CN102339093A - Server - Google Patents

Abstract

The invention provides a server which comprises a rack, a case, a hard disk array, a mainboard module array, a partition plate and a hard disk back plate. The case is arranged in the frame and is provided with a front end, a rear end and two side walls. One side wall is provided with a first ventilation groove and an air inlet, and the other side wall is provided with a second ventilation groove. The hard disk array comprises at least two hard disk modules which are stacked at the front end and positioned between the two side walls. The first and second ventilation grooves are correspondingly arranged at the junction of the two hard disk arrays. The main board module array is arranged at the rear end and is positioned between the two side walls. The partition plate is arranged on the case, extends from one side wall to the other side wall, is positioned between the hard disk array and the mainboard module array, has a distance from the hard disk array to form a flow channel, and the air inlet corresponds to the flow channel. The hard disk back plate is arranged on the case and positioned between the hard disk array and the partition plate, and is provided with a vent hole.

Description

server

technical field

The present invention relates to a server, in particular to a rack server.

Background technique

The server is the core computer serving each computer in the network system. It can provide functions such as disk and printing services required by network users, and it can also be used by various clients to share various resources in the network environment with each other. The basic structure of the server is roughly the same as that of a general personal computer. It is composed of a central processing unit (CPU), a memory (Memory) and an input/output (I/O) device, and is internally connected by a bus (Bus). Connected, the central processing unit and the memory are connected through the north bridge chip, and the input/output terminals are connected through the south bridge. According to the structure of the chassis, the server has gone through three evolutionary processes: from the early tower chassis to the rack type that emphasizes centralized performance, and then to the blade server with high-density computing.

Here, a rack server is taken as an example. A rack server is a server whose appearance is designed according to a uniform standard and used in conjunction with a cabinet. It can be said that the rack type is a tower server with an optimized structure, and its design purpose is mainly to reduce the server space occupation as much as possible. Many professional network devices are rack-mounted, and most of them are flat, just like drawers. Such as switches, routers, hardware firewalls, etc. The width of the rack server is 19 inches, and the height is in U (1U = 1.75 inches = 44.45 mm). There are usually several standard servers of 1U, 2U, 3U, 4U, 5U, and 7U.

The size of the cabinet is also a common industry standard, usually ranging from 22U to 42U. There are detachable sliding brackets in the cabinet according to the height of U. Users can flexibly adjust the height according to the height of their own servers to store network equipment such as servers, hubs, and disk array cabinets. After the server chassis is placed, all its cables are led out from the rear of the cabinet, and are uniformly placed in the wire slots of the cabinet, usually with labels for easy management.

With the improvement of server computing power, its energy consumption has become an increasingly heavy burden for enterprises. Inefficient or unreasonable cooling methods will cause more unnecessary energy consumption of servers. Therefore, how to effectively improve the cooling efficiency of servers is an important issue at present. topic.

Contents of the invention

The invention provides a server with better heat dissipation performance.

The invention provides a server, which includes a rack, a case, a hard disk array, a motherboard module array, a partition, and a hard disk backplane. The chassis is configured in the rack and has a front end, a rear end and two side walls. One side wall has at least one first ventilation slot and an air inlet, and the other side wall has at least one second ventilation slot. The hard disk array includes at least two hard disk modules, and the hard disk modules are stacked on the front and located between the two side walls. The first ventilation slot and the second ventilation slot are correspondingly arranged at the junction of the two hard disk arrays. The motherboard module array is arranged at the rear end and is located between the two side walls. The partition is configured on the chassis and extends from one side wall to the other side wall. The separator is located between the hard disk array and the motherboard module array, and there is a distance between the separator and the hard disk array to form a flow channel, and the air inlet corresponds to the flow channel. The hard disk backplane is disposed on the chassis and located between the hard disk array and the partition, wherein the hard disk backplane has a plurality of ventilation holes.

