging holes on both sides of a PCB board for solder resistance.
背景技术 Background technique
目前,具有两面开窗的PCB板在进行阻焊加工时,通常采用如下阻焊流程:塞孔→丝印油墨→预烤→曝光→显影→检板→后烤。采用该阻焊加工流程生产时,容易出现塞孔位冲穿或呕油等品质缺陷,需要加以改进。At present, when the PCB board with windows on both sides is subjected to solder resist processing, the following solder resist process is usually adopted: plugging → silk screen printing ink → pre-baking → exposure → development → board inspection → post-baking. When this solder mask process is used for production, it is easy to have quality defects such as punching through the plug hole or vomiting oil, which needs to be improved.
发明内容 Contents of the invention
因此,本发明的目的在于提供一种PCB板阻焊两面开窗塞孔的制作方法,其针对两面开窗塞孔采用单独的塞孔流程,有效改善塞孔冲穿以及呕油等缺陷。Therefore, the object of the present invention is to provide a method for manufacturing plug holes with windows on both sides of the PCB board, which adopts a separate plug hole process for the plug holes with windows on both sides, and effectively improves defects such as plug hole punching and oil vomiting.
为实现上述目的,本发明提供一种PCB板阻焊两面开窗塞孔的制作方法,包括如下步骤:In order to achieve the above object, the present invention provides a method for making window plug holes on both sides of PCB board solder resistance, comprising the following steps:
步骤1:提供PCB板,所述PCB板上设有待两面开窗塞孔的第一通孔及待两面无窗塞孔的第二通孔;Step 1: Provide a PCB board, the PCB board is provided with a first through hole to be opened on both sides of the plug hole and a second through hole to be no window plug hole on both sides;
步骤2:对所述PCB板制作第一次阻焊,制作流程为:两面开窗塞孔→第一次预烤→第一次曝光→第一次显影→第一次后烤,进行两面开窗塞处理时,采用阻焊剂对所述第一通孔进行塞孔处理,而对于所述第二通孔则不进行塞孔处理,完成两面开窗塞孔后,不对PCB板的板面进行丝印油墨而直接进行第一次预烤,经后续处理后在所述第一通孔位置形成两面开窗塞孔;Step 2: Make the first solder resist on the PCB board. The production process is: open the window plug hole on both sides → the first pre-baking → the first exposure → the first development → the first post-baking, and perform double-sided opening During the window plug treatment, the first through-hole is plugged with solder resist, but the second through-hole is not plugged. After the window plugging is completed on both sides, the PCB surface is not plugged. Screen printing ink and directly carry out the first pre-baking, and after subsequent processing, a double-sided window plug hole is formed at the position of the first through hole;
步骤3:对所述PCB板制作第二次阻焊,制作流程为:两面无窗塞孔→丝印油墨→第二次预烤→第二次曝光→第二次显影→第二次后烤,丝印油墨时,对PCB板的板面进行丝印,所采用的网版在两面开窗塞孔位置设有挡油点以防止油墨进入两面开窗塞孔内。Step 3: Make a second solder mask on the PCB board. The production process is: no window plug holes on both sides → silk screen printing ink → second pre-baking → second exposure → second development → second post-baking, When screen printing ink, screen printing is performed on the surface of the PCB board, and the screen used is provided with an oil stop at the position of the plug hole with windows on both sides to prevent ink from entering the plug hole with windows on both sides.
所述步骤2中,两面开窗塞孔时使用铝片塞孔,第一次预烤时,在70℃烤60分钟,第一次显影时,显影时间为75-90秒,显影压力控制在1.2-1.4Kg/cm2,第一次后烤时采用分段式,在75℃烤30分钟,在90℃烤30分钟,在120℃烤120分钟。In the step 2, use aluminum sheet plug holes when opening windows on both sides, bake at 70°C for 60 minutes during the first pre-baking, and develop for the first time. The developing time is 75-90 seconds, and the developing pressure is controlled at 1.2-1.4Kg/cm 2 , the first post-baking adopts segmented type, bake at 75°C for 30 minutes, bake at 90°C for 30 minutes, and bake at 120°C for 120 minutes.
所述步骤3中,丝印油墨时,所采用网版的T数为43T或48T,其中T数与目数之间的转换关系为1T=2.542目。In the step 3, when screen printing ink, the T number of the screen used is 43T or 48T, and the conversion relationship between the T number and the mesh number is 1T=2.54 2 mesh.
所述挡油点的直径比第一通孔的孔径大10mil。The diameter of the oil blocking point is 10 mil larger than the diameter of the first through hole.
本发明的有益效果:本发明的PCB板阻焊两面开窗塞孔的制作方法,通过采用分两次阻焊,以针对两面开窗塞孔采用单独的塞孔流程,有效改善塞孔冲穿以及呕油等缺陷。Beneficial effects of the present invention: the manufacturing method of the plug hole with windows on both sides of the PCB board solder mask of the present invention adopts a separate plug hole process for the plug hole with windows on both sides by using the solder mask twice, which effectively improves the punching through of the plug hole And defects such as vomiting oil.
