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CN102363885A - Pretreatment solution for selective stripping of silver coating and quantitative analysis of elements in silver coating - Google Patents

Pretreatment solution for selective stripping of silver coating and quantitative analysis of elements in silver coating Download PDF

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CN102363885A
CN102363885A CN2011103089494A CN201110308949A CN102363885A CN 102363885 A CN102363885 A CN 102363885A CN 2011103089494 A CN2011103089494 A CN 2011103089494A CN 201110308949 A CN201110308949 A CN 201110308949A CN 102363885 A CN102363885 A CN 102363885A
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silver coating
acid
solution
stripping
silver
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CN102363885B (en
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陈智栋
王钰蓉
张静
王文昌
周阳
光崎尚利
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CHANGZHOU JIANGGONG KUOZHI ELECTRONIC TECHNOLOGY CO LTD
Changzhou University
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CHANGZHOU JIANGGONG KUOZHI ELECTRONIC TECHNOLOGY CO LTD
Changzhou University
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Abstract

The invention relates to a solution for selective stripping of a silver coating. The solution consists of the following components in percentage by mass: 0.01 to 10 percent of chloroacetic acid, 0.01 to 10 percent of carboxylic acid, 1 to 20 percent of hydrogen peroxide, and the balance of deionized water. The solution has the advantages that: the solution does not contain nitric acid, hydrochloric acid, sulfuric acid and other strong acid, so when the silver coating is stripped, the solution can greatly improve the environment of field production operation; and the solution has the property of selectively corroding silver, so that the solution slightly influences the surface of a base material and can be used as the pretreatment solution for the quantitative analysis of elements in the silver coating.

Description

选择性剥离银镀层及银镀层中元素定量分析的前处理溶液Pretreatment solution for selective stripping of silver coating and quantitative analysis of elements in silver coating

技术领域 technical field

本发明涉及一种选择性剥离银镀层及银镀层中元素定量分析的前处理溶液。The invention relates to a pretreatment solution for selective stripping of silver coating and quantitative analysis of elements in the silver coating.

背景技术 Background technique

在印制线路板或电子接插件制造工艺中,为了保护基材和增加可焊性,常常在基材表面进行镀银。在制造印制电路板的过程中,还可能根据工艺的需要,再将部分银镀层进行剥离,还可能在处理银镀层不合格品时,将银镀层剥离,还可能为了分析银镀层中金属元素的含量,将银镀层剥离。In the manufacturing process of printed circuit boards or electronic connectors, in order to protect the substrate and increase solderability, silver plating is often performed on the surface of the substrate. In the process of manufacturing printed circuit boards, part of the silver coating may be stripped according to the needs of the process, or the silver coating may be stripped when dealing with unqualified silver coatings, and it is also possible to analyze the metal elements in the silver coating The content of silver plating will be stripped.

用于银镀层剥离的溶液通常采用氰化物、铬酸盐及强酸溶液。众所周知氰化物是剧毒物质,对环境污染极大;而铬酸盐由于其对环境的污染也逐渐不被使用;由于强酸容易产生酸雾,会对生产现场造成不良的影响。同时,常用的银镀层剥离溶液会直接腐蚀基材,对银镀层没有选择性。Solutions for silver plating stripping usually use cyanide, chromate and strong acid solutions. It is well known that cyanide is a highly toxic substance that pollutes the environment greatly; and chromate is gradually not used due to its pollution to the environment; because strong acid is easy to produce acid mist, it will cause adverse effects on the production site. At the same time, commonly used silver plating stripping solutions will directly corrode the substrate and have no selectivity for the silver plating.

发明内容 Contents of the invention

本发明要解决的技术问题是:为解决现在的银镀层剥离的溶液对环境污染极大;会直接腐蚀基材,对银镀层没有选择性的技术问题,本发明提供一种选择性剥离银镀层及银镀层中元素定量分析的前处理溶液,该选择性剥离银镀层及银镀层中元素定量分析的前处理溶液不腐蚀基材,并且去除银的速度较快。由于本发明的选择性剥离银镀层及银镀层中元素定量分析的前处理溶液不含有氰化物和强酸,所以该选择性剥离银镀层及银镀层中元素定量分析的前处理溶液溶液对环境友好。The technical problem to be solved by the present invention is: in order to solve the technical problem that the current solution for stripping the silver coating is extremely polluting to the environment; it will directly corrode the substrate and has no selectivity to the silver coating. The present invention provides a selective stripping silver coating And the pretreatment solution for quantitative analysis of elements in the silver coating, the selective stripping silver coating and the pretreatment solution for quantitative analysis of elements in the silver coating do not corrode the base material, and the silver removal speed is fast. Since the pretreatment solution for selective stripping of the silver coating and quantitative analysis of elements in the silver coating does not contain cyanide and strong acid, the pretreatment solution for selective stripping of the silver coating and quantitative analysis of elements in the silver coating is environmentally friendly.