In an embodiment of the present invention, the above-mentioned ventilation holes are arranged from sparse to dense along the direction away from the air inlet.

In an embodiment of the present invention, each of the above-mentioned side walls has ventilation openings corresponding to the motherboard module array.

In an embodiment of the present invention, the above-mentioned motherboard module array has a plurality of memories, and the memories are arranged at intervals and extend along a direction perpendicular to the two side walls.

In an embodiment of the present invention, the above server further includes an expansion card disposed between the motherboard module array and the partition.

In an embodiment of the present invention, the above-mentioned server further includes a baffle plate disposed at the rear end to surround the motherboard module array together with the two side walls and the partition plate.

In an embodiment of the present invention, the above server further includes a plurality of fans disposed on the side of the chassis and facing the side wall with the air inlet, wherein the fans are located between the rack and the chassis.

In an embodiment of the present invention, there is a gap between the above two adjacent hard disk modules, and the cooling air flow is suitable for circulating through the first ventilation slot, the gap and the second ventilation slot.

In an embodiment of the present invention, the above server further includes slide rails and input/output brackets. The slide rails are arranged in the rack, and the chassis is slidably arranged on the slide rails. The I/O bracket is located at the rear end of the rack and is fixed to one end of the slide rail, wherein the chassis moves along the slide rail relative to the rack to contact or move away from the I/O bracket.

In an embodiment of the present invention, the above-mentioned server further includes a plurality of sealing strips, which are respectively arranged on the upper edges of the wall on both sides, the upper edge of the partition plate, and the upper edge of the input/output bracket.

In an embodiment of the present invention, the sealing member is made of foam.

Based on the above, the fan of the present invention is disposed on the side of the chassis and faces the side wall, and directly dissipates heat to the hard disk array through the ventilation slots on the side wall, so as to improve heat dissipation efficiency. The partition is arranged between the hard disk array and the motherboard module array, and there is a distance between the partition and the hard disk array to form a flow channel corresponding to the air inlet, so as to reduce wind resistance and further improve heat dissipation efficiency.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail with reference to the accompanying drawings.

Description of drawings

FIG. 1 is a perspective view of a server according to an embodiment of the present invention.

FIG. 2 is a top view of the server in FIG. 1 .

FIG. 3 is a perspective view of the server in FIG. 1 from another perspective.

FIG. 4 is a schematic diagram of the hard disk backplane in FIG. 1 .

Explanation of main reference signs:

100: server; 110: rack;

120: chassis; 122: front end;

124: Rear end; 125: Hard disk backplane;

125a: ventilation hole; 126, 128: side wall;

126a: first ventilation slot; 126b: air inlet;

126c, 128b: ventilation openings; 128a: second ventilation slots;

130: hard disk array; 140: motherboard module array;

142: memory; 150: clapboard;

160: fan; 170: baffle;

175: slide rail; 180: seal;

185: input/output bracket; 190: expansion card;

C: Runner; 132: Hard disk module.

Detailed ways

FIG. 1 is a perspective view of a server according to an embodiment of the present invention. FIG. 2 is a top view of the server in FIG. 1 . Please refer to FIG. 1 and FIG. 2 , the server 100 of this embodiment includes a rack 110 , a case 120 , a hard disk array 130 , a motherboard module array 140 , a partition 150 and a plurality of fans 160 .

The chassis 120 is disposed in the rack 110 , wherein the chassis 120 has a front end 122 , a rear end 124 , a side wall 126 and a side wall 128 . The side wall 126 has at least one first ventilation slot 126a (two are shown) and an air inlet 126b, and the side wall 128 has at least one second ventilation slot 128a (two are shown). The hard disk array 130 includes at least two hard disk modules 132 (shown as three), the hard disk modules 132 are stacked on the front end 122 and are located between the side wall 126 and the side wall 128, wherein each first ventilation slot 126a and each second The ventilation slot 128a is correspondingly disposed at the junction of two adjacent hard disk arrays 130 .

