CN102345805A - Light-emitting diode bulb - Google Patents

Abstract

A light-emitting diode light bulb, which includes a shell, at least one light-emitting diode light source accommodated in the shell, a cover installed around the shell, and a cover installed on the bottom of the shell and electrically connected to the light-emitting diode light source The electrical connector, the housing is made of ceramic material. Compared with the existing technology, due to the use of ceramic materials, the shell will not have too much deformation due to the surrounding environment, and will not leak electricity, and has the advantages of light weight, high hardness, and corrosion resistance.

Description

light emitting diode bulb

technical field

The invention relates to a bulb, in particular to a light emitting diode bulb.

Background technique

Compared with traditional light sources, light-emitting diodes have the advantages of light weight, small size, low pollution, and long life. As a new type of light source, they have been increasingly used in various fields, such as street lamps, Traffic lights, signal lights, spotlights and decorative lights, etc.

However, rapid heat dissipation is still an important issue affecting the overall performance of LED bulbs. In the prior art, metals with high thermal conductivity are generally used as the shell, and the volume of the shell is increased to achieve a good heat dissipation effect.

However, due to the physical and chemical properties of the metal itself, it has disadvantages caused by its various properties when used as a shell. For example, the high density of metal makes the overall weight of the bulb relatively heavy; the thermal expansion coefficient of metal is relatively large, which causes the connection parts of other internal mechanisms to be separated or cracked due to thermal expansion of the shell, resulting in damage; The metal shell and the power supply part are not well insulated, and leakage is easy to occur; because of the corrosion resistance of the metal itself, if it is not rust-proofed, it is easy to rust due to external conditions; the metal hardness is not high, if dropped Then it is easy to cause deformation on the heat dissipation surface of the housing. Thus, the use of metal as the housing introduces instability in the external performance of the bulb, which occasionally leads to internal instability.

Contents of the invention

In view of this, the present invention aims to provide a light-emitting diode bulb with more stable external performance and heat dissipation.

A light-emitting diode light bulb, which includes a shell, at least one light-emitting diode light source accommodated in the shell, a cover installed around the shell, and a cover installed on the bottom of the shell and electrically connected to the light-emitting diode light source The electrical connector, the housing is made of ceramic material.

Compared with the prior art, the light-emitting diode bulb of the present invention has the following advantages due to the use of ceramics as the housing due to the physical and chemical properties of the ceramic itself: the density of ceramics is smaller than that of metal, which reduces the overall weight of the bulb; The coefficient of thermal expansion is lower than that of metal, so that the shell of the bulb will not have too much deformation due to changes in the ambient temperature; ceramics are electrically insulated, so there will be no leakage current; ceramics have good chemical stability, corrosion resistance, It can resist oxidation caused by the external environment; the hardness of the ceramic is high, and it is not easy to be damaged or deformed by dropping; at the same time, the ceramic has a certain thermal conductivity, which is enough to dissipate and dissipate the heat emitted by the LED light source.

The present invention will be further described below in conjunction with specific embodiments with reference to the accompanying drawings.

Description of drawings

FIG. 1 is a schematic cross-sectional view of an LED light bulb according to a first embodiment of the present invention.

FIG. 2 is a schematic diagram of the LED light source of the LED light bulb according to the first embodiment of the present invention.

FIG. 3 is a schematic cross-sectional view of an LED light bulb according to a second embodiment of the present invention.

FIG. 4 is a schematic cross-sectional view of a light-emitting diode bulb according to a third embodiment of the present invention.

FIG. 5 is a schematic cross-sectional view of a light-emitting diode bulb according to a fourth embodiment of the present invention.

FIG. 6 is a schematic cross-sectional view of a light emitting diode bulb according to a fifth embodiment of the present invention.

FIG. 7 is a circuit diagram of an LED light bulb according to a fifth embodiment of the present invention.

FIG. 8 is a schematic cross-sectional view of an LED light bulb according to a sixth embodiment of the present invention.

FIG. 9 is a schematic cross-sectional view of a variant embodiment of an LED light source of an LED light bulb according to the present invention.