本发明解决其技术问题采用的技术方案是:一种选择性剥离银镀层及银镀层中元素定量分析的前处理溶液由氯乙酸、羧酸、双氧水和去离子水构成。The technical solution adopted by the present invention to solve the technical problem is: a pretreatment solution for selective stripping of the silver coating and quantitative analysis of elements in the silver coating consists of chloroacetic acid, carboxylic acid, hydrogen peroxide and deionized water.

氯乙酸的质量百分浓度为0.01~10%,羧酸的质量百分浓度为0.01~10%,双氧水的质量百分浓度为1~20%,其余为去离子水。The mass percentage concentration of chloroacetic acid is 0.01-10%, the mass percentage concentration of carboxylic acid is 0.01-10%, the mass percentage concentration of hydrogen peroxide is 1-20%, and the rest is deionized water.

氯乙酸选自一氯乙酸、二氯乙酸三氯乙酸的一种或一种以上的混合物。当氯乙酸的质量百分浓度大于10%时,容易腐蚀基材,选择性下降;当氯乙酸的质量百分浓度低于0.01%时,对银镀层的剥离效果不佳,剥离时间过长。氯乙酸的质量百分浓度范围为0.01~10%,最佳质量百分浓度范围为0.1~5%。Chloroacetic acid is selected from one or more mixtures of monochloroacetic acid, dichloroacetic acid and trichloroacetic acid. When the mass percentage concentration of chloroacetic acid is greater than 10%, it is easy to corrode the base material, and the selectivity decreases; when the mass percentage concentration of chloroacetic acid is lower than 0.01%, the stripping effect of silver plating is not good, and the stripping time is too long. The mass percentage concentration range of chloroacetic acid is 0.01-10%, and the optimum mass percentage concentration range is 0.1-5%.

羧酸的加入,有助于增加对银镀层的剥离速度,羧酸为一元酸或二元酸,其中含碳数为不大于5,如甲酸、乙酸、丙酸,丁酸、戊酸、乙二酸、丙二酸、丁二酸、戊二酸等,当羧酸的质量百分浓度大于10%时,单纯对剥离银镀层来说,无任何影响,但是当将剥离溶液作为剥离银镀层的前处理液,对银镀层中其他元素进行定量分析时,过多的羧酸会导致测定结果偏低。当羧酸的质量百分浓度低于0.01%时,对加速银镀层剥离的影响很难显现。羧酸的质量百分浓度为0.01~10%,其最佳质量百分浓度范围为1~5%。The addition of carboxylic acid helps to increase the stripping speed of the silver coating. The carboxylic acid is a monobasic acid or a dibasic acid with a carbon number of not more than 5, such as formic acid, acetic acid, propionic acid, butyric acid, valeric acid, ethyl Diacid, malonic acid, succinic acid, glutaric acid etc., when the mass percentage concentration of carboxylic acid is greater than 10%, simply for stripping silver coating, without any influence, but when stripping solution is used as stripping silver coating When carrying out quantitative analysis on other elements in the silver coating, too much carboxylic acid will lead to low measurement results. When the mass percent concentration of carboxylic acid is lower than 0.01%, the effect on accelerating the stripping of silver plating is difficult to appear. The mass percent concentration of carboxylic acid is 0.01-10%, and the optimum mass percent concentration range is 1-5%.

