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CN102343480A - Laser processing device and method for manufacturing light guide plate - Google Patents

Laser processing device and method for manufacturing light guide plate Download PDF

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Publication number
CN102343480A
CN102343480A CN2010102451055A CN201010245105A CN102343480A CN 102343480 A CN102343480 A CN 102343480A CN 2010102451055 A CN2010102451055 A CN 2010102451055A CN 201010245105 A CN201010245105 A CN 201010245105A CN 102343480 A CN102343480 A CN 102343480A
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laser
light
light source
laser beam
reflective
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黄雍伦
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Abstract

The invention relates to a laser processing device, which is used for processing a processing surface of a substrate. The laser processing device comprises a first laser light source module and a second laser light source module of which the positions are relatively fixed, and a light combining component which has two reflecting surfaces back to back and can move relative to the first laser light source module and the second laser light source module. The first laser light source module emits first laser beams and the first laser beams reach one reflecting surface of the light combining component to form a first light path. The second laser light source module emits second laser beams and the second laser beams reach the other reflecting surface of the light combining component to form a second light path. When the light combining component moves, the sum of the first light path and the second light path is kept constant. The light combining component reflects and combines the first laser beams and the second laser beams to form third laser beams, and guides the third laser beams to be focused to the processing surface of the substrate. The invention also relates to a method for manufacturing a light guide plate.

Description

激光加工装置及导光板制造方法Laser processing device and light guide plate manufacturing method

技术领域 technical field

本发明涉及网点加工领域,尤其涉及一种激光加工装置及一种导光板制造方法。The invention relates to the field of dot processing, in particular to a laser processing device and a method for manufacturing a light guide plate.

背景技术 Background technique

导光板是背光模块中的关键零件之一,为了满足导光板出光均匀性的市场需求,导光板的底面通常会设置多个网点,该多个网点用来破坏光束在导光板内部传输的全反射条件,且使光束散射以提高导光板出射光的均匀性,从而提升背光模块的整体性能。The light guide plate is one of the key parts in the backlight module. In order to meet the market demand for light uniformity of the light guide plate, the bottom surface of the light guide plate is usually provided with multiple dots. The multiple dots are used to destroy the total reflection of the light beam transmitted inside the light guide plate. Conditions, and the light beam is scattered to improve the uniformity of the light emitted by the light guide plate, thereby improving the overall performance of the backlight module.

目前,导光板网点的制作方法主要有印刷法。印刷法是由人工将网点印刷至硬质透明压克力板上,不仅人力成本耗费大,印刷质量不易控制,例如油墨过多或过少造成印刷不均匀,人为触碰而破坏油墨图案等,而且油墨吸收光线,降低发光效率。为了解决上述问题,设计人员开始采用激光法来加工导光板上的网点,激光法是利用激光光源发出的激光束经过一定光路后到达激光头,再由激光头射出以在基板上直接击打出网点以形成导光板或者形成模仁,再由该模仁成型导光板。如此便可克服印刷法制造网点所存在的弊端。At present, the manufacturing method of the dots of the light guide plate mainly includes the printing method. The printing method is to manually print the dots on the hard transparent acrylic board, which not only consumes a lot of labor costs, but also the printing quality is not easy to control, such as uneven printing caused by too much or too little ink, and the ink pattern is destroyed by human touch, etc. Moreover, the ink absorbs light, reducing luminous efficiency. In order to solve the above problems, designers began to use the laser method to process the dots on the light guide plate. The laser method uses the laser beam emitted by the laser light source to reach the laser head after passing through a certain optical path, and then the laser head shoots out the dots directly on the substrate. To form a light guide plate or form a mold core, and then shape the light guide plate by the mold core. In this way, the disadvantages of printing dots can be overcome.

然而,使用激光法加工网点时,激光头是相对该基板移动以在该基板的不同位置加工出网点,此时从激光光源到达激光头的激光束的光路路程会发生改变,由于光路路程越长,激光束能量衰减越强,光路路程越短,激光束能量衰减越弱,因此,激光头在不同位置时击打在基板上的激光束的能量会不同,这就导致在基板不同位置加工出的网点的大小及深浅不一致。However, when using the laser method to process dots, the laser head moves relative to the substrate to process dots at different positions on the substrate. At this time, the optical path of the laser beam from the laser light source to the laser head will change. , the stronger the energy attenuation of the laser beam, the shorter the optical path, and the weaker the energy attenuation of the laser beam. Therefore, the energy of the laser beam hitting the substrate will be different when the laser head is in different positions, which leads to the processing of different positions on the substrate. The size and depth of the dots are inconsistent.

发明内容 Contents of the invention

有鉴于此,有必要提供一种激光加工装置及导光板制造方法,其能保证加工不同位置的网点时的激光束的能量尽可能保持恒定,以避免加工出的网点的大小或深浅不一致。In view of this, it is necessary to provide a laser processing device and a light guide plate manufacturing method, which can ensure that the energy of the laser beam is kept as constant as possible when processing dots at different positions, so as to avoid inconsistency in the size or depth of the dots processed.

一种激光加工装置,其用于在基板的加工面上加工。该激光加工装置包括一个第一激光光源模块、一个第二激光光源模块以及一个具有两个相背对的反射面的合光组件。该第一激光光源模块用于发出第一激光束并到达该合光组件的该两个反射面中的一个反射面形成第一光路。该第二激光光源模块用于发出第二激光束并到达该合光组件的该两个反射面中的另一个反射面形成第二光路。该第一激光光源模块与该第二激光光源模块位置相对固定,该合光组件相对该第一激光光源与该第二激光光源能够移动。该合光组件移动时该第一光路路程与该第二光路路程的总和保持恒定。该合光组件用于反射并合并该第一激光束及该第二激光束以形成第三激光束并导引该第三激光束聚焦至该基板的加工面上。A laser processing device is used for processing on a processing surface of a substrate. The laser processing device includes a first laser light source module, a second laser light source module and a light combining assembly with two opposite reflective surfaces. The first laser light source module is used to emit a first laser beam and reach one of the two reflective surfaces of the light combining assembly to form a first light path. The second laser light source module is used to emit a second laser beam and reach the other reflective surface of the two reflective surfaces of the light combining assembly to form a second light path. The first laser light source module and the second laser light source module are relatively fixed in position, and the light combining assembly is movable relative to the first laser light source and the second laser light source. The sum of the distance of the first light path and the distance of the second light path remains constant when the light-combining assembly moves. The light combination component is used to reflect and combine the first laser beam and the second laser beam to form a third laser beam and guide the third laser beam to focus on the processing surface of the substrate.

