CN102376458A - Electronic component, electronic device and method for manufacturing electronic component - Google Patents
Electronic component, electronic device and method for manufacturing electronic component Download PDFInfo
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- CN102376458A CN102376458A CN2011102400908A CN201110240090A CN102376458A CN 102376458 A CN102376458 A CN 102376458A CN 2011102400908 A CN2011102400908 A CN 2011102400908A CN 201110240090 A CN201110240090 A CN 201110240090A CN 102376458 A CN102376458 A CN 102376458A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/13—Energy storage using capacitors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Electric Double-Layer Capacitors Or The Like (AREA)
- Connection Of Batteries Or Terminals (AREA)
- Sealing Battery Cases Or Jackets (AREA)
- Cell Electrode Carriers And Collectors (AREA)
- Secondary Cells (AREA)
Abstract
本发明提供电子部件、电子装置以及电子部件的制造方法,可提高双电层电容器等的生产性。凹状容器(2)具有凹部(13),在凹部的底部形成有在底面具有金属层(11)的贮留部(17)。在金属层上形成有将碳作为导电材料的集电体(18),在集电体上固定有电极(6)。这些集电体(18)和电极(6)如下形成。在对凹状容器(2)进行烧制后,向贮留部(17)供给将碳作为导电材料的导电膏。设置贮留部(17)是因为,导电膏为液状,因此为了不向周围泄漏而成为短路的原因,利用贮留部(17)将导电膏集中在凹部(13)的中央部。然后,当在导电膏上放置电极(6)进行加热时,导电膏固化,形成固定有电极(6)的集电体(18)。
The present invention provides an electronic component, an electronic device, and a method for manufacturing the electronic component, which can improve productivity of electric double layer capacitors and the like. The concave container (2) has a concave portion (13), and a storage portion (17) having a metal layer (11) on the bottom surface is formed at the bottom of the concave portion. A collector (18) using carbon as a conductive material is formed on the metal layer, and an electrode (6) is fixed on the collector. These current collectors (18) and electrodes (6) are formed as follows. After firing the concave container (2), a conductive paste containing carbon as a conductive material is supplied to the storage portion (17). The storage part (17) is provided because the conductive paste is liquid, so the conductive paste is collected in the center of the recess (13) by the storage part (17) in order not to leak to the surroundings and cause a short circuit. Then, when the electrode (6) is placed on the conductive paste and heated, the conductive paste is cured to form a current collector (18) to which the electrode (6) is fixed.
Description
技术领域 technical field
本发明涉及电子部件、电子装置以及电子部件的制造方法,例如涉及双电层电容器等电化学电池。The present invention relates to electronic components, electronic devices, and methods of manufacturing electronic components, for example, to electrochemical cells such as electric double layer capacitors.
背景技术 Background technique
双电层电容器是如下的器件:通过对电解质中的离子进行极化而蓄电,通过对其进行放电而供给电力。An electric double layer capacitor is a device that stores electricity by polarizing ions in an electrolyte, and supplies electricity by discharging them.
通过该蓄电放电功能,双电层电容器例如用于电子设备的时钟功能或半导体存储器等的备用电源、微型计算机或IC存储器等电子装置的预备电源等。With this charge storage and discharge function, the electric double layer capacitor is used, for example, as a clock function of electronic equipment, as a backup power source for semiconductor memories, and as a backup power source for electronic devices such as microcomputers and IC memories.
特别是可进行表面安装的双电层电容器能够实现小型化和薄型化,因此,适于薄型的便携终端。In particular, surface-mountable electric double layer capacitors can be miniaturized and thinned, and thus are suitable for thin portable terminals.
为了应对这种小型化和薄型化的期望,在下述专利文献1中,提出了如下的双电层电容器:如以下说明的那样,在具有凹部的容器中收纳极化用的电极和电解质,并利用封口板密封开口部。In order to cope with such a desire for miniaturization and thinning,
图9是现有的双电层电容器100的侧面剖视图。FIG. 9 is a side cross-sectional view of a conventional electric
在形成有凹部113的陶瓷制的凹状容器102的底面设有金属层111,在金属层111的上表面接合有正极电极106。金属层111贯通凹状容器102而与凹状容器102的底面的正极端子112电连接,因此,正极电极106经由金属层111与正极端子112电连接。A
并且,封口板103通过金属制的接合金属层108与凹部113的开口部接合,对凹部113进行封口。Furthermore, the
在封口板103的下侧表面,形成有作为集电体发挥功能的金属层115,在金属层115的表面接合有负极电极105。A
在凹状容器102的侧面形成有金属层109,该金属层109连接接合金属层108与凹状容器102的底面的负极端子110。A
而且,负极电极105经由金属层115、接合金属层108、金属层109与负极端子110电连接。Furthermore, the
在负极电极105与正极电极106之间设有防止它们短路的隔板107,并且,在凹部113中封入电解质。A
而且,双电层电容器100在对负极端子110、正极端子112施加电压时蓄电,对该蓄积的电荷进行放电从而维持时钟功能并对存储器等供给电力。Furthermore, the electric
但是,凹部113的金属层111由作为底层的钨层和形成在钨层上的铝层构成。However, the
这是基于以下理由。即,金属层111用作集电体,因此,需要由即使施加电压也不会溶解于电解质中的物质形成。在正极的集电体的情况下,作为这种物质有铝,但是,铝无法耐受凹状容器102的烧制温度(优选为1000[℃]以上)。This is based on the following reasons. That is, the
因此,利用能够耐受高温的钛制作底层,在凹状容器102的烧制后,在钛的底层上形成铝层。Therefore, the bottom layer is made of titanium capable of withstanding high temperatures, and an aluminum layer is formed on the bottom layer of titanium after the firing of the
但是,在凹部113的底面形成铝薄膜时,需要使用真空蒸镀等的干式工艺,存在成本升高的问题。However, when forming the aluminum thin film on the bottom surface of the
【专利文献1】日本特开2001-216952号公报[Patent Document 1] Japanese Patent Laid-Open No. 2001-216952
发明内容 Contents of the invention
本发明的目的在于,提高双电层电容器等的生产性。An object of the present invention is to improve productivity of electric double layer capacitors and the like.