在本发明的选择性剥离银镀层及银镀层中元素定量分析的前处理溶液中,双氧水的加入量为质量百分浓度为1~20%,当双氧水的质量百分浓度大于20%时,溶液对银镀层的剥离速度很快,但同时该溶液也会对基材产生腐蚀,导致选择性下降。当双氧水的质量百分浓度小于1%时,选择性剥离银镀层及银镀层中元素定量分析的前处理溶液对银镀层的剥离速度过低,双氧水质量百分浓度的最佳范围为5~10%。In the pretreatment solution for selective stripping of the silver coating and the quantitative analysis of elements in the silver coating of the present invention, the addition of hydrogen peroxide is 1 to 20% in mass percent concentration, and when the mass percent concentration of hydrogen peroxide is greater than 20%, the solution The stripping speed of the silver plating is very fast, but at the same time, the solution will also corrode the substrate, resulting in a decrease in selectivity. When the mass percentage concentration of hydrogen peroxide is less than 1%, the stripping speed of the silver coating is too low for the pretreatment solution of the selective stripping silver coating and the quantitative analysis of elements in the silver coating, and the optimal range of the hydrogen peroxide mass percentage concentration is 5~10 %.

使用本发明的选择性剥离银镀层及银镀层中元素定量分析的前处理溶液方法为:将欲去除银镀层的样片置于45℃的脱脂清洗液中(NaOH 10g/L、Na2CO3 20g/L、Na3PO4·12H2O 5g/L、OP-10乳化剂1g/L)5min,水洗后将样片置于本发明的选择性剥离银镀层及银镀层中元素定量分析的前处理溶液中,直至全部露出基材层颜色,取出后水洗热风烘干。Use the pretreatment solution method of the selective stripping silver coating of the present invention and the quantitative analysis of elements in the silver coating to be: the sample piece that wants to remove the silver coating is placed in the degreasing cleaning solution of 45 ℃ (NaOH 10g/L, Na 2 CO 20g /L, Na 3 PO 4 12H 2 O 5g/L, OP-10 emulsifier 1g/L) 5min, after washing, the sample is placed in the pretreatment of selective stripping of the silver coating and quantitative analysis of elements in the silver coating of the present invention Solution, until the color of the substrate layer is completely exposed, take it out, wash it with water and dry it with hot air.

本发明的技术效果是:不含有如硝酸、盐酸和硫酸等强酸,对镀银层进行剥离时,该溶液的使用能够极大地改善现场生产作业的环境;同时由于该溶液具有选择性腐蚀银的特性,所以该溶液对基材表面的影响小,并且可以直接作为银镀层中元素定量分析的前处理液。The technical effect of the present invention is: do not contain strong acids such as nitric acid, hydrochloric acid and sulfuric acid, when stripping the silver-plated layer, the use of this solution can greatly improve the environment of on-site production operations; characteristics, so the solution has little effect on the surface of the substrate, and can be directly used as a pretreatment solution for quantitative analysis of elements in the silver coating.

具体实施例 specific embodiment

下面通过具体实施例来介绍本发明的功效。The effects of the present invention are described below through specific examples.

实施例1 1000g选择性剥离银镀层及银镀层中元素定量分析的前处理溶液的配制Embodiment 1 The preparation of the pretreatment solution for selective stripping of silver coating and element quantitative analysis in silver coating of 1000g

氯乙酸以一氯乙酸为例,羧酸以乙酸为例,对银镀层剥离液的配制方法进行说明,取0.1g的一氯乙酸加入到600g的去离子水中,充分混合后加入100g的乙酸,待充分混合后加入双氧水200g,再加入99.9g的去离子水搅拌混合。Chloroacetic acid takes monochloroacetic acid as an example, and carboxylic acid takes acetic acid as an example. The preparation method of the silver plating stripping solution is explained. Get 0.1g of monochloroacetic acid and add it to 600g of deionized water. After fully mixing, add 100g of acetic acid. After fully mixing, add 200g of hydrogen peroxide, then add 99.9g of deionized water and stir to mix.

实施例2 1000g选择性剥离银镀层及银镀层中元素定量分析的前处理溶液的配制Embodiment 2 Preparation of pretreatment solution for selective stripping of silver coating and quantitative analysis of elements in silver coating of 1000g

氯乙酸以二氯乙酸为例,羧酸以甲酸为例,对银镀层剥离液的配制方法进行说明,取1g的二氯乙酸加入到600g的去离子水中,充分混合后加入50g的甲酸,待充分混合后加入双氧水100g,再加入240g的去离子水搅拌混合。Take dichloroacetic acid as an example for chloroacetic acid, and formic acid as an example for carboxylic acid. The preparation method of the silver plating stripping solution is explained. Get 1g of dichloroacetic acid and join it in 600g of deionized water. After fully mixing, add 50g of formic acid. After fully mixing, add 100 g of hydrogen peroxide, then add 240 g of deionized water and stir to mix.

