CN102376698A - High-brightness LED colorful optical module for lighting or displaying device - Google Patents

Abstract

The invention discloses a high-brightness LED color optical module for lighting or display equipment, comprising a high thermal conductivity substrate and an LED chip, the high thermal conductivity substrate includes a metal substrate and a ceramic substrate, and the LED chips are red LED chips, blue LED chips and green LED chips. At least one light LED chip; the LED chip is directly fixedly connected to the high thermal conductivity substrate; the high thermal conductivity substrate is also provided with a circuit layer, and when the high thermal conductivity substrate is a metal substrate, an insulating layer is provided between the circuit layer and the metal substrate , the LED chips are electrically connected through the circuit layer, at least one red LED chip, blue LED chip and green LED chip are used, and the combination of three-color LED chips can easily adjust the color and color temperature of the light. Directly fixedly connected to the metal substrate, welding, silver paste crystal bonding and other processing techniques can be used without other processing techniques. There is no insulating layer between the metal substrate and the LED chip, which greatly reduces thermal resistance. The entire product structure is simple and easy to produce. The cost is lower.

Description

High brightness LED color optical module for lighting or display equipment

technical field

The invention relates to an LED lighting product, in particular to a high-brightness LED color optical module used for lighting or display equipment.

Background technique

With the rapid development of LED technology and the maturity of high-power LED production technology, its low power consumption, high efficiency, small size, light weight and long life and many other advantages make it widely used. The development of high-power LED packaging technology , has greatly accelerated the application of high-power LEDs in the lighting field. With the development of color LED chip technology, high-brightness LED color optical modules have begun to be used in lighting or display fields that require high light color and color temperature. LED The packaging requirements of color optical modules are relatively high, not only for the heat dissipation of LED chips, but also for the arrangement and spacing of chips and other issues. At present, the packaging method of low thermal resistance and high-power light-emitting diodes is complicated. , the product structure is also relatively complex, requiring insulating layers, copper-clad layers, electrode layers and outer insulating layers. There is a pit in the center of the metal substrate, and the LED chip is installed in the pit, resulting in more processing procedures and higher production costs. In addition, The insulating layer under the copper clad laminate also increases the thermal resistance; in addition, the color and color temperature of the light emitted by the existing LED chip module cannot meet the high standard requirements, and its application cannot be expanded.

Contents of the invention

In order to solve the above problems, the object of the present invention is to provide a high-brightness LED color light for lighting or display equipment with simple production process, low cost, small thermal resistance, and the color and color temperature of emitted light can meet high standards. Optical modules.

In order to achieve the above object, the technical solution of the present invention is: a high-brightness LED color optical module for lighting or display equipment, including a high thermal conductivity substrate and an LED chip, the high thermal conductivity substrate includes a metal substrate and a ceramic substrate, the The LED chip is at least one red LED chip, blue LED chip and green LED chip; the LED chip is directly fixedly connected to the high thermal conductivity substrate; the high thermal conductivity substrate is also provided with a circuit layer. When the thermally conductive substrate is a metal substrate, an insulating layer is provided between the circuit layer and the metal substrate, and the LED chips are electrically connected through the circuit layer.

Preferably, the red LED chip, the blue LED chip and the green LED chip are respectively connected in parallel; or two kinds of LED chips are connected in parallel, and the other LED chip is connected in parallel alone; or all three kinds of LED chips are connected in parallel.

Preferably, the high-brightness LED color optical module used for lighting or display equipment is also provided with a protective cover, the protective cover includes a frame and a transparent window arranged on the frame or integrated with the frame, the protective cover The cover is arranged on the upper surface of the LED chip.