The motherboard module array 140 is disposed at the rear end 124 and is located between the side wall 126 and the side wall 128 . The partition 150 is disposed on the chassis 120 and extends from the side wall 126 to the side wall 128, wherein the partition 150 is located between the hard disk array 130 and the motherboard module array 140, and there is a distance between the partition 150 and the hard disk array 130 to form a flow path. Channel C, the air inlet 126b corresponds to channel C. The fans 160 are disposed on a side of the chassis 120 facing the side wall 126 having the air inlet 126 b, wherein the fans 160 are located between the rack 110 and the chassis 120 . It should be noted that only the fan 160 is shown in FIG. 2 to make the drawing clearer.

According to the above configuration, the fan 160 is located on the side of the chassis 120 and faces the side wall 126, and directly dissipates heat to the hard disk array 130 through the first ventilation slot 126a on the side wall 126 to improve heat dissipation efficiency, wherein the heat dissipation airflow is suitable for Through the first ventilation slots 126 a , the gaps between adjacent hard disk modules 132 and the second ventilation slots 128 a , the air flows through each layer of the hard disk array 130 . The partition 150 is disposed between the hard disk array 130 and the motherboard module array 140, and there is a distance between the partition 150 and the hard disk array 130 to form a flow channel C corresponding to the air inlet 126b, so that the fan 160 can pass through the air inlet 126b and The flow channel C dissipates heat from the hard disk array 130 and reduces wind resistance to further improve heat dissipation efficiency.

FIG. 3 is a perspective view of the server in FIG. 1 from another perspective. FIG. 4 is a schematic diagram of the hard disk backplane in FIG. 1 . Please refer to FIG. 3 and FIG. 4 , the server 100 of this embodiment further includes a hard disk backplane 125 , and the hard disk backplane 125 is disposed on the chassis 120 and located between the hard disk array 130 and the partition 150 . The hard disk backplane 125 has a plurality of ventilation holes 125a, so that the fan 160 can dissipate heat from the hard disk array 130 through the ventilation holes 125a. As shown in FIG. 4 , the ventilation holes 125 a are arranged from sparse to dense along the direction away from the air inlet 126 b, which can further improve the heat dissipation effect of the heat dissipation airflow on the hard disk array 130 .

In addition, in this embodiment, the side wall 126 and the side wall 128 respectively have a ventilation opening 126 c and a ventilation opening 128 b corresponding to the motherboard module array 140 . The fan 160 can dissipate heat from the motherboard module array 140 through the ventilation opening 126c and the ventilation opening 128b.

In more detail, in this embodiment, the mainboard module array 140 has a plurality of storage devices 142, the storage devices 142 are arranged at intervals and extend along a direction perpendicular to the side wall 126 and the side wall 128, so that the cooling airflow generated by the fan 160 It is easy to pass between adjacent storage devices 142 to improve heat dissipation efficiency. In addition, the server 100 of the present embodiment further includes a baffle 170 disposed at the rear end 124 to surround the motherboard module array 140 together with the side wall 126 , the side wall 128 and the partition 150 .

In this embodiment, the server 100 further includes an expansion card 190 disposed between the motherboard module array 140 and the partition 150 , and the fan 160 can dissipate heat from the expansion card 190 through the ventilation opening 126c and the ventilation opening 128b. In addition, please refer to FIG. 1 , the server 100 of this embodiment further includes a slide rail 175 and an input/output bracket 185 . The slide rail 175 is disposed in the rack 110 , wherein the chassis 120 is slid on the slide rail 175 . The I/O bracket 185 is located at the rear end of the rack 110 and fixed on one end of the slide rail 175 , wherein the chassis 120 is adapted to move along the slide rail 175 relative to the rack 110 to contact or move away from the I/O bracket 185 . When the chassis 120 touches the I/O bracket 185 , the hard disk array 130 and the motherboard module array 140 are suitable for connecting to an external power source through the I/O bracket 185 and performing data transmission with the external device.