实施例3 1000g选择性剥离银镀层及银镀层中元素定量分析的前处理溶液的配制Embodiment 3 Preparation of pretreatment solution for selective stripping of silver coating and quantitative analysis of elements in silver coating of 1000g

氯乙酸以三氯乙酸为例,羧酸以乙酸为例,对银镀层剥离液的配制方法进行说明,取50g的一氯乙酸加入到600g的去离子水中,充分混合后加入1g的戊二酸,待充分混合后加入双氧水50g,再加入290g的去离子水搅拌混合。Take trichloroacetic acid as an example for chloroacetic acid, and acetic acid as an example for carboxylic acid. The preparation method of the silver plating stripping solution is explained. Take 50g of monochloroacetic acid and add it to 600g of deionized water. After mixing well, add 1g of glutaric acid After fully mixing, add 50g of hydrogen peroxide, then add 290g of deionized water and stir to mix.

实施例4 1000g选择性剥离银镀层及银镀层中元素定量分析的前处理溶液的配制Embodiment 4 Preparation of pretreatment solution for selective stripping of silver coating and element quantitative analysis in silver coating of 1000g

氯乙酸以一氯乙酸和三氯乙酸为例,羧酸以丙二酸为例,对银镀层剥离液的配制方法进行说明,取50g的一氯乙酸和50g的三氯乙酸加入到600g的去离子水中,充分混合后加入0.1g的丙二酸,待充分混合后加入双氧水10g,再加入289.9g的去离子水搅拌混合。Chloroacetic acid is example with monochloroacetic acid and trichloroacetic acid, and carboxylic acid is example with malonic acid, and the preparation method of silver plating stripping solution is explained, and the monochloroacetic acid of 50g and the trichloroacetic acid of 50g are added to 600g of In deionized water, after fully mixing, add 0.1 g of malonic acid, after fully mixing, add 10 g of hydrogen peroxide, then add 289.9 g of deionized water and stir and mix.

比较例1 1L银镀层剥离液的配制The preparation of comparative example 1 1L silver coating stripping solution

以硫代硫酸钠剥离液为例,对剥离液的配制方法进行说明,取300g硫代硫酸钠溶于1000ml的去离子水中,搅拌使固体充分溶解。(因为强酸型剥离液对基材腐蚀性太大,所以这里不选做比较例。此处选择温和型的硫代硫酸钠银镀层剥离液作为比较。)Taking the sodium thiosulfate stripping solution as an example, the preparation method of the stripping solution is described. Take 300g of sodium thiosulfate and dissolve it in 1000ml of deionized water, and stir to fully dissolve the solid. (Because the strong acid type stripping solution is too corrosive to the base material, so it is not selected as a comparative example here. The mild sodium thiosulfate silver plating stripping solution is selected here as a comparison.)

实施例5 选择性剥离银镀层及银镀层中元素定量分析的前处理溶液在去除银镀层时对基材表面的影响Embodiment 5 Selective stripping of the silver coating and the influence of the pretreatment solution for the quantitative analysis of elements in the silver coating on the surface of the substrate when the silver coating is removed

对于去除银镀层后,重新返工镀银的样品,需要保持基材表面的平整度非常重要,所以评价了使用本发明选择性剥离银镀层及银镀层中元素定量分析的前处理溶液在去除银镀层时对基材表面的影响。具体方法为:首先,利用显微镜测量覆铜板表面铜箔的粗糙度,在该样品表面镀银后,使用本发明实施例1-4的选择性剥离银镀层及银镀层中元素定量分析的前处理溶液和比较例1的银镀层剥离液对银层进行剥离后,再测量铜箔表面的粗糙度,其粗糙度变化不大于10%的,标记为◎,其粗糙度变化大于10%不大于20%的,标记为○,粗糙度变化大于20%的,标记为X。结果见表1。After removing the silver coating, rework the silver-plated sample again, it is very important to keep the flatness of the substrate surface, so the use of the pretreatment solution for selective stripping of the silver coating and the quantitative analysis of elements in the silver coating of the present invention is evaluated in removing the silver coating. effect on the substrate surface. The specific method is as follows: First, use a microscope to measure the roughness of the copper foil on the surface of the copper clad laminate, and after the surface of the sample is plated with silver, use the pretreatment of selective stripping of the silver coating and quantitative analysis of elements in the silver coating according to Examples 1-4 of the present invention solution and the silver plating stripping solution of Comparative Example 1 to strip the silver layer, then measure the roughness of the copper foil surface, the roughness change is not greater than 10%, marked as ◎, and the roughness change is greater than 10% and not greater than 20% %, marked as ○, roughness change greater than 20%, marked as X. The results are shown in Table 1.