Preferably, the LED chip is a unipolar chip, its anode is the LED chip base, and its cathode is drawn from the upper surface of the LED chip; when the high thermal conductivity substrate is a metal substrate, the base of the LED chip, that is, the anode is directly fixed and connected to On the metal substrate; when the high thermal conductivity substrate is a ceramic substrate, the base of the LED chip, that is, the anode is directly fixedly connected to the ceramic substrate and electrically connected to each other; the red LED chip, the blue LED chip and the green LED chip The cathodes of the LED chips are respectively electrically connected to the mutually insulated circuit layers; or the cathodes of the two LED chips are electrically connected to the same circuit layer or the interconnected circuit layers, and the cathodes of the other LED chip are electrically connected The circuit layer insulated therefrom; or the cathodes of the three LED chips are all electrically connected to the same circuit layer or the circuit layers connected to each other.

Preferably, the high-brightness LED color optical module used for lighting or display equipment is also provided with a temperature monitoring device, and the temperature monitoring device is connected to the high-brightness LED color optical module used for lighting or display equipment. The electrical signal connection of the electrical control device for power on or off.

Preferably, the metal substrate includes a copper substrate, an aluminum substrate and a silver substrate, and the ceramic substrate includes an alumina ceramic substrate and an aluminum nitride ceramic substrate.

Preferably, the fixed connection between the LED chip and the high thermal conductivity substrate is high thermal conductivity solder paste soldering or silver paste die-bonding connection.

Preferably, the light emitting area ratio of the red LED chip, the blue LED chip and the green LED chip is 2:1:3.

Preferably, the LED chip further includes a white LED chip or a yellow LED chip.

Preferably, optical positioning holes for auxiliary positioning are also provided on the high thermal conductivity substrate.

The beneficial effect of adopting this technical solution is that at least one red LED chip, one blue LED chip and one green LED chip are used, and the combination of three-color LED chips can easily adjust the color and color temperature of the light, and the LED chip is directly fixedly connected to the On the metal substrate, processing techniques such as welding and silver paste crystal bonding can be used without other processing techniques. There is no insulating layer between the metal substrate and the LED chip, which greatly reduces thermal resistance. The entire product structure is simple and the production cost is low.

Description of drawings

1 is a cross-sectional view of Embodiment 1 of a high-brightness LED color optical module for lighting or display equipment according to the present invention;

Fig. 2 is a schematic diagram of Embodiment 1 of a high-brightness LED color optical module for lighting or display equipment according to the present invention;

3 is a schematic diagram of Embodiment 2 of a high-brightness LED color optical module for lighting or display equipment according to the present invention;

Fig. 4 is a schematic diagram of Embodiment 3 of a high-brightness LED color optical module for lighting or display equipment according to the present invention;

Fig. 5 is a schematic diagram of Embodiment 4 of a high-brightness LED color optical module used in lighting or display equipment according to the present invention.

The corresponding part names indicated by numbers and letters in the figure:

11. Metal substrate 12. Ceramic substrate 2. Unipolar LED chip 21. Red LED chip 22. Blue LED chip 23. Green LED chip 24 Cathode 25. White LED chip 3. Circuit layer strip 31. Red light circuit layer strip 32. Blue light line layer 33. Green light line layer 34. White light line layer 41. Frame 42. Transparent window 5. Temperature sensor 6. Insulation layer 7. Pin 8. Optical positioning hole

Detailed ways

The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

Example 1,

As shown in Figures 1 and 2, a high-brightness LED color optical module for lighting or display equipment includes a metal substrate 1 and a unipolar LED chip 2, and the unipolar LED chip 2 is two red LED chips 21 1, one blue LED chip 22 and three green LED chips 23; the unipolar LED chip 2 is directly fixedly connected to the metal substrate 11; the metal substrate 11 is also provided with a circuit layer, and an insulating layer is provided between the circuit layer and the metal substrate 11. Layer 6, the circuit layer includes red light circuit layer strip 31, blue light line layer strip 32 and green light line layer strip 33, the anodes of the unipolar LED chip are connected together through the metal substrate 11 to form a common anode, the red light LED chip 21, The cathodes of the blue LED chip 22 and the green LED chip 23 are respectively connected to the red line layer bar 31, the blue light line layer bar 32 and the green light line layer bar 33, that is, the red light LED chip 21, the blue light LED chip 22 and the green light line layer bar. The three LED chips 23 are respectively connected in parallel, and lead out pins 7 respectively.

