CN102343480A - Laser processing device and method for manufacturing light guide plate - Google Patents
Laser processing device and method for manufacturing light guide plate Download PDFInfo
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Abstract
Description
技术领域 technical field
本发明涉及网点加工领域,尤其涉及一种激光加工装置及一种导光板制造方法。The invention relates to the field of dot processing, in particular to a laser processing device and a method for manufacturing a light guide plate.
背景技术 Background technique
导光板是背光模块中的关键零件之一,为了满足导光板出光均匀性的市场需求,导光板的底面通常会设置多个网点,该多个网点用来破坏光束在导光板内部传输的全反射条件,且使光束散射以提高导光板出射光的均匀性,从而提升背光模块的整体性能。The light guide plate is one of the key parts in the backlight module. In order to meet the market demand for light uniformity of the light guide plate, the bottom surface of the light guide plate is usually provided with multiple dots. The multiple dots are used to destroy the total reflection of the light beam transmitted inside the light guide plate. Conditions, and the light beam is scattered to improve the uniformity of the light emitted by the light guide plate, thereby improving the overall performance of the backlight module.
目前,导光板网点的制作方法主要有印刷法。印刷法是由人工将网点印刷至硬质透明压克力板上,不仅人力成本耗费大,印刷质量不易控制,例如油墨过多或过少造成印刷不均匀,人为触碰而破坏油墨图案等,而且油墨吸收光线,降低发光效率。为了解决上述问题,设计人员开始采用激光法来加工导光板上的网点,激光法是利用激光光源发出的激光束经过一定光路后到达激光头,再由激光头射出以在基板上直接击打出网点以形成导光板或者形成模仁,再由该模仁成型导光板。如此便可克服印刷法制造网点所存在的弊端。At present, the manufacturing method of the dots of the light guide plate mainly includes the printing method. The printing method is to manually print the dots on the hard transparent acrylic board, which not only consumes a lot of labor costs, but also the printing quality is not easy to control, such as uneven printing caused by too much or too little ink, and the ink pattern is destroyed by human touch, etc. Moreover, the ink absorbs light, reducing luminous efficiency. In order to solve the above problems, designers began to use the laser method to process the dots on the light guide plate. The laser method uses the laser beam emitted by the laser light source to reach the laser head after passing through a certain optical path, and then the laser head shoots out the dots directly on the substrate. To form a light guide plate or form a mold core, and then shape the light guide plate by the mold core. In this way, the disadvantages of printing dots can be overcome.
然而,使用激光法加工网点时,激光头是相对该基板移动以在该基板的不同位置加工出网点,此时从激光光源到达激光头的激光束的光路路程会发生改变,由于光路路程越长,激光束能量衰减越强,光路路程越短,激光束能量衰减越弱,因此,激光头在不同位置时击打在基板上的激光束的能量会不同,这就导致在基板不同位置加工出的网点的大小及深浅不一致。However, when using the laser method to process dots, the laser head moves relative to the substrate to process dots at different positions on the substrate. At this time, the optical path of the laser beam from the laser light source to the laser head will change. , the stronger the energy attenuation of the laser beam, the shorter the optical path, and the weaker the energy attenuation of the laser beam. Therefore, the energy of the laser beam hitting the substrate will be different when the laser head is in different positions, which leads to the processing of different positions on the substrate. The size and depth of the dots are inconsistent.
发明内容 Contents of the invention
有鉴于此,有必要提供一种激光加工装置及导光板制造方法,其能保证加工不同位置的网点时的激光束的能量尽可能保持恒定,以避免加工出的网点的大小或深浅不一致。In view of this, it is necessary to provide a laser processing device and a light guide plate manufacturing method, which can ensure that the energy of the laser beam is kept as constant as possible when processing dots at different positions, so as to avoid inconsistency in the size or depth of the dots processed.