一种导光板制造方法,其包括以下步骤:提供一个基板,其包括一个加工面;提供一个激光加工装置,利用该激光加工装置在该基板的加工面上形成网点,以形成一模仁;该激光加工装置包括一个第一激光光源模块、一个第二激光光源模块以及一个具有两个相背对的反射面的合光组件,该第一激光光源模块用于发出第一激光束并到达该合光组件的该两个反射面中的一个反射面形成第一光路,该第二激光光源模块用于发出第二激光束并到达该合光组件的该两个反射面中的另一个反射面形成第二光路,该第一激光光源模块与该第二激光光源模块位置相对固定,该合光组件相对该第一激光光源与该第二激光光源能够移动,该合光组件移动时该第一光路路程与该第二光路路程的总和保持恒定,该合光组件用于反射并合并该第一激光束及该第二激光束以形成第三激光束并导引该第三激光束聚焦至该基板的加工面上形成网点;利用该模仁成型一个导光板。A method for manufacturing a light guide plate, comprising the following steps: providing a substrate including a processing surface; providing a laser processing device, using the laser processing device to form dots on the processing surface of the substrate to form a mold core; The laser processing device includes a first laser light source module, a second laser light source module and a light combination assembly with two opposite reflective surfaces, the first laser light source module is used to emit the first laser beam and reach the combination One of the two reflective surfaces of the optical component forms a first optical path, and the second laser light source module is used to emit a second laser beam and reach the other reflective surface of the two reflective surfaces of the light combining component to form a The second optical path, the position of the first laser light source module and the second laser light source module is relatively fixed, the light combination assembly can move relative to the first laser light source and the second laser light source, the first light path when the light combination assembly moves The sum of the distance and the distance of the second optical path is kept constant, and the light combination component is used to reflect and combine the first laser beam and the second laser beam to form a third laser beam and guide the third laser beam to focus on the substrate Dots are formed on the processed surface; a light guide plate is formed by using the mold core.

一种导光板制造方法,其包括以下步骤:提供一个基板,其包括一个加工面;提供一个金属箔;贴覆该金属箔于该基板的加工面上;提供一个激光加工装置,利用该激光加工装置击穿该金属箔于该基板的加工面上形成网点,撕离该金属箔以形成一个模仁;该激光加工装置包括一个第一激光光源模块、一个第二激光光源模块以及一个具有两个相背对的反射面的合光组件,该第一激光光源模块用于发出第一激光束并到达该合光组件的该两个反射面中的一个反射面形成第一光路,该第二激光光源模块用于发出第二激光束并到达该合光组件的该两个反射面中的另一个反射面形成第二光路,该第一激光光源模块与该第二激光光源模块位置相对固定,该合光组件相对该第一激光光源与该第二激光光源能够移动,该合光组件移动时该第一光路路程与该第二光路路程的总和保持恒定,该合光组件用于反射并合并该第一激光束及该第二激光束以形成第三激光束并导引该第三激光束聚焦至该基板的加工面上形成网点;利用该模仁成型一个导光板。A method for manufacturing a light guide plate, comprising the following steps: providing a substrate including a processing surface; providing a metal foil; pasting the metal foil on the processing surface of the substrate; providing a laser processing device, using the laser processing The device breaks through the metal foil to form dots on the processing surface of the substrate, and tears off the metal foil to form a mold core; the laser processing device includes a first laser light source module, a second laser light source module and one with two The light-combining component of the opposite reflective surface, the first laser light source module is used to emit the first laser beam and reach one of the two reflective surfaces of the light-combining component to form a first optical path, and the second laser beam The light source module is used to emit the second laser beam and reach the other of the two reflective surfaces of the light combination assembly to form a second optical path. The position of the first laser light source module and the second laser light source module is relatively fixed. The light-combining assembly can move relative to the first laser light source and the second laser light source. When the light-combining assembly moves, the sum of the first optical path and the second optical path remains constant. The light-combining assembly is used to reflect and combine the The first laser beam and the second laser beam are used to form a third laser beam, and the third laser beam is guided to focus on the processing surface of the substrate to form dots; the mold core is used to form a light guide plate.

相较于现有技术,该激光加工装置及该导光板制造方法采用第一激光束及第二激光束并移动合光组件以在加工面上加工出网点,由于合光组件沿着该基板移动过程中第一光路路程与第二光路路程的总和保持恒定,则当合光组件移动导致第一光路路程增加,到达合光组件的第一激光束的能量衰减增加时,第二光路路程会缩短,到达合光组件的第二激光束的能量衰减相应减少,反之亦然,以此实现第一光路上的第一激光束能量与第二光路上的第二激光束能量相互弥补以保证合光组件在不同位置时击打在基板上的第三激光束的能量尽可能保持恒定,以避免在基板的加工面上不同位置加工出的网点的大小及深浅不一致。Compared with the prior art, the laser processing device and the light guide plate manufacturing method adopt the first laser beam and the second laser beam and move the light-combining component to process dots on the processing surface, because the light-combining component moves along the substrate During the process, the sum of the distance of the first optical path and the distance of the second optical path is kept constant, and when the movement of the light-combining assembly causes the distance of the first optical path to increase, and the energy attenuation of the first laser beam reaching the light-combining assembly increases, the distance of the second optical path will be shortened , the energy attenuation of the second laser beam reaching the light-combining component is correspondingly reduced, and vice versa, so that the energy of the first laser beam on the first optical path and the energy of the second laser beam on the second optical path can complement each other to ensure the combination of light The energy of the third laser beam striking the substrate at different positions of the component is kept as constant as possible to avoid inconsistency in the size and depth of dots processed at different positions on the processing surface of the substrate.

附图说明 Description of drawings

图1是本发明第一实施方式的激光加工装置在基板的加工面上形成网点的示意图。FIG. 1 is a schematic diagram of a laser processing device according to a first embodiment of the present invention forming halftone dots on a processing surface of a substrate.

图2是图1中的基板形成网点后的平面示意图。FIG. 2 is a schematic plan view of the substrate in FIG. 1 after dots are formed.

图3是本发明第二实施方式的激光加工装置的示意图。Fig. 3 is a schematic diagram of a laser processing apparatus according to a second embodiment of the present invention.

图4是本发明第三实施方式的导光板制造方法的流程图。FIG. 4 is a flowchart of a manufacturing method of a light guide plate according to a third embodiment of the present invention.