This embodiment is also equipped with a protective cover and a temperature monitoring device. The protective cover includes a frame 41 and a transparent window 42 arranged on the frame or integrated with the frame. The protective cover is arranged on the unipolar LED chip 2 .

The temperature monitoring device is a temperature sensor 5, and the temperature sensor 5 is connected with the electrical signal of the electric control device for controlling the power on or off of the high-brightness LED color optical module used for lighting or display equipment. When the temperature exceeds the set value, the temperature The sensor 5 sends an overheating signal to the electric control device, and the electric control device cuts off the power supply of the unipolar LED chip 2 to achieve the purpose of protecting the module.

Optical positioning holes 8 for auxiliary positioning are also provided on the metal substrate 11 to facilitate the installation and adjustment of the module.

In this embodiment, the metal substrate 11 includes a copper substrate, an aluminum substrate and a silver substrate, and is generally preferably a copper substrate.

In this embodiment, the fixed connection between the unipolar LED chip 2 and the metal substrate 11 is high thermal conductivity solder paste welding or silver paste die-bonding connection.

The effect is best when the light emitting area ratio of the red LED chip 21, the blue LED chip 22 and the green LED chip 23 is 2:1:3. The arrangement of unipolar LED chips of three colors is as shown in the figure, which can achieve the best effect.

Example 2,

As shown in FIG. 3 , the rest is the same as that of Embodiment 1, except that the unipolar LED chips 2 are three red LED chips 21 , two blue LED chips 22 and four green LED chips 23 . The arrangement of unipolar LED chips of three colors is as shown in the figure, which can achieve the best effect.

Example 3,

As shown in FIG. 4 , the rest is the same as that of Embodiment 1, except that the unipolar LED chips 2 are five red LED chips 21 , three blue LED chips 22 and eight green LED chips 23 . The arrangement of unipolar LED chips of three colors is as shown in the figure, which can achieve the best effect.

Example 4,

As shown in Figure 5, the rest are the same as in Embodiment 1, except that the unipolar LED chips 2 are six red LED chips 21, four blue LED chips 22 and nine green LED chips 23, and Six white LED chips 25 and white light circuit layer strips 34, the cathodes of the six white light LED chips 25 are all connected to the white light circuit layer strips 34, and pins 7 are specially led out. The arrangement of four-color unipolar LED chips is shown in the figure As shown, the best effect can be achieved.

Example 6,

The rest are the same as any one of Embodiments 1 to 5, except that the LED chip is a bipolar chip, and the connection mode of the cathodes of the LED chips of each color is the same as that of the previous embodiment, and the metal substrate 11 is also provided with For the anode circuit layer strip, the anodes of all LED chips are connected to the anode circuit layer strip, and the LED chips are directly fixedly connected to the metal substrate 11 to minimize thermal resistance.

In the above embodiments, the high thermal conductivity substrate can also be a ceramic substrate, such as an alumina ceramic substrate and an aluminum nitride ceramic substrate. In this case, no insulating layer 6 is provided between the circuit layer strips on the ceramic substrate and the substrate.

When ceramic substrate and unipolar LED chip 2 are used, because the distance between the chips is very short, the anodes of the chips of different colors can be electrically connected with conductive material and fixed together on the ceramic substrate to form a common anode connection.

In addition, a yellow LED chip can also be added to the LED chip.

The beneficial effect of adopting this technical solution is that at least one red LED chip, one blue LED chip and one green LED chip are used, and the combination of three-color LED chips can easily adjust the color and color temperature of the light, and the LED chip is directly fixedly connected to the On the metal substrate, processing techniques such as welding and silver paste crystal bonding can be used without other processing techniques. There is no insulating layer between the metal substrate and the LED chip, which greatly reduces thermal resistance. The entire product structure is simple and the production cost is low.

