CN102378414B - Micro-heater with temperature monitoring function - Google Patents
Micro-heater with temperature monitoring function Download PDFInfo
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- CN102378414B CN102378414B CN 201010250663 CN201010250663A CN102378414B CN 102378414 B CN102378414 B CN 102378414B CN 201010250663 CN201010250663 CN 201010250663 CN 201010250663 A CN201010250663 A CN 201010250663A CN 102378414 B CN102378414 B CN 102378414B
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- 238000012544 monitoring process Methods 0.000 title claims abstract description 24
- 238000010438 heat treatment Methods 0.000 claims abstract description 126
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- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- 229910052715 tantalum Inorganic materials 0.000 claims description 5
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical group [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 5
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 claims description 4
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 3
- 229920005591 polysilicon Polymers 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 229910000623 nickel–chromium alloy Inorganic materials 0.000 claims description 2
- 239000006185 dispersion Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
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- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
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Abstract
一种具有温度监控功能的微加热器,包括:一芯片、一加热片、一第一加热焊垫、一第二加热焊垫、一测温电阻以及一辐射放射层。该加热片设置于芯片上且外缘形成有两导通端。该第一加热焊垫与第二加热焊垫设置于加热片外的芯片上,第一加热焊垫与第二加热焊垫分别电性连接于加热片的两导通端。该测温电阻一端连接于第一加热焊垫。该辐射放射层设置于芯片上且覆盖加热片。藉此,使微加热器可依据流经测温电阻的电流,来判断微加热器目前的温度,进而达到温度监控的功能。
A micro heater with a temperature monitoring function comprises: a chip, a heating plate, a first heating pad, a second heating pad, a temperature measuring resistor and a radiation emission layer. The heating plate is arranged on the chip and has two conducting ends formed on the outer edge. The first heating pad and the second heating pad are arranged on the chip outside the heating plate, and the first heating pad and the second heating pad are electrically connected to the two conducting ends of the heating plate respectively. One end of the temperature measuring resistor is connected to the first heating pad. The radiation emission layer is arranged on the chip and covers the heating plate. Thereby, the micro heater can judge the current temperature of the micro heater according to the current flowing through the temperature measuring resistor, thereby achieving the function of temperature monitoring.
Description
技术领域 technical field
本发明有关一种微加热器,尤指一种具有温度监控功能的微加热器。The invention relates to a micro heater, in particular to a micro heater with a temperature monitoring function.
背景技术 Background technique
加热器的类型众多,而加热器通常会外接温度传感器,藉以控制加热器的温度。随着科技的飞速成长,加热器渐渐朝向微型化发展,但是,加热器的温度控制还是须由外接的温度传感器来监控。此易造成使用上的困扰,并且所需成本较高。There are many types of heaters, and the heater is usually connected with an external temperature sensor to control the temperature of the heater. With the rapid development of technology, heaters are gradually developing toward miniaturization. However, the temperature control of the heater still needs to be monitored by an external temperature sensor. This is easy to cause trouble in use, and the required cost is relatively high.
本发明人有感上述缺点的可改善,乃特潜心研究并配合学理的运用,终于提出一种设计合理且有效改善上述缺点的本发明。The inventor of the present invention feels that the above-mentioned shortcomings can be improved, so he devoted himself to research and combined with the application of theories, and finally proposed an invention with reasonable design and effective improvement of the above-mentioned shortcomings.
发明内容 Contents of the invention
本发明主要目的,在于提供一种微加热器,并且该微加热器具有温度监控功能。The main purpose of the present invention is to provide a micro heater, and the micro heater has a temperature monitoring function.
为达上述的目的,本发明提供一种具有温度监控功能的微加热器,包括:一芯片;一加热片,其设置于该芯片上,该加热片外缘形成有两导通端;一第一加热焊垫与一第二加热焊垫,其设置于该加热片外的该芯片上,该第一加热焊垫与该第二加热焊垫分别电性连接于该加热片的该两导通端;一测温电阻,其一端连接于该第一加热焊垫;以及一辐射放射层,其设置于该芯片上且覆盖该加热片。In order to achieve the above-mentioned purpose, the present invention provides a micro-heater with temperature monitoring function, comprising: a chip; a heating plate, which is arranged on the chip, and the outer edge of the heating plate is formed with two conducting ends; a first A heating pad and a second heating pad are arranged on the chip outside the heating chip, and the first heating pad and the second heating pad are respectively electrically connected to the two conductions of the heating chip. end; a temperature measuring resistor, one end of which is connected to the first heating pad; and a radiation emitting layer, which is arranged on the chip and covers the heating sheet.