在第1方面所述的发明中,提供一种电子部件,其特征在于,该电子部件具有:容器,其具有空洞部;第1导电体,其从所述空洞部导通到所述容器的外部;将碳作为导电材料的第1集电体,其在所述空洞部内与所述第1导电体接合;第1电极,其与所述第1集电体接合;第2导电体,其从所述空洞部导通到所述容器的外部;第2集电体,其在所述空洞部内与所述第2导电体接合;第2电极,其与所述第2集电体接合,且隔开预定距离与所述第1电极相对;以及电解质,其与所述第1电极和第2电极接触。In the invention according to
在第2方面所述的发明中,提供第1方面所述的电子部件,其特征在于,所述第1电极是正极,所述第2电极是负极。In the invention according to
在第3方面所述的发明中,提供第1或第2方面所述的电子部件,其特征在于,所述第1集电体在所述空洞部内包覆整个所述第1导电体。In the invention according to
在第4方面所述的发明中,提供第1、第2或第3方面所述的电子部件,其特征在于,所述第1集电体由将碳作为导电材料的树脂形成。In the invention according to claim 4, there is provided the electronic component according to
在第5方面所述的发明中,提供第1~第4方面中的任意一个方面所述的电子部件,其特征在于,所述第1集电体形成于在所述空洞部形成的凹部中。In the invention according to
在第6方面所述的发明中,提供第1~第5方面中的任意一个方面所述的电子部件,其特征在于,所述第1集电体层状地形成有将碳作为导电材料的部件。In the invention according to
在第7方面所述的发明中,提供第1~第6方面中的任意一个方面所述的电子部件,其特征在于,所述第2集电体将碳作为导电材料。In the invention according to
在第8方面所述的发明中,提供一种电子装置,其特征在于,该电子装置具有:第1~第7方面中的任意一个方面所述的电子部件;蓄电单元,其向所述电子部件蓄积电荷;其他电子部件,其发挥预定功能;以及电力供给单元,其用所述蓄积的电荷对所述其他电子部件供给电力。In the invention according to
在第9方面所述的发明中,提供一种电子部件的制造方法,其特征在于,该电子部件的制造方法包含以下步骤:形成凹状容器,其中,该凹状容器具有用于形成空洞的凹部、形成在所述凹部内的贮留导电膏的贮留部、以及从所述贮留部的底面导通到外部的第1导电体;对所述贮留部供给将碳作为导电材料的导电膏;在所述供给的导电膏上设置第1电极;使设置有所述第1电极的导电膏固化而形成第1集电体;在所述凹部中形成第2集电体、设置于所述第2集电体且隔开预定距离与所述第1电极相对的第2电极、与所述第2集电体接合且导通到外部的第2导电体、以及与所述第1电极和所述第2电极接触的电解质;以及对所述凹部进行封口。In the invention according to
根据本发明,通过在凹部底面形成以碳为主要成分的集电体,能够提高双电层电容器的生产性。According to the present invention, the productivity of the electric double layer capacitor can be improved by forming the current collector mainly composed of carbon on the bottom surface of the concave portion.
附图说明 Description of drawings
图1是用于说明第1实施方式的双电层电容器的图。FIG. 1 is a diagram for explaining an electric double layer capacitor according to a first embodiment.
图2是用于说明第1实施方式的变形例的图。FIG. 2 is a diagram for explaining a modified example of the first embodiment.
图3是用于说明第1实施方式的变形例的图。FIG. 3 is a diagram for explaining a modified example of the first embodiment.
图4是用于说明第1实施方式的集电体的形成方法的图。FIG. 4 is a diagram for explaining a method of forming a current collector according to the first embodiment.
图5是用于说明第1实施方式的集电体的形成方法的图。FIG. 5 is a diagram illustrating a method of forming a current collector according to the first embodiment.
图6是用于说明第2实施方式的双电层电容器的图。FIG. 6 is a diagram illustrating an electric double layer capacitor according to the second embodiment.
图7是用于说明第2实施方式的变形例的图。FIG. 7 is a diagram for explaining a modified example of the second embodiment.
图8是用于说明第2实施方式的集电体的形成方法的图。FIG. 8 is a diagram illustrating a method of forming a current collector according to the second embodiment.
图9是用于说明现有例的图。FIG. 9 is a diagram for explaining a conventional example.
标号说明Label description
1:双电层电容器;2:凹状容器;3:封口板;5:电极;6:电极;7:隔板;8:接合金属层;9:金属层;10:端子;11:金属层;12:端子;13:凹部;15:金属层;17:贮留部;18:集电体;19:弯月面;21、22:贯通电极;28:中间电极;31:渗透部件;33:突起部;41~45:片材;51、52:部分;61:贯通电极;100:双电层电容器;102:凹状容器;103:封口板;105:负极电极;106:正极电极;107:隔板;108:接合金属层;109:金属层;110:负极端子;111:金属层;112:正极端子;113:凹部;115:金属层。1: electric double layer capacitor; 2: concave container; 3: sealing plate; 5: electrode; 6: electrode; 7: separator; 8: joint metal layer; 9: metal layer; 10: terminal; 11: metal layer; 12: terminal; 13: concave portion; 15: metal layer; 17: storage portion; 18: collector; 19: meniscus; 21, 22: through electrode; 28: intermediate electrode; 31: penetration member; 33: Protrusion; 41-45: sheet; 51, 52: part; 61: through electrode; 100: electric double layer capacitor; 102: concave container; 103: sealing plate; 105: negative electrode; 106: positive electrode; 107: Separator; 108: bonding metal layer; 109: metal layer; 110: negative electrode terminal; 111: metal layer; 112: positive electrode terminal; 113: concave portion; 115: metal layer.
具体实施方式 Detailed ways
(1)实施方式的概要(1) Outline of Embodiment
如图1的(a)所示,凹状容器2具有凹部13,在该凹部13的底部形成有在底面具有金属层11的贮留部17。As shown in FIG. 1( a ), the
金属层11由钨构成,能够耐受凹状容器2的烧制温度。The
在金属层11上形成有将碳作为导电材料的集电体18,在该集电体18上固定有用作正极的电极6。这些集电体18和电极6如下形成。A
在对凹状容器2进行烧制后,向贮留部17供给将碳作为导电材料的导电膏。设置贮留部17是因为,导电膏为液状,因此,为了不向周围泄漏而成为短路的原因,利用贮留部17将该导电膏集中在凹部13的中央部。After the
然后,通过对导电膏进行加热而使导电膏固化,形成集电体18。并且,当在导电膏上放置电极6进行加热时,导电膏固化,形成固定有电极6的集电体18。Then, the conductive paste is cured by heating the conductive paste to form
一般地,作为能够用作集电体的物质,除了铝以外还有碳,但是,如本实施方式那样,当对金属层11上供给导电膏并进行加热后,形成集电体18,因此,不需要经过对铝进行真空蒸镀等的干式工艺。Generally, as a substance that can be used as a current collector, there is carbon in addition to aluminum, but, as in the present embodiment, when the conductive paste is supplied on the
因此,能够实现制造成本的降低和制造工序的简化等,能够提高双电层电容器1的生产性。Therefore, reduction of manufacturing cost, simplification of manufacturing process, etc. can be achieved, and the productivity of electric
另外,在导电膏上放置电极6的情况下,利用导电膏的表面张力将电极6定位在贮留部17的中央,因此,电极6的定位简单,由此,生产性提高。In addition, when the
导电膏的粘度大约为400dPa·s,但是作业性差,因此,能够使用稀释剂等低沸点溶剂进行稀释。通过该稀释,粘度能够降低到大约40dPa·s以下。这样,在考虑作业性而降低导电膏的粘度的情况下,具有避免以下情况的效果:导电膏伴随溶剂而沿着壁面上升,在上升的状态下使其干燥固化的情况下,壁面处于导电性状态,在层叠电极的情况下,存在短路的危险性。The viscosity of the conductive paste is about 400 dPa·s, but workability is poor, so it can be diluted with a low-boiling point solvent such as a thinner. Through this dilution, the viscosity can be lowered below about 40 dPa·s. In this way, in the case of reducing the viscosity of the conductive paste in consideration of workability, there is an effect of avoiding the following situation: the conductive paste rises along the wall surface with the solvent, and when it is dried and solidified while rising, the wall surface becomes conductive. State, in the case of stacked electrodes, there is a risk of short circuit.
并且,能够通过CVD法形成不定形或结晶性的碳质的被膜。In addition, an amorphous or crystalline carbonaceous film can be formed by the CVD method.