一种激光加工装置,其用于在基板的加工面上加工。该激光加工装置包括一个第一激光光源模块、一个第二激光光源模块以及一个具有两个相背对的反射面的合光组件。该第一激光光源模块用于发出第一激光束并到达该合光组件的该两个反射面中的一个反射面形成第一光路。该第二激光光源模块用于发出第二激光束并到达该合光组件的该两个反射面中的另一个反射面形成第二光路。该第一激光光源模块与该第二激光光源模块位置相对固定,该合光组件相对该第一激光光源与该第二激光光源能够移动。该合光组件移动时该第一光路路程与该第二光路路程的总和保持恒定。该合光组件用于反射并合并该第一激光束及该第二激光束以形成第三激光束并导引该第三激光束聚焦至该基板的加工面上。A laser processing device is used for processing on a processing surface of a substrate. The laser processing device includes a first laser light source module, a second laser light source module and a light combining assembly with two opposite reflective surfaces. The first laser light source module is used to emit a first laser beam and reach one of the two reflective surfaces of the light combining assembly to form a first light path. The second laser light source module is used to emit a second laser beam and reach the other reflective surface of the two reflective surfaces of the light combining assembly to form a second light path. The first laser light source module and the second laser light source module are relatively fixed in position, and the light combining assembly is movable relative to the first laser light source and the second laser light source. The sum of the distance of the first light path and the distance of the second light path remains constant when the light-combining assembly moves. The light combination component is used to reflect and combine the first laser beam and the second laser beam to form a third laser beam and guide the third laser beam to focus on the processing surface of the substrate.
一种导光板制造方法,其包括以下步骤:提供一个基板,其包括一个加工面;提供一个激光加工装置,利用该激光加工装置在该基板的加工面上形成网点,以形成一模仁;该激光加工装置包括一个第一激光光源模块、一个第二激光光源模块以及一个具有两个相背对的反射面的合光组件,该第一激光光源模块用于发出第一激光束并到达该合光组件的该两个反射面中的一个反射面形成第一光路,该第二激光光源模块用于发出第二激光束并到达该合光组件的该两个反射面中的另一个反射面形成第二光路,该第一激光光源模块与该第二激光光源模块位置相对固定,该合光组件相对该第一激光光源与该第二激光光源能够移动,该合光组件移动时该第一光路路程与该第二光路路程的总和保持恒定,该合光组件用于反射并合并该第一激光束及该第二激光束以形成第三激光束并导引该第三激光束聚焦至该基板的加工面上形成网点;利用该模仁成型一个导光板。A method for manufacturing a light guide plate, comprising the following steps: providing a substrate including a processing surface; providing a laser processing device, using the laser processing device to form dots on the processing surface of the substrate to form a mold core; The laser processing device includes a first laser light source module, a second laser light source module and a light combination assembly with two opposite reflective surfaces, the first laser light source module is used to emit the first laser beam and reach the combination One of the two reflective surfaces of the optical component forms a first optical path, and the second laser light source module is used to emit a second laser beam and reach the other reflective surface of the two reflective surfaces of the light combining component to form a The second optical path, the position of the first laser light source module and the second laser light source module is relatively fixed, the light combination assembly can move relative to the first laser light source and the second laser light source, the first light path when the light combination assembly moves The sum of the distance and the distance of the second optical path is kept constant, and the light combination component is used to reflect and combine the first laser beam and the second laser beam to form a third laser beam and guide the third laser beam to focus on the substrate Dots are formed on the processed surface; a light guide plate is formed by using the mold core.
一种导光板制造方法,其包括以下步骤:提供一个基板,其包括一个加工面;提供一个金属箔;贴覆该金属箔于该基板的加工面上;提供一个激光加工装置,利用该激光加工装置击穿该金属箔于该基板的加工面上形成网点,撕离该金属箔以形成一个模仁;该激光加工装置包括一个第一激光光源模块、一个第二激光光源模块以及一个具有两个相背对的反射面的合光组件,该第一激光光源模块用于发出第一激光束并到达该合光组件的该两个反射面中的一个反射面形成第一光路,该第二激光光源模块用于发出第二激光束并到达该合光组件的该两个反射面中的另一个反射面形成第二光路,该第一激光光源模块与该第二激光光源模块位置相对固定,该合光组件相对该第一激光光源与该第二激光光源能够移动,该合光组件移动时该第一光路路程与该第二光路路程的总和保持恒定,该合光组件用于反射并合并该第一激光束及该第二激光束以形成第三激光束并导引该第三激光束聚焦至该基板的加工面上形成网点;利用该模仁成型一个导光板。A method for manufacturing a light guide plate, comprising the following steps: providing a substrate including a processing surface; providing a metal foil; pasting the metal foil on the processing surface of the substrate; providing a laser processing device, using the laser processing The device breaks through the metal foil to form dots on the processing surface of the substrate, and tears off the metal foil to form a mold core; the laser processing device includes a first laser light source module, a second laser light source module and one with two The light-combining component of the opposite reflective surface, the first laser light source module is used to emit the first laser beam and reach one of the two reflective surfaces of the light-combining component to form a first optical path, and the second laser beam The light source module is used to emit the second laser beam and reach the other of the two reflective surfaces of the light combination assembly to form a second optical path. The position of the first laser light source module and the second laser light source module is relatively fixed. The light-combining assembly can move relative to the first laser light source and the second laser light source. When the light-combining assembly moves, the sum of the first optical path and the second optical path remains constant. The light-combining assembly is used to reflect and combine the The first laser beam and the second laser beam are used to form a third laser beam, and the third laser beam is guided to focus on the processing surface of the substrate to form dots; the mold core is used to form a light guide plate.