本发明另提供一种具有温度监控功能的微加热器,包括:一芯片;一加热片,其设置于该芯片上,该加热片外缘形成有两导通端;一第一加热焊垫与一第二加热焊垫,其设置于该加热片外的该芯片上,该第一加热焊垫与该第二加热焊垫分别电性连接于该加热片的该两导通端;一第一测温电阻,其一端连接于该第一加热焊垫;一第二测温电阻,其一端连接于该第二加热焊垫,该第二测温电阻的电阻值大于该第一测温电阻的电阻值;以及一辐射放射层,其设置于该芯片上且覆盖该加热片。The present invention also provides a micro-heater with a temperature monitoring function, comprising: a chip; a heating chip, which is arranged on the chip, and the outer edge of the heating chip is formed with two conducting ends; a first heating pad and a second heating pad, which is arranged on the chip outside the heating sheet, and the first heating pad and the second heating pad are respectively electrically connected to the two conductive ends of the heating sheet; a first A temperature-measuring resistor, one end of which is connected to the first heating pad; a second temperature-measuring resistor, one end of which is connected to the second heating pad, and the resistance value of the second temperature-measuring resistor is greater than that of the first temperature-measuring resistor resistance value; and a radiation emission layer, which is arranged on the chip and covers the heating chip.
本发明具有下述有益的效果:The present invention has following beneficial effect:
本发明设有测温电阻,藉以使微加热器可依据流经测温电阻的电流,来判断微加热器目前的温度,进而达到温度监控的功能。The present invention is equipped with a temperature measuring resistor, so that the micro heater can judge the current temperature of the micro heater according to the current flowing through the temperature measuring resistor, thereby achieving the function of temperature monitoring.
为使能更进一步了解本发明的特征及技术内容,请参阅以下有关本发明的详细说明与附图,但是说明书与附图仅用来说明本发明,而非对本发明的保护范围作任何的限制。In order to enable a further understanding of the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention, but the description and drawings are only used to illustrate the present invention, not to limit the protection scope of the present invention .
附图说明 Description of drawings
图1为本发明具有温度监控功能的微加热器俯视示意图。Fig. 1 is a schematic top view of the micro heater with temperature monitoring function of the present invention.
图2为本发明具有温度监控功能的微加热器侧视示意图。Fig. 2 is a schematic side view of the micro heater with temperature monitoring function of the present invention.
符号说明Symbol Description
1芯片 11薄膜1 chip 11 film
2加热片 21导通端2
22缺口 23路径22
231子路径 24缝隙231
25突缘 3第一加热焊垫25 lugs 3 first heating pads
31测温焊垫 4第二加热焊垫31 temperature measuring pad 4 second heating pad
41测温焊垫 5第一测温电阻41 Temperature measuring
6第二测温电阻 7辐射放射层6 Second
8通道8 channels
具体实施方式 Detailed ways
请参阅图1和图2,其为本发明的较佳实施例,本发明为一种具有温度监控功能的微加热器,其包括:一芯片1、一加热片2、一第一加热焊垫3、一第二加热焊垫4、一第一测温电阻5、一第二测温电阻6以及一辐射放射层7。其中,加热片2、第一加热焊垫3、第二加热焊垫4、第一测温电阻5以及第二测温电阻6设置于芯片1与辐射放射层7之间。其中,该芯片1于中央处形成一薄膜11。Please refer to Fig. 1 and Fig. 2, it is a preferred embodiment of the present invention, and the present invention is a kind of micro-heater with temperature monitoring function, and it comprises: a
该加热片2设置于芯片1的薄膜11上,加热片2外缘形成有两导通端21。加热片2的两端缘向内交错地凹设数个缺口22,缺口22呈长条状且相互平行,使加热片2形成数条相连接的路径23。相连接的该些路径23的最前端与最末端分别连接于两导通端21。该些路径23各形成有一缝隙24,缝隙24呈长条状且平行于缺口22,该些路径23分别经由缝隙24以形成两子路径231;藉此,当有电流流经路径23时,电流可更为均匀的分散于两子路径231中。The
再者,加热片2的外型可为方型,两导通端21由加热片2一侧的两角所延伸形成,且加热片2的材质可为铂或多晶硅。本发明以上述形状和材质为例,但实际应用并不以此为限。Furthermore, the shape of the
该第一加热焊垫3与第二加热焊垫4设置于加热片2外的芯片1上,且对向地设置于加热片2外侧,第一加热焊垫3与第二加热焊垫4的内缘平行于加热片2的外缘。第一加热焊垫3与第二加热焊垫4之间形成两通道8,且该两通道8分别连通于加热片2两端缘的缺口22。第一加热焊垫3与第二加热焊垫4分别连接于加热片2的两导通端21;藉此,使加热片2可电性连接于第一加热焊垫3与第二加热焊垫4。The first heating pad 3 and the second heating pad 4 are arranged on the
再者,第一加热焊垫3与第二加热焊垫4可连接于一外部电源,藉以产生电流。第一加热焊垫3与第二加热焊垫4的材质可为铝或金,但并不以此为限。Furthermore, the first heating pad 3 and the second heating pad 4 can be connected to an external power source to generate current. The material of the first heating pad 3 and the second heating pad 4 can be aluminum or gold, but not limited thereto.