例如,能够如下形成:涂布包含作为一种气相生长碳的镍系触媒粒子的分散溶液,使溶剂干燥后,在管状炉内加热到600℃以上且1600℃以下的温度,在还原氛围气下流入包含甲烷、乙炔或其他碳氢化合物的气体。For example, it can be formed by applying a dispersion solution containing nickel-based catalyst particles as a kind of vapor-phase grown carbon, drying the solvent, heating to a temperature of 600° C. to 1600° C. in a tubular furnace, Inflow of gases containing methane, acetylene or other hydrocarbons.
并且,此时,成型的气相生长碳可以是单层或多层的管状的碳。进而,通过加热处理促进碳质的被覆的晶化,进而,进行赋予活性的处理,由此,能够增加比表面积。此时,能够一体形成电极6和集电体18,因此,作业性提高。In addition, at this time, the formed vapor-grown carbon may be single-layer or multi-layer tubular carbon. Furthermore, the specific surface area can be increased by accelerating the crystallization of the carbonaceous coating by heat treatment, and further performing an activity-imparting treatment. In this case, since the
(2)实施方式的详细情况(2) Details of the embodiment
(第1实施方式)(first embodiment)
参照附图说明构成本实施方式的电子部件的电化学电池。另外,下面,作为实施方式,以双电层电容器为例进行说明,但是,电子部件也可以是非水电解质电池等其他种类的电化学电池。An electrochemical cell constituting the electronic component of this embodiment will be described with reference to the drawings. In the following, an electric double layer capacitor will be described as an example of an embodiment, but the electronic component may be other types of electrochemical cells such as non-aqueous electrolyte cells.
例如可以是如下的电池:负极使用由通过金属锂而活化的氧化硅(50wt%)、导电助剂(40wt%)和聚丙烯酸系的粘结剂(20wt%)构成的电极片,正极使用由锂-锰-氧的元素具有尖晶石型的结晶构造的活性物质(85wt%)、导电助剂(10wt%)和PTFE系的粘结剂(5wt%)构成的电极片,该电池通过由玻璃纤维构成的隔板、以及在PC中溶解1M的LiN(SO2CF3)2而得到的电解液构成。这里,正极和负极的大小可以是长1mm×宽1.5mm×厚0.2mm。For example, it can be a battery as follows: the negative electrode uses an electrode sheet made of silicon oxide (50wt%) activated by metal lithium, a conductive additive (40wt%) and a polyacrylic binder (20wt%), and the positive electrode uses an electrode sheet made of The element of lithium-manganese-oxygen has an active material (85wt%) with a spinel crystal structure, a conductive additive (10wt%) and a PTFE-based binder (5wt%). A separator made of glass fiber, and an electrolyte solution obtained by dissolving 1M LiN(SO 2 CF 3 ) 2 in PC. Here, the size of the positive electrode and the negative electrode may be 1 mm in length×1.5 mm in width×0.2 mm in thickness.
进而,除了上述正极活性物质以外,还可以使用Li4Ti5O12、Li4Mn5O12、LiCoO2等。并且,作为负极的活性物质,还可以使用Li-Si-O、Li-Al等。Furthermore, Li 4 Ti 5 O 12 , Li 4 Mn 5 O 12 , LiCoO 2 , and the like can be used in addition to the above-mentioned positive electrode active material. In addition, Li—Si—O, Li—Al, or the like can also be used as the active material of the negative electrode.
而且,通过使用在PC中溶解1M的LiBF4而得到的电解液等,能够构成锂离子电池。此时,在各活性物质中能够一并使用导电助剂和粘结剂。Furthermore, a lithium ion battery can be constituted by using an electrolytic solution obtained by dissolving 1M LiBF 4 in PC, or the like. In this case, a conductive additive and a binder can be used together in each active material.
图1的(a)是第1实施方式的双电层电容器1的侧面剖视图。双电层电容器1具有长方体形状,大小具有例如高度为1[mm]以下、纵向为2.5[mm]左右、横向为3.0[mm]左右的长方体形状。(a) of FIG. 1 is a side cross-sectional view of an electric
使用具有凹部13的凹状容器2、在下侧表面形成有金属层15的封口板3(厚度为0.1[mm]左右)、用作负极的电极5、用作正极的电极6、隔板7、接合金属层8、金属层11、集电体18、贯通电极21、贯通电极22、端子10、端子12、以及封入凹部13中的电解质(未图示)等构成双电层电容器1。A
端子10、12是表面安装用的端子,下面,设端子10、12一侧为下方向,设封口板3一侧为上方向。The
另外,在图1的(a)中,为了容易分清部件的接合关系,在电极5、隔板7、电极6之间图示了间隙,但是,也可以以没有间隙的方式在凹部13中填入这些部件。In addition, in Fig. 1(a), gaps are shown between the
凹状容器2例如由使用氧化铝的陶瓷构成,通过重叠多张被称为生片的具有柔软性的陶瓷片材41~45进行烧制而一体化,从而形成该凹状容器2。可以设烧制后的各片的厚度为100~300μm。并且,当成为同一厚度时,准备片时的管理上的劳力和时间减少,是理想的。在图1的(a)中,用虚线示出片材41~45的接合部。The
在生片上形成有与凹部13和贮留部17对应的开口部和与设置贯通电极21、22的贯通孔对应的孔,通过在厚度方向层叠这些生片并进行烧制,形成具有凹部13和贯通电极21、22用的贯通孔的凹状容器2。这里,可以设贯通电极的直径大约为100μm。并且,在层叠生片时,以吸收在各层形成的贯通电极和贯通电极偏移时的误差为目的,可以在各生片的上表面预先实施钨(W)制的导体印刷。Openings corresponding to the
更详细地讲,在片材41、42上形成有与贯通电极21、22的形状对应的贯通孔,在片材43上形成有与贯通电极21的形状对应的贯通孔和与贮留部17的形状对应的开口部,在片材44~45上形成有与贯通电极21的形状对应的贯通孔和与凹部13的形状对应的开口部。More specifically, through-holes corresponding to the shape of the through-
从上方观察时,凹部13具有矩形截面,在凹部13的底部形成有在底面形成有金属层11的凹型形状的贮留部17。The
在与贮留部17的底面对应的片材42的表面进行导体印刷,对凹状容器2进行烧制,由此形成金属层11。The
这里,使金属层11的大小为必要最低限度,从而降低成本。另外,也可以在贮留部17的整个底面形成金属层11。Here, the size of the
例如,利用包含钨等的具有耐腐蚀性且能够耐受凹状容器2的烧制的高熔点的金属材料的油墨进行丝网印刷,由此进行导体印刷。For example, conductor printing is performed by performing screen printing with an ink containing a high-melting-point metal material such as tungsten that has corrosion resistance and can withstand firing of the
钨的熔点高且难以氧化,进而,与陶瓷表面之间具有适度的紧密贴合极度,在烧制后也具有实用的电阻,因此,适于作为在凹部13中形成的电极。Tungsten has a high melting point and is difficult to oxidize. Furthermore, it has moderately close contact with the ceramic surface and has practical resistance after firing. Therefore, it is suitable as an electrode formed in the
但是,在使用钨作为正极的集电体的情况下,当在与电解质接触的状态下施加电压时,以电化学的方式溶解于电解质中。However, when tungsten is used as the current collector of the positive electrode, when a voltage is applied while in contact with the electrolyte, it is electrochemically dissolved in the electrolyte.