相较于现有技术,该激光加工装置及该导光板制造方法采用第一激光束及第二激光束并移动合光组件以在加工面上加工出网点,由于合光组件沿着该基板移动过程中第一光路路程与第二光路路程的总和保持恒定,则当合光组件移动导致第一光路路程增加,到达合光组件的第一激光束的能量衰减增加时,第二光路路程会缩短,到达合光组件的第二激光束的能量衰减相应减少,反之亦然,以此实现第一光路上的第一激光束能量与第二光路上的第二激光束能量相互弥补以保证合光组件在不同位置时击打在基板上的第三激光束的能量尽可能保持恒定,以避免在基板的加工面上不同位置加工出的网点的大小及深浅不一致。Compared with the prior art, the laser processing device and the light guide plate manufacturing method adopt the first laser beam and the second laser beam and move the light-combining component to process dots on the processing surface, because the light-combining component moves along the substrate During the process, the sum of the distance of the first optical path and the distance of the second optical path is kept constant, and when the movement of the light-combining assembly causes the distance of the first optical path to increase, and the energy attenuation of the first laser beam reaching the light-combining assembly increases, the distance of the second optical path will be shortened , the energy attenuation of the second laser beam reaching the light-combining component is correspondingly reduced, and vice versa, so that the energy of the first laser beam on the first optical path and the energy of the second laser beam on the second optical path can complement each other to ensure the combination of light The energy of the third laser beam striking the substrate at different positions of the component is kept as constant as possible to avoid inconsistency in the size and depth of dots processed at different positions on the processing surface of the substrate.
附图说明 Description of drawings
图1是本发明第一实施方式的激光加工装置在基板的加工面上形成网点的示意图。FIG. 1 is a schematic diagram of a laser processing device according to a first embodiment of the present invention forming halftone dots on a processing surface of a substrate.
图2是图1中的基板形成网点后的平面示意图。FIG. 2 is a schematic plan view of the substrate in FIG. 1 after dots are formed.
图3是本发明第二实施方式的激光加工装置的示意图。Fig. 3 is a schematic diagram of a laser processing apparatus according to a second embodiment of the present invention.
图4是本发明第三实施方式的导光板制造方法的流程图。FIG. 4 is a flowchart of a manufacturing method of a light guide plate according to a third embodiment of the present invention.
图5是本发明第四实施方式的导光板制造方法的流程图。主要元件符号说明FIG. 5 is a flowchart of a method for manufacturing a light guide plate according to a fourth embodiment of the present invention. Description of main component symbols
基板 10、30
加工面 102、302
第一边 104
第二边 106
激光加工装置 20、40
第一激光光源模块 201The first laser
第二激光光源模块 211The second laser
第一激光光源 202The first
第一滤光元件 204The
第一聚光元件 206The first concentrating
第一反射元件 208
第二反射元件 210Second
第二激光光源 212Second
第二滤光元件 214
第二聚光元件 216The second concentrating
第三反射元件 218The third
第四反射元件 220Fourth
第三聚光元件 222The third concentrating
第四聚光元件 224The fourth concentrating
合光组件 226、426
反射单元 2262
聚光单元 2264、4266Concentrating
第一反射面 2266、4263First
第二反射面 2268、4265Second
第一反射单元 4262First reflection unit 4262
第二反射单元 4264Second reflection unit 4264
具体实施方式Detailed ways
下面结合附图将对本发明各个实施方式作进一步的详细说明。Various embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings.