Description of main component symbols

LED Bulbs 10, 20, 30, 40, 50, 60

Housing 11, 21, 31

The first accommodation space 111, 211, 311

The second accommodation space 112, 212

Loading board 113, 213, 313

Through-hole 114, 214, 314

Filler 115

Light-emitting diode light source 12, 22, 32

Light-emitting diode chip 121

Substrate 122

Electrodes 123, 251, 323

Encapsulation layer 124, 324

Cover body 13, 23

Electrical Connectors 14

Power module 15, 25

Incident light side 231

Elastic fasteners 24

Cylinder 241

Tapered end 242

Wire 26, 51

Circuit layer 61

Detailed ways

Hereinafter, the light-emitting diode light bulb of the technical solution will be described in detail with reference to the drawings and embodiments.

As shown in FIG. 1 , it is a light emitting diode bulb 10 provided in the first embodiment of the present invention. The LED light bulb 10 includes a housing 11, an LED light source 12 housed in the housing 11, a cover 13 mounted around the housing 11, and an electrical connector 14 installed at the bottom of the housing 11. , and a power module 15 housed in the casing 11 and electrically connected to the LED light source 12 and the electrical connector 14 .

The shell is made of ceramic material, which may include: silicon nitride (Si ₃ N ₄ ), silicon carbide (SiC), zirconia (ZrO ₂ ), boron nitride (B ₄ C), titanium diboride (TiB ₄ ), aluminum oxide (Al _x O _y ), aluminum nitride (AlN), beryllium oxide (BeO) and silicon aluminum oxygen carbon ceramics (Sialon) or a mixture of two or more of the foregoing. The casing 11 includes a first accommodating space 111 and a second accommodating space 112 . The first accommodating space 111 is a conical cavity with an inner diameter gradually decreasing from top to bottom formed by the top surface of the casing 11 being recessed downwards, for accommodating the LED light source 12 . The second accommodating space 112 is a conical cavity with an inner diameter gradually increasing from bottom to top formed by the bottom surface of the housing 11 being recessed upwards. It is deeper than the first accommodating space 111 and straight to the second accommodating space 112. The maximum diameter of is equivalent to the minimum diameter of the first accommodating space 111 . The second accommodating space 112 is used for accommodating the power module 15 . The housing part between the first accommodating space 111 and the second accommodating space 112 is a bearing plate 113 with a certain thickness, on which at least one through hole 114 is provided to connect the first accommodating space 111 and the second accommodating space. Space 112. In this embodiment, the housing 11 is in the shape of an inverted truncated cone as a whole, and the diameter of the top surface is larger than the diameter of the bottom surface.

The manufacturing method of the shell 11 is to grind, mix, stir and disperse the raw materials, and then make a blank through various processes, such as: spray granulation, extrusion molding, casting molding or scraper molding. After the blank is obtained, the subsequent green body modification and sintering are carried out. Before the finished product is made, various technological processes such as: metal attachment, welding electrodes, or inspection, or surface treatment, and packaging can be carried out.

Please refer to FIG. 2 together. The LED light source 12 is accommodated in the first accommodation space 111 of the casing 11, which includes at least one LED chip 121, a substrate 122 carrying these LED chips 121, and at least two electrodes. 123 and encapsulation layer 124.

The LED chips 121 can be single or multiple, and are disposed on a flat surface of the substrate 122 . The light-emitting diode chip 121 contains phosphide that can emit yellow light to red light wavelength, such as: AlxInyGa(1-xy)P (0≤x≤1, 0≤y≤1, x+y≤1), or arsenic AlInGaAs, or use various semiconductors such as oxide ZnO or nitride GaN to emit short-wavelength light sufficient to excite fluorescent materials. Nitride semiconductor (In _x Al _y Ga _1-xy N, 0≤ x≤1, 0≤y≤1, x+y≤1) is the best. In this embodiment, there are 9 light-emitting diode chips 121, which are divided into three groups, connected in series first and then in parallel. Of course, all of them can be connected in parallel or in series, or in reverse parallel and then in series, depending on the usage.