因此,为了防止该溶解,如以下说明的那样,需要利用基于导电膏的集电体18包覆与电解质接触的整个表面(即凹状容器2内的全部部分)。Therefore, in order to prevent this dissolution, it is necessary to coat the entire surface in contact with the electrolyte (that is, the entire portion inside the concave container 2 ) with the
并且,通过在整个表面进行涂布,利用自身的表面张力而沿着内部侧面的壁面形成为弯月形状,但是,也具有使液状的膏的中心部的厚度平坦化的效果。In addition, the coating on the entire surface forms a meniscus shape along the wall surface of the inner side by its own surface tension, but also has the effect of flattening the thickness of the center portion of the liquid paste.
在电化学方面,电子具有集中于导体的锐利的前端部的倾向。在对电化学器件进行充放电时,当电子集中于该导体的锐利的前端部时,电力仅集中于该前端部周围,可能促进劣化。Electrochemically, electrons tend to concentrate at the sharp front end of a conductor. When the electrochemical device is charged and discharged, if electrons are concentrated on the sharp front end of the conductor, electric power is concentrated only around the front end, and deterioration may be promoted.
因此,通过涂布本发明的膏,消除锐利部位,消除电子的集中,能够期待避免电极的劣化。Therefore, by applying the paste of the present invention, it can be expected to avoid sharp parts and concentration of electrons, thereby avoiding deterioration of electrodes.
在金属层11上形成有使导电膏固化后的集电体18。On the
金属层11具有厚度,但是,通过导电膏使金属层11的厚度均匀,得到表面平坦的集电体18。The
导电膏可以使用将包含碳材料和溶剂的酚醛树脂加工成膏状而得到的物质。碳材料是为了赋予导电性而添加的。作为碳材料,可以使用石墨粉末、无定形碳(碳黑)中的任意一种或者混合使用两者。As the conductive paste, one obtained by processing a phenolic resin containing a carbon material and a solvent into a paste form can be used. Carbon materials are added to impart electrical conductivity. As the carbon material, any one of graphite powder, amorphous carbon (carbon black), or a mixture of both can be used.
当通过加热使溶剂干燥而使酚醛树脂成分聚合(固化)时,形成将酚醛树脂作为粘结剂、将碳作为导电体的树脂制的集电体18。When the phenolic resin component is polymerized (cured) by heating to dry the solvent, a resin
这里,一般在负极的集电体的情况下,可以使用镍、铜、黄铜、锌、锡、金、不锈钢、钨、铝等多种金属,但是,为了不使集电体溶解于电解质中,正极的集电体需要使用铝、钛、铌等的被称为塞金属(plug metal)的金属。作为正极的集电体,除了这些金属以外,还可以使用碳,在本实施方式中,使用包含碳材料的导电膏。当使用导电膏时,不需要利用真空蒸镀等形成塞金属的薄膜,因此,工序大幅简化。Here, generally, in the case of the current collector of the negative electrode, various metals such as nickel, copper, brass, zinc, tin, gold, stainless steel, tungsten, and aluminum can be used. However, in order not to dissolve the current collector in the electrolyte, , The current collector of the positive electrode needs to use metals called plug metals such as aluminum, titanium, and niobium. As the current collector of the positive electrode, carbon can be used in addition to these metals, and in this embodiment, a conductive paste containing a carbon material is used. When the conductive paste is used, it is not necessary to form a thin film of the plug metal by vacuum deposition or the like, so the process is greatly simplified.
导电膏混合了碳类中的结晶性高的石墨和碳类中的无定形的碳黑这2种材料,进而,含有酚醛树脂作为主要成分和粘结剂。该酚醛树脂可以使用以甲醛为代表的包含醛和酚的衍生物。The conductive paste is a mixture of two materials, namely highly crystalline graphite among carbons and amorphous carbon black among carbons, and further contains a phenolic resin as a main component and a binder. As the phenolic resin, derivatives including aldehyde and phenol represented by formaldehyde can be used.
贮留部17形成在凹部13的底部中央,贮留部17的深度被设定为小于电极6的厚度,贮留部17的内周被设定为比电极6的外周大导电膏的弯月面19的程度。贮留部17是为了防止导电膏在固化前飞散或溢出而成为短路原因而设置的。The
贮留部17作为由绝缘性的片材42、43形成的用于保持导电膏的留存部发挥功能。
这里,弯月面19是在贮留部17中贮留有导电膏时由于表面张力而在导电膏的表面产生的凹面。Here, the
在制造双电层电容器1时,在贮留部17中贮留液体状的导电膏,在该导电膏的表面放置电极6时,通过弯月面19将电极6定位在贮留部17的中央。When manufacturing the electric
然后,在进行加热而使导电膏固化后,形成集电体18,并且,电极6固定在贮留部17的中央。即,电极6固定在由于导电膏的表面张力而形成的凹面上,因此,能够容易且准确地对电极6进行定位。Then, after the conductive paste is cured by heating, the
这样,在本实施方式中,在正极集电体的形成时不需要真空蒸镀等干式工艺,而且,电极6的定位容易,因此,能够实现双电层电容器1的制造成本的降低和生产性的提高。In this way, in this embodiment, a dry process such as vacuum evaporation is not required in the formation of the positive electrode current collector, and the positioning of the
将以活性碳为主要成分的电极活性物质形成为片状并切断成矩形,由此形成电极6,例如,在天然原料中可以使用椰子壳,在人造材料中,可以使用分别通过水蒸气、化学药品或电学方式对石炭沥青、石油沥青或酚醛树脂的碳化物赋予活性后的材料。The electrode active material with activated carbon as the main component is formed into a sheet and cut into a rectangle to form the
如之前说明的那样,在凹状容器2的凹部13的下方层叠有孔的片材41、42,由此,形成在凹部13的底面和凹状容器2的底面具有开口部的贯通孔。As described above, the
而且,在该贯通孔中形成有对金属层11和端子12进行电连接的圆柱形状的贯通电极22。In addition, a cylindrical through-
贯通电极22的外径和贯通孔的内径设定为相同,使得在贯通电极22和贯通孔的内壁之间不产生间隙。贯通电极还被称为VIA。The outer diameter of the through-
贯通电极22的直径为0.1~0.3[mm]左右。并且,通过导体印刷在各片材层间设有中间电极28。通过中间电极28,例如,即使在贯通孔的精度不高、或者片材的层叠出现偏移的情况下,也能够可靠地形成贯通电极22。另外,后述的贯通电极21的结构相同。The diameter of the
在该贯通孔中,使以钨等金属粉末为主要成分的金属膏烧结,或者注入碳等的导电膏并使其固化,或者插入金属制的棒材或板材,由此形成贯通电极22。作为金属制的棒材,例如可以使用铝、不锈钢、钨、镍、银、金、或者含碳的导电性树脂等。电极6经由金属层11、贯通电极22与端子12电连接。
在凹部13的开口部的端部形成有对封口板3和凹状容器2进行接合的金属层即金属层9和接合金属层8。
接合金属层8由形成在开口部的端部的整周的金属层9(金属喷镀层)上方的焊料(镍、金等)的层构成。接合金属层8有时也被称为密封圈,用于确保封口板3和凹状容器2之间的气密性。The
金属喷镀层例如由科瓦铁镍钴合金(Co:17、Ni:29、Fe:54的比率的合金)构成,在凹状容器2的端部设置科瓦铁镍钴合金制的金属环进行烧制,从而形成金属喷镀层。The metal sprayed layer is made of, for example, Kovar (Co: 17, Ni: 29, Fe: 54 ratio alloy), and a metal ring made of Kovar is set at the end of the
如后所述,当在凹部13的开口部设置封口板3并进行加热时,焊料层熔化而与金属层15熔接,凹部13被封口板3封口。As will be described later, when the sealing
通过在凹状容器2上层叠有孔的片材41~45,在包围凹部13的侧壁内形成在凹部13的开口部的端部和凹状容器2的底面具有开口部的贯通孔。By laminating the
而且,在该贯通孔中形成有对接合金属层8和端子10进行电连接的圆柱形状的贯通电极21。Further, in the through hole, a cylindrical through
贯通电极21的外径和贯通孔的内径设定为相同,在贯通电极21和贯通孔的内壁之间不产生间隙。The outer diameter of the through-
贯通电极21的材质和形成方法以及使用中间电极28进行接合等与贯通电极22相同。The material and formation method of the
在利用包含钨的油墨等进行导体印刷并烧制后,在其表面镀敷金或镍等,从而形成端子10、12。进而,为了防锈,可以在镀镍上方镀敷金或锡等金属。The
镀敷包括电解镀、无电解镀等,并且,也可以通过真空蒸镀等的气相法而形成。Plating includes electrolytic plating, electroless plating, and the like, and can also be formed by a vapor phase method such as vacuum evaporation.