表1  选择性剥离银镀层及银镀层中元素定量分析的前处理溶液和银镀层剥离液处理后铜箔表面粗糙度的变化Table 1 Pretreatment solution for selective stripping of silver coating and quantitative analysis of elements in silver coating and change of surface roughness of copper foil after treatment with silver coating stripping solution

  例 example   处理后铜箔表面粗糙度变化率 Change rate of copper foil surface roughness after treatment   实施例1 Example 1   ◎   实施例2 Example 2   ◎   实施例3 Example 3   ◎   实施例4 Example 4   ○   比较例1 Comparative example 1   ○

实施例6 银镀层中其他元素的含量分析The content analysis of other elements in the silver coating of embodiment 6

对于分析银镀层中其他元素的含量,如RoHS指令中的Cd2+、Hg2+、Pb2+和Cr6+,银镀层的选择性剥离显的尤为重要。因为如果银镀层剥离液过度腐蚀基材的话,会将基材中的微量杂质元素带入到待测的剥离银溶液中。因此,评价了使用本发明选择性剥离银镀层及银镀层中元素定量分析的前处理溶液的选择性,其方法为将2×2cm镀银的覆铜板置于50mL本发明实施例1-4选择性剥离银镀层及银镀层中元素定量分析的前处理溶液(室温)和比较例1的银镀层剥离液中(70℃),待完全露出铜基材表面后,取出覆铜板。将溶解了银的选择性剥离银镀层及银镀层中元素定量分析的前处理溶液和银剥离液分别转移到100ml的容量瓶中,稀释至刻度,用原子吸收分光光度法测定剥离液中铜离子的含量,判断本发明的选择性剥离银镀层及银镀层中元素定量分析的前处理溶液的选择性。结果见表2。For the analysis of the content of other elements in the silver coating, such as Cd 2+ , Hg 2+ , Pb 2+ and Cr 6+ in the RoHS directive, the selective stripping of the silver coating is particularly important. Because if the silver plating stripping solution corrodes the base material excessively, the trace impurity elements in the base material will be brought into the stripping silver solution to be tested. Therefore, the selectivity of the pretreatment solution for selective stripping of the silver coating and the quantitative analysis of elements in the silver coating using the present invention was evaluated. The method was to place a 2×2 cm silver-plated copper-clad board in 50 mL of the selected solution of Examples 1-4 of the present invention. In the pretreatment solution (room temperature) for the permanent stripping of the silver coating and the quantitative analysis of elements in the silver coating (at room temperature) and the silver coating stripping solution (70° C.) of Comparative Example 1, after the surface of the copper substrate is completely exposed, the copper-clad board is taken out. The pretreatment solution and the silver stripping solution for the selective stripping of the silver coating and the quantitative analysis of elements in the silver coating that have been dissolved in silver are transferred to a 100ml volumetric flask respectively, diluted to the scale, and the copper ion in the stripping solution is measured by atomic absorption spectrophotometry To determine the selectivity of the pretreatment solution for the selective stripping of the silver coating and the quantitative analysis of elements in the silver coating of the present invention. The results are shown in Table 2.

表2  溶于选择性剥离银镀层及银镀层中元素定量分析的前处理溶液和银镀层剥离液中的铜离子的浓度Table 2 The concentration of copper ions dissolved in the selective stripping silver coating and the pretreatment solution for quantitative analysis of elements in the silver coating and the silver coating stripping solution

  例 example   剥离液中铜离子浓度(μg/ml) Concentration of copper ion in stripping solution (μg/ml)   实施例1 Example 1   98 98   实施例2 Example 2   79 79   实施例3 Example 3   158 158   实施例4 Example 4   220 220   比较例1 Comparative example 1   178 178

(实施例1-4在室温下的玻璃时间分别约为6min、4min、5min、8min,比较例1在70℃下的剥离时间为9min)(The glass time of Examples 1-4 at room temperature is about 6min, 4min, 5min, 8min respectively, and the peeling time of Comparative Example 1 at 70°C is 9min)

以上述依据本发明的理想实施例为启示,通过上述的说明内容,相关工作人员完全可以在不偏离本项发明技术思想的范围内,进行多样的变更以及修改。本项发明的技术性范围并不局限于说明书上的内容,必须要根据权利要求范围来确定其技术性范围。Inspired by the above-mentioned ideal embodiment according to the present invention, through the above-mentioned description content, relevant workers can make various changes and modifications within the scope of not departing from the technical idea of the present invention. The technical scope of the present invention is not limited to the content in the specification, but must be determined according to the scope of the claims.