图5是本发明第四实施方式的导光板制造方法的流程图。主要元件符号说明FIG. 5 is a flowchart of a method for manufacturing a light guide plate according to a fourth embodiment of the present invention. Description of main component symbols

基板              10、30Substrate 10, 30

加工面            102、302Processing surface 102, 302

第一边            104First Side 104

第二边            106Second Side 106

激光加工装置      20、40Laser processing device 20, 40

第一激光光源模块  201The first laser light source module 201

第二激光光源模块  211The second laser light source module 211

第一激光光源      202The first laser light source 202

第一滤光元件      204The first filter element 204

第一聚光元件      206The first concentrating element 206

第一反射元件      208First reflection element 208

第二反射元件      210Second reflective element 210

第二激光光源      212Second laser light source 212

第二滤光元件      214Second filter element 214

第二聚光元件      216The second concentrating element 216

第三反射元件      218The third reflective element 218

第四反射元件      220Fourth reflective element 220

第三聚光元件      222The third concentrating element 222

第四聚光元件      224The fourth concentrating element 224

合光组件          226、426Synthetic components 226, 426

反射单元          2262Reflection unit 2262

聚光单元          2264、4266Concentrating unit 2264, 4266

第一反射面        2266、4263First reflective surface 2266, 4263

第二反射面        2268、4265Second reflective surface 2268, 4265

第一反射单元      4262First reflection unit 4262

第二反射单元      4264Second reflection unit 4264

具体实施方式Detailed ways

下面结合附图将对本发明各个实施方式作进一步的详细说明。Various embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings.

请参阅图1及图2,为本发明第一实施方式的激光加工装置20,其用于在基板10上形成网点。Please refer to FIG. 1 and FIG. 2 , which illustrate a laser processing device 20 according to a first embodiment of the present invention, which is used to form dots on a substrate 10 .

该基板10包括一个加工面102,该加工面102与该激光加工装置20相对。该激光加工装置20形成的网点位于该加工面102上。该加工面102呈矩形且包括两个相互平行的第一边104及两个相互平行的第二边106。The substrate 10 includes a processing surface 102 opposite to the laser processing device 20 . The dots formed by the laser processing device 20 are located on the processing surface 102 . The processing surface 102 is rectangular and includes two parallel first sides 104 and two parallel second sides 106 .

该激光加工装置20包括一个第一激光光源202、一个第一滤光元件204、一个第一聚光元件206、一个第一反射元件208、一个第二反射元件210、一个第二激光光源212、一个第二滤光元件214、一个第二聚光元件216、一个第三反射元件218、一个第四反射元件220、一个第三聚光元件222、一个第四聚光元件224以及一个合光组件226。其中,该第一激光光源202、该第一滤光元件204、该第一聚光元件206、该第一反射元件208、该第二反射元件210以及该第三聚光元件222形成一个第一激光光源模块201。该第二激光光源212、该第二滤光元件214、该第二聚光元件216、该第三反射元件218、该第四反射元件220以及该第四聚光元件224形成一个第二激光光源模块211。The laser processing device 20 includes a first laser light source 202, a first filter element 204, a first light concentrating element 206, a first reflective element 208, a second reflective element 210, a second laser light source 212, A second filter element 214, a second light-condensing element 216, a third reflective element 218, a fourth reflective element 220, a third light-condensing element 222, a fourth light-condensing element 224, and a light-combining assembly 226. Wherein, the first laser light source 202, the first filter element 204, the first light concentrating element 206, the first reflective element 208, the second reflective element 210 and the third light concentrating element 222 form a first Laser light source module 201. The second laser light source 212, the second filter element 214, the second light concentrating element 216, the third reflective element 218, the fourth reflective element 220 and the fourth light concentrating element 224 form a second laser light source Module 211.

该第一激光光源202用于发出第一激光束。该第一滤光元件204位于该第一激光光源202与该第一聚光元件206之间,该第一滤光元件204用于除去第一激光束中能量较弱的部分。该第一聚光元件206位于该第一滤光元件204与该第一反射元件208之间,该第一聚光元件206用于汇聚第一激光束使其更为集中。该第一反射元件208用于反射经该第一聚光元件206汇聚的第一激光束至该第二反射元件210上。该第二反射元件210用于反射被该第一反射元件208反射的第一激光束至该第三聚光元件222。该第三聚光元件222位于该第二反射元件210与该合光组件226之间。该第一激光光源202发出的第一激光束穿过该第一滤光元件204、该第一聚光元件206后依次被该第一反射元件208及该第二反射元件210反射,被该第二反射元件210反射的第一激光束由该第三聚光元件222汇聚最终到达该合光组件226以形成第一光路。The first laser light source 202 is used to emit a first laser beam. The first filter element 204 is located between the first laser light source 202 and the first light concentrating element 206 , and the first filter element 204 is used to remove the weaker energy part of the first laser beam. The first light concentrating element 206 is located between the first filter element 204 and the first reflective element 208 , and the first light concentrating element 206 is used to condense the first laser beam to make it more concentrated. The first reflective element 208 is used to reflect the first laser beam converged by the first light concentrating element 206 onto the second reflective element 210 . The second reflective element 210 is used for reflecting the first laser beam reflected by the first reflective element 208 to the third light concentrating element 222 . The third light concentrating element 222 is located between the second reflective element 210 and the light combination assembly 226 . The first laser beam emitted by the first laser light source 202 passes through the first optical filter element 204 and the first light concentrating element 206, and is reflected by the first reflective element 208 and the second reflective element 210 in sequence, and is reflected by the first reflective element 208 and the second reflective element 210. The first laser beam reflected by the two reflective elements 210 is converged by the third light concentrating element 222 and finally arrives at the light combining assembly 226 to form a first light path.