The substrate 122 is flat and is used to carry the light emitting diode chip 121. Its upper surface has a circuit layer (not shown in the figure), through the electrical connection between the circuit layer and the electrode 123, the electrode 123 is connected to an external power source and connected to the light emitting diode chip. 121 provides electricity. In this embodiment, the substrate 122 is only thermally connected to the LED chip 121 , and the circuit layer is electrically connected to the LED chip 121 , so that the LED chip 121 is a thermoelectrically separated structure. The substrate 122 is an intrinsic/pure semiconductor or a semiconductor not intentionally doped with other impurities, and its carrier concentration is less than or equal to 5×10 ⁶ cm ^-3 , preferably less than or equal to 2×10 ⁶ cm ^-3 . The substrate 122 mainly includes such as: spinel, silicon carbide (SiC), silicon (Si), zinc oxide (ZnO), gallium nitride (GaN), gallium arsenide (GaAs), gallium beryllium (GaP), nitrogen Materials such as aluminum oxide (AlN) may of course also be materials with good thermal conductivity and poor electrical conductivity, such as diamond. The substrate 122 and the LED chip 121 are connected by silver glue. Of course, in order to achieve better heat conduction efficiency, solder paste can also be printed on the position where the substrate 122 and the LED chip 121 are connected to each other, and then heat reflow soldering is performed. To bond the two, either by solder ball bonding or by eutectic bonding. When using the eutectic bonding process, the following metals can be used: gold (Au), tin (Sn), indium (In), aluminum (Al), silver (Ag), bismuth (Bi), beryllium (Be) or these Alloys of metals.

The encapsulation layer 124 is closely attached to the upper surface of the substrate 122 , covers and wraps all the LED chips 121 , and at the same time exposes the electrodes 123 for connection with the outside. The material of the encapsulation layer 124 used in this embodiment includes thermosetting light-transmitting materials such as silicone resin, epoxy resin, low-temperature melting glass, polymethyl methacrylate, and polymers. The encapsulation layer 124 can also add a fluorescent material, which can be: sulfide fluorescent material, aluminate fluorescent material, oxide fluorescent material, silicate fluorescent material, nitride fluorescent material and so on. The encapsulation layer 124 can be formed into a desired shape, such as hemispherical or dome, by means of injection molding.

The cover body 13 is installed around and above the casing 11 , and covers the first accommodating space 111 of the casing 11 and the LED light source 12 housed in the first accommodating space 111 inside the cover body 13 . In this embodiment, the cover body 13 is a hollow structure, of course, it can also be a solid structure in other embodiments.

The electrical connector 14 is installed at the bottom of the housing 11, and the electrical connector 14 can be any conventional light bulb connector such as E12, E14, E26, E27, GU10, PAR30, MR16, etc.

The power supply module 15 is located in the second accommodating space 112 of the casing 11, the power supply module 15 is cylindrical, its upper end is against the bottom surface of the bearing plate 113, and its lower end is flush with the bottom of the casing 11. And electrically connected with the electrical connector 14 . The power module 15 can be electrically connected to the LED light source 12 through a wire (not shown) passing through the aforementioned through hole 114 . The power supply module 15 includes: AC-AC transformers, AC-DC converters, DC-DC transformers, high-power drive integrated circuits and other related electronic components.

Please refer to FIG. 3 , which is a light-emitting diode bulb 20 provided in the second embodiment of the present invention. The light-emitting diode bulb 20 includes a housing 11, a light-emitting diode light source 12 housed in the housing 11, and an LED light source 12 mounted around the housing. A cover 13 on the housing 11 , an electrical connector 14 mounted on the bottom of the housing 11 , and a power module 15 housed in the housing 11 and electrically connecting the LED light source 12 to the electrical connector 14 .

The housing 11 includes a first accommodating space 111 and a second accommodating space 112 . The difference from the previous embodiment is that a filler 115 is provided around the power module 15 in the second accommodating space 112. The filler 115 is thermally conductive but electrically insulating, which can increase heat dissipation efficiency. For example, it can be thermally conductive glue .