为更进一步阐述本发明为实现预定目的所采取的技术手段及功效,请参阅以下有关本发明的详细说明与附图,相信本发明的目的、特征与特点,应当可由此得到深入且具体的了解,然而附图仅提供参考与说明用,并非用来对本发明加以限制。In order to further elaborate the technical means and effects adopted by the present invention to achieve the predetermined purpose, please refer to the following detailed description and accompanying drawings of the present invention. It is believed that the purpose, characteristics and characteristics of the present invention should be able to gain a deep and specific understanding from this , however, the accompanying drawings are provided for reference and illustration only, and are not intended to limit the present invention.
附图说明 Description of drawings
下面结合附图,通过对本发明的具体实施方式详细描述,将使本发明的技术方案及其他有益效果显而易见。The technical solutions and other beneficial effects of the present invention will be apparent through the detailed description of specific embodiments of the present invention below in conjunction with the accompanying drawings.
附图中,In the attached picture,
图1为本发明PCB板阻焊两面开窗塞孔的制作方法的流程示意图;Fig. 1 is the schematic flow sheet of the manufacturing method of opening window plug hole on both sides of PCB board solder resistance of the present invention;
图2为本发明PCB板阻焊两面开窗塞孔的制作方法各制作阶段所对应PCB板的剖面结构示意图。Fig. 2 is a schematic cross-sectional structure schematic diagram of a PCB board corresponding to each manufacturing stage of the manufacturing method of the present invention with solder-resisting holes on both sides of the PCB board.
具体实施方式 Detailed ways
如图1与图2所示,本发明PCB板阻焊两面开窗塞孔的制作方法,包括如下步骤:As shown in Fig. 1 and Fig. 2, the manufacturing method of opening a window plug hole on both sides of the PCB board solder resistance of the present invention comprises the following steps:
步骤1:提供PCB板,所述PCB板上设有待两面开窗塞孔的第一通孔11及待两面无窗塞孔的第二通孔12;Step 1: Provide a PCB board, and the PCB board is provided with a first through
步骤2:对所述PCB板制作第一次阻焊,制作流程为:两面开窗塞孔→第一次预烤→第一次曝光→第一次显影→第一次后烤,进行两面开窗塞处理时,采用阻焊剂对所述第一通孔11进行塞孔处理,而对于所述第二通孔12则不进行塞孔处理,完成两面开窗塞孔后,不对PCB板的板面进行丝印油墨而直接进行第一次预烤,经后续处理后在所述第一通孔11位置形成两面开窗塞孔;Step 2: Make the first solder resist on the PCB board. The production process is: open the window plug hole on both sides → the first pre-baking → the first exposure → the first development → the first post-baking, and perform double-sided opening During the window plug treatment, the first through
步骤3:对所述PCB板制作第二次阻焊,制作流程为:两面无窗塞孔→丝印油墨→第二次预烤→第二次曝光→第二次显影→第二次后烤,丝印油墨时,对PCB板的板面进行丝印,所采用的网版在两面开窗塞孔位置设有挡油点13以防止油墨进入两面开窗塞孔内。Step 3: Make a second solder mask on the PCB board. The production process is: no window plug holes on both sides → silk screen printing ink → second pre-baking → second exposure → second development → second post-baking, During silk screen printing ink, the board surface of PCB board is carried out silk screen printing, and the screen plate that adopts is provided with oil retaining point 13 to prevent ink from entering in the two-sided window plug hole position.
所述步骤2中,两面开窗塞孔时使用铝片塞孔,第一次预烤时,在70℃烤60分钟,第一次显影时,显影时间为75-90秒,显影压力控制在1.2-1.4Kg/cm2,第一次后烤时采用分段式,在75℃烤30分钟,在90℃烤30分钟,在120℃烤120分钟。In the step 2, use aluminum sheet plug holes when opening windows on both sides, bake at 70°C for 60 minutes during the first pre-baking, and develop for the first time. The developing time is 75-90 seconds, and the developing pressure is controlled at 1.2-1.4Kg/cm2, the first post-baking adopts segmented type, bake at 75°C for 30 minutes, bake at 90°C for 30 minutes, and bake at 120°C for 120 minutes.
所述步骤3中,丝印油墨时,所采用网版的T数为43T或48T。In the step 3, when screen printing ink, the T number of the screen used is 43T or 48T.
所述挡油点13的直径比第一通孔11的孔径大10mil。The diameter of the oil blocking point 13 is 10 mil larger than the diameter of the first through
上述PCB板阻焊两面开窗塞孔的制作方法,通过采用分两次阻焊,以针对两面开窗塞孔采用单独的塞孔流程,有效改善塞孔冲穿以及呕油等缺陷。The above-mentioned method for manufacturing plug holes with windows on both sides of the solder mask on the PCB adopts a separate plug hole process for the plug holes with windows on both sides by dividing the solder mask into two times, so as to effectively improve defects such as plug hole punching and oil vomiting.
以上所述,对于本领域的普通技术人员来说,可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形,而所有这些改变和变形都应属于本发明后附的权利要求的保护范围。As mentioned above, for those of ordinary skill in the art, other various corresponding changes and modifications can be made according to the technical scheme and technical concept of the present invention, and all these changes and modifications should belong to the appended claims of the present invention scope of protection.
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Address after: 523127 Dongcheng District City, Guangdong province (with sand) science and Technology Industrial Park Road, No. 33 vibration with the number of Patentee after: Shengyi electronic Limited by Share Ltd Address before: 523000 Dongcheng District (Dongguan) science and Technology Industrial Park, Guangdong, China Patentee before: Dongguan Shengyi Electronics Ltd. |