由此,能够确保端子10、12的较高的焊锡湿润性,能够良好地在基板表面安装双电层电容器1。Accordingly, high solder wettability of the
另外,在本实施方式中,在凹状容器2的外侧底面部设置端子10、12,但是,也可以形成在外侧侧面部,或者,还可以从外侧底面连续形成到侧面。In addition, in this embodiment, the
在贯通孔中设置了贯通电极21、22后形成端子10、12。
并且,当端子10、12没有形成到凹状容器2的底部的端部时,在利用椭圆形的片材同时形成多个双电层电容器1的情况下,在切开这些双电层电容器1时,能够防止端子10、12的剥离等。Also, when the
封口板3是由科瓦铁镍钴合金等构成的金属部件。科瓦铁镍钴合金的热膨胀率与陶瓷大致相等,因此,在回流焊时对双电层电容器1进行加热的情况下,能够抑制在封口板3与凹状容器2之间产生的应力。The sealing
在封口板3的下侧表面形成有由镀镍形成的金属层15,以使封口板3与接合金属层8良好地接合。A nickel-plated
当在接合金属层8上锡焊金属层15时,封口板3与凹部13的开口部物理接合且电接合。When the
在锡焊时,通过对封口板3进行加压并加热而使其熔化,从而对封口板3和凹状容器2进行接合。During soldering, the sealing
更具体而言,可以使用如下的平行缝焊:以适当的压力使辊式电极与封口板3的缘部接触,一边通电一边使其旋转移动。通过接触阻力对接合金属层8进行加热,进行加压和加热。除了平行缝焊以外,还可以使用基于激光的加热焊接。More specifically, parallel seam welding can be used in which a roller electrode is brought into contact with the edge of the sealing
在进行平行缝焊的情况下,优选选择接合金属层8和封口板3的相融性良好的材料,例如,在接合金属层8使用电解镍、无电解镍的情况下,封口板3使用对科瓦铁镍钴合金实施了电解镍或无电解镍而得到的材料。In the case of parallel seam welding, it is preferable to select a material with good compatibility between the joining
或者,相反,在接合金属层8使用电解镍的情况下,封口板3使用对科瓦铁镍钴合金实施了无电解镍而得到的材料。由此,不用将焊接功率提高到必要以上即可。进而,在进行无电解镍的情况下,可以使用各种还原剂。例如可列举二甲胺基甲硼烷、次亚磷酸、肼、硼氢化钠等。这里,作为焊料,在使镀敷用的镍熔融时,优选镍的熔点较低。因此,镀敷时的还原剂使用次亚磷酸,由此,在已完成的镀敷的化学成分为“Ni:90%-96%、P:4%-10%”的情况下,与含硼的情况相比,熔点较低,因此适于锡焊。Or, conversely, when electrolytic nickel is used for the joining
并且,为了将接合金属层8的密封圈固定在陶瓷的金属喷镀层上,也可以使用金焊料、银焊料等焊料或焊锡材料。In addition, in order to fix the gasket joining the
在金属层15的下侧表面,通过含碳的导电性粘接剂接合由电极活性物质构成的电极5。The
电极5的材质和形状与电极6相同。金属层15的与电极5接触的部分51作为集电体发挥功能。而且,金属层15的不与电极5接触的部分52作为与集电体接合的导电体发挥功能。The material and shape of the
这样,电极5经由金属层15、接合金属层8、贯通电极21与端子10电连接。In this way,
电极5、6在由凹部13和封口板3构成的空洞部内相对,在电极5、6之间设置有用于防止电极5、6由于接触而短路的隔板7。The
作为隔板7的材质,例如可以使用由对PPS(聚苯硫醚)、PEEK(聚醚醚酮)、变性PEEK、PTFE(聚四氟乙烯)等耐热性树脂等的表面赋予亲水性而得到的材料构成的无纺布或玻璃纤维。As the material of the
进而,在由凹部13和封口板3构成的空洞部内封入电解质。Furthermore, an electrolyte is sealed in the cavity formed by the
电解质例如由在PC(碳酸丙烯酯)或SL(环丁砜)等非水溶剂中溶解(CH3)·(CH4)3N·BF4等支持盐而得到的溶液构成。这样,在本实施方式中,使用液体作为支持盐,但是,也可以使用凝胶状或固体状的电解质。虽然依赖于密封方法,但是,在使用液体溶剂作为电解质的情况下,优选沸点为200℃以上。进而,优选不会由于封口时施加的热而使蒸气压力上升。可以在电解液中添加沸点小于100℃的低沸点的溶剂,但是,优选至少树脂的熔点下的蒸气压力为0.2MPa-G以下。在注入电解液的情况下,在凹部13中注入电解液后,通过单独进行减压、加热、加压或它们的组合,能够使电解质渗透到电极的细部。The electrolyte is composed of a solution obtained by dissolving a supporting salt such as (CH 3 )·(CH 4 )3N·BF 4 in a non-aqueous solvent such as PC (propylene carbonate) or SL (sulfolane), for example. Thus, in the present embodiment, a liquid is used as the supporting salt, but a gel or solid electrolyte may also be used. Although it depends on the sealing method, in the case of using a liquid solvent as the electrolyte, it is preferable that the boiling point is 200° C. or higher. Furthermore, it is preferable not to increase the vapor pressure due to the heat applied at the time of sealing. A low-boiling solvent having a boiling point of less than 100° C. may be added to the electrolytic solution, but it is preferable that the vapor pressure at least at the melting point of the resin is 0.2 MPa-G or less. In the case of injecting the electrolytic solution, after injecting the electrolytic solution into the
另外,在使用固体的电解质的情况下,不需要隔板7。In addition, when a solid electrolyte is used, the
进而,在使用固定的电解质的情况下,当采用电解质与集电体不接触的结构时,集电体不会溶解,因此,能够将电极5作为正极,将电极6作为负极。Furthermore, in the case of using a fixed electrolyte, the current collector will not dissolve if the electrolyte is not in contact with the current collector. Therefore, the
以端子10为负极、端子12为正极的方式在基板表面安装如上所述构成的双电层电容器1,例如,能够用作便携电话的存储器或时钟的备用电源。The electric
该情况下,在便携电话中,在装配主电源电池的同时对双电层电容器1进行充电,在更换电池时或者主电源电压降低的情况下,对蓄积在双电层电容器1中的电荷进行放电,向存储器供给电力,或者保持时钟等的功能。In this case, in the mobile phone, the electric
以上,利用以氧化铝为主要成分的陶瓷构成凹状容器2,但是,例如,也可以由耐热性树脂、玻璃、陶瓷玻璃等的耐热材料构成。In the above, the