Please refer to FIG. 4 , which is an LED light bulb 30 provided in the third embodiment of the present invention. The LED light bulb 30 includes a housing 11 , an LED light source 12 housed in the housing 11 , and an LED light source 12 mounted around the housing. A cover 23 on 11 , an electrical connector 14 mounted on the bottom of the housing 11 , and a power module 15 accommodated in the housing 11 and electrically connects the LED light source 12 to the electrical connector 14 .

The housing 11 includes a first accommodating space 111 and a second accommodating space 112, a carrying plate 113 is formed between the first accommodating space 111 and the second accommodating space 112, and the carrying plate 113 has at least one through Hole 114. The difference from the second embodiment is that the cover 23 has at least two elastic fasteners 24, and the elastic fasteners 24 include a cylinder 241 extending from the bottom of the cover 23 and a tapered tail of the cylinder 241. End 242. The size of the column 241 is the same as the size of the aforementioned through hole 114, the size of the tapered end 242 is larger than the size of the through hole 114, and a groove is provided in the middle of the tapered end 242, so the tapered end 242 is subjected to When the pressing force along the direction parallel to the bottom of the cover body 23 will produce a certain degree of elastic deformation and the size will become smaller. The tapered end 242 passes through the through hole 114 and fastens to the bottom of the bearing plate 113 to secure the cover 23 tightly. In this embodiment, the cover body 23 is a solid structure, and its light-incident surface 231 is in close contact with the light-emitting surface of the LED light source 12, so as to ensure that the light of the LED light source 12 does not pass through too many interfaces and cause light loss. . Of course, in other embodiments, the cover body 23 can also be a hollow structure, and at the same time, the cover body 23 can be in different shapes and colors to change different light shapes and different colors of light.

Please refer to FIG. 5 , which shows an LED light bulb 40 according to a fourth embodiment of the present invention. The light emitting diode bulb 40 includes a casing 11, a light emitting diode light source 12 housed in the casing 11, a cover 13 mounted around the casing 11, and an electrical connector 14 mounted on the bottom of the casing 11. , and a power supply module 25 accommodated in the casing 11 and electrically connected to the LED light source 12 and the electrical connector 14 .

Different from the second embodiment, the power supply module 25 also includes a set of electrodes 251, the electrodes 251 are an elastic buckle extending from the top surface of the power supply module 25, and the shape of the elastic buckle can be consistent with that of the second embodiment. The above-mentioned elastic fastener 24 is the same, and can also be of other shapes, which can be electrically connected to the LED light source 12 through the through hole 114, and at the same time be clamped in the through hole 114 to connect the LED light source 12 and the power module 25 to the housing 11 Tightly fixed to achieve better heat dissipation. The size of the power module 25 is small, and its bottom is not in contact with the electrical connector 14 . The connection with the electrical connector 14 is achieved through a wire 26 extending from the bottom of the power module 25 .

Please refer to FIG. 6 , which shows an LED light bulb 50 according to a fifth embodiment of the present invention. The LED bulb 50 includes a casing 21, an LED light source 22 housed in the casing 21, a cover 13 mounted around the casing 21, and an electrical connector 14 mounted on the bottom of the casing 21. .

The casing 21 includes a first accommodating space 211 and a second accommodating space 212, a carrying plate 213 is formed between the first accommodating space 211 and the second accommodating space 212, and at least one through hole is opened on the carrying plate 213. The hole 214 is different from the fourth embodiment in that the light emitting diode bulb 50 does not include a power module, but two wires 51 pass through the through hole 214 to connect the light emitting diode light source 22 and the electrical connector 14 to provide light. Diode light source 22 power. At the same time, since the second accommodating space 212 no longer accommodates the power module, its volume can be reduced, thereby reducing the volume of the entire LED light bulb 50 .

Please refer to FIG. 7 at the same time, which is a circuit diagram of the LED light source 22 of the LED light bulb 50 in this embodiment. In this embodiment, it divides every three LED chips into a group, and the LED chips in the same group are in the same direction. In series, the light-emitting diode chips of two adjacent groups are connected in antiparallel, a total of six groups, and the two ends of the circuit are respectively connected to the positive pole and the ground. Such arrangement of the circuit enables the LED light bulb 50 to operate directly under AC power without the need for a power module such as an AC-to-DC converter, thereby making the LED light bulb 50 smaller, lighter, and more efficient.