该第二激光光源212用于发出第二激光束,且该第一激光光源202与该第二激光光源212的位置相对固定。该第二滤光元件214位于该第二激光光源212与该第二聚光元件216之间,该第二滤光元件214用于除去第二激光束中能量较弱的部分。该第二聚光元件216位于该第二滤光元件214与该第三反射元件218之间,该第二聚光元件216用于汇聚第二激光束使其更为集中。该第三反射元件218用于反射经该第二聚光元件216汇聚的第二激光束至该第四反射元件220上。该第四反射元件220用于反射被该第三反射元件218反射的第二激光束至该第四聚光元件224。该第四聚光元件224位于该第四反射元件220与该合光组件226之间。该第二激光光源212发出的第二激光束穿过该第二滤光元件214、该第二聚光元件216后依次被该第三反射元件218及该第四反射元件220反射,被该第四反射元件220反射后的第二激光束经该第四聚光元件224汇聚最终到达该合光组件226以形成第二光路。该第二光路与该第一光路相互之间不产生干扰,即二者相互独立。The second laser light source 212 is used to emit a second laser beam, and the positions of the first laser light source 202 and the second laser light source 212 are relatively fixed. The second filter element 214 is located between the second laser light source 212 and the second light concentrating element 216 , and the second filter element 214 is used to remove the weaker energy part of the second laser beam. The second light concentrating element 216 is located between the second filter element 214 and the third reflective element 218 , and the second light concentrating element 216 is used for converging the second laser beam to make it more concentrated. The third reflective element 218 is used for reflecting the second laser beam converged by the second light concentrating element 216 onto the fourth reflective element 220 . The fourth reflective element 220 is used for reflecting the second laser beam reflected by the third reflective element 218 to the fourth light concentrating element 224 . The fourth light concentrating element 224 is located between the fourth reflective element 220 and the light combination assembly 226 . The second laser beam emitted by the second laser light source 212 passes through the second filter element 214 and the second light concentrating element 216, and is reflected by the third reflective element 218 and the fourth reflective element 220 in sequence, and is reflected by the first reflective element 218 and the fourth reflective element 220. The second laser beam reflected by the four reflective elements 220 is converged by the fourth light concentrating element 224 and finally arrives at the light combination assembly 226 to form a second light path. The second optical path and the first optical path do not interfere with each other, that is, they are independent of each other.

该合光组件226能够移动地设置于该第一激光光源202与该第二激光光源212之间,且该合光组件226移动时该第一光路路程与该第二光路路程的总和保持恒定。该合光组件226包括一个反射单元2262及一个聚光单元2264。该反射单元2262的截面呈三角形且包括一个第一反射面2266及一个第二反射面2268。该第一反射面2266与该第二反射面2268为倾斜相连且相对称的两侧面。本实施方式中,该第一激光束到达该第一反射面2266,该第二激光束到达该第二反射面2268,且该第一激光束与该第二激光束分别到达该第一反射面2266及该第二反射面2268的入射角相等。该聚光单元2264为一个凸透镜,本实施方式中,该凸透镜的焦点正好落在该基板10的加工面102上。The light combination component 226 is movably disposed between the first laser light source 202 and the second laser light source 212 , and the sum of the first light path distance and the second light path distance remains constant when the light combination component 226 moves. The light combination unit 226 includes a reflection unit 2262 and a light collection unit 2264 . The reflective unit 2262 has a triangular cross section and includes a first reflective surface 2266 and a second reflective surface 2268 . The first reflective surface 2266 and the second reflective surface 2268 are obliquely connected and symmetrical two sides. In this embodiment, the first laser beam reaches the first reflective surface 2266, the second laser beam reaches the second reflective surface 2268, and the first laser beam and the second laser beam respectively reach the first reflective surface 2266 and the incident angle of the second reflective surface 2268 are equal. The focusing unit 2264 is a convex lens. In this embodiment, the focal point of the convex lens just falls on the processing surface 102 of the substrate 10 .

本实施方式中,该第一滤光元件204及该第二滤光元件214均为滤光片;该第一聚光元件206、该第二聚光元件216、该第三聚光元件222及该第四聚光元件224均为聚光透镜;该第一反射元件208、该第二反射元件210、该第三反射元件218及该第四反射元件220均为反射镜。In this embodiment, the first filter element 204 and the second filter element 214 are all filters; The fourth condensing element 224 is a condensing lens; the first reflective element 208 , the second reflective element 210 , the third reflective element 218 and the fourth reflective element 220 are reflective mirrors.

使用该激光加工装置20在该基板10的加工面102上形成网点时,该第一激光束及该第二激光束分别被该第一反射面2266及该第二反射面2268反射后平行进入该聚光单元2264形成多个第三激光束,且该聚光单元2264导引该多个第三激光束聚焦至该加工面102上的一点以在该加工面102上的该点形成一个网点。沿着该第一边104的方向(X轴正方向)移动该合光组件226并间隔操作该激光加工装置20即可在该加工面102上加工出第一行网点,接着,沿该第二边106的方向(Y轴正方向)整体移动该激光加工装置20,再沿该第一边104的反方向(X轴负方向)移动该合光组件226并间隔操作该激光加工装置20即可在该加工面102上加工出第二行网点,该第二行网点与该第一行网点平行且相互间隔。如此类推,该激光加工装置20即可在整个加工面102上加工出网点(如图2示)。When the laser processing device 20 is used to form dots on the processing surface 102 of the substrate 10, the first laser beam and the second laser beam are respectively reflected by the first reflective surface 2266 and the second reflective surface 2268 and enter the The condensing unit 2264 forms a plurality of third laser beams, and the condensing unit 2264 guides the plurality of third laser beams to focus on a point on the processing surface 102 to form a dot on the point on the processing surface 102 . Moving the light-combining assembly 226 along the direction of the first side 104 (X-axis positive direction) and operating the laser processing device 20 at intervals can process the first row of dots on the processing surface 102, and then, along the second Move the laser processing device 20 as a whole in the direction of the side 106 (Y-axis positive direction), and then move the light-combining assembly 226 along the opposite direction of the first side 104 (X-axis negative direction) and operate the laser processing device 20 at intervals. A second row of dots is processed on the processing surface 102, and the second row of dots is parallel to and spaced apart from the first row of dots. By analogy, the laser processing device 20 can process dots on the entire processing surface 102 (as shown in FIG. 2 ).

本实施方式的激光加工装置20采用第一激光束及第二激光束并移动合光组件226以在加工面102上加工出网点,由于合光组件226沿着该基板10移动过程中第一光路路程与第二光路路程的总和保持恒定,则当合光组件226移动导致第一光路路程增加,到达合光组件226的第一激光束的能量衰减增加时,第二光路路程会缩短,到达合光组件226的第二激光束的能量衰减相应减少。相反,当合光组件226移动导致第二光路路程增加,到达合光组件226的第二激光束的能量衰减增加时,第一光路路程会缩短,到达合光组件226的第一激光束的能量衰减相应减少,以此实现第一光路上的第一激光束能量与第二光路上的第二激光束能量相互弥补以保证合光组件226在不同位置时击打在基板10上的第三激光束的能量尽可能保持恒定,以避免在基板10的加工面102上不同位置加工出的网点的大小及深浅不一致。The laser processing device 20 of this embodiment adopts the first laser beam and the second laser beam and moves the light-combining assembly 226 to process dots on the processing surface 102, because the first optical path of the light-combining assembly 226 moves along the substrate 10 If the sum of the distance and the second optical path distance remains constant, then when the light combining assembly 226 moves and causes the first optical path distance to increase, and the energy attenuation of the first laser beam reaching the light combining assembly 226 increases, the second optical path distance will be shortened to reach the combined laser beam. The energy attenuation of the second laser beam of the light assembly 226 is correspondingly reduced. On the contrary, when the movement of the light combining assembly 226 causes the distance of the second optical path to increase, and the energy attenuation of the second laser beam reaching the light combining assembly 226 increases, the distance of the first optical path will be shortened, and the energy of the first laser beam arriving at the light combining assembly 226 will The attenuation is correspondingly reduced, so that the energy of the first laser beam on the first optical path and the energy of the second laser beam on the second optical path can complement each other to ensure that the third laser beam striking the substrate 10 when the light-combining component 226 is in a different position The energy of the beam is kept as constant as possible to avoid inconsistency in the size and depth of dots processed at different positions on the processing surface 102 of the substrate 10 .