在利用玻璃或玻璃陶瓷形成凹状容器2的情况下,通过导体印刷对低熔点的玻璃或玻璃陶瓷实施布线并层叠后,在低温下进行烧制。When the
在利用树脂构成凹状容器2的情况下,也可以对贯通电极21、22进行插入成型。When the
并且,关于贯通电极22,当设定为片材42的直径比片材41的直径大时,即使在回流焊时加热而使凹部13的压力上升的情况下,该压力也作用于贯通电极22,能够防止贯通电极22从凹状容器2脱落。Furthermore, when the diameter of the
同样,关于贯通电极21,能够设定为片材45的直径比片材41~44的直径大。Similarly, regarding the
图1的(b)是用于说明双电层电容器1的变形例的图。(b) of FIG. 1 is a diagram illustrating a modified example of the electric
在该例子中,双电层电容器1不具有贯通电极21、22,通过形成在凹状容器2的侧面的布线使电极5、6与端子10、12连接。其他结构与之前说明的第1实施方式相同。In this example, electric
金属层11从贮留部17的底面沿着片材42的表面贯通到凹状容器2的外部,经由凹状容器2的侧面与形成在凹状容器2的底面的端子12电连接。The
金属层11以必要最低限度的大小形成在贮留部17的底面,但是,也可以形成在整个底面。另外,通过导电膏使金属层11的厚度均匀,得到平坦的集电体18。The
金属层9在凹状容器2的上端面与接合金属层8接合,并且,经由凹状容器2的侧面与形成在凹状容器2的底面的端子10电连接。The
在凹状容器2的侧面,在片材41~44的上表面设置有辅助电极,以使得侧面的电连接更加可靠。On the side of the
这样,能够以不使用贯通电极的方式构成双电层电容器1。In this way, the electric
图1的(c)是在金属层11的上表面设置预先涂布导电膏并固化后的集电体20的例子。该情况下,使用导电性粘接剂等对金属层11和集电体20、以及集电体20和电极6进行接合。(c) of FIG. 1 is an example in which a
这样,也可以不是在贮留部17中注入导电膏并使其固化,而是在贮留部17中设置预先固化后的导电膏。In this way, instead of injecting and curing the conductive paste into the
另外,集电体20以没有间隙的方式埋设在金属层11的周围,使得电解液不与金属层11接触。In addition, the
由此,能够防止金属层11溶出而导致品质降低。Thereby, it is possible to prevent the
图2的(d)是利用导电膏形成贯通电极的例子。(d) of FIG. 2 is an example of forming through electrodes using conductive paste.
在片材42上形成从贮留部17的底面贯通到金属层11的贯通孔,当在贮留部17中注入导电膏后,导电膏侵入贯通孔而固化,形成贯通电极61。A through hole is formed on the
并且,通过在注入导电膏后进行减压,能够消除在贯通电极61的位置与导电膏一起卷入的气泡。In addition, by depressurizing after injecting the conductive paste, it is possible to eliminate air bubbles entrapped together with the conductive paste at the positions of the penetrating
集电体18和贯通电极61一体形成,因此,电极6经由集电体18、贯通电极61、金属层11与端子12电连接。
并且,在该例子中,接合金属层8和端子10通过贯通电极21电连接。In addition, in this example, the
图2的(e)是如下的例子:利用贯通电极61进行集电体18与金属层11的电连接,并且,利用金属层9对接合金属层8和端子10进行电连接。FIG. 2( e ) is an example in which
图3的(f)是不在凹部13制作阶梯部而直接作为贮留部17的例子。在该例子中,通过贯通电极61对集电体18与金属层11进行电连接。(f) of FIG. 3 is an example in which the recessed
图3的(g)是在贮留部17的底部的一部分形成集电体18的例子。这样,即使不在贮留部17的整个底面形成集电体18,也能够使电极6发挥功能。(g) of FIG. 3 is an example in which
在该例子中,不在凹部13制作阶梯部而作为贮留部17,并且,通过贯通电极61对集电体18与金属层11进行电连接。In this example, the
图4的各图是用于说明集电体18的形成方法的图。Each diagram in FIG. 4 is a diagram for explaining a method of forming the
首先,如图4的(a)所示,准备形成有接合金属层8、贯通电极21、22、金属层11、端子10、12的凹状容器2。First, as shown in FIG. 4( a ), the
然后,对贮留部17供给作为集电体18的导电膏。导电膏的供给量被设定为铺满贮留部17的整个底面而形成弯月面19的程度。Then, conductive paste as
图4的(b)是在对贮留部17供给导电膏之前从上方观察凹状容器2的图。FIG. 4( b ) is a view of the
如图所示,在贮留部17的底部,金属层11形成为圆形。另外,金属层11的形状也可以是矩形等任意的形状。As shown in the figure, at the bottom of the reserving
图4的(c)是从上方观察对凹状容器2供给导电膏之后的情况的图。在凹状容器2的中央贮留有作为集电体18的导电膏。(c) of FIG. 4 is a figure which looked at the state after supplying the conductive paste to the
接着,如图5所示,在作为集电体18的导电膏的液面上放置电极6。于是,通过导电膏的弯月面19使电极6位于贮留部17的中央部。Next, as shown in FIG. 5 , the
然后,加热到180[℃]左右的温度后,导电膏固化而成为集电体18,电极6固定在贮留部17的中央部。Then, after heating to a temperature of about 180 [° C.], the conductive paste is solidified to become the
虽然没有图示,但是,然后在电极6上放置隔板7,供给电解质,进而利用安装有电极5的封口板3对凹部13的开口部进行封口钎焊后,双电层电容器1完成。Although not shown, the
另外,多次进行对贮留部17供给导电膏并使其固化的工序(即分为多次进行涂布),由此,能够将集电体18形成为层状。In addition, the process of supplying and curing the conductive paste to the
该情况下,反复进行对贮留部17供给导电膏进行加热固化进而对其上方供给导电膏进行加热固化的工序,直到最上层的下面一层为止。In this case, the process of supplying the conductive paste to the
然后,在形成最上层时,供给作为最上层的导电膏,在其液面上设置电极6后进行加热,使最上层的导电膏固化。这样,集电体18形成为层状。Then, when forming the uppermost layer, the conductive paste as the uppermost layer is supplied, and the
并且,在导电膏的厚度较薄的情况下,由于导电膏的厚度差异和分布,在电阻中产生偏差,因此,引起程度较低的电力集中。Also, in the case where the thickness of the conductive paste is thin, variation in resistance occurs due to the difference in thickness and distribution of the conductive paste, thereby causing a low degree of power concentration.