请参阅图1及图2,为本发明第一实施方式的激光加工装置20,其用于在基板10上形成网点。Please refer to FIG. 1 and FIG. 2 , which illustrate a
该基板10包括一个加工面102,该加工面102与该激光加工装置20相对。该激光加工装置20形成的网点位于该加工面102上。该加工面102呈矩形且包括两个相互平行的第一边104及两个相互平行的第二边106。The
该激光加工装置20包括一个第一激光光源202、一个第一滤光元件204、一个第一聚光元件206、一个第一反射元件208、一个第二反射元件210、一个第二激光光源212、一个第二滤光元件214、一个第二聚光元件216、一个第三反射元件218、一个第四反射元件220、一个第三聚光元件222、一个第四聚光元件224以及一个合光组件226。其中,该第一激光光源202、该第一滤光元件204、该第一聚光元件206、该第一反射元件208、该第二反射元件210以及该第三聚光元件222形成一个第一激光光源模块201。该第二激光光源212、该第二滤光元件214、该第二聚光元件216、该第三反射元件218、该第四反射元件220以及该第四聚光元件224形成一个第二激光光源模块211。The
该第一激光光源202用于发出第一激光束。该第一滤光元件204位于该第一激光光源202与该第一聚光元件206之间,该第一滤光元件204用于除去第一激光束中能量较弱的部分。该第一聚光元件206位于该第一滤光元件204与该第一反射元件208之间,该第一聚光元件206用于汇聚第一激光束使其更为集中。该第一反射元件208用于反射经该第一聚光元件206汇聚的第一激光束至该第二反射元件210上。该第二反射元件210用于反射被该第一反射元件208反射的第一激光束至该第三聚光元件222。该第三聚光元件222位于该第二反射元件210与该合光组件226之间。该第一激光光源202发出的第一激光束穿过该第一滤光元件204、该第一聚光元件206后依次被该第一反射元件208及该第二反射元件210反射,被该第二反射元件210反射的第一激光束由该第三聚光元件222汇聚最终到达该合光组件226以形成第一光路。The first
该第二激光光源212用于发出第二激光束,且该第一激光光源202与该第二激光光源212的位置相对固定。该第二滤光元件214位于该第二激光光源212与该第二聚光元件216之间,该第二滤光元件214用于除去第二激光束中能量较弱的部分。该第二聚光元件216位于该第二滤光元件214与该第三反射元件218之间,该第二聚光元件216用于汇聚第二激光束使其更为集中。该第三反射元件218用于反射经该第二聚光元件216汇聚的第二激光束至该第四反射元件220上。该第四反射元件220用于反射被该第三反射元件218反射的第二激光束至该第四聚光元件224。该第四聚光元件224位于该第四反射元件220与该合光组件226之间。该第二激光光源212发出的第二激光束穿过该第二滤光元件214、该第二聚光元件216后依次被该第三反射元件218及该第四反射元件220反射,被该第四反射元件220反射后的第二激光束经该第四聚光元件224汇聚最终到达该合光组件226以形成第二光路。该第二光路与该第一光路相互之间不产生干扰,即二者相互独立。The second
该合光组件226能够移动地设置于该第一激光光源202与该第二激光光源212之间,且该合光组件226移动时该第一光路路程与该第二光路路程的总和保持恒定。该合光组件226包括一个反射单元2262及一个聚光单元2264。该反射单元2262的截面呈三角形且包括一个第一反射面2266及一个第二反射面2268。该第一反射面2266与该第二反射面2268为倾斜相连且相对称的两侧面。本实施方式中,该第一激光束到达该第一反射面2266,该第二激光束到达该第二反射面2268,且该第一激光束与该第二激光束分别到达该第一反射面2266及该第二反射面2268的入射角相等。该聚光单元2264为一个凸透镜,本实施方式中,该凸透镜的焦点正好落在该基板10的加工面102上。The
本实施方式中,该第一滤光元件204及该第二滤光元件214均为滤光片;该第一聚光元件206、该第二聚光元件216、该第三聚光元件222及该第四聚光元件224均为聚光透镜;该第一反射元件208、该第二反射元件210、该第三反射元件218及该第四反射元件220均为反射镜。In this embodiment, the
使用该激光加工装置20在该基板10的加工面102上形成网点时,该第一激光束及该第二激光束分别被该第一反射面2266及该第二反射面2268反射后平行进入该聚光单元2264形成多个第三激光束,且该聚光单元2264导引该多个第三激光束聚焦至该加工面102上的一点以在该加工面102上的该点形成一个网点。沿着该第一边104的方向(X轴正方向)移动该合光组件226并间隔操作该激光加工装置20即可在该加工面102上加工出第一行网点,接着,沿该第二边106的方向(Y轴正方向)整体移动该激光加工装置20,再沿该第一边104的反方向(X轴负方向)移动该合光组件226并间隔操作该激光加工装置20即可在该加工面102上加工出第二行网点,该第二行网点与该第一行网点平行且相互间隔。如此类推,该激光加工装置20即可在整个加工面102上加工出网点(如图2示)。When the