Claims (6)

1.一种适用于剥离银镀层及银镀层中元素定量分析的前处理溶液,其特征在于:该溶液的构成为氯乙酸、羧酸、双氧水和去离子水。1. a kind of pretreatment solution that is applicable to stripping silver coating and element quantitative analysis in silver coating, it is characterized in that: the composition of this solution is chloroacetic acid, carboxylic acid, hydrogen peroxide and deionized water. 2.权利要求1所述的前处理溶液,其特征是氯乙酸的质量百分浓度为0.01~10%,羧酸的质量百分浓度为0.01~10%,双氧水的质量百分浓度为1~20%,其余为去离子水。2. the described pretreatment solution of claim 1 is characterized in that the mass percent concentration of chloroacetic acid is 0.01~10%, the mass percent concentration of carboxylic acid is 0.01~10%, and the mass percent concentration of hydrogen peroxide is 1~10%. 20%, and the rest is deionized water. 3.权利要求1所述的前处理溶液,其特征是氯乙酸的质量百分浓度为0.1~5%,羧酸的质量百分浓度为0.1~10%,双氧水的质量百分浓度为5~10%,其余为去离子水。3. the described pretreatment solution of claim 1 is characterized in that the mass percent concentration of chloroacetic acid is 0.1~5%, the mass percent concentration of carboxylic acid is 0.1~10%, and the mass percent concentration of hydrogen peroxide is 5~5%. 10%, and the rest is deionized water. 4.权利要求1所述的前处理溶液,其特征是氯乙酸选自一氯乙酸、二氯乙酸、三氯乙酸中的一种或一种以上混合物。4. The pretreatment solution according to claim 1, characterized in that chloroacetic acid is selected from one or more mixtures of monochloroacetic acid, dichloroacetic acid and trichloroacetic acid. 5.权利要求1所述的前处理溶液,其特征是羧酸为一元酸或二元酸,其中含碳数小于5。5. The pretreatment solution according to claim 1, characterized in that the carboxylic acid is a monobasic acid or a dibasic acid, wherein the carbon number is less than 5. 6.权利要求1所述的前处理溶液,其特征是银镀层是镀覆于铜、钢或铁-镍合金基材上的。6. The pretreatment solution according to claim 1, characterized in that the silver coating is plated on copper, steel or iron-nickel alloy substrate.
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Publication number Priority date Publication date Assignee Title
CN103074497A (en) * 2013-01-24 2013-05-01 惠州Tcl环境科技有限公司 Method for recovering silver from waste film
CN105256325A (en) * 2015-10-28 2016-01-20 湖南赛奥硅业股份有限公司 Stripping agent for silver plating layer
CN108425145A (en) * 2018-05-09 2018-08-21 泉州市蓝水环保科技有限公司 A kind of nontoxic copper and iron base silver decoating liquid and its withdrawal plating

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CN1237207C (en) * 2003-06-25 2006-01-18 铼宝科技股份有限公司 Silver alloy etching solution

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CN1476489A (en) * 2001-10-09 2004-02-18 长濑化成株式会社 Etchant composition
CN1678714A (en) * 2002-08-26 2005-10-05 默克专利有限公司 Etching pastes for titanium oxide surfaces
CN1237207C (en) * 2003-06-25 2006-01-18 铼宝科技股份有限公司 Silver alloy etching solution

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103074497A (en) * 2013-01-24 2013-05-01 惠州Tcl环境科技有限公司 Method for recovering silver from waste film
CN105256325A (en) * 2015-10-28 2016-01-20 湖南赛奥硅业股份有限公司 Stripping agent for silver plating layer
CN108425145A (en) * 2018-05-09 2018-08-21 泉州市蓝水环保科技有限公司 A kind of nontoxic copper and iron base silver decoating liquid and its withdrawal plating

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