因此,在涂布导电膏时,以大约50μm以上的均匀厚度进行涂布是重要的。在涂布后进行加热,由此,膏中包含的硬化成分的主剂和固化的催化剂由于化学反应而聚合,碳彼此接触,形成具有电子导电性的网格的集电体层18。Therefore, when applying the conductive paste, it is important to apply it with a uniform thickness of about 50 μm or more. By heating after application, the main agent of the hardening component contained in the paste and the cured catalyst are polymerized by a chemical reaction, and the carbons are in contact with each other to form the
此时,以降低导电膏的粘度为目的,有时添加有机溶剂,该溶剂气化时产生气泡,有时形成直径为几μm左右的小径的连通孔。At this time, an organic solvent may be added for the purpose of reducing the viscosity of the conductive paste, and bubbles may be generated when the solvent is vaporized, and small communicating holes with a diameter of about several μm may be formed.
或者,有时在涂布导电膏时卷入的氛围气中的气体成分也会形成上述小径的连通孔。在电解质经由该连通孔与金属层11接触的情况下,有时金属层11的金属从该连通孔溶出,在活性碳的表面被还原而成为金属。Alternatively, gas components in the atmosphere entrained at the time of coating the conductive paste may also form the aforementioned small-diameter communication holes. When the electrolyte is in contact with the
为了避免这种金属的溶解和析出,在涂布导电膏后进行减压,从而消除气泡,由此,能够得到抑制所述连通孔的生成的效果。In order to avoid such dissolution and precipitation of the metal, decompression is performed after the conductive paste is applied to eliminate air bubbles, whereby the effect of suppressing the generation of the via hole can be obtained.
并且,即使分为多次以大约50μm以上的均匀厚度涂布导电膏,也能够得到抑制所述连通孔的生成的效果。此时,至少分为2次以上进行涂布即可,更加优选进行3次以上的涂布。In addition, even when the conductive paste is applied to a uniform thickness of about 50 μm or more in multiple times, the effect of suppressing the formation of the via hole can be obtained. At this time, the coating may be divided into at least two times or more, and it is more preferable to apply three or more times.
通过以上说明的实施方式,能够得到以下的效果。According to the embodiment described above, the following effects can be obtained.
(1)能够利用碳材料形成正极的集电体18。(1) The
(2)使导电膏固化来形成集电体18,因此,不需要真空蒸镀等的干式工艺。(2) Since the conductive paste is solidified to form the
(3)通过在凹部13的底部设置贮留部17,能够贮留液体状的导电膏,能够防止导电膏的溢出等。(3) By providing the
(4)通过在贮留的液体状的导电膏上放置电极6,能够通过导电膏的表面张力容易地对电极6进行定位。(4) By placing the
(2)第2实施方式(2) Second embodiment
图6的(a)是第2实施方式的双电层电容器1的侧面剖视图。(a) of FIG. 6 is a side cross-sectional view of the electric
对与第1实施方式相同的结构要素标注相同标号并省略说明。The same reference numerals are assigned to the same constituent elements as those of the first embodiment, and description thereof will be omitted.
在凹部13的底面形成有将该底面分割成2部分的突起部33。然后,通过突起部33,在凹部13的底面形成有作为贮留固化前的导电膏的留存部的2个贮留部17a、17b。A
在贮留部17a、17b中固化的导电膏分别成为集电体18a、18b。另外,使用的导电膏与第1实施方式相同。The conductive paste solidified in the
贮留部17a、17b的深度是留存导电膏的程度,贮留部17a、17b的内周被设定为比电极5、6的外周大导电膏的弯月面的程度。The depths of the
在贮留部17a、17b的底面分别形成有金属层11a、11b。金属层11a、11b的制法与第1实施方式的金属层11相同。
贮留部17a、17b分别通过形成在凹状容器2的底部的贯通电极21、22与端子10、12电连接。贯通电极21、22通过中间电极28可靠地接合。
在贮留部17a、17b中,分别在金属层11a、11b的上侧表面形成有使导电膏固化后的集电体18a、18b的层,进而,在该集电体18a、18b的层上露出电极5、6。In the
在导电膏为液体时,在该导电膏上放置电极5、6,对导电膏进行加热而使其固化,通过集电体18a、18b将电极5、6固定在贮留部17a、17b上。When the conductive paste is liquid, the
金属层11a、11b形成为必要最小限度的面积,通过导电膏使其厚度均匀,集电体18a、18b的上表面平坦。另外,金属层11a、11b也可以形成在贮留部17a、17b的整个底面上。The metal layers 11a, 11b are formed in the minimum necessary area, the thickness is made uniform by the conductive paste, and the upper surfaces of the
电极5、6具有长方体形状,由与第1实施方式的电极5、6相同的材质构成。另外,也可以使电极5、6为圆柱形状等的其他形状。The
在第2实施方式中,对称地形成电极5、6,因此,可以使任意一方为正极。In the second embodiment, since the
并且,电极5、6在突起部33的上部相对,在电极5、6之间配置有防止短路的隔板7。隔板7的材质与第1实施方式相同。另外,在使用固体的电解质的情况下,不需要隔板7。In addition, the
凹部13充满电解质,在电极5、6的上侧表面与封口板3的下侧表面(金属层15的表面)之间设置有渗透了该电解质的渗透部件31。
渗透部件31通过玻璃材料或树脂管芯等形成为海绵状,具有弹性和吸液性。The
渗透部件31被电极5、6和隔板7按压。由此,渗透部件31能够在电极5、6与电解质接触的状态下保持电极5、6和隔板7。The
封口板3的结构与第1实施方式相同,但是,例如也可以使用如下部件:用铝形成封口板3,通过热氧化处理,在下侧表面形成基于氧化铝的绝缘层。由此,即使在由于冲击等而使电极5、6与封口板3的下侧表面接触的情况下,也能够防止短路。The structure of the sealing
与第1实施方式同样,层叠基于生片的片材41~45来形成凹状容器2。Similar to the first embodiment, the
在片材41、42上形成有用于形成贯通电极21、22的贯通孔,在片材43~45上形成有与凹部13对应的开口部。在片材43上残留有未脱落的作为突起部33的部分。Through holes for forming the through
图6的(b)是用于说明第2实施方式的变形例的图。(b) of FIG. 6 is a diagram for explaining a modified example of the second embodiment.
在该例子中,双电层电容器1不具有贯通电极21、22,通过形成在凹状容器2的侧面的布线使电极5、6与端子10、12连接。其他结构与之前说明的第2实施方式相同。In this example, electric
金属层11a、11b分别从贮留部17a、17b的底面沿着片材42的表面贯通到凹状容器2的外部,经由凹状容器2的侧面与端子10、12电连接。金属层11a、11b以必要最小限度的大小形成在贮留部17a、17b的底面,但是,也可以形成在整个底面。The metal layers 11a, 11b penetrate from the bottoms of the
这样,能够以不使用贯通电极的方式构成双电层电容器1。In this way, the electric
图7的(a)是用于说明第2实施方式的又一个变形例的图。(a) of FIG. 7 is a figure for demonstrating still another modification of 2nd Embodiment.
形成树脂制的片材41~45来构成凹状容器2。
作为树脂,例如可以使用PTFE(聚四氟乙烯)、PFA(四氟乙烯-全氟烷氧基乙烯基醚共聚物)、FRP(纤维强化塑料)等。As the resin, for example, PTFE (polytetrafluoroethylene), PFA (tetrafluoroethylene-perfluoroalkoxy vinyl ether copolymer), FRP (fiber reinforced plastic), or the like can be used.