The server 100 of this embodiment may further include a plurality of seals 180 . The sealing member 180 is made of foam and is respectively disposed on the upper edge of the side wall 126 , the upper edge of the side wall 128 , the upper edge of the partition 150 and the upper edge of the input/output bracket 185 . Therefore, when the user puts the upper cover (not shown) on the server 100 , the structure can be sealed by the sealing member 180 to prevent the cooling air from escaping from the gap between the upper cover and the server 100 .

To sum up, the fan of the present invention is disposed on the side of the chassis and faces the side wall, and directly dissipates heat to the hard disk array through the ventilation slots on the side wall, so as to improve heat dissipation efficiency. The partition is arranged between the hard disk array and the motherboard module array, and there is a distance between the partition and the hard disk array to form a flow channel corresponding to the air inlet, so as to reduce wind resistance and further improve heat dissipation efficiency. In addition, the server may also include a hard disk backplane disposed on the chassis and located between the hard disk array and the partition, and the fan may dissipate heat from the hard disk array through the ventilation holes of the hard disk backplane. In addition, each side wall can have a ventilation opening corresponding to the motherboard module array, and the fan can dissipate heat to the motherboard module array through the ventilation opening.

Although the present invention has been disclosed above with the embodiments, it is not intended to limit the present invention. Anyone skilled in the art can make any changes or equivalent replacements without departing from the spirit and scope of the present invention. Therefore, the present invention The scope of protection should be defined by the claims of the present application.

Claims (11)

1. A server, comprising: a rack; A case, configured in the frame, wherein the case has a front end, a rear end and two side walls, one of the side walls has at least one first ventilation slot and an air inlet, and the other side wall has at least one first Two ventilation slots; A hard disk array, including at least two hard disk modules, the hard disk modules are stacked on the front end and located between the two side walls, wherein the first ventilation slot and the second ventilation slot are correspondingly arranged on the hard disk module at the junction of; a motherboard module array, arranged at the rear end and between the two side walls; A partition, configured on the chassis and extending from one side wall to the other side wall, wherein the partition is located between the hard disk array and the motherboard module array, between the partition and the hard disk array There is a gap to form a flow channel, and the air inlet corresponds to the flow channel; as well as A hard disk backplane is arranged on the chassis and located between the hard disk array and the separator, wherein the hard disk backplane has a plurality of ventilation holes. 2. The server according to claim 1, wherein the ventilation holes are arranged from sparse to dense along a direction away from the air inlet. 3. The server according to claim 1, wherein each of the side walls has a ventilation opening corresponding to the motherboard module array. 4. The server according to claim 3, wherein the motherboard module array has a plurality of storage devices arranged at intervals and extending along a direction perpendicular to the two side walls. 5. The server according to claim 1, further comprising an expansion card disposed between the motherboard module array and the partition. 6 . The server according to claim 1 , further comprising a baffle disposed at the rear end to surround the motherboard module array together with the two side walls and the partition. 6 . 7. The server according to claim 1, further comprising a plurality of fans disposed on a side of the chassis and facing the side wall having the air inlet, wherein the fans are located between the rack and the chassis. 8 . The server according to claim 1 , wherein there is a gap between two adjacent hard disk modules, and the cooling airflow is adapted to circulate through the first ventilation slot, the gap and the second ventilation slot. 9. The server according to claim 1, further comprising: a slide rail, configured in the rack, wherein the chassis is slid on the slide rail; as well as An input/output bracket is located at the rear end of the rack and is fixed on one end of the slide rail, wherein the chassis moves relative to the rack along the slide rail to contact or stay away from the input/output bracket. 10. The server according to claim 9, further comprising a plurality of seals respectively disposed on the upper edges of the two side walls, the upper edge of the partition plate and the upper edge of the input/output bracket. 11. The server according to claim 10, wherein the sealing member is made of foam.

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