Please refer to FIG. 8 , which shows an LED light bulb 60 according to a sixth embodiment of the present invention. The LED light bulb 60 includes a housing 31 , an LED light source 22 housed in the housing 31 , a cover 13 mounted around the housing 31 , and an electrical connector 14 mounted at the bottom of the housing 31 .

The difference from the fifth embodiment is that the housing 31 only includes the first accommodating space 311 and the bearing plate 313 at the lower part of the first accommodating space 311, and at least one through hole 314 is opened on the bearing plate 313, so that the two The wire 51 passes through the through hole 314 to connect the LED light source 22 and the electrical connector 14 . Due to the omission of the second accommodating space and the filler inside, the LED bulb 60 is smaller and lighter than the LED bulb 50 of the fifth embodiment.

Please refer to FIG. 9 , which is a modified embodiment of the LED light source 32 in the LED light bulb of the present invention. The LED light source 32 includes a LED chip 121 , an electrode 323 and an encapsulation layer 324 .

The LED chip 121 is directly bonded and packaged on the carrier board 113 of the housing 11 , and the circuit layer 61 is also directly laid on the carrier board 113 , and the electrodes 323 are directly connected to the circuit layer 61 . Compared with the LED light sources 12 and 22 in the foregoing embodiments, the substrate 122 is omitted, which further reduces thermal resistance and improves heat dissipation efficiency.

The technical content and technical features of the present invention have been disclosed above, but those skilled in the art may still make various substitutions and modifications based on the teaching and disclosure of the present invention without departing from the spirit of the present invention. Therefore, the protection scope of the present invention should not be limited to the contents disclosed in the embodiments, but should include various replacements and modifications that do not depart from the present invention, and should be covered by the appended claims.

Claims (10)

1. light emitting diode bulb; It comprises a housing, be placed at least one LED source in the housing, one around be installed on the cover body on the housing and be installed on housing bottom and with the electrical joint that LED source electrically connects, it is characterized in that: said housing adopts ceramic material to process.

2. light emitting diode bulb as claimed in claim 1 is characterized in that: said LED source comprises a substrate and is packaged in the some light-emitting diode chip for backlight unit on the substrate, and the carrier concentration of this substrate is smaller or equal to 5 * 10 ⁶Cm ^-3

3. light emitting diode bulb as claimed in claim 1; It is characterized in that: said housing comprises first accommodation space that is used to hold LED source; And have at least one through hole on the said housing, make LED source and electrically joint electric connection through this through hole.

4. light emitting diode bulb as claimed in claim 3 is characterized in that: said LED source electrically connects through two electric wires that wear said at least one through hole with electrical joint.

5. light emitting diode bulb as claimed in claim 3; It is characterized in that: said LED source electrically connects through a power supply module with electrical joint; And said housing comprises second accommodation space that is used to accommodate the power supply module; Be provided with a loading plate between first accommodation space and second accommodation space; Said LED source is located on the loading plate, and said at least one through hole is located on the loading plate.

6. light emitting diode bulb as claimed in claim 5; It is characterized in that: said power supply module comprises at least one electrode; Said at least one electrode is electrically connected with LED source, thereby and is fastened in said at least one through hole LED source and power supply module and housing are fixed together.

7. light emitting diode bulb as claimed in claim 5 is characterized in that: be filled with heat conduction but the material of electric insulation in said second accommodation space.

8. light emitting diode bulb as claimed in claim 3 is characterized in that: said cover body has at least two spring secures rail to sleepers, thereby spring secures rail to sleeper holding just said cover body in through hole is fixed on the housing.

9. light emitting diode bulb as claimed in claim 1 is characterized in that: said LED source comprises some light-emitting diode chip for backlight unit, and said light-emitting diode chip for backlight unit directly is encapsulated on the housing.

10. like any described light emitting diode bulb in the claim 1 to 9; It is characterized in that: said ceramic material is a kind of in silicon nitride, carborundum, zirconia, boron carbide, titanium dioxide, aluminium oxide, aluminium nitride, beryllium oxide, the sialon, perhaps is aforementioned multiple mixture.

Images