可以理解,该基板10的形状并不局限于本实施方式中为矩形,还可以为圆形,三角形等形状。另外,该第一滤光元件204、该第二滤光元件214、该第三聚光元件222及该第四聚光元件224均可省略。It can be understood that the shape of the substrate 10 is not limited to the rectangle in this embodiment, and may also be circular, triangular and other shapes. In addition, the first light filter element 204 , the second light filter element 214 , the third light focus element 222 and the fourth light focus element 224 can all be omitted.

可以理解,该激光加工装置20还可以是仅包括第一激光光源202、第二激光光源212及合光组件226。合光组件226可移动地设置于该第一激光光源202与该第二激光光源212之间,且该第一激光光源202发出的第一激光束直接到达该合光组件226,该第二激光光源212发出的第二激光束直接到达该合光组件226。该合光组件226合成该第一激光束及该第二激光束以形成第三激光束并导引该第三激光束聚焦至加工面102上形成网点。It can be understood that the laser processing device 20 may also only include the first laser light source 202 , the second laser light source 212 and the light combination assembly 226 . The light combining assembly 226 is movably arranged between the first laser light source 202 and the second laser light source 212, and the first laser beam emitted by the first laser light source 202 directly reaches the light combining assembly 226, and the second laser beam The second laser beam emitted by the light source 212 directly reaches the light combination assembly 226 . The light combination component 226 combines the first laser beam and the second laser beam to form a third laser beam and guides the third laser beam to focus on the processing surface 102 to form dots.

请参阅图3,为本发明第二实施方式的激光加工装置40,其用于在基板30的加工面302上形成网点。Please refer to FIG. 3 , which is a laser processing device 40 according to a second embodiment of the present invention, which is used to form dots on the processing surface 302 of the substrate 30 .

本实施方式中的激光加工装置40与第一实施中的激光加工装置20的不同之处在于:该合光组件426包括一个第一反射单元4262、一个第二反射单元4264以及一个聚光单元4266。该第一反射单元4262包括一个第一反射面4263。该第二反射单元4264包括一个第二反射面4265。该第一反射面4263相对该第二反射面4265倾斜,且该第一反射面4263与该第二反射面4265为该合光组件426对称的两侧面。该聚光单元4266为一个凸透镜,且该凸透镜的焦点位于该基板30的加工面302上。该第一激光束及该第二激光束分别被该第一反射面4263及该第二反射面4265反射后平行进入该聚光单元4266形成多个第三激光束,且该聚光单元4266导引该多个第三激光束至该基板30的加工面302上的一点以在该点处形成网点。本实施方式中的激光加工装置40与第一实施方式中的激光加工装置20的有益效果相同。The difference between the laser processing device 40 in this embodiment and the laser processing device 20 in the first embodiment is that the light combination assembly 426 includes a first reflection unit 4262 , a second reflection unit 4264 and a light concentrating unit 4266 . The first reflection unit 4262 includes a first reflection surface 4263 . The second reflection unit 4264 includes a second reflection surface 4265 . The first reflective surface 4263 is inclined relative to the second reflective surface 4265 , and the first reflective surface 4263 and the second reflective surface 4265 are two symmetrical sides of the light combination assembly 426 . The light focusing unit 4266 is a convex lens, and the focal point of the convex lens is located on the processing surface 302 of the substrate 30 . The first laser beam and the second laser beam are respectively reflected by the first reflective surface 4263 and the second reflective surface 4265 and enter the light concentrating unit 4266 in parallel to form a plurality of third laser beams, and the light concentrating unit 4266 guides The plurality of third laser beams are directed to a point on the processing surface 302 of the substrate 30 to form dots at the point. The beneficial effect of the laser processing device 40 in this embodiment is the same as that of the laser processing device 20 in the first embodiment.

请参阅图4,为第三实施方式的导光板制造方法的流程图。请结合图1及图2,该导光板制造方法包括以下步骤:Please refer to FIG. 4 , which is a flow chart of the manufacturing method of the light guide plate according to the third embodiment. Please combine Figure 1 and Figure 2, the light guide plate manufacturing method includes the following steps:

S102:提供一个基板10。该基板10包括一个加工面102,且该基板10的材质可以由金属或者压克力材料制成。S102: Provide a substrate 10 . The substrate 10 includes a processing surface 102, and the substrate 10 can be made of metal or acrylic material.

S104:提供一个激光加工装置20,利用该激光加工装置20在该基板10的加工面102上形成网点,以形成一个模仁。其中,该激光加工装置20为第一实施方式中的激光加工装置。具体地,该第一激光束及该第二激光束分别被该第一反射面2266及该第二反射面2268反射后平行进入该聚光单元2264形成多个第三激光束,且该聚光单元2264导引该多个第三激光束聚焦至该加工面102上的一点以在该加工面102上的该点形成一个网点。请结合图2,沿着该第一边104的方向(X轴正方向)移动该合光组件226并间隔操作该激光加工装置20即可在该加工面102上加工出第一行网点,接着,沿该第二边106的方向(Y轴正方向)整体移动该激光加工装置20后,再沿该第一边104的反方向(X轴负方向)移动该合光组件226并间隔操作该激光加工装置20即可在该加工面102上加工出第二行网点,该第二行网点与该第一行网点平行且相互间隔。如此类推,该激光加工装置20即可在整个加工面102上加工出网点。S104: providing a laser processing device 20, using the laser processing device 20 to form dots on the processing surface 102 of the substrate 10 to form a mold core. However, this laser processing device 20 is the laser processing device in the first embodiment. Specifically, the first laser beam and the second laser beam are respectively reflected by the first reflective surface 2266 and the second reflective surface 2268 and enter the light concentrating unit 2264 in parallel to form a plurality of third laser beams, and the concentrating The unit 2264 guides the plurality of third laser beams to focus on a point on the processing surface 102 to form a dot on the point on the processing surface 102 . Please refer to FIG. 2, move the light-combining assembly 226 along the direction of the first side 104 (the positive direction of the X-axis) and operate the laser processing device 20 at intervals to process the first row of dots on the processing surface 102, and then After moving the laser processing device 20 as a whole along the direction of the second side 106 (Y-axis positive direction), then move the light-combining assembly 226 along the opposite direction of the first side 104 (X-axis negative direction) and operate the The laser processing device 20 can process a second row of dots on the processing surface 102 , and the second row of dots is parallel to and spaced apart from the first row of dots. By analogy, the laser processing device 20 can process dots on the entire processing surface 102 .