The above is only the preferred embodiment of the present invention, it should be pointed out that for those skilled in the art, without departing from the inventive concept of the present invention, some modifications and improvements can also be made, and these all belong to the present invention. protection scope of the invention.

Claims (10)

1. A high-brightness LED color optical module for lighting or display equipment, comprising a high thermal conductivity substrate and an LED chip, the high thermal conductivity substrate comprising a metal substrate and a ceramic substrate, characterized in that, The LED chip is at least one each of a red LED chip, a blue LED chip and a green LED chip; The LED chip is directly fixedly connected to the high thermal conductivity substrate; A circuit layer is also provided on the high thermal conductivity substrate. When the high thermal conductivity substrate is a metal substrate, an insulating layer is provided between the circuit layer and the metal substrate, and the LED chips are electrically connected through the circuit layer. 2. The high-brightness LED color optical module for lighting or display equipment according to claim 1, wherein the red LED chip, the blue LED chip and the green LED chip are respectively connected in parallel; or two of them The LED chips are connected in parallel, and the other LED chip is connected in parallel alone; or the three LED chips are all connected in parallel. 3. The high-brightness LED color optical module for lighting or display equipment according to claim 1 or 2, characterized in that, the high-brightness LED color optical module for lighting or display equipment is also provided with protection A cover, the protective cover includes a frame and a transparent window arranged on the frame or integrated with the frame, and the protective cover is arranged on the LED chip. 4. The high brightness LED color optical module for lighting or display equipment according to claim 3, characterized in that, The LED chip is a unipolar chip, its anode is the base of the LED chip, and its cathode is drawn from the upper surface of the LED chip; When the high thermal conductivity substrate is a metal substrate, the base of the LED chip, that is, the anode is directly fixedly connected to the metal substrate; When the high thermal conductivity substrate is a ceramic substrate, the base of the LED chip, that is, the anode is directly fixedly connected to the ceramic substrate and electrically connected to each other; The cathodes of the red LED chip, the blue LED chip and the green LED chip are respectively electrically connected to the mutually insulated circuit layers; or the cathodes of the two LED chips are electrically connected to the same circuit layer or all interconnected circuits The circuit layer, the cathode of another LED chip is electrically connected to the circuit layer insulated from it; or the cathodes of the three LED chips are all electrically connected to the same circuit layer or the circuit layers connected to each other. 5. The high-brightness LED color optical module for lighting or display equipment according to claim 3, wherein the high-brightness LED color optical module for lighting or display equipment is also provided with a temperature monitoring device , the temperature monitoring device is electrically connected with the electric control device for controlling the power on or off of the high-brightness LED color optical module used for lighting or display equipment. 6. The high-brightness LED color optical module for lighting or display equipment according to claim 3, wherein the metal substrate includes a copper substrate, an aluminum substrate and a silver substrate, and the ceramic substrate includes alumina ceramics substrate and aluminum nitride ceramic substrate. 7. The high-brightness LED color optical module for lighting or display equipment according to claim 3, wherein the fixed connection between the LED chip and the high thermal conductivity substrate is high thermal conductivity solder paste welding or silver paste Die-bonded connections. 8. The high-brightness LED color optical module for lighting or display equipment according to claim 3, wherein the light-emitting area ratio of the red LED chip, the blue LED chip and the green LED chip is 2: 1:3. 9 . The high-brightness LED color optical module for lighting or display equipment according to claim 3 , wherein the LED chip further comprises a white LED chip or a yellow LED chip. 10. The high-brightness LED color optical module for lighting or display equipment according to claim 3, wherein optical positioning holes for auxiliary positioning are also provided on the high thermal conductivity substrate.

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