PFA具有与不锈钢熔接的树脂特有的性质,PTFE具有强度高等的树脂特有的性质,因此,可以组合不同种类的树脂的片材,例如使片材41为PTFE、片材42、43为PFA、片材44、45为PTFE。PFA has properties unique to resins welded to stainless steel, and PTFE has properties unique to resins such as high strength. Therefore, sheets of different types of resins can be combined, for example,
例如使用不锈钢的板材来形成金属层11a、11b,与片材41~45一起对其进行层叠并加热,与片材42、43熔接。Metal layers 11 a and 11 b are formed using, for example, stainless steel plates, laminated together with the
金属层11a、11b在凹状容器2的底面弯曲,金属层11a、11b的前端部分形成端子10、12。
封口板3例如由PTFE的片材构成,通过激光焊接等与凹状容器2的开口部熔接。The sealing
通过导电膏使金属层11a、11b的厚度均匀,集电体18a、18b的上表面平坦。也可以多重涂装导电膏。The thickness of the
使用金属板作为金属层11a、11b时,能够降低成本。When a metal plate is used as the
图7的(b)是用于说明第2实施方式的又一个变形例的图。(b) of FIG. 7 is a figure for demonstrating still another modification of 2nd Embodiment.
在该例子中,集电体18a和金属层11a、以及集电体18b和金属层11b分别通过使导电膏固化而形成的贯通电极61a、61b电连接。In this example, the
图8的各图是用于说明集电体18a、18b的形成方法的图。Each figure of FIG. 8 is a figure for demonstrating the formation method of
首先,如图8的(a)所示,准备形成有接合金属层8、贯通电极21、22、贮留部17a、17b、金属层11a、11b、端子10、12的凹状容器2。First, as shown in FIG. 8( a ),
然后,对贮留部17a、17b供给导电膏。导电膏的供给量被设定为铺满贮留部17a、17b的整个底面而形成弯月面19a、19b的程度。Then, the conductive paste is supplied to the
图8的(b)示出从上方观察对凹状容器2供给导电膏之后的情况。在贮留部17a、17b中贮留有固化后作为集电体18a、18b的导电膏。(b) of FIG. 8 shows the situation after supplying the conductive paste to the
接着,如图8的(c)所示,在导电膏的液面上分别放置电极5、6。于是,通过导电膏的弯月面使电极5、6分别位于贮留部17a、17b的中央部。Next, as shown in (c) of FIG. 8 , the
然后,加热到180[℃]左右的温度后,导电膏固化而成为集电体18a、18b,电极5、6固定在贮留部17a、17b的中央部。Then, when heated to a temperature of about 180[° C.], the conductive paste is cured to form
虽然没有图示,但是,然后在电极5、6之间放置隔板7,供给电解质。进而在电极5、6上放置渗透有电解质的渗透部件31,利用封口板3对凹部13的开口部进行封口钎焊后,双电层电容器1完成。Although not shown in the figure, a
通过以上说明的第1实施方式,能够得到以下结构。According to the first embodiment described above, the following configurations can be obtained.
凹部13成为空洞部,因此,被封口板3封口的凹状容器2作为具有空洞部的容器发挥功能。The
金属层11和与该金属层11接合的贯通电极22作为从所述空洞部导通到所述容器的外部的第1导电体发挥功能。The
集电体18作为在所述空洞部内与所述第1导电体接合且将碳作为导电材料的第1集电体发挥功能。The
电极6作为与所述第1集电体接合的第1电极发挥功能。The
金属层15的不与电极5接触的部分52、与该部分52接合的接合金属层8以及贯通电极21作为从所述空洞部导通到所述容器的外部的第2导电体发挥功能。The
金属层15的与电极5接触的部分51作为在所述空洞部内与所述第2导电体接合的第2集电体发挥功能。A
电极5作为与所述第2集电体接合且隔开预定距离与所述第1电极相对的第2电极发挥功能。The
封入凹部13中的电解质作为与所述第1电极和第2电极接触的电解质发挥功能。The electrolyte enclosed in the
电极6被用作正极,电极5被用作负极,因此,所述第1电极是正极,所述第2电极是负极。The
为了防止金属层11溶解于电解质中,金属层11在凹部13内整个被集电体18覆盖,因此,所述第1集电体在所述空洞部内包覆整个所述第1导电体。In order to prevent the
导电膏使用将包含碳材料和溶剂的酚醛树脂加工成膏状而得到的物质,使酚醛树脂成分聚合而成为树脂状,因此,所述第1集电体由将碳作为导电材料的树脂形成。The conductive paste is obtained by processing a phenolic resin containing a carbon material and a solvent into a paste form, and the phenolic resin component is polymerized into a resinous form. Therefore, the first current collector is formed of a resin using carbon as a conductive material.
集电体18形成在贮留部17(由凹部形成)中,因此,所述第1集电体形成于在所述空洞部中形成的凹部中。The
通过反复进行导电膏的供给和固化,能够将集电体18形成为层状,该情况下,所述第1集电体层状地形成有将碳作为导电材料的部件。By repeating the supply and curing of the conductive paste, the
并且,在第2实施方式中,针对电极5,也利用导电膏形成集电体,因此,该情况下,所述第2集电体将碳作为导电材料。Furthermore, in the second embodiment, the
并且,双电层电容器1例如能够用作便携电话的存储器或时钟的备用电源。Furthermore, the electric
该情况下,该便携电话作为如下的电子装置发挥功能:该电子装置具有:由双电层电容器1构成的电子部件;蓄电单元,其在装配主电源电池的同时向所述电子部件蓄电;其他电子部件,其发挥存储器或时钟等的预定功能;以及电力供给单元,其用所述蓄积的电荷对所述其他电子部件供给电力,例如对蓄积的电荷进行放电从而对存储器或时钟供给电力等。In this case, the mobile phone functions as an electronic device including: an electronic component composed of an electric
层叠片材41~45来形成凹状容器2,该凹状容器2形成有用于形成空洞的凹部13、贮留部17、金属层11、贯通电极21、22,因此,双电层电容器1的制造工序包含形成凹状容器的步骤,其中,该凹状容器具有用于形成空洞的凹部、形成在所述凹部内的贮留导电膏的贮留部、以及从所述贮留部的底面导通到外部的第1导电体。The
并且,对贮留部17供给导电膏并在液面上设置电极6,然后进行加热使导电膏固化,因此,该制造工序包含以下步骤:对所述贮留部供给将碳作为导电材料的导电膏的步骤、在所述供给的导电膏上设置第1电极的步骤、使设置有所述第1电极的导电膏固化而形成第1集电体的步骤。In addition, the conductive paste is supplied to the
进而,在金属层15上接合电极5,对凹部13供给电解质,与隔板7一起在凹部13中设置电极5,因此,该工序包含如下步骤:在所述凹部中形成第2集电体、设置于所述第2集电体且隔开预定距离与所述第1电极相对的第2电极、与所述第2集电体接合且导通到外部的第2导电体、以及与所述第1电极和所述第2电极接触的电解质。Furthermore, the
进行钎焊并利用封口板3对凹部13进行封口,因此,该工序包含对所述凹部进行封口的步骤。Since brazing is performed and the
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Also Published As
Publication number | Publication date |
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CN105185603B (en) | 2017-10-13 |
CN102376458B (en) | 2015-12-16 |
CN105185603A (en) | 2015-12-23 |
JP5777001B2 (en) | 2015-09-09 |
JP2012044074A (en) | 2012-03-01 |
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