本实施方式的激光加工装置20采用第一激光束及第二激光束并移动合光组件226以在加工面102上加工出网点,由于合光组件226沿着该基板10移动过程中第一光路路程与第二光路路程的总和保持恒定,则当合光组件226移动导致第一光路路程增加,到达合光组件226的第一激光束的能量衰减增加时,第二光路路程会缩短,到达合光组件226的第二激光束的能量衰减相应减少。相反,当合光组件226移动导致第二光路路程增加,到达合光组件226的第二激光束的能量衰减增加时,第一光路路程会缩短,到达合光组件226的第一激光束的能量衰减相应减少,以此实现第一光路上的第一激光束能量与第二光路上的第二激光束能量相互弥补以保证合光组件226在不同位置时击打在基板10上的第三激光束的能量尽可能保持恒定,以避免在基板10的加工面102上不同位置加工出的网点的大小及深浅不一致。The
可以理解,该基板10的形状并不局限于本实施方式中为矩形,还可以为圆形,三角形等形状。另外,该第一滤光元件204、该第二滤光元件214、该第三聚光元件222及该第四聚光元件224均可省略。It can be understood that the shape of the
可以理解,该激光加工装置20还可以是仅包括第一激光光源202、第二激光光源212及合光组件226。合光组件226可移动地设置于该第一激光光源202与该第二激光光源212之间,且该第一激光光源202发出的第一激光束直接到达该合光组件226,该第二激光光源212发出的第二激光束直接到达该合光组件226。该合光组件226合成该第一激光束及该第二激光束以形成第三激光束并导引该第三激光束聚焦至加工面102上形成网点。It can be understood that the
请参阅图3,为本发明第二实施方式的激光加工装置40,其用于在基板30的加工面302上形成网点。Please refer to FIG. 3 , which is a laser processing device 40 according to a second embodiment of the present invention, which is used to form dots on the processing surface 302 of the substrate 30 .
本实施方式中的激光加工装置40与第一实施中的激光加工装置20的不同之处在于:该合光组件426包括一个第一反射单元4262、一个第二反射单元4264以及一个聚光单元4266。该第一反射单元4262包括一个第一反射面4263。该第二反射单元4264包括一个第二反射面4265。该第一反射面4263相对该第二反射面4265倾斜,且该第一反射面4263与该第二反射面4265为该合光组件426对称的两侧面。该聚光单元4266为一个凸透镜,且该凸透镜的焦点位于该基板30的加工面302上。该第一激光束及该第二激光束分别被该第一反射面4263及该第二反射面4265反射后平行进入该聚光单元4266形成多个第三激光束,且该聚光单元4266导引该多个第三激光束至该基板30的加工面302上的一点以在该点处形成网点。本实施方式中的激光加工装置40与第一实施方式中的激光加工装置20的有益效果相同。The difference between the laser processing device 40 in this embodiment and the
请参阅图4,为第三实施方式的导光板制造方法的流程图。请结合图1及图2,该导光板制造方法包括以下步骤:Please refer to FIG. 4 , which is a flow chart of the manufacturing method of the light guide plate according to the third embodiment. Please combine Figure 1 and Figure 2, the light guide plate manufacturing method includes the following steps:
S102:提供一个基板10。该基板10包括一个加工面102,且该基板10的材质可以由金属或者压克力材料制成。S102: Provide a
S104:提供一个激光加工装置20,利用该激光加工装置20在该基板10的加工面102上形成网点,以形成一个模仁。其中,该激光加工装置20为第一实施方式中的激光加工装置。具体地,该第一激光束及该第二激光束分别被该第一反射面2266及该第二反射面2268反射后平行进入该聚光单元2264形成多个第三激光束,且该聚光单元2264导引该多个第三激光束聚焦至该加工面102上的一点以在该加工面102上的该点形成一个网点。请结合图2,沿着该第一边104的方向(X轴正方向)移动该合光组件226并间隔操作该激光加工装置20即可在该加工面102上加工出第一行网点,接着,沿该第二边106的方向(Y轴正方向)整体移动该激光加工装置20后,再沿该第一边104的反方向(X轴负方向)移动该合光组件226并间隔操作该激光加工装置20即可在该加工面102上加工出第二行网点,该第二行网点与该第一行网点平行且相互间隔。如此类推,该激光加工装置20即可在整个加工面102上加工出网点。S104: providing a
S106:利用该模仁成型一个导光板。此步骤为现有技术,在此不赘述。S106: Using the mold core to form a light guide plate. This step belongs to the prior art and will not be described in detail here.