第一测温电阻5一端连接于第一加热焊垫3,第二测温电阻6一端连接于第二加热焊垫4。第二测温电阻6的电阻值大于第一测温电阻5的电阻值,且第一测温电阻5与第二测温电阻6的电阻值为定值,其皆不会随着温度变化而改变。而第一测温电阻5与第二测温电阻6可选择性地使用其中一个;藉此,当电流流经第一测温电阻5或第二测温电阻6时,可经由此电流大小来判断微加热器目前的温度值,进而达到温度监控的功能。One end of the first
其中,该第一测温电阻5与第二测温电阻6的材质为钽、氮化钽或镍铬合金。再者,可进一步将第一测温电阻5的材质限定为钽,第二测温电阻6的材质限定为氮化钽。并且,第二测温电阻6可为交指形测温电阻。本发明以上述形状和材质为例,但实际应用并不以此为限。Wherein, the first
该辐射放射层7设置于芯片1上,且覆盖整个加热片2,藉以达到高辐射放射。辐射放射层7的材质可为二氧化硅或氮化硅,并可镀上高放射率薄膜,但并不以此为限。The
此外,该加热片2外缘可进一步形成有两突缘25。该第一加热焊垫3与第二加热焊垫4各进一步具有一测温焊垫31、41,该两测温焊垫31、41分别连接于第一测温电阻5的另一端以及第二测温电阻6的另一端,该两测温焊垫31、41分别平行地间隔设置于两突缘25外侧。其中,两突缘25由相对于导通端21的加热片2两角所延伸形成。第一加热焊垫3与第二加热焊垫4的内缘分别平行于两突缘25的侧边;藉此,当加热片2受热使突缘25抵触于第一加热焊垫3与该第二加热焊垫4的内缘时,可达到应力分散的效果。In addition, two
〔本发明的特点〕[Features of the present invention]
(1)具有温度监控功能:本发明设有第一测温电阻5与第二测温电阻6,藉以使微加热器可依据流经第一测温电阻5或第二测温电阻6的电流,来判断微加热器目前的温度,进而达到温度监控的功能。(1) With temperature monitoring function: the present invention is provided with the first
(2)电流均匀流动:本发明于每一路径23形成有缝隙24,以形成两子路径231;藉此,当有电流流经路径23时,电流可更为均匀的分散于两子路径231中。(2) Current flows evenly: the present invention forms a
(3)辐射加热效果较佳:本发明辐射放射层7覆盖于加热片2,藉以达到高辐射放射率。(3) Radiation heating effect is better: the radiation
(4)应力分散:本发明的第一加热焊垫3与第二加热焊垫4的内缘分别平行于两突缘25的侧边;藉此,当加热片2受热使突缘25抵触于第一加热焊垫3与该第二加热焊垫4的内缘时,可达到应力分散的效果。(4) Stress dispersion: the inner edges of the first heating pad 3 and the second heating pad 4 of the present invention are respectively parallel to the sides of the two
以上公开的内容,仅为本发明较佳实施例而已,自不能以此限定本发明的保护范围,因此依本发明保护范围所做的均等变化或修饰,仍属本发明所涵盖的范围。The content disclosed above is only a preferred embodiment of the present invention, which cannot limit the protection scope of the present invention. Therefore, equivalent changes or modifications made according to the protection scope of the present invention still fall within the scope of the present invention.
Claims (10)
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CN103954649A (en) * | 2014-04-22 | 2014-07-30 | 上海大学 | Multifunctional miniature temperature control device |
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US4900161A (en) * | 1986-12-10 | 1990-02-13 | Fissler Gmbh | System for measuring temperature of a filled vessel on a hot plate |
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