S106:利用该模仁成型一个导光板。此步骤为现有技术,在此不赘述。S106: Using the mold core to form a light guide plate. This step belongs to the prior art and will not be described in detail here.

可以理解,该导光板制造方法并不局限于本实施方式中采用第一实施方式中的激光加工装置20,还可以采用第二实施方式中的激光加工装置40。另外,该基板10可以为导光板,在基板10的加工面102上加工出网点即是制得导光板成品,如此便可以省去利用模仁成型导光板的步骤。It can be understood that the manufacturing method of the light guide plate is not limited to the use of the laser processing device 20 in the first embodiment in this embodiment, and the laser processing device 40 in the second embodiment can also be used. In addition, the substrate 10 can be a light guide plate, and the dots are processed on the processed surface 102 of the substrate 10 to obtain a finished light guide plate, so that the step of forming the light guide plate by using a mold core can be omitted.

该导光板制造装置利用激光加工装置20采用第一激光束及第二激光束并移动合光组件226以在加工面102上加工出网点,由于合光组件226沿着该基板10移动过程中第一光路路程与第二光路路程的总和保持恒定,则当合光组件226移动导致第一光路路程增加,到达合光组件226的第一激光束的能量衰减增加时,第二光路路程会缩短,到达合光组件226的第二激光束的能量衰减相应减少。相反,当合光组件226移动导致第二光路路程增加,到达合光组件226的第二激光束的能量衰减增加时,第一光路路程会缩短,到达合光组件226的第一激光束的能量衰减相应减少,以此实现第一光路上的第一激光束能量与第二光路上的第二激光束能量相互弥补以保证合光组件226在不同位置时击打在基板10上的第三激光束的能量尽可能保持恒定,以避免在基板10的加工面102上不同位置加工出的网点的大小及深浅不一致。The light guide plate manufacturing device utilizes the laser processing device 20 to adopt the first laser beam and the second laser beam and move the light combination assembly 226 to process dots on the processing surface 102. Since the light combination assembly 226 moves along the substrate 10 during the first The sum of the first optical path distance and the second optical path distance remains constant, then when the light combining assembly 226 moves to cause the first optical path distance to increase, and when the energy attenuation of the first laser beam reaching the light combining assembly 226 increases, the second optical path distance will be shortened, The energy attenuation of the second laser beam reaching the light combining assembly 226 is correspondingly reduced. On the contrary, when the movement of the light combining assembly 226 causes the distance of the second optical path to increase, and the energy attenuation of the second laser beam reaching the light combining assembly 226 increases, the distance of the first optical path will be shortened, and the energy of the first laser beam arriving at the light combining assembly 226 will The attenuation is correspondingly reduced, so that the energy of the first laser beam on the first optical path and the energy of the second laser beam on the second optical path can complement each other to ensure that the third laser beam striking the substrate 10 when the light-combining component 226 is in a different position The energy of the beam is kept as constant as possible to avoid inconsistency in the size and depth of dots processed at different positions on the processing surface 102 of the substrate 10 .

请参阅图5,为第四实施方式的导光板制造方法的流程图。请结合图1及图2,该导光板制造方法包括以下步骤:Please refer to FIG. 5 , which is a flowchart of a method for manufacturing a light guide plate according to a fourth embodiment. Please combine Figure 1 and Figure 2, the light guide plate manufacturing method includes the following steps:

S202:提供一个基板10。该基板10包括一个加工面102,且该基板10的材质可以由金属或者压克力材料制成。S202: Provide a substrate 10 . The substrate 10 includes a processing surface 102, and the substrate 10 can be made of metal or acrylic material.

S204:提供一个金属箔(图未示)。S204: Provide a metal foil (not shown).

S206:贴覆该金属箔于该基板10的加工面102。S206 : Paste the metal foil on the processed surface 102 of the substrate 10 .

S208:提供一个激光加工装置20,利用该激光加工装置20击穿该金属箔于该基板10的加工面102上形成网点,撕离该金属箔以形成一模仁。其中,该激光加工装置20为第一实施方式中的激光加工装置。该激光加工装置20在该基板10的加工面102上形成网点的具体步骤与第三实施方式中激光加工装置在基板10的加工面102形成网点的步骤相同。S208: Provide a laser processing device 20, use the laser processing device 20 to break through the metal foil to form dots on the processing surface 102 of the substrate 10, and tear off the metal foil to form a mold core. However, this laser processing device 20 is the laser processing device in the first embodiment. The specific steps for the laser processing device 20 to form dots on the processing surface 102 of the substrate 10 are the same as the steps for the laser processing device to form dots on the processing surface 102 of the substrate 10 in the third embodiment.

S210:利用该模仁成型一个导光板。S210: Using the mold core to form a light guide plate.

第四实施方式的导光板制造方法与第三实施方式的导光板制造方法的有益效果相似,更进一步地,第四实施方式的导光板制造方法利用特定厚度之金属箔覆盖基板的加工面,然后利用激光加工装置击穿金属箔于基板的加工面加工出网点,金属箔可以阻挡激光束中心边缘能量,使网点之形状较为准确。导光板之网点因为有金属箔之保护可以更加符合光学设计。The light guide plate manufacturing method of the fourth embodiment has similar beneficial effects to the light guide plate manufacturing method of the third embodiment. Furthermore, the light guide plate manufacturing method of the fourth embodiment uses a metal foil of a specific thickness to cover the processed surface of the substrate, and then Use the laser processing device to break through the metal foil to process the dots on the processing surface of the substrate. The metal foil can block the energy at the center and edge of the laser beam, so that the shape of the dots is more accurate. The dots of the light guide plate are more in line with the optical design because they are protected by metal foil.