可以理解,该导光板制造方法并不局限于本实施方式中采用第一实施方式中的激光加工装置20,还可以采用第二实施方式中的激光加工装置40。另外,该基板10可以为导光板,在基板10的加工面102上加工出网点即是制得导光板成品,如此便可以省去利用模仁成型导光板的步骤。It can be understood that the manufacturing method of the light guide plate is not limited to the use of the
该导光板制造装置利用激光加工装置20采用第一激光束及第二激光束并移动合光组件226以在加工面102上加工出网点,由于合光组件226沿着该基板10移动过程中第一光路路程与第二光路路程的总和保持恒定,则当合光组件226移动导致第一光路路程增加,到达合光组件226的第一激光束的能量衰减增加时,第二光路路程会缩短,到达合光组件226的第二激光束的能量衰减相应减少。相反,当合光组件226移动导致第二光路路程增加,到达合光组件226的第二激光束的能量衰减增加时,第一光路路程会缩短,到达合光组件226的第一激光束的能量衰减相应减少,以此实现第一光路上的第一激光束能量与第二光路上的第二激光束能量相互弥补以保证合光组件226在不同位置时击打在基板10上的第三激光束的能量尽可能保持恒定,以避免在基板10的加工面102上不同位置加工出的网点的大小及深浅不一致。The light guide plate manufacturing device utilizes the
请参阅图5,为第四实施方式的导光板制造方法的流程图。请结合图1及图2,该导光板制造方法包括以下步骤:Please refer to FIG. 5 , which is a flowchart of a method for manufacturing a light guide plate according to a fourth embodiment. Please combine Figure 1 and Figure 2, the light guide plate manufacturing method includes the following steps:
S202:提供一个基板10。该基板10包括一个加工面102,且该基板10的材质可以由金属或者压克力材料制成。S202: Provide a
S204:提供一个金属箔(图未示)。S204: Provide a metal foil (not shown).
S206:贴覆该金属箔于该基板10的加工面102。S206 : Paste the metal foil on the processed
S208:提供一个激光加工装置20,利用该激光加工装置20击穿该金属箔于该基板10的加工面102上形成网点,撕离该金属箔以形成一模仁。其中,该激光加工装置20为第一实施方式中的激光加工装置。该激光加工装置20在该基板10的加工面102上形成网点的具体步骤与第三实施方式中激光加工装置在基板10的加工面102形成网点的步骤相同。S208: Provide a
S210:利用该模仁成型一个导光板。S210: Using the mold core to form a light guide plate.
第四实施方式的导光板制造方法与第三实施方式的导光板制造方法的有益效果相似,更进一步地,第四实施方式的导光板制造方法利用特定厚度之金属箔覆盖基板的加工面,然后利用激光加工装置击穿金属箔于基板的加工面加工出网点,金属箔可以阻挡激光束中心边缘能量,使网点之形状较为准确。导光板之网点因为有金属箔之保护可以更加符合光学设计。The light guide plate manufacturing method of the fourth embodiment has similar beneficial effects to the light guide plate manufacturing method of the third embodiment. Furthermore, the light guide plate manufacturing method of the fourth embodiment uses a metal foil of a specific thickness to cover the processed surface of the substrate, and then Use the laser processing device to break through the metal foil to process the dots on the processing surface of the substrate. The metal foil can block the energy at the center and edge of the laser beam, so that the shape of the dots is more accurate. The dots of the light guide plate are more in line with the optical design because they are protected by metal foil.
可以理解的是,对于本领域的普通技术人员来说,可以根据本发明的技术构思做出其它各种相应的改变与变形,而所有这些改变与变形都应属于本发明权利要求的保护范围。It can be understood that those skilled in the art can make various other corresponding changes and modifications according to the technical concept of the present invention, and all these changes and modifications should belong to the protection scope of the claims of the present invention.
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CN109532243A (en) * | 2018-09-27 | 2019-03-29 | 合肥兆通科技有限公司 | A kind of high speed light guide plate laser printer |
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