可以理解的是,对于本领域的普通技术人员来说,可以根据本发明的技术构思做出其它各种相应的改变与变形,而所有这些改变与变形都应属于本发明权利要求的保护范围。It can be understood that those skilled in the art can make various other corresponding changes and modifications according to the technical concept of the present invention, and all these changes and modifications should belong to the protection scope of the claims of the present invention.

Claims (10)

1.一种激光加工装置,其用于在基板的加工面上加工,其特征在于:该激光加工装置包括一个第一激光光源模块、一个第二激光光源模块以及一个具有两个相背对的反射面的合光组件,该第一激光光源模块用于发出第一激光束并到达该两个反射面中的一个反射面形成第一光路,该第二激光光源模块用于发出第二激光束并到达该两个反射面中的另一个反射面形成第二光路,该第一激光光源模块与该第二激光光源模块位置相对固定,该合光组件相对该第一激光光源与该第二激光光源能够移动,该合光组件移动时该第一光路路程与该第二光路路程的总和保持恒定,该合光组件用于反射并合并该第一激光束及该第二激光束以形成第三激光束并导引该第三激光束聚焦至该基板的加工面上。1. A laser processing device, which is used for processing on a processing surface of a substrate, is characterized in that: the laser processing device includes a first laser light source module, a second laser light source module and a The light combination component of the reflective surface, the first laser light source module is used to emit the first laser beam and reaches one of the two reflective surfaces to form a first optical path, and the second laser light source module is used to emit the second laser beam and reach the other reflective surface of the two reflective surfaces to form a second optical path, the first laser light source module and the second laser light source module are relatively fixed in position, and the light combining assembly is relatively fixed to the first laser light source and the second laser light source The light source can be moved, and the sum of the first optical path distance and the second optical path distance remains constant when the light combining component moves, and the light combining component is used to reflect and combine the first laser beam and the second laser beam to form a third and guiding the third laser beam to focus on the processing surface of the substrate. 2.如权利要求1所述的激光加工装置,其特征在于,该两个反射面相互对称,该第一激光束与该第二激光束分别到达该两个反射面的入射角相等。2 . The laser processing device according to claim 1 , wherein the two reflective surfaces are symmetrical to each other, and the incident angles of the first laser beam and the second laser beam reaching the two reflective surfaces are equal. 3 . 3.如权利要求2所述的激光加工装置,其特征在于,该第一激光光源模块包括一个第一激光光源、一个第一聚光元件、一个第一反射元件以及一个第二反射元件,该第一激光光源发出的第一激光束穿过该第一聚光元件后依次被该第一反射元件及该第二反射元件反射到达该两个反射面中的一个反射面。3. The laser processing device according to claim 2, wherein the first laser light source module comprises a first laser light source, a first light concentrating element, a first reflective element and a second reflective element, the The first laser beam emitted by the first laser light source passes through the first light concentrating element and is reflected by the first reflective element and the second reflective element in turn to reach one of the two reflective surfaces. 4.如权利要求3所述的激光加工装置,其特征在于,该第二激光光源模块包括一个第二激光光源、一个第二聚光元件、一个第三反射元件以及一个第四反射元件,该第二激光光源发出的第二激光束穿过该第二聚光元件后依次被该第三反射元件及该第四反射元件反射到达该两个反射面中的另一个反射面。4. The laser processing device according to claim 3, wherein the second laser light source module comprises a second laser light source, a second light concentrating element, a third reflective element and a fourth reflective element, the The second laser beam emitted by the second laser light source passes through the second light concentrating element and is sequentially reflected by the third reflective element and the fourth reflective element to reach the other reflective surface of the two reflective surfaces. 5.如权利要求4所述的激光加工装置,其特征在于,该第一激光光源模块还包括一个第一滤光元件,该第二激光光源模块还包括一个第二滤光元件,该第一滤光元件位于该第一激光光源与该第一聚光元件之间,该第一激光束穿过该第一滤光元件后到达该第一聚光元件,该第二滤光元件位于该第二激光光源与该第二聚光元件之间,该第二激光束穿过该第二滤光元件后到达该第二聚光元件。5. The laser processing device according to claim 4, wherein the first laser light source module also includes a first filter element, the second laser light source module also includes a second filter element, the first The filter element is located between the first laser light source and the first condensing element, the first laser beam passes through the first filter element and reaches the first condensing element, and the second filter element is located at the first condensing element Between the two laser light sources and the second light concentrating element, the second laser beam passes through the second filter element and reaches the second light concentrating element. 6.如权利要求5所述的激光加工装置,其特征在于,该第一激光光源模块还包括一个第三聚光元件,该第二激光光源模块还包括一个第四聚光元件,该第三聚光元件位于该第二反射元件与该合光组件之间,该第一激光束被该第二反射元件反射并由该第三聚光元件汇聚后到达该合光组件,该第四聚光元件位于该第四反射元件与该合光组件之间,该第二激光束被该第四反射元件反射并由该第四聚光元件汇聚后到达该合光组件。6. The laser processing device according to claim 5, characterized in that, the first laser light source module also includes a third light concentrating element, the second laser light source module also includes a fourth light concentrating element, the third The light-condensing element is located between the second reflective element and the light-combining assembly. The first laser beam is reflected by the second reflective element and converged by the third light-condensing element to reach the light-combining assembly. The fourth light-condensing The element is located between the fourth reflective element and the light-combining assembly, and the second laser beam is reflected by the fourth reflective element and converged by the fourth light-condensing element to reach the light-combining assembly. 7.如权利要求2所述的激光加工装置,其特征在于,该合光组件包括一个反射单元及一个聚光单元,该反射单元包括一个第一反射面及一个与该第一反射面倾斜相连的第二反射面,该第一反射面与该第二反射面为该反射单元相对称的两个反射面,该聚光单元为一个凸透镜,且该凸透镜的焦点位于该基板的加工面上,该第一激光束及该第二激光束分别被该第一反射面及该第二反射面反射后平行进入该聚光单元形成该第三激光束,且该聚光单元导引该第三激光束聚焦至该基板的加工面上。7. The laser processing device as claimed in claim 2, wherein the light-combining assembly includes a reflection unit and a light-condensing unit, and the reflection unit includes a first reflection surface and an oblique connection with the first reflection surface. The second reflection surface, the first reflection surface and the second reflection surface are two reflection surfaces symmetrical to the reflection unit, the light concentrating unit is a convex lens, and the focal point of the convex lens is located on the processing surface of the substrate, The first laser beam and the second laser beam are respectively reflected by the first reflective surface and the second reflective surface and enter the light concentrating unit in parallel to form the third laser beam, and the light concentrating unit guides the third laser beam The beam is focused onto the processing surface of the substrate. 8.如权利要求2所述的激光加工装置,其特征在于,该合光组件包括一个第一反射单元,一个第二反射单元及一个聚光单元,该第一反射单元包括一个第一反射面,该第二反射单元包括一个第二反射面,该第一反射面相对该第二反射面倾斜,且该第一反射面与该第二反射面为该合光组件相对称的两个反射面,该聚光单元为一个凸透镜,且该凸透镜的焦点位于该基板的加工面上,该第一激光束及该第二激光束分别被第一反射面及该第二反射面反射后平行进入该聚光单元形成该第三激光束,且该聚光单元导引该第三激光束聚焦至该基板的加工面上。8. The laser processing device according to claim 2, wherein the light combining assembly comprises a first reflection unit, a second reflection unit and a light concentrating unit, and the first reflection unit comprises a first reflection surface , the second reflective unit includes a second reflective surface, the first reflective surface is inclined relative to the second reflective surface, and the first reflective surface and the second reflective surface are two symmetrical reflective surfaces of the light combining assembly , the condensing unit is a convex lens, and the focal point of the convex lens is located on the processing surface of the substrate, the first laser beam and the second laser beam are respectively reflected by the first reflective surface and the second reflective surface and enter the The light focusing unit forms the third laser beam, and the light focusing unit guides the third laser beam to focus on the processing surface of the substrate. 9.一种导光板制造方法,其包括:9. A method of manufacturing a light guide plate, comprising: 提供一个基板,其包括一个加工面;providing a substrate comprising a processed surface; 提供一个激光加工装置,利用该激光加工装置在该基板的加工面上形成网点,以形成一模仁;该激光加工装置包括一个第一激光光源模块、一个第二激光光源模块以及一个具有两个相背对的反射面的合光组件,该第一激光光源模块用于发出第一激光束并到达该两个反射面中的一个反射面形成第一光路,该第二激光光源模块用于发出第二激光束并到达该两个反射面中的另一个反射面形成第二光路,该第一激光光源模块与该第二激光光源模块位置相对固定,该合光组件相对该第一激光光源与该第二激光光源能够移动,该合光组件移动时该第一光路路程与该第二光路路程的总和保持恒定,该合光组件用于反射并合并该第一激光束及该第二激光束以形成第三激光束并导引该第三激光束聚焦至该基板的加工面上形成网点;及Provide a laser processing device, use the laser processing device to form dots on the processing surface of the substrate to form a mold core; the laser processing device includes a first laser light source module, a second laser light source module and a module with two The light-combining components of the opposite reflective surfaces, the first laser light source module is used to emit the first laser beam and reach one of the two reflective surfaces to form a first optical path, and the second laser light source module is used to emit The second laser beam reaches the other reflective surface of the two reflective surfaces to form a second optical path, the position of the first laser light source module and the second laser light source module are relatively fixed, and the light combining assembly is relatively fixed to the first laser light source and the second laser light source module. The second laser light source can be moved, and the sum of the first optical path distance and the second optical path distance remains constant when the light combining assembly is moved, and the light combining assembly is used to reflect and combine the first laser beam and the second laser beam forming a third laser beam and directing the third laser beam to focus on the processing surface of the substrate to form dots; and 利用该模仁成型一个导光板。The mold core is used to form a light guide plate. 10.一种导光板制造方法,其包括:10. A method of manufacturing a light guide plate, comprising: 提供一个基板,其包括一个加工面;providing a substrate comprising a processed surface; 提供一个金属箔;Provide a metal foil; 贴覆该金属箔于该基板的加工面上;pasting the metal foil on the processing surface of the substrate; 提供一个激光加工装置,利用该激光加工装置击穿该金属箔于该基板的加工面上形成网点,撕离该金属箔以形成一个模仁;该激光加工装置包括一个第一激光光源模块、一个第二激光光源模块以及一个具有两个相背对的反射面的合光组件,该第一激光光源模块用于发出第一激光束并到达该两个反射面中的一个反射面形成第一光路,该第二激光光源模块用于发出第二激光束并到达该两个反射面中的另一个反射面形成第二光路,该第一激光光源模块与该第二激光光源模块位置相对固定,该合光组件相对该第一激光光源与该第二激光光源能够移动,该合光组件移动时该第一光路路程与该第二光路路程的总和保持恒定,该合光组件用于反射并合并该第一激光束及该第二激光束以形成第三激光束并导引该第三激光束聚焦至该基板的加工面上形成网点;及Provide a laser processing device, use the laser processing device to break through the metal foil to form dots on the processing surface of the substrate, tear off the metal foil to form a mold core; the laser processing device includes a first laser light source module, a The second laser light source module and a light-combining assembly with two opposite reflective surfaces, the first laser light source module is used to emit the first laser beam and reach one of the two reflective surfaces to form a first optical path , the second laser light source module is used to emit a second laser beam and reach the other reflective surface of the two reflective surfaces to form a second optical path, the first laser light source module and the second laser light source module are relatively fixed in position, the The light-combining assembly can move relative to the first laser light source and the second laser light source. When the light-combining assembly moves, the sum of the first optical path and the second optical path remains constant. The light-combining assembly is used to reflect and combine the The first laser beam and the second laser beam are used to form a third laser beam and guide the third laser beam to focus on the processing surface of the substrate to form dots; and 利用该模仁成型一个导光板。The mold core is used to form a light guide plate.
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CN1614469A (en) * 2003-11-05 2005-05-11 鸿富锦精密工业(深圳)有限公司 Production for light conductive board
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CN102728956A (en) * 2012-06-15 2012-10-17 张英兵 Technology for machining surface microstructure of optical mold
CN103447694A (en) * 2013-09-17 2013-12-18 瑞安市博业激光应用技术有限公司 Design and manufacturing method of light guide points on light guide plate
CN105345274A (en) * 2015-11-22 2016-02-24 苏州光韵达光电科技有限公司 Light guide plate machining device
CN105345274B (en) * 2015-11-22 2017-07-07 苏州光韵达光电科技有限公司 A kind of light guide plate process unit
CN108581213A (en) * 2018-05-03 2018-09-28 东莞运城制版有限公司 Laser direct engraving processing technology of light guide plate
CN109532243A (en) * 2018-09-27 2019-03-29 合肥兆通科技有限公司 A kind of high speed light guide plate laser printer
CN109532243B (en) * 2018-09-27 2020-07-24 合肥泰沃达智能装备有限公司 High-speed light guide plate laser printer
CN112091416A (en) * 2020-09-27 2020-12-18 华夏鲲鹏科技股份有限公司 Multi-wavelength laser processing device

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Application